CN205071480U - Supplementary silver foil laminating top PIN tool - Google Patents
Supplementary silver foil laminating top PIN tool Download PDFInfo
- Publication number
- CN205071480U CN205071480U CN201520813453.6U CN201520813453U CN205071480U CN 205071480 U CN205071480 U CN 205071480U CN 201520813453 U CN201520813453 U CN 201520813453U CN 205071480 U CN205071480 U CN 205071480U
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- China
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- pin
- cover plate
- silver foil
- upper cover
- wiring board
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Abstract
The utility model provides a supplementary silver foil laminating top PIN tool, relates to the circuit board production field. Include and follow bottom plate, well apron and the upper cover plate that upwards stacks in proper order down, it pushes up PIN to be provided with the circuit board location PIN who is used for the circuit board location and the drawing of patterns that is used for the silver foil drawing of patterns on the bottom plate, the position that corresponds of pushing up PIN with the drawing of patterns on and gate board location PIN's corresponding position and the well apron on well apron and the upper cover plate is provided with the PIN hole respectively, the upper cover plate is provided with than the drawing of patterns top slightly big quadrangle hole of PIN with drawing of patterns top PIN's the position that corresponds, corresponding PIN hole and the quadrangle hole that PIN upwards passed well apron and upper cover plate is respectively pushed up in the circuit board location PIN and the drawing of patterns on the bottom plate. The utility model discloses can the guaranteed quality, reduced manufacturing cost, promote work efficiency again.
Description
Technical field
The utility model relates to wiring board production field, is specially a kind of auxiliary silver foil laminating top PIN tool.
Background technology
Flexible print circuit board has flexing because of it, the size in space and shape can be able to be utilized to carry out three-dimensional space three-dimensional wiring according to product, with the requirement that applicable electronic product is light, thin, short, little, be therefore usually used in the product of the high precision such as notebook computer, CD-ROM device, mobile phone, digital camera and car electronics.And the product of part high precision there are certain requirements electromagnetic wave, therefore often a kind of auxiliary material being called silver foil is sticked in its whole property in surface when flexible print circuit board makes, so just, can effectively prevent Electromagnetic Interference from using, to improve the serviceability of wiring board.
Because silver foil raw material are combined into by conducting resinl, release film, release film covers on conducting resinl, at present on flexible circuit board Surface Machining is fitted after the auxiliary material of silver foil, make for ease of operations such as other text printouts of rear station, need further the release film of pasted silver foil surface coverage to be removed, only leave and take conductive glue.But because the release film of silver foil conducting resinl and surface coverage is close to, be difficult to peel off this release film by instruments such as artificial tweezers, strong stripping also can cause silver foil surface scratches, affects plank quality, and greatly reduces person works's efficiency.
Utility model content
The purpose of this utility model is to provide a kind of auxiliary silver foil laminating top PIN tool, and the release film pasting silver foil surface for improving above-mentioned flexible circuit board institute peels off problem, reduction product fraction defective, and promotes operating efficiency.
The technical scheme realizing above-mentioned purpose is: comprise the base plate, cover plate and the upper cover plate that stack successively from bottom to top, described base plate is provided with the wiring board location PIN and the demoulding top PIN for the silver foil demoulding for wiring board location, described cover plate and upper cover plate are located with wiring board in the correspondence position of PIN and cover plate and be respectively arranged with PIN hole with the correspondence position of demoulding top PIN, the correspondence position of described upper cover plate and demoulding top PIN is provided with the quadrilateral hole bigger compared with demoulding top PIN; Wiring board location PIN and demoulding top PIN on described base plate is upward through corresponding PIN hole and the quadrilateral hole of cover plate and upper cover plate respectively.
The length of side of four sides of described quadrilateral hole is 1.5-2.5mm, and demoulding top PIN is positioned at the position, drift angle of quadrilateral hole.
One side end face of described base plate, cover plate and upper cover plate is connected as one by adhesive tape.
Using method of the present utility model:
1, raise upper cover plate, be placed in cover plate by the wiring board being fitted with silver foil, wiring board is provided with and locates PIN, PIN hole that demoulding top PIN is corresponding with wiring board, the PIN hole on wiring board is placed through on corresponding wiring board location PIN and demoulding top PIN respectively.
The silver foil that wiring board is fitted is run through in the PIN hole that wiring board locates PIN corresponding with wiring board, and the silver foil that wiring board is fitted is not run through in PIN hole corresponding with demoulding top PIN on wiring board; Wiring board location PIN is arranged on the scrap area (being the outer part of plate of shaping rear removal) at the corner of wiring board and middle part, and demoulding top PIN is 2-4, is arranged in the diagonal angle of silver foil and is silver foil corner location.
2, upper cover plate is covered, and firmly press down upper cover plate, because the silver foil that wiring board is fitted is not run through in PIN hole corresponding with demoulding top PIN on wiring board, and the position of corresponding demoulding top PIN is provided with quadrilateral hole on upper cover plate, the silver foil of therefore corresponding with demoulding top PIN on wiring board PIN hole site upwards jack-up under the effect of demoulding top PIN, and most of area of silver foil is all lived by upper cover plate shelves, now by the corner silver foil of jack-up because stressed conducting resinl and the release film one jiao that make successfully is separated.
3, eventually raise upper cover plate and cover plate, and take out wiring board; Because silver foil edge has backed down tearing port, personnel so just can be facilitated by this tearing port rapidly and with peeling off whole release film with imitating.
The utility model can guaranteed quality, reduces production cost, promotes operating efficiency again.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is vertical view of the present utility model;
Fig. 3 is working state figure of the present utility model.
Embodiment
As shown in Figure 1, 2, 3, the utility model comprises the base plate 1, cover plate 2 and the upper cover plate 3 that stack successively from bottom to top, and a side end face of base plate 1, cover plate 2 and upper cover plate 3 is connected as one by adhesive tape 7.
Base plate 1 is provided with the wiring board location PIN4 and the demoulding top PIN5 for the silver foil demoulding for wiring board location, cover plate 2 and upper cover plate 3 are located with wiring board in the correspondence position of PIN4 and cover plate 2 and be respectively arranged with PIN hole 6 with the correspondence position of demoulding top PIN5, upper cover plate 3 is provided with the quadrilateral hole 13 bigger compared with demoulding top PIN5 with the correspondence position of demoulding top PIN5, the length of side of four sides of quadrilateral hole 13 is 1.5-2.5mm, and demoulding top PIN5 is positioned at the position, drift angle of quadrilateral hole.
Wiring board location PIN4 and demoulding top PIN5 on base plate 1 is upward through corresponding PIN hole 6 and the quadrilateral hole 13 of cover plate 2 and upper cover plate 3 respectively.
During use, the wiring board 9 being fitted with silver foil 8 is placed between cover plate 2 and upper cover plate 3, and silver foil 8 comprises the conducting resinl 12 being positioned at upper strata release film 11 and being positioned at lower floor.Wiring board 9 is provided with and locates PIN4, PIN hole 10 that demoulding top PIN5 is corresponding with wiring board, the PIN hole 10 on wiring board 9 is placed through on the PIN4 and demoulding top PIN5 of corresponding line plate location respectively.
Wiring board 9 is located PIN hole 10 corresponding to PIN4 with wiring board and run through the silver foil 8 that wiring board 9 is fitted, the silver foil 8 that wiring board 9 is fitted is not run through in PIN hole 10 corresponding with demoulding top PIN5 on wiring board 9; Wiring board location PIN4 is arranged on the scrap area (being the outer part of plate of shaping rear removal) at the corner of wiring board 9 and middle part, and demoulding top PIN5 is 2-4, is arranged in the diagonal angle of silver foil 8 and is the corner location of silver foil 8.
Claims (3)
1. an auxiliary silver foil laminating top PIN tool, it is characterized in that: comprise the base plate, cover plate and the upper cover plate that stack successively from bottom to top, described base plate is provided with the wiring board location PIN and the demoulding top PIN for the silver foil demoulding for wiring board location, described cover plate and upper cover plate are located with wiring board in the correspondence position of PIN and cover plate and be respectively arranged with PIN hole with the correspondence position of demoulding top PIN, the correspondence position of described upper cover plate and demoulding top PIN is provided with the quadrilateral hole bigger compared with demoulding top PIN; Wiring board location PIN and demoulding top PIN on described base plate is upward through corresponding PIN hole and the quadrilateral hole of cover plate and upper cover plate respectively.
2. one according to claim 1 is assisted silver foil to fit and is pushed up PIN tool, and it is characterized in that: the length of side of four sides of described quadrilateral hole is 1.5-2.5mm, demoulding top PIN is positioned at the position, drift angle of quadrilateral hole.
3. one according to claim 1 and 2 is assisted silver foil to fit and is pushed up PIN tool, it is characterized in that: a side end face of described base plate, cover plate and upper cover plate is connected as one by adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520813453.6U CN205071480U (en) | 2015-10-21 | 2015-10-21 | Supplementary silver foil laminating top PIN tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520813453.6U CN205071480U (en) | 2015-10-21 | 2015-10-21 | Supplementary silver foil laminating top PIN tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071480U true CN205071480U (en) | 2016-03-02 |
Family
ID=55397976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520813453.6U Active CN205071480U (en) | 2015-10-21 | 2015-10-21 | Supplementary silver foil laminating top PIN tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071480U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770521A (en) * | 2020-12-17 | 2021-05-07 | 江西弘信柔性电子科技有限公司 | Separation process of silver foil and release film for PCB |
-
2015
- 2015-10-21 CN CN201520813453.6U patent/CN205071480U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770521A (en) * | 2020-12-17 | 2021-05-07 | 江西弘信柔性电子科技有限公司 | Separation process of silver foil and release film for PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |