CN205091470U - A system and controller for docking LC sensor - Google Patents
A system and controller for docking LC sensor Download PDFInfo
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- CN205091470U CN205091470U CN201520493896.1U CN201520493896U CN205091470U CN 205091470 U CN205091470 U CN 205091470U CN 201520493896 U CN201520493896 U CN 201520493896U CN 205091470 U CN205091470 U CN 205091470U
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
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- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
- G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/34—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering
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Abstract
The utility model relates to a system and controller for docking LC sensor. The utility model provides a carry out LC sensor and the control unit the scheme of docking. The control unit can contact including first contact and second, and wherein the LC sensor is connected between first contact and second contact. The condenser is connected between first contact and ground connection. For the vibration of beginning LC sensor, during the first stage, be connected to mains voltage and arrange the second contact in high impedance status with first contact to make the condenser charged through mains voltage. During the second stage, arrange first contact in high impedance status to be connected to ground connection with the second contact, thereby make the condenser shift the electric charge towards the LC sensor. During the phase III, the high impedance status can be arranged in first contact and second contact, therefore the LC sensor can vibrate.
Description
Technical field
Embodiment of the present disclosure relates to a kind of technology for docking LC sensor.
Background technology
LC sensor is known in the art.Such as, LC sensor can be used as the electronics adjacency sensor of the existence that can detect conductive object.Some usual application of inductance type transducer comprise such as metal detector and derivation application, such as rotation sensor.
Fig. 1 shows the key property of LC sensor 10.Especially, in considered example, LC sensor 10 comprises inductor L and capacitor C, and inductor L and capacitor C forms the resonant circuit being also referred to as tank circuit.This layout comprises power supply 102 and the switch 104 of such as voltage source and so on further.
When switch 104 is positioned at primary importance (as shown in Figure 1), capacitor C is charged to supply voltage.When capacitor C is completely charged, switch 104 changes position, is set to by capacitor C in parallel with inductor L, and capacitor C begins through inductor L discharges.This starts the vibration between LC resonant circuit 10.
From the angle of practice, LC sensor 10 also comprises resistive component R, and this resistive component R dissipates to energy all the time.Correspondingly, the loss of vibrating that will detract occurs, that is, vibration is attenuated.
This LC sensor 10 can be used for such as detecting metal object.This is because compared to not having the vibration of metal object, (see such as Fig. 2, a), the vibration (see such as Fig. 2 b) that there is metal object will decay faster.As a rule, the sensing component of LC sensor 10 can be inductor L, capacitor C and/or resistor R.Such as, resistor R major effect decay factor, and L and C assembly major effect oscillation frequency.
In addition, this LC sensor 10 can also by being connected to inductance type transducer L or inductor L being connected to capacitance type sensor C to create simply by capacitor C.But inductor L (loss with it dissipates) provides sensing element usually.
Fig. 3 a shows the possible embodiment of the LC sensing being performed sensor 10 by the control module 20 of such as microcontroller, such as at " the LowEnergySensorInterface – InductiveSensing " of document application mark AN0029, Rev.1.05, on 05 09th, 2013, Energymicro, or ApplicationReportSLAA222A, " RotationDetectionwiththeMSP430ScanInterface ", in April, 2011, described in TexasInstruments.In considered example, control module 20 has two pins or pad 202 and 204, and LC sensor 10 is connected between these pins 202 and 204.
Control module 20 comprises the controllable voltage source 206 be connected with pin 202, with by fixed voltage V
mIDbe applied to this pin 202 place.Such as, digital-to-analog converter (DAC) is usually used for this purpose.
During the charging stage, pin 204 is connected to ground connection GND.Correspondingly, during this stage, sensor 10 is connected to voltage V
mIDand between ground connection GND, and the capacitor C of sensor 10 is charged to voltage V
mID.
Then, control module 20 makes the second pin 204 disconnect, and namely this pin 204 is floating.Correspondingly, because the capacitor C of sensor 10 charges during the stage before, LC resonant circuit 10 starts to vibrate as described above.
Thus, by voltage such as at the voltage V at pin 204 place
204analyze, characterization can be carried out to vibration.In fact, as shown in Figure 3 b, at the voltage V at pin 204 place
204corresponding to the voltage V had with applied by voltage source 206
mIDthe vibration of the decay of corresponding DC skew, that is, voltage V
mIDdefine the mid point of vibration.Correspondingly, voltage V
mIDusually be set to the half of the supply voltage of control module 20, i.e. VDD/2, thus there is maximum scope.
Usually, described circuit also comprises the additional capacitor C1 be connected between pin 202 and ground connection GND, to make voltage signal V
mIDstable and the lifting of the electric current needed for charging to sensor is provided.(see such as Fig. 3 a), control module 20 can comprise the analog-digital converter (ADC) 208 that is connected to pin 204 thus sample to the voltage of vibration in order to analyze the signal at pin 204 place.Like this, based on resolution and the sample frequency of ADC206, whole vibration can be characterized.
Fig. 4 shows alternative scheme.More properly, in the illustrated example, control module 20 comprises comparer 210, and it is to the voltage at pin 204 place and such as reference voltage V
refreference signal compare.Such as, this reference voltage V
refsuch as VDD/2 place can be fixed to, or be arranged by digital analog converter 212.Such as, Fig. 5 a and Fig. 5 b each illustrates when to exist near sensor 10 and to there is not metal object along with possible reference voltage V
refwith the vibration of the output CMP of comparer 210.Usually, two schemes shown in Fig. 3 a and Fig. 4, i.e. ADC208 and comparer 210, also can be incorporated in same control module 20.
Thus, based on aforementioned, by directly being docked with microcontroller integrated circuit (IC) by LC sensor, contactless motion measurement can be realized.This sensing may be used for metering system (gas, water, distance etc.).But when processing sensor and sampling, microcontroller (or MCU) should reduce power consumption as far as possible, thus allow research and development battery-powered system.In addition, because MCU unit is generally general, therefore owing to implementing the special circuit required for above-mentioned functions, also need to reduce silicon area as much as possible.
Correspondingly, in LC sensor excitation and measuring technique, as has been mentioned, power consumption and cost is reduced, particularly for particularly important battery-powered application.Therefore, first problem is the use about special low power analog assembly, such as, for formation voltage V
mIDand internal reference voltage V
ref, which results in larger cost.
Second Problem is about digital analog converter 210, and it should low-power and enough quick with the vibration of following decay.Which results in the challenging application constraint in the significant power consumption and battery-powered system at every turn measured.
In addition, process-voltage-temperature (PVT) change is another major issue in battery-powered system, wherein has significant change in voltage.Really, most assembly described above may be subject to the impact of PVT change, comprises sensor (decay factor, frequency etc.); I/O pad electric current and resistance (excitation); Comparator switch point etc.
Utility model content
Based on above-mentioned, need a kind of scheme that can overcome the one or more defects enumerated listed hereinbefore.
Provide the scheme for being carried out docking by the control module of LC sensor and such as microcontroller, wherein said control module comprises the first contact and contacts with second, the pin of such as microcontroller or pad.Especially, LC sensor connect between two contacts and building-out condenser be connected between the first contact and ground connection.
In certain embodiments, the vibration of LC sensor is by three phases.More specifically, during the first stage, by first contact be connected to supply voltage and second contact be placed in high impedance status, such as disconnect, capacitor charged by the supply voltage provided in the first contact position.During subordinate phase, the first contact is placed in high impedance status, such as, disconnect, and the second contact is connected to ground connection, and wherein capacitor is connected with LC sensor parallel and electric charge shifts from capacitor towards LC sensor.During the phase III, two contacts are all placed in high impedance status, and such LC sensor can vibrate.Correspondingly, the vibration of LC sensor can be started by the tri-stated driver circuit of such as microcontroller.
In certain embodiments, make the duration of subordinate phase, namely the duration of charge transfer phase changes, to adjust the voltage at the capacitor place when the phase III, (that is, oscillation phase) started.This defines the mid-point voltage of the vibration produced in the second contact position.
In certain embodiments, at least during the phase III, the voltage of the second contact position is monitored, to determine some characteristics of the vibration of LC sensor.Such as, the voltage in the second contact position can compare with at least one reference voltage thus generate comparison signal.In this case, the pulse number in comparison signal can be counted thus carry out characterization to vibration.Correspondingly, can be monitored by the vibration of the input sense circuit of such as microcontroller to LC sensor.
In certain embodiments, the number of pulse is also used for adjusting the mid-point voltage of vibration produced in the second contact position.Such as, this can by changing the duration of subordinate phase, and namely the duration of charge transfer phase completes.
In certain embodiments, the charge or discharge performance of capacitor can be analyzed by utilizing during calibration phase the comparer with sluggishness.The mid-point voltage of the vibration produced in the second contact position can carry out charge or discharge to adjust to capacitor by the charge or discharge performance based on the capacitor determined during calibration phase between subordinate phase and phase III.Correspondingly, the mid-point voltage of vibration also can be adjusted by the tri-stated driver circuit of such as microcontroller.
According to an aspect of the application, a kind of system for docking LC sensor being provided, comprising: LC sensor, controller, comprises the first contact and contacts with second, and wherein said LC sensor is coupling between described first contact of described controller and described second contact, and capacitor, be coupling between described first contact and reference voltage, described controller is configured to: during the first stage, described first contact is connected to supply voltage and described second contact is placed in high impedance status, described capacitor is charged by described supply voltage, during subordinate phase, described first contact is placed in described high impedance status and described second contact is connected to described reference voltage, make described capacitor by Charger transfer to described LC sensor, and during the phase III, described first contact is contacted with described second and is placed in described high impedance status, make described LC sensor oscillation.
In one embodiment, controller is further configured to the voltage monitored during the described phase III in described second contact position.
In one embodiment, controller is further configured to the duration changing described subordinate phase, to adjust the voltage at described capacitor place in the beginning of described phase III, is limited to the mid-point voltage of the described vibration that described second contact position occurs thus.
In one embodiment, reference voltage comprises the first reference voltage; And wherein said controller is by comparing to generate comparison signal by the voltage in described second contact position and at least one the second reference voltage, monitors the described voltage in described second contact position thus.
In one embodiment, controller is by counting the described voltage monitored in described second contact position to the number of the pulse in described comparison signal.
In one embodiment, controller, by changing the duration of described subordinate phase to guarantee the minimum pulse number in described comparison signal, changes the duration of described subordinate phase thus to adjust the voltage at described capacitor place in the beginning of described phase III.
In one embodiment, comparison signal comprises the first comparison signal, and wherein said controller is further configured to: monitor the voltage in described first contact position, make when the described voltage in described first contact position is higher than given higher thresholds, second comparison signal is set to high, and when the described voltage in described first contact position is lower than given comparatively Low threshold, described second comparison signal is set to low; And perform calibration.
In one embodiment, controller be configured to by under list and perform described calibration:
During the first calibration phase, described first contact is connected with described supply voltage, and described second contact is placed in high impedance status, described capacitor is charged by described supply voltage; During the second calibration phase, described first contact is placed in high impedance status, and described second contact is connected with described first reference voltage, make described capacitor by Charger transfer to described LC sensor; During the 3rd calibration phase, once the described voltage of described second comparison signal instruction in described first contact position is lower than described given comparatively Low threshold, just described first contact is connected to supply voltage, described capacitor is charged by described supply voltage; And during the 4th calibration phase, once the described voltage of described second comparison signal instruction in described first contact position is higher than described given higher thresholds, just determine the duration of described 3rd calibration phase.
In one embodiment, controller comprises: the first switch, is configured to selectively described first contact is connected to described supply voltage or described first contact is placed in described high impedance status; Second switch, is configured to selectively described second contact is connected to described reference voltage or described first contact is placed in described high impedance status; And comparer, be configured to monitor the voltage in described second contact position.
In one embodiment, the first switch comprises and contacts with described first the ternary output driving circuit be associated; Wherein said second switch comprises and contacts with described second the ternary output driving circuit be associated; And wherein said comparer comprises and contacts with described second the input sense circuit be associated, described input sense circuit comprises Schmidt trigger.
In one embodiment, controller is integrated in integrated circuit.
According to the another aspect of the application, a kind of controller is provided, for using together with capacitor with LC sensor, described controller comprises: the first contact contacts with second, wherein said LC sensor will be coupling between described first contact and described second contact, and wherein said capacitor will be coupling between described first contact and reference voltage, and processor, be configured to: during the first stage, described first contact is connected to supply voltage and described second contact is placed in high impedance status, described capacitor is charged by described supply voltage, during subordinate phase, described first contact is placed in described high impedance status and described second contact is connected to described reference voltage, make described capacitor by Charger transfer to described LC sensor, and during the phase III, described first contact is contacted with described second and is placed in described high impedance status, make described LC sensor oscillation.
In one embodiment, processor is further configured to the voltage monitored during the described phase III in described second contact position.
In one embodiment, processor is further configured to the duration changing described subordinate phase, to adjust the voltage at described capacitor place in the beginning of described phase III, is limited to the mid-point voltage of the described vibration that described second contact position occurs thus.
In one embodiment, reference voltage comprises the first reference voltage; And wherein said processor is by comparing to generate comparison signal by the described voltage in described second contact position and at least one the second reference voltage, monitors the described voltage in described second contact position thus.
In one embodiment, processor is by counting the described voltage monitored in described second contact position to the number of the pulse in described comparison signal.
According to system and the controller of the application, the improved plan for docking LC sensor can be realized.
Accompanying drawing explanation
Be described embodiment of the present disclosure now with reference to accompanying drawing, accompanying drawing only provides as nonrestrictive example, and wherein:
Fig. 1 is the schematic diagram of the LC sensor according to prior art;
When Fig. 2 a and Fig. 2 b is respectively and has and do not have the existing of metal object, the diagram of the voltage oscillation of the LC sensor of Fig. 1;
Fig. 3 a describes the schematic diagram arranged according to another LC sensor comprising controller of prior art;
Fig. 3 b is the diagram of the voltage oscillation of the LC sensor of Fig. 3 a;
Fig. 4 is the schematic diagram arranged according to another LC sensor comprising controller of prior art;
The diagram of the voltage oscillation that the LC sensor that Fig. 5 a and Fig. 5 b is respectively Fig. 4 when having and do not have the existing of metal object is arranged;
Fig. 6, Fig. 7, Fig. 9, Figure 10 and Figure 12 are the schematic diagram of the system for docking LC sensor described according to exemplary embodiment;
Fig. 8, Figure 14 and Figure 15 are the process flow diagram describing the method for docking LC sensor that can use in the system of Fig. 6, Fig. 7, Fig. 9, Figure 10 and Figure 12;
Figure 11 a-Figure 11 d and Figure 16 is the diagram describing the example waveform that may occur in the system of Fig. 6, Fig. 7, Fig. 9, Figure 10 and Figure 12; And
Figure 13 is the chart providing the example results utilizing the system of Fig. 6, Fig. 7, Fig. 9, Figure 10 and Figure 12 to obtain.
Embodiment
In the following description, give various specific details and complete understanding for embodiment is provided.These embodiments can be put into practice without the need to one or several specific detail, or utilize other method, assembly, material etc. to put into practice.In other example, known structure, material or operation are not illustrated or described in detail thus avoid the aspect making the present embodiment to become ambiguous.
Run through this instructions, mention that " embodiment " or " embodiment " mean and to comprise at least one embodiment about the special characteristic described by embodiment, structure or characteristic.Like this, the phrase " in one embodiment " occurred in each place running through this instructions or " in one embodiment " might not all refer to same embodiment.Further, specific feature, structure or characteristic can combine in one or more embodiments in an appropriate manner.Title provided here only for convenience and do not explain scope or the implication of embodiment.
In Fig. 6 to Figure 16 below, the part, element or the assembly that have been described referring to figs. 1 through Fig. 5 refer to the identical reference number used in these figure.Like this, the description to element described before is no longer repeated in the following description.
Embodiment described is here by the upper assembly of special required for minimizing and/or provide the scheme allowed effective manipulation of at least one LC sensor 10 by providing the power consumption of reduction.Some embodiments also can be implemented with digital form by traditional low cost microcontroller, reduce costs thus.
The restoring force (being particularly useful for battery-powered system) that various embodiment can provide the antagonism PVT of improvement to change.In certain embodiments, the program is based on two kinds of different technology, and namely condenser type dynamic charge shares (CDCS) and self-tuning reference (STR).In certain embodiments, this scheme apply condenser type dynamic charge share remove about Fig. 3 a and V illustrated in fig. 4
mIDmaker and V
refmaker 206/212, and utilize self-tuning reference technique to allow the robustness using fixing internal reference and improvement antagonism PVT change.
condenser type dynamic charge is shared
As mentioned above, condenser type dynamic charge shares (CDCS) technology permission removal V
mIDvoltage generator module.More specifically, the program based on the fact be within the very short time, the inductance L of sensor 10 makes the capacitor C of sensor 10 and capacitor C1 be connected in series.
Fig. 6 shows the basic framework of the program.More specifically, LC sensor 10 connects (such as, direct) again between the pin 202 and 204 of the control module 20 of such as microcontroller in the embodiments described.In addition, capacitor C1 connects (such as, direct) between pin 202 and ground connection GND.Just as will be described, capacitor C1 is to be used compared to the mode different with reference to the prior art described by Fig. 3 b and Fig. 4.
In the embodiments described, control module 20 does not comprise for formation voltage V
mIDspecial DAC, but control module 20 only comprises switch 220, the fixed voltage that switch 220 is arranged to the supply voltage VDD optionally pin 202 being connected to such as control module 20 or the voltage signal provided by obtainable internal voltage references maker frequent in conventional microcontroller.As a rule, supply voltage VDD can be received by the power pins (not shown) of control module 20.Correspondingly, pin 202 or for floating or be connected to supply voltage.Such as, in certain embodiments, the operation of switch 220 can adopt traditional tri-stated driver circuit to implement, such as " 1 " for VDD, " 0 " for GND and " Z " for high impedance status, it is generally used for the output pin of microcontroller or other digital integrated circuits.
In the present embodiment, control module 20 comprises another switch 222, and this switch 222 is configured to pin 204 to be optionally connected to ground connection GND.Like this, the operation of switch 222 also can utilize the conventional driver circuit of the output pin of microcontroller to implement.
The switching of switch 220 and switch 222 is controlled by processing unit 230, the digital processing element that processing unit 230 is such as programmed via software instruction.Such as, this can be CPU (central processing unit) (CPU) or the special digital IP of microcontroller.Correspondingly, in certain embodiments (see such as Fig. 7), the driving of above-described pad 202 and 204 can have been come by traditional tri-state driving circuit 240 and 242 of such as microcontroller 20.
Fig. 8 show by control module 20 perform for the process flow diagram of main operation of vibration of LC sensor 10.After beginning step 2000, in step 2002 control module 20, pin 202 is connected to power supply signal, the supply voltage VDD of such as microcontroller 20, and pin 204 is floating.Such as, processing unit 230 can utilize logic level " 1 " to drive pin 202, and utilizes logic level " Z " to drive pin 204.Correspondingly, in step 2002, only capacitor C1 is connected between supply voltage VDD and ground connection GND, and capacitor C1 is charged.
Then, in step 2004, pin 204 is connected to ground connection GND by control module 20, and pin 202 is floating.Such as, processing unit 230 can utilize logic level " Z " to drive pin 202, and utilizes logic level " 0 " to drive pin 204.Correspondingly, in step 2004, sensor 10 be connected in parallel with capacitor C1, and electric charge is on the capacitor cl transferred to capacitor C at least in part and usually transferred to sensor 10, that is, the electric charge of capacitor C1 is shared with sensor 10.
Then, in step 2006, control module 20 makes the second pin 204 disconnect, and namely pin 202 and 204 is all floating.Such as, processing unit 230 can utilize logic level " Z " to drive both pin 202 and pin 204.Correspondingly, due to LC sensor 10 during step 2006 by the fact of charging, LC resonant circuit 10 step 2008 start vibration, as described above.Finally, procedure ends is in step 2010.
Drive scheme can also comprise optional step 2008, wherein stops oscillation.Such as, this will needs perform multiple continuous print measure time can be useful.As shown in Figure 8, this step 2008 can perform in measurement end (after step 2006) or in new measurement beginning, such as, can perform before step 2002.Such as, during step 2008, both pads 202 and 204 can be connected to ground connection, and such as, processing unit 230 can utilize logic level " 0 " to drive both pin 202 and pin 204, thus discharges to capacitor C1 and C.
Description above can be applicable to single-sensor 10.But this system also can be extended to multiple sensor, such as, by utilizing single pad 202 and corresponding sensing pad 204 for each LC sensor.As a rule, during step 2004, the amount of the electric charge of transfer depends on actuation duration T
excit, its breaker in middle 222 remains closed and switch 220 is off, namely step 2004 duration.
Substantially, if time T
excitenough short, then the inductor L of sensor can be assumed to be and to disconnect and the total electrical charge of original storage in capacitor C1 will redistribute between two capacitor C1 and C at the end of step 2004, and will be provided by capacitor divider formula at the voltage at capacitor C1 and C place.Such as, when two capacitor C1 and C have identical electric capacity and suppose moment Charger transfer, the voltage on capacitor C1 and capacitor C will reach the half of voltage source signal VDD.
But should be understood that Charger transfer in fact right and wrong " moment ", such as, because the resistive load between capacitor C1 and C caused, and inductor L is at time T
excitperiod can not be assumed to be eternal disconnection.That is, capacitor C1 also will be discharged by inductor L.As a result, depend on time T at the final voltage at capacitor C1 and capacitor C place
excit, the voltage that namely (when the end in step 2004 and the beginning in step 2006) capacitor C1 and sensor capacitance C reaches depends on actuation duration T
excit.
Correspondingly, Fig. 6 and condenser type dynamic charge illustrated in fig. 7 share (CDCS) technology substantially based on the capacitive divider principle applied during the of short duration period (utilizing existing assembly).Especially, in considered embodiment, capacitor C1 is precharged to VDD, and electric charge is according to the duration T of step 2004
excitand part transfers to sensor 10, that is, when pin 202 is for floating and pin 204 is connected to ground connection.But as mentioned above, during LC sensor carries out the step 2006 of vibrating wherein, the voltage at capacitor C1 place constitutes the mid-point voltage V of vibration
mID.Correspondingly, by controlling duration T
excit, can to voltage V
mIDadjust, voltage V
mIDnamely the voltage when the beginning of the end of step 2004 or step 2006 at capacitor C1 place.
self-tuning reference
Self-tuning with reference to the condenser type dynamic charge that (STR) technology described before combining share (CDCS) technology use time, allow use to have fixing (that is, inside) reference value V
refsimple comparator analyze vibration during step 2006.Correspondingly, digital analog converter (block 208 such as, in Fig. 3 a) is not needed maybe can to control Voltage Reference (block 212 such as, in Fig. 4).
Such as, as shown in Figure 9, comparer 250 can be connected to pin 204 and to the voltage at pin 204 place and fixed reference V
refcompare.Then can make the processing unit 230 of the result CMP the compared digital processing core that can be used for such as microcontroller and so on, this processing unit 230 can be arranged to be analyzed the pulse train in signal CMP.
Such as, in certain embodiments, the comparer with such as Schmidt trigger and so on of fixed threshold with sluggishness is used to analyze vibration.Such as, this Schmidt trigger with fixed threshold is often used in the sensing circuit of the input pad of microcontroller or other digital integrated circuits.Correspondingly, the assembly that adds can not be needed and the sensing circuit of the input pin of traditional microcontroller can be used.
As an example, as shown in Figure 10, the sensing circuit 260 of the input pad of traditional such as microcontroller can be used to implement comparer 250.Correspondingly, the value be associated with input pad 204 by only " reading ", the result compared can be directly used in process core 230.
In the prior art described above with reference to Fig. 4, via the tuning internal reference voltage V in source 212
refpossibility usually allow set reference value V
ref, which ensure that in the enough digit pulses of the output CMP place of comparer generation, so instead of much more too pulses, thus avoid losing time and energy (see also Fig. 5 a and Fig. 5 b).On the contrary, in certain embodiments, above-mentioned condenser type dynamic charge technology of sharing is used for the mid-point voltage V optionally changing vibration
mIDinstead of the threshold voltage of comparer 250.Correspondingly, V
mIDand V
refrole swap, namely by mobile voltage V
mID, the number of digit pulse can according to mobile voltage V
refsubstantially similar mode is changed.
Exemplarily, Figure 11 a shows and has mid-point voltage V
mID(its usually correspond to 0.5VDD) and be set to V in this example
midreference voltage V
refthe typical vibration of LC sensor.On the contrary, Figure 11 b illustrates wherein mid-point voltage V
mIDpromoted to change the number of digit pulse instead of mobile voltage V
refexample.
Similarly, Figure 11 c shows the waveform of Figure 11 a, which uses Schmidt trigger, such as, have the higher thresholds TH compared with Low threshold TL and 0.6VDD of 0.4VDD.Finally, Figure 11 d shows the mid-point voltage V with lifting
mIDthe waveform of Figure 11 b, and which use the Schmidt trigger of Figure 11 c.
As shown in above-mentioned Figure 11 a to Figure 11 d, the pulse number of the output of comparer 210 for same waveform according to mid-point voltage V
mIDand change.But, as mentioned above, during charge transfer phase 2004, mid-point voltage V
mIDaccording to actuation duration T
excitand change.Like this, by control time T
excit, can compared result carry out tuning.
Figure 12 shows the embodiment of integrated circuit 20 in this context, such as microcontroller, and it can be used to perform aforesaid operations.More specifically, pad 204 is for having input pad and the o pads of the input sense circuit 260 of ternary output the driving circuit 242 and such as Schmidt trigger be associated.Pad 202 is the o pads at least with the ternary output driving circuit 240 be associated.
Correspondingly, by driving pad 202 and pad 204 via drive circuit 240 and drive circuit 242 as mentioned above, in particular with reference to Fig. 8, the vibration of LC sensor 10 can be encouraged and mid-point voltage V can be set
mID.More specifically, the driving of pad 202 and pad 204 can perform via digital processing core 230.
Once vibration, from the output of sensing circuit 260 be fed to process core 230 for further analyze thus determine vibrate characteristic.Such as, as shown in reference to Fig. 5 a and Fig. 5 b, export the decay factor that CMP indicates vibration, the decay factor of vibration indicates again the existence of the metal object near sensor 10.As a rule, digital processing element 230 can be application specific hardware modules, via software instruction programming general processor or the combination of the two.
Like this, the counting of the pulse in executive signal CMP also can be carried out via digital processing core.But vibration can have high-frequency, carrying out counting via software instruction in this case may be infeasible.Correspondingly, control module 20 can comprise the counter 270 of hardware implementation in this case, and it has been included in traditional microcontroller usually, and the output of sensing circuit 260 can be fed to counter 270.Like this, counter 270 can count the number of the pulse in signal CMP independent of processing unit 230, and processing unit 230 only can read net result, namely at the signal of the output of counter 270, and finally when starting new measurement, counter 270 is reset.
In addition, counter 270 also can be expanded thus provide special measurement and processing unit, its Directly solution read signal CMP thus extract required for information.Such as, measure and processing unit 270 can direct detection to the state of sensor, such as, on metal, first-class at plastics.
Module 270 can also generate at least one programmable interruption under given conditions.Such as, this measurement and processing unit can also be connected to multiple sensing pad 204 thus understand the signal from multiple sensor, such as, with execution speed or wheel measuring.
As shown in reference to Figure 11 a to Figure 11 d, the number of the pulse of the output of comparer 210 for same waveform according to mid-point voltage V
mIDand change.During charge transfer phase 2004, mid-point voltage V
mIDagain according to actuation duration T
excitand change.
In certain embodiments, the number of the digit pulse that the output that self-tuning directly finds the comparer of the Schmidt trigger 260 at such as Figure 10 with reference to (STR) technology generates, the actuation duration T will be used in CDCS technology described above with hands-off tuning
excit.By this way, can obtain the number of the hope of digit pulse, it corresponds to given reference conditions (such as, having metal) usually.Such as, reference conditions are usually corresponding to the situation with the maximum attenuation factor, and this situation corresponds to the vibration in the output CMP of comparer 250/260 with the pulse number of minimum expectation.As an example, in certain embodiments, closed loop adjustment is utilized to carry out setup times T
excit, to guarantee that the pulse number for given reference conditions corresponds to target pulse number K, described given reference conditions are such as having the condition of the maximum attenuation factor.In this case, when witness mark condition, the number of the pulse in the output of comparer will comprise K counting, and the number of pulse increases under the condition of decay factor with reduction.
Such as, consider resistance R wherein in sensor 10 (it mainly carries out modeling to attenuate action) can between 3Ohm to 45Ohm and the minimum number counting K should be 4 illustrative example, calibration will come for the condition of R=45Ohm.Exemplarily, for typical LC sensor, final result can be:
Be 4 pulses for R=45Ohm;
Be 5 pulses for R=37Ohm; And
Be 9 pulses for R=3Ohm.
In addition, described alignment mechanism provides the system robustness of the Parameters variation of antagonism impact vibration.Such as, Figure 13 shows and comprises for different electrical power voltage VDD ∈ { 3.3V, 2.V, 2.5V, 2.1V}, temperature T ∈ {-30 DEG C, 25 DEG C, 125 DEG C }, and the resistance R ∈ { chart of the pulse number in the signal CMP of 3Ohm, 37Ohm, 45Ohm}.As shown in figure 13, the program is very sane for antagonism change in voltage, although resolution may by low temperature effect.
In certain embodiments, replace and only perform calibration once, self-tuning reference technique can be run continuously and adjust voltage V
mID, guarantee that pulse number in the signal CMP for measuring is from being not less than K.Such as this can be used for rotation sensor, and the dish wherein with metal profile rotates in the front of at least one LC sensor 10, because in this case, the correct reference conditions setting up priori are difficult.Like this, as a rule, by digital processing element 230 or directly self-tuning reference technique can also can be completed by measurement and processing unit 270.
STR technology can also be used to mark as modification time T
excittime the direction of taking and/or process deadlock, at time T
excitdeadlock can be there is when exceeding effective range.Such as, in certain embodiments, parameter below can be used:
NP – is for the pulse number of current measurement cycle;
PNP – is for the pulse number of measuring period before;
DIR – direction;
Direction before PDIR –;
K – is for the target minimum pulse number measured;
T
excitthe – actuation duration, such as betwixt capacitor C1 transfer charge in the clock period of sensor 10; And
TO – time-out, such as, within measuring period.
In certain embodiments, when the pulse number NP measured is less than target K and is less than the pulse PNP in the cycle before, direction can be forced to change, should correction time T in the opposite direction because can suppose
excit.In certain embodiments, counter C is used to check whether generation Timeout conditions.Such as, this counter C can each ranging pulse number N P be less than K but equal previous PNP time increase progressively.Correspondingly, if this condition is true for TO measuring period, then parameter T
excitgo beyond the scope, because for T
excitchange no longer there is susceptibility.Such as, in this case, time T
excitcan to be reset as its initial value and direction is changed.
Exemplarily, Figure 14 shows and can be used for automatically determining time T
excitthe process flow diagram of method.After beginning step 3000, process starts and carries out initialization in step 3002 pair parameter.Such as, in this step 3002, counter C can be reset (such as, being set to zero), and parameter PNP is set to zero, and time T
excitbe set to initial default (such as, zero).
This process continues in step 3004, performs measurement herein.If calibration process is connected all the time, then whether this process can also only be performed in control survey.
At verification step 3006, whether measured pulse number NP is less than desired value K to this process verification.If measured pulse number NP is equal to or greater than target K (output " N " of condition step 3006), then do not need revise and this process continue in step 3008, reset (such as at this place to time-out counter C, be set to zero), and process turns back to step 3004.
On the contrary, when measured pulse number NP is less than desired value K (output " Y " of verification step 3006), may needs to carry out some and to revise and process continues in step 3010.Especially, at verification step 3010, the pulse number PNP before whether the pulse number NP measured by process verification is less than.
During pulse number PNP (output " Y " of verification step 3010) before measured pulse number NP is less than, in step 3012, make for time T
excitthe direction DIR of correction reverse.Such as, if direction PDIR T instruction time before
excitshould reduce, then new direction DIR indicates present time T
excitshould increase progressively.On the contrary, if direction PDIR T instruction time before
excitshould increase progressively, then new direction DIR indicates present time T
excitshould successively decrease.
In addition, reset in step 3014 couple counter C in this case, and in step 3016 couple time T
excitupgrade, such as, pass through based on upgraded parameter DIR T
excitvalue carry out successively decreasing or increasing progressively.Such as, in the exemplary embodiment, parameter T
excitchange only clock period, i.e. a T
excit=T
excit± 1.But this change can depend on the speed of control module, the frequency of such as clock signal.
Finally, the parameter in cycle upgrades in step 3018 before, such as, by direction PDIR before the value of direction DIR being distributed to and pulse number PNP before the value of pulse number NP being distributed to.On the contrary, if measured pulse number NP be equal to or greater than before pulse number PNP (output " N " of verification step 3010), then for time T
excitthe direction DIR of correction usually correct.
But, in this case, can verify and whether reach Timeout conditions.Such as, in considered embodiment, in step 3020, the pulse number PNP before whether the pulse number NP measured by process verification equals.
More specifically, the pulse number PNP before if the number N P of measured pulse is not equal to (output " N " of verification step 3020) and consider pulse number PNP (see step 3010) before the pulse number NP before measured by empirical tests is not less than, then the pulse number PNP before measured pulse number NP is greater than.Correspondingly, in this case, revise and to carry out to correct direction and time-out counter C can be reset and time T
excitcan be updated, namely based on current direction DIR increasing or decreasing.Such as, in the present embodiment, process is carried out in step 3014 simply for this reason.
On the contrary, when pulse number PNP (output " Y " of verification step 3020) before measured pulse number NP equals, Timeout conditions may occur.This is due to time T
excitlast change do not affect measured by pulse number.
Correspondingly, in certain embodiments, process continues increasing or decreasing time T
excituntil there occurs the change of pulse number or reach time-out.Such as, in the present embodiment, process continues at verification step 3022 for this reason, and wherein whether process verification counter C reaches timeout value TO.
When counter C does not reach timeout value TO (output " N " of verification step 3022), time T
excitsingle change may not, and counter C increases progressively in step 3024.In addition, process continues to change time T in current direction in this case
excit, namely based on current direction DIR increasing or decreasing T
excit.Such as, in the present embodiment, process is carried out in step 3016 for this reason.
On the contrary, if counter C reaches timeout value TO (output " Y " of verification step 3022), then Timeout conditions is created, that is, time T
excitchange no longer affect pulse number.In this case, possible scheme can be see whether change is in the opposite direction applicable to reaching required pulse number K.Such as, in the exemplary embodiment, before Timeout conditions reaches direction reversion and by time T
excitvalue before being set to.
In the present embodiment, for correction time T
excitdirection DIR can reverse in step 3026.Such as, if direction PDIR T instruction time before
excitshould reduce, then new direction DIR indicates present time T
excitshould increase progressively.On the contrary, if direction PDIR T instruction time before
excitshould increase progressively, then new direction DIR indicates present time T
excitshould successively decrease.
In addition, in this case, reset in step 3028 couple counter C, and in step 3030 by time T
excitvalue T before being set to
excit.Such as, if new direction DIR T instruction time
excitshould increase progressively, then timeout value TO can be added to time T
excit, that is, T
excit=T
excit+ TO, the T before turning back to time-out loop thus
excitvalue.On the contrary, if new direction DIR T instruction time
excitshould successively decrease, then timeout value TO should from time T
excitin be subtracted, i.e. T
excit=T
excit– TO.
Finally, process can continue in step 3018 in this case, to upgrade the parameter in cycle before.Such as, traditional microcontroller has been utilized to verify the convergence of process described above for K=4 and TO=4.
Except the above-mentioned method for arranging minimum pulse number K, different schemes can also be used to carry out setup times T
excit.More specifically, in certain embodiments, via being connected to the Schmidt trigger of pad 202 to determine voltage V
mID, such as, be similar to the respective input circuit 262 (such as, see, Figure 12) for the pad 202 described by pad 204.
In the exemplary embodiment, by driving pad 202 and pad 204 and monitoring the voltage at pad 202 place via Schmidt trigger, can to voltage V
mIDadjust.More specifically, Figure 15 shows calibration process and Figure 16 shows for the voltage at pad 202 place of given time period t and thus at the voltage V at capacitor C1 place
mIDeach waveform.
After beginning step 4000, in step 4002 control module 20 pad 202 is set to voltage VDD and pad 204 is set to high impedance status.Such as, processing unit 230 can utilize logic level " 1 " drive pin 202 and utilize logic level " Z " to drive pin 204.
Correspondingly, this situation corresponds to above with reference to the step 2002 described by Fig. 8.That is, only capacitor C1 to be connected between supply voltage VDD and ground connection GND and capacitor C1 is charged.
Once the voltage V at pad 202 place
202stable (such as after a given time period), is connected to ground connection GND in step 4004 (at time t1 place) control module 20 by pad 204 and pad 202 is set to high impedance status.Such as, processing unit 230 can utilize logic level " Z " to drive pin 202 and utilize logic level " 0 " to drive pin 204.Correspondingly, this situation corresponds to the step 2004 described above with reference to Fig. 8, and wherein sensor 10 and capacitor C1 are connected in parallel and electric charge on capacitor C1 transfers to sensor 10 at least partly.Correspondingly, in this stage, reduce as shown in figure 16 at the voltage at pad 202 place.
In the present embodiment, processing unit 230 monitors the logic level CMP of the output of the Schmidt trigger 262 be associated with pad 202
202.In fact, at voltage V
202remain on Schmidt trigger compared with while on Low threshold, signal CMP
202for high, logic level " 1 " will be.
Working as signal CMP
202namely step-down becomes the moment t2 of logic level " 0 ", voltage V
202arrive comparatively Low threshold TL.Immediately preceding detecting signal CMP
202after step-down, namely immediately after the time t 2, pad 202 is set to voltage VDD in step 4006 and pad 204 is connected to Z by control module 20.
Correspondingly, at time t1 place, capacitor C1 stores following electric charge:
Q
t1＝C1·Vdd，
And only store following electric charge at time t2 capacitor C1:
Q
t2＝C1·TL，
That is, following electric charge is transferred to LC sensor 10:
Q
LC＝Q
t1-Q
t2。
Correspondingly, in this moment, the vibration of LC sensor 10 has started and pin 202 also can be disconnected connection or be placed in high impedance status.On the contrary, in considered embodiment, in this stage, capacitor C1 (that is, pin 202) is connected to supply voltage VDD again to recharge capacitor C1, thus increases mid-point voltage V
mID.Exemplarily, processing unit 230 can utilize logic level " 1 " drive pin 202 and utilize logic level " Z " to drive pin 204.
At moment t3, as signal CMP
202when uprising (namely becoming logic level " 1 "), voltage V
mID/ V
202arrive higher thresholds TH.Therefore, capacitor C1 is charged to time required for TH from TL by the persond eixis between t2 and t3.
Correspondingly, control module 20 can detect the time passed between times t 2 and t 3 and the recharge time T utilizing the time according to passage and determine during routine operation during the calibration phase of step 4008
rechargeperform and recharge, adjust the mid-point voltage V will used during routine operation thus
mID.Such as, the maximum number of pulses in signal CMP can by arranging recharge time for predict as follows:
T
recharge＝(t3-t2)/2，
Because in this case, mid-point voltage V
mIDshould more or less correspond to:
V
MID＝(TH-TL)/2。
Such as, in certain embodiments, the method shown in Fig. 8 is modified for this object, such as, by adding additional step between step 2004 and step 2006.Specifically, once comparison signal CMP
202indicate the voltage V at the first contact 202 places
202lower than comparatively Low threshold TL, the first contact 202 is just again connected to supply voltage VDD, thus described capacitor C1 is recharged by supply voltage VDD.More specifically, capacitor C1 recharge duration T
rechargedetermine according to duration of the above-mentioned duration t3-t2 of calibration phase 4006, thus limit mid-point voltage V
mID.Finally, process stops in stopping step 4010.
In certain embodiments, replace the recharge time between monitoring threshold TL and TH (that is, t2 and t3), process can monitor the discharge time between threshold value TH and TL.Such as, in the exemplary embodiment, process again can be discharged to capacitor C1 after step 4006, such as, by utilizing the driving described with reference to step 4004.That is, once voltage V
202reach threshold value TH and logic level becomes height, pad 204 is just connected to ground connection GND and pad 202 is set to high impedance status.Thus, by monitoring time of when arriving compared with Low threshold TL, that is, when CMP
202logic level step-down, can discharge performance be determined and T discharge time is correspondingly set
discharge.
As a rule, this calibration process also can periodically perform.In addition, in certain embodiments, the closed loop calibration method that before describes (for example, referring to Figure 14 describe for setup times T
excitmethod) also can be used for regulation time T
rechargeor T
discharge.
Correspondingly, as mentioned above, self-tuning reference technique have employed mobile external reference voltage V
mIDthus avoid the advantage of variable internal reference signal.Although describe embodiment in conjunction with CDCS technology, as a rule, this scheme also can be applied in prior art, wherein (a) applies mid-point voltage V see such as Fig. 3 via voltage signal
mID.Therefore, self-tuning is with reference to (STR) technology hands-off tuning time T
excitor directly tuning mid-point voltage V
mID, thus no matter how running parameter (and being generally PVT variable) all meets target pulse number.
The details of structure and embodiment can change to some extent with regard to described content and purely exemplarily be described at this, and can not depart from the scope of the present disclosure limited by claim of enclosing.
Claims (16)
1. for docking a system for LC sensor, it is characterized in that, comprising:
LC sensor;
Controller, comprises the first contact and contacts with second, and wherein said LC sensor is coupling between described first contact of described controller and described second contact; And
Capacitor, is coupling between described first contact and reference voltage;
Described controller also comprises the first switch, second switch and processor, and described processor is configured to
Make described first switch, during the first stage, described first contact is connected to supply voltage, and make described second switch, during the described first stage, described second contact is placed in high impedance status, thus described capacitor is charged by described supply voltage
Make described first switch, during subordinate phase, described first contact is placed in described high impedance status, and make described second switch, during described subordinate phase, described second contact is connected to described reference voltage, thus make described capacitor by Charger transfer to described LC sensor, and
Make described first switch, during the phase III, described first contact is placed in described high impedance status, and make described second switch, during the described phase III, described second contact is placed in described high impedance status, make described LC sensor oscillation.
2. system according to claim 1, is characterized in that, described controller is further configured to the voltage monitored during the described phase III in described second contact position.
3. system according to claim 2, it is characterized in that, described controller is further configured to the duration changing described subordinate phase, to adjust the voltage at described capacitor place in the beginning of described phase III, be limited to the mid-point voltage of the described vibration that described second contact position occurs thus.
4. system according to claim 3, is characterized in that, described reference voltage comprises the first reference voltage; And wherein said controller is by comparing to generate comparison signal by the voltage in described second contact position and at least one the second reference voltage, monitors the described voltage in described second contact position thus.
5. system according to claim 4, is characterized in that, described controller is by counting the described voltage monitored in described second contact position to the number of the pulse in described comparison signal.
6. system according to claim 5, it is characterized in that, described controller, by changing the duration of described subordinate phase to guarantee the minimum pulse number in described comparison signal, changes the duration of described subordinate phase thus to adjust the voltage at described capacitor place in the beginning of described phase III.
7. system according to claim 6, is characterized in that, described comparison signal comprises the first comparison signal, and wherein said controller is further configured to:
Monitor the voltage in described first contact position, make when the described voltage in described first contact position is higher than given higher thresholds, second comparison signal is set to high, and when the described voltage in described first contact position is lower than given comparatively Low threshold, described second comparison signal is set to low; And
Perform calibration.
8. system according to claim 7, is characterized in that, described controller be configured to by under list and perform described calibration:
During the first calibration phase, described first contact is connected with described supply voltage, and described second contact is placed in high impedance status, described capacitor is charged by described supply voltage;
During the second calibration phase, described first contact is placed in high impedance status, and described second contact is connected with described first reference voltage, make described capacitor by Charger transfer to described LC sensor;
During the 3rd calibration phase, once the described voltage of described second comparison signal instruction in described first contact position is lower than described given comparatively Low threshold, just described first contact is connected to supply voltage, described capacitor is charged by described supply voltage; And
During the 4th calibration phase, once the described voltage of described second comparison signal instruction in described first contact position is higher than described given higher thresholds, just determine the duration of described 3rd calibration phase.
9. system according to claim 1, is characterized in that, described controller comprises:
Comparer, is configured to monitor the voltage in described second contact position.
10. system according to claim 1, is characterized in that, described first switch comprises and contacts with described first the ternary output driving circuit be associated; Wherein said second switch comprises and contacts with described second the ternary output driving circuit be associated; And wherein said comparer comprises and contacts with described second the input sense circuit be associated, described input sense circuit comprises Schmidt trigger.
11. systems according to claim 1, is characterized in that, described controller is integrated in integrated circuit.
12. 1 kinds of controllers, for using together with capacitor with LC sensor, described controller comprises:
First contact contacts with second, and wherein said LC sensor will be coupling between described first contact and described second contact, and wherein said capacitor will be coupling between described first contact and reference voltage;
First switch and second switch; And
Processor, described processor is configured to
Make described first switch, during the first stage, described first contact is connected to supply voltage, and make described second switch be configured to, during the described first stage, described second contact is placed in high impedance status, thus described capacitor is charged by described supply voltage
Make described first switch, during subordinate phase, described first contact is placed in described high impedance status, and make described second switch, during described subordinate phase, described second contact is connected to described reference voltage, make described capacitor by Charger transfer to described LC sensor, and
Make described first switch, during the phase III, described first contact is placed in described high impedance status, and make described second switch, during the described phase III, described second contact is placed in described high impedance status, make described LC sensor oscillation.
13. controllers according to claim 12, is characterized in that, described processor is further configured to the voltage monitored during the described phase III in described second contact position.
14. controllers according to claim 13, it is characterized in that, described processor is further configured to the duration changing described subordinate phase, to adjust the voltage at described capacitor place in the beginning of described phase III, be limited to the mid-point voltage of the described vibration that described second contact position occurs thus.
15. controllers according to claim 14, is characterized in that, described reference voltage comprises the first reference voltage; And wherein said processor is by comparing to generate comparison signal by the described voltage in described second contact position and at least one the second reference voltage, monitors the described voltage in described second contact position thus.
16. controllers according to claim 15, is characterized in that, described processor is by counting the described voltage monitored in described second contact position to the number of the pulse in described comparison signal.
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9456506B2 (en) * | 2013-12-20 | 2016-09-27 | International Business Machines Corporation | Packaging for eight-socket one-hop SMP topology |
| US9886074B2 (en) | 2015-11-17 | 2018-02-06 | Stmicroelectronics S.R.L. | Electronic device and sensor device with low power consumption and related methods |
| US9831831B2 (en) * | 2016-01-28 | 2017-11-28 | Arm Limited | Integrated oscillator circuitry |
| FR3047573B1 (en) * | 2016-02-10 | 2018-03-02 | Continental Automotive France | METHOD FOR VOLTAGE CONTROL OF MOUNTED EQUIPMENT IN A MOTOR VEHICLE |
| ES2956816T3 (en) | 2018-11-22 | 2023-12-28 | Behr Hella Thermocontrol Gmbh | Procedure and device for controlling a tensile armature magnet |
| CN112179436A (en) * | 2020-09-28 | 2021-01-05 | 济南瑞泉电子有限公司 | Electromechanical separation detection method for water meter of Internet of things |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4279257A (en) * | 1977-03-31 | 1981-07-21 | Hochstein Peter A | Electromagnetic field responder for respiration monitoring |
| JPS62299755A (en) * | 1986-06-20 | 1987-12-26 | Nitto Gurasufuaibaa Kogyo Kk | Method and apparatus for detecting conductive material in glass fiber |
| DE3812633A1 (en) * | 1988-04-15 | 1989-10-26 | Daimler Benz Ag | METHOD FOR CONTACTLESS RESISTANCE MEASUREMENT |
| DE3923398C1 (en) | 1989-07-14 | 1991-01-03 | Ziegler, Horst, Prof. Dr., 4790 Paderborn, De | |
| US5278512A (en) * | 1992-05-15 | 1994-01-11 | Richard Goldstein | Apparatus and method for continuously monitoring grounding conductor resistance in power distribution systems |
| JP3216938B2 (en) * | 1993-06-08 | 2001-10-09 | 株式会社日立製作所 | RF probe for MRI and magnetic resonance imaging apparatus |
| US5793640A (en) * | 1996-12-26 | 1998-08-11 | Vlsi Technology, Inc. | Capacitance measurement using an RLC circuit model |
| US6560567B1 (en) * | 1999-03-03 | 2003-05-06 | Sitaramao S. Yechuri | Method and apparatus for measuring on-wafer lumped capacitances in integrated circuits |
| US6815958B2 (en) * | 2003-02-07 | 2004-11-09 | Multimetrixs, Llc | Method and apparatus for measuring thickness of thin films with improved accuracy |
| EP1894025A1 (en) * | 2005-06-03 | 2008-03-05 | Synaptics Incorporated | Methods and systems for detecting a capacitance using sigma-delta measurement techniques |
| US7535021B2 (en) * | 2005-11-01 | 2009-05-19 | Alpha & Omega Semiconductor, Ltd. | Calibration technique for measuring gate resistance of power MOS gate device at water level |
| US7282927B1 (en) * | 2006-06-21 | 2007-10-16 | Eastman Kodak Company | Use of a configurable electronic controller for capacitance measurements and cable break detection |
| US7619421B2 (en) * | 2006-08-31 | 2009-11-17 | Microtune (Texas), L.P. | Systems and methods for detecting capacitor process variation |
| US7755351B2 (en) * | 2007-01-23 | 2010-07-13 | The Boeing Company | Method and apparatus for detecting inconsistencies in fiber reinforced resin parts using eddy currents |
| US8178355B2 (en) * | 2008-09-15 | 2012-05-15 | Platypus Technologies, Llc. | Detection of vapor phase compounds by changes in physical properties of a liquid crystal |
| US8384378B2 (en) * | 2009-02-27 | 2013-02-26 | Kimberly-Clark Worldwide, Inc. | Conductivity sensor |
| US8710853B2 (en) * | 2010-08-31 | 2014-04-29 | Infineon Technologies Ag | Capacitance sensing |
| US8979362B2 (en) * | 2012-02-15 | 2015-03-17 | Infineon Technologies Ag | Circuit and method for sensing a physical quantity, an oscillator circuit, a smartcard, and a temperature-sensing circuit |
| US8723610B2 (en) * | 2012-07-27 | 2014-05-13 | Broadcom Corporation | Voltage controlled oscillator |
| US8836349B2 (en) * | 2012-08-15 | 2014-09-16 | Robert Bosch Gmbh | Capacitive sensor |
-
2015
- 2015-06-15 US US14/739,195 patent/US10162038B2/en active Active
- 2015-07-03 EP EP15175313.4A patent/EP2966410B1/en active Active
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-
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- 2018-12-07 US US16/213,534 patent/US10451703B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110260892A (en) * | 2018-03-12 | 2019-09-20 | 巴鲁夫有限责任公司 | Inductance type transducer and method for running inductance type transducer |
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