CN205028900U - 抗辐照高速光电耦合器 - Google Patents

抗辐照高速光电耦合器 Download PDF

Info

Publication number
CN205028900U
CN205028900U CN201520710779.6U CN201520710779U CN205028900U CN 205028900 U CN205028900 U CN 205028900U CN 201520710779 U CN201520710779 U CN 201520710779U CN 205028900 U CN205028900 U CN 205028900U
Authority
CN
China
Prior art keywords
pole piece
tube socket
base
utility
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201520710779.6U
Other languages
English (en)
Inventor
王四新
宋亚美
殷伟伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BEIJING RUIPU BEIGUANG ELECTRONICS Co Ltd
Original Assignee
BEIJING RUIPU BEIGUANG ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING RUIPU BEIGUANG ELECTRONICS Co Ltd filed Critical BEIJING RUIPU BEIGUANG ELECTRONICS Co Ltd
Priority to CN201520710779.6U priority Critical patent/CN205028900U/zh
Application granted granted Critical
Publication of CN205028900U publication Critical patent/CN205028900U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Optical Measuring Cells (AREA)

Abstract

本实用新型提供了一种可靠性好的抗辐照高速光电耦合器，包括管座，位于管座上方的外盖板，所述管座内设有多个极片，伸出管座；所述管座外缘设有胶套，所述胶套将极片伸出管座部分包裹住；所述管座上设有凹槽，所述一个极片上设有另一凹槽，所述凹槽内设有光敏芯片，所述另一凹槽内设有发光芯片，所述光敏芯片和发光芯片分别通过金丝与极片相连。本实用新型的抗辐照高速光电耦合器，结构紧凑，封装效果好，性能可靠。

Description

抗辐照高速光电耦合器
技术领域
本实用新型涉及一种光电耦合器，尤其是一种抗辐照高速光电耦合器。
背景技术
随着中国航天事业的发展，航天用户对半导体器件抗辐照、高可靠的要求日益突出。以前此类器件抗辐照性能差、可靠性差，不能作为航天器件适用。因此对器件抗辐照性能、高可靠性的需求迫在眉睫。
实用新型内容
本实用新型提供了一种可靠性好的抗辐照高速光电耦合器。
实现本实用新型目的的抗辐照高速光电耦合器，包括管座，位于管座上方的外盖板，所述管座内设有多个极片，伸出管座；所述管座外缘设有胶套，所述胶套将极片伸出管座部分包裹住；所述管座上设有凹槽，所述一个极片上设有另一凹槽，所述凹槽内设有光敏芯片，所述另一凹槽内设有发光芯片，所述光敏芯片和发光芯片分别通过金丝与极片相连。
本实用新型的抗辐照高速光电耦合器的有益效果如下：
本实用新型的抗辐照高速光电耦合器，结构紧凑，封装效果好，性能可靠。
附图说明
图1为本实用新型的抗辐照高速光电耦合器的结构示意图。
图2为图1的俯视图。
具体实施方式
如图1、2所示，本实用新型的抗辐照高速光电耦合器，包括管座1，位于管座1上方的外盖板2，所述管座1内设有多个极片6，伸出管座1；所述管座1外缘设有胶套7，所述胶套7将极片6伸出管座1部分包裹住；所述管座1上设有凹槽，所述一个极片6上设有另一凹槽，所述凹槽内设有光敏芯片4，所述另一凹槽内设有发光芯片3，所述光敏芯片4和发光芯片3分别通过金丝5与极片6相连。
上面所述的实施例仅仅是对本实用新型的优选实施方式进行描述，并非对本实用新型的范围进行限定，在不脱离本实用新型设计精神前提下，本领域普通工程技术人员对本实用新型技术方案做出的各种变形和改进，均应落入本实用新型的权利要求书确定的保护范围内。

Claims (1)

1.抗辐照高速光电耦合器，其特征在于：包括管座，位于管座上方的外盖板，所述管座内设有多个极片，伸出管座；所述管座外缘设有胶套，所述胶套将极片伸出管座部分包裹住；所述管座上设有凹槽，所述一个极片上设有另一凹槽，所述凹槽内设有光敏芯片，所述另一凹槽内设有发光芯片，所述光敏芯片和发光芯片分别通过金丝与极片相连。
CN201520710779.6U 2015-09-15 2015-09-15 抗辐照高速光电耦合器 Active CN205028900U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520710779.6U CN205028900U (zh) 2015-09-15 2015-09-15 抗辐照高速光电耦合器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520710779.6U CN205028900U (zh) 2015-09-15 2015-09-15 抗辐照高速光电耦合器

Publications (1)

Publication Number Publication Date
CN205028900U true CN205028900U (zh) 2016-02-10

Family

ID=55261412

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520710779.6U Active CN205028900U (zh) 2015-09-15 2015-09-15 抗辐照高速光电耦合器

Country Status (1)

Country Link
CN (1) CN205028900U (zh)

Similar Documents

Publication Publication Date Title
CN205028900U (zh) 抗辐照高速光电耦合器
CN204375713U (zh) 电池片旋转搬运机构
CN103759228A (zh) 表面贴装型食人鱼led灯
CN203112095U (zh) 用于轮胎自动化生产线的垂直分流输送装置
CN202585395U (zh) 一种dip双岛引线框结构
CN202977524U (zh) 贴片式led灯珠
CN203339165U (zh) 一种双路表贴高速光电耦合器
CN202977408U (zh) 一种用于灯串ic封装的引线支架
CN205039180U (zh) 一种新型霍尔器件封装结构
CN203191745U (zh) 一种隔离式安全栅
CN202709004U (zh) 多颗led灯注塑封装装置
CN203241453U (zh) 一种rs485通讯电路
CN203520075U (zh) 一种专变采集终端中的控制模块
CN204332998U (zh) 一种高强度led芯片
CN203941918U (zh) 一种主栅线与细栅线分面设置的太阳能电池片
CN203327824U (zh) 一种防鸟占位器
CN202852701U (zh) 一种led球泡灯真空封装设备用小车
CN203797583U (zh) 表面贴装型食人鱼led灯
CN205750386U (zh) 一种无人机设备信息采集系统
CN208622763U (zh) 一种高压芯片用电极
CN203465988U (zh) 新型复合绝缘子间隔棒用防鸟害均压环
CN202259410U (zh) 内置电阻式led发光二极管
CN204276372U (zh) 一种钢球分装机
CN201859874U (zh) 一种7p引线框架
CN203942489U (zh) 光伏发电站用新型汇流箱

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant