CN205017611U - Temperature control system of electron cigarette heat -generating body - Google Patents
Temperature control system of electron cigarette heat -generating body Download PDFInfo
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- CN205017611U CN205017611U CN201520412908.3U CN201520412908U CN205017611U CN 205017611 U CN205017611 U CN 205017611U CN 201520412908 U CN201520412908 U CN 201520412908U CN 205017611 U CN205017611 U CN 205017611U
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Abstract
The utility model relates to a temperature control system of electron cigarette heat -generating body, central processing unit's input is connected to the output of listening AD feedback module including the heating, and the input of heating module is connected to central processing unit's output, and the input of display module is connected to central processing unit's output, and central processing unit's input is connected to button input module's output, and mains operated module electric connection power management module, power management module connect central processing unit central processing unit 1, voltage central processing unit 2's output connection central processing unit's input, the output of mains operated module is connected to voltage detection module's input, and the input that joins conversely the module is prevented and connect the mains operated module that the output connection central processing unit's of module input, power management module difference electric connection display module and central processing unit are prevented joining conversely by the battery to the battery. Meanwhile, the semiconductor laser treatment device has a simple structure and is low in cost.
Description
Technical field
The utility model belongs to electronic technology field, particularly relates to a kind of temperature control system of electronic cigarette heater.
Background technology
For market is all be in power adjustments or NTC regulating and controlling to current electronic cigarette method for heating and controlling.Power adjustments causes the non-constant of temperature, easily low during height during boiling hot mouth temperature, likely causes smell of scorching.Atomizer NTC temperature is adopted to control, if be placed on complexity and compatibility that atomizer can cause atomizer to be connected with battery case at NTC, as on control board with or other power devices on detection can cause the inaccurate, error larger of actual temperature and detected temperatures.But use electronic cigarette heater temperature control technology, by the change of heating-up temperature, thus cause the change of heater resistance value, system is by determining the monitoring to temperature to the detecting of resistance value.
Utility model content
The purpose of this utility model is the temperature control system providing a kind of electronic cigarette heater, is intended to solve above-mentioned technical problem.
The utility model realizes like this, a kind of temperature control system of electronic cigarette heater, this temperature control system comprises central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, heating module, heating detecting AD feedback module and keyboard input module, the output of described heating detecting AD feedback module connects the input of described central processor MCU, the output of described central processor MCU connects the input of described heating module, the output of described central processor MCU connects the input of described display module, the output of described keyboard input module connects the input of described central processor MCU, described power supply module is electrically connected described power management module, described power management module connects described central processor MCU two-way communication, the output of described detecting voltage module connects the input of described central processor MCU, the input of described detecting voltage module connects the output of described power supply module, the input of described cell anti-reverse connection module connects described power supply module, the output of described cell anti-reverse connection module connects the input of described central processor MCU, described power supply module is electrically connected described display module and central processor MCU respectively.
Further technical scheme of the present utility model is: described power management module comprises electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post P4, the 1st pin VBUS of described binding post P4 connects the positive pole of electric capacity C19 respectively, the 4th pin VCC of chip U5, 8 pin CE, one end of the 7th pin CHRG contact resistance R11 of described chip U5, the 2nd pin PROG of described chip U5 is by resistance R12 ground connection, the 5th pin BAT of described chip U5 connects the positive pole of described electric capacity C20, the negative pole of described electric capacity C20 connects the 1st pin TEMP and the ground connection of described chip U5, the 3rd pin GND of described chip U5, 6 pin STDBY, the negative pole of electric capacity C19, the 4th pin GND of binding post P4, the equal ground connection of 5 pin SHLD.
Further technical scheme of the present utility model is: described cell anti-reverse connection module comprises resistance R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of described metal-oxide-semiconductor Q4 connects one end of described resistance R14, the drain electrode of described metal-oxide-semiconductor Q4 connects the drain electrode of metal-oxide-semiconductor Q3 and the 2nd pin of binding post P5 respectively, one end of the grid contact resistance R13 of described metal-oxide-semiconductor Q3,1st pin of the other end of described resistance R13, the other end of resistance R14 and binding post P5 connects the 5th pin VCC of described chip U5, the source ground of described metal-oxide-semiconductor respectively.
Further technical scheme of the present utility model is: the second power supply unit that described power supply module comprises first power supply unit of powering for display module and powers for central processing unit, described first power supply unit is identical with the structure of described second power supply unit, described first power supply unit comprises electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L 1, the Vin pin of described chip U2 connects the positive pole of described electric capacity C7 and one end of electric capacity C8 respectively, the Vout pin of described chip U2 connects one end of described electric capacity C9 respectively, the positive pole of electric capacity C10 and one end of inductance L, the negative pole of described electric capacity C7, the other end of electric capacity C8, the GND pin of chip U2, one end of electric capacity C9 and the equal ground connection of negative pole of electric capacity C10, second power supply unit comprises electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14 and inductance L 2, the Vin pin of described chip U3 connects the positive pole of described electric capacity C11 and one end of electric capacity C12 respectively, the Vout pin of described chip U3 connects one end of described electric capacity C13, the positive pole of electric capacity C14 and one end of inductance L respectively, the equal ground connection of negative pole of the negative pole of described electric capacity C11, the other end of electric capacity C12, the GND pin of chip U3, one end of electric capacity C13 and electric capacity C14.
Further technical scheme of the present utility model is: described display module comprises chip U1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, the 28th pin VPP of described chip U1 is through described electric capacity C6 ground connection, the 27th pin VCOMH of described chip U1 is through described electric capacity C5 ground connection, the 26th pin IPEF of described chip U1 is through described resistance R1 ground connection, the 9th pin VDD1 of described chip U1 is through described electric capacity C3 ground connection, the 6th pin VDD2 of chip U1 is through described electric capacity C4 ground connection, described chip U1 the 4th pin C2P connects the 5th pin C2N of described chip U1 through described electric capacity C2, described chip U1 the 2nd pin CIN connects the 3rd pin CIP of described chip U1 through described electric capacity C1, the 8th pin VSS of described chip U1, 11 pin IM1, 12 pin IM2, 16 pin WRB, 17 pin RDB, 20 pin D2, 21 pin D3, 22 pin D4, 23 pin D5, 24 pin D6, the equal ground connection of 25 pin D7.
Further technical scheme of the present utility model is: described central processor MCU comprises chip U4, electric capacity C15, electric capacity C16, interrupteur SW 1 and interrupteur SW 2,7th pin VDD, the 8 pin VDD of described chip U4 are respectively through described electric capacity C15 ground connection, the 13rd pin VDD1 of described chip U4 is through described electric capacity C16 ground connection, the 19th pin EICKP1.0 of described chip U4 connects one end of described interrupteur SW 1, the 20th pin EIDKP1.1 of described chip U4 connects one end of described interrupteur SW 2, the 18th pin VSS1 of described chip U4,10 pin VSS ground connection.
Further technical scheme of the present utility model is: described heating detecting AD feedback module comprises resistance R10, triode Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding post P3 and electric capacity C18, one end of described resistance R10 connects the base stage of described triode Q1, the collector electrode of described triode Q1 connects the grid of described metal-oxide-semiconductor Q2 and one end of resistance R9 respectively, the drain electrode of described metal-oxide-semiconductor connects the 1st pin of binding post P3, the 2nd pin one end of resistance R7 and one end of resistance R8 respectively of described binding post P3, the other end of described resistance R8 is through electric capacity C18 ground connection, the other end of described resistance R7 and the equal ground connection of emitter of triode Q1.
Further technical scheme of the present utility model is: described heating module comprises resistance Rt.
Further technical scheme of the present utility model is: described keyboard input module comprises resistance R2, resistance R3, resistance R4, button S1, button S2 and button S3, one end of described resistance R2 connects one end of described button S1, one end of described resistance R3 connects one end of described button S2, one end of described resistance R4 connects one end of described button S3, the equal ground connection of the other end of the described other end of button S1, the other end of button S2 and button S3.
Further technical scheme of the present utility model is: described detecting voltage module block comprises resistance R5, resistance R6 and electric capacity C17, one end of described resistance R5 connects one end of described resistance R6 and one end of electric capacity C17 respectively, the other end of described resistance R6 and the equal ground connection of the other end of electric capacity C17.
The beneficial effects of the utility model are: the application's structure is simple, easy to use, with low cost; Detect more accurate, control globality stability and the harmony of effectively implementation system more easily.Adopt built-in boosting, improve communication speed, operation stability is strong.
Accompanying drawing explanation
Fig. 1 is the structured flowchart of the temperature control system of the electronic cigarette heater that the utility model embodiment provides;
Fig. 2 is the electrical schematic diagram of the power supply module that the utility model embodiment provides;
Fig. 3 be the utility model embodiment provide power management module, cell anti-reverse connection module electrical schematic diagram;
Fig. 4 is the electrical schematic diagram of the display module that the utility model embodiment provides;
Fig. 5 is the electrical schematic diagram of the central processing unit that the utility model embodiment provides;
Fig. 6 is the electrical schematic diagram of the heating detecting AD feedback module that the utility model embodiment provides;
Fig. 7 is the electrical schematic diagram of the keyboard input module that the utility model embodiment provides;
Fig. 8 is the electrical schematic diagram of the detecting voltage module that the utility model embodiment provides;
Fig. 9 is the curve relation figure of the temperature that provides of the utility model embodiment and AD value;
Figure 10 is the temperature curve target temperature 180 degree of corresponding data points after the control that provides of the utility model embodiment;
Figure 11 is that the utility model embodiment provides PID control software design control flow chart.
Embodiment
Fig. 1 shows the temperature control system of the electronic cigarette heater that the utility model provides, this temperature control system comprises central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, heating module, heating detecting AD feedback module and keyboard input module, the output of described heating detecting AD feedback module connects the input of described central processor MCU, the output of described central processor MCU connects the input of described heating module, the output of described central processor MCU connects the input of described display module, the output of described keyboard input module connects the input of described central processor MCU, described power supply module is electrically connected described power management module, described power management module connects described central processor MCU two-way communication, the output of described detecting voltage module connects the input of described central processor MCU, the input of described detecting voltage module connects the output of described power supply module, the input of described cell anti-reverse connection module connects described power supply module, the output of described cell anti-reverse connection module connects the input of described central processor MCU, described power supply module is electrically connected described display module and central processor MCU respectively.
Described power management module comprises electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post P4, the 1st pin VBUS of described binding post P4 connects the positive pole of electric capacity C19 respectively, the 4th pin VCC of chip U5, 8 pin CE, one end of the 7th pin CHRG contact resistance R11 of described chip U5, the 2nd pin PROG of described chip U5 is by resistance R12 ground connection, the 5th pin BAT of described chip U5 connects the positive pole of described electric capacity C20, the negative pole of described electric capacity C20 connects the 1st pin TEMP and the ground connection of described chip U5, the 3rd pin GND of described chip U5, 6 pin STDBY, the negative pole of electric capacity C19, the 4th pin GND of binding post P4, the equal ground connection of 5 pin SHLD.
Described cell anti-reverse connection module comprises resistance R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of described metal-oxide-semiconductor Q4 connects one end of described resistance R14, the drain electrode of described metal-oxide-semiconductor Q4 connects the drain electrode of metal-oxide-semiconductor Q3 and the 2nd pin of binding post P5 respectively, one end of the grid contact resistance R13 of described metal-oxide-semiconductor Q3,1st pin of the other end of described resistance R13, the other end of resistance R14 and binding post P5 connects the 5th pin VCC of described chip U5, the source ground of described metal-oxide-semiconductor respectively.
The second power supply unit that described power supply module comprises first power supply unit of powering for display module and powers for central processing unit, described first power supply unit is identical with the structure of described second power supply unit, described first power supply unit comprises electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L 1, the Vin pin of described chip U2 connects the positive pole of described electric capacity C7 and one end of electric capacity C8 respectively, the Vout pin of described chip U2 connects one end of described electric capacity C9 respectively, the positive pole of electric capacity C10 and one end of inductance L, the negative pole of described electric capacity C7, the other end of electric capacity C8, the GND pin of chip U2, one end of electric capacity C9 and the equal ground connection of negative pole of electric capacity C10, second power supply unit comprises electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14 and inductance L 2, the Vin pin of described chip U3 connects the positive pole of described electric capacity C11 and one end of electric capacity C12 respectively, the Vout pin of described chip U3 connects one end of described electric capacity C13, the positive pole of electric capacity C14 and one end of inductance L respectively, the equal ground connection of negative pole of the negative pole of described electric capacity C11, the other end of electric capacity C12, the GND pin of chip U3, one end of electric capacity C13 and electric capacity C14.
Described display module comprises chip U1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, the 28th pin VPP of described chip U1 is through described electric capacity C6 ground connection, the 27th pin VCOMH of described chip U1 is through described electric capacity C5 ground connection, the 26th pin IPEF of described chip U1 is through described resistance R1 ground connection, the 9th pin VDD1 of described chip U1 is through described electric capacity C3 ground connection, the 6th pin VDD2 of chip U1 is through described electric capacity C4 ground connection, described chip U1 the 4th pin C2P connects the 5th pin C2N of described chip U1 through described electric capacity C2, described chip U1 the 2nd pin CIN connects the 3rd pin CIP of described chip U1 through described electric capacity C1, the 8th pin VSS of described chip U1, 11 pin IM1, 12 pin IM2, 16 pin WRB, 17 pin RDB, 20 pin D2, 21 pin D3, 22 pin D4, 23 pin D5, 24 pin D6, the equal ground connection of 25 pin D7.
Described central processor MCU comprises chip U4, electric capacity C15, electric capacity C16, interrupteur SW 1 and interrupteur SW 2,7th pin VDD, the 8 pin VDD of described chip U4 are respectively through described electric capacity C15 ground connection, the 13rd pin VDD1 of described chip U4 is through described electric capacity C16 ground connection, the 19th pin EICKP1.0 of described chip U4 connects one end of described interrupteur SW 1, the 20th pin EIDKP1.1 of described chip U4 connects one end of described interrupteur SW 2, the 18th pin VSS1 of described chip U4,10 pin VSS ground connection.
Described heating detecting AD feedback module comprises resistance R10, triode Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding post P3 and electric capacity C18, one end of described resistance R10 connects the base stage of described triode Q1, the collector electrode of described triode Q1 connects the grid of described metal-oxide-semiconductor Q2 and one end of resistance R9 respectively, the drain electrode of described metal-oxide-semiconductor connects the 1st pin of binding post P3, the 2nd pin one end of resistance R7 and one end of resistance R8 respectively of described binding post P3, the other end of described resistance R8 is through electric capacity C18 ground connection, the other end of described resistance R7 and the equal ground connection of emitter of triode Q1.
Described heating module comprises resistance Rt.
Described keyboard input module comprises resistance R2, resistance R3, resistance R4, button S1, button S2 and button S3, one end of described resistance R2 connects one end of described button S1, one end of described resistance R3 connects one end of described button S2, one end of described resistance R4 connects one end of described button S3, the equal ground connection of the other end of the described other end of button S1, the other end of button S2 and button S3.
Described detecting voltage module block comprises resistance R5, resistance R6 and electric capacity C17, and one end of described resistance R5 connects one end of described resistance R6 and one end of electric capacity C17 respectively, the other end of described resistance R6 and the equal ground connection of the other end of electric capacity C17.
Display module adopts built-in boosting, SPI tri-line communication interface pattern, stable at a high speed.
Power management module, have employed Q3, and Q4 two MOS prevent battery reversal connection to the burnout phenomenon of other devices of circuit.
Power supply module, have employed two-way Power supply mode, a road powers to OLED, due to the built-in boosting of display module, prevents power supply disturbance MCU power supply, causes AD to calculate inaccurate, so the mode that have employed isolation is powered.
MCU (SN8F27E93L) central processing unit, has 1KRAM, 16KROM, and 12 high-precision adc input channels, have the PWM of built in hardware module, detects more smart Zhu, controls globality stability and the harmony of effectively implementation system more easily.
Data between heater actual temperature and actual measurement AD value are as shown in the table.
The curve relation figure of temperature and AD value is as shown in 9 figure.
According to above-mentioned mass data, data fitting analysis obtains the calculated relationship of AD and temperature T
T=753.3-1.556ad+0.000787ad*ad, above-mentioned calculated relationship is different according to heat-generating system, and the calculated relationship generated is not identical yet, and therefore above-mentioned calculated relationship refers to as is that an embodiment is to support this heat-generating system.
Can calculate the temperature value T0 corresponding to different AD by this formula, output display, feeds back to MCU simultaneously, and MCU acquisition value of feedback is only seen with set point and compared, and utilizes pid algorithm to realize the thermostatic control realized accurately heater.
In process control, the PID controller (also known as PID adjuster) carrying out controlling in the ratio (P) of deviation, integration (I) and differential (D) is a kind of automatic controller be most widely used.It is simple that it has principle, is easy to realize, and widely applicable, controling parameters is separate, the advantage such as selected fairly simple of parameter; And can prove in theory, for the typical subject of process control---the control object of " first-order lag+purely retarded " and " second-order lag+purely retarded ", PID controller is a kind of optimal control.PID Rule adjusting is a kind of effective ways that continuous system dynamic quality corrects, and its way of self-regulation is easy, structural change flexibly (PI, PD ...).
The selection of parameter:
1. proportionality coefficient P is on the impact of systematic function: proportionality coefficient strengthens, and makes being active in one's movements of system, and speed is accelerated, and steady-state error reduces; P is bigger than normal, and the number of oscillation is added, and regulating time lengthens; When P is too large, system can be tending towards unstable; P is too little, can make the slow in one's movements of system again.P can select negative, and this is mainly determined by the characteristic of actuator, transducer and control object.If the symbol of P select improper object measured value will from the set point of control objectives more and more away from, the symbol if there is such situation P just must negate.Simultaneously it should be noted that the P parameter of the PID controll block of the strategy controller of power control is the gain in PID control.
2. integral control I is on the impact of systematic function: integral action makes the stability of system decline, and I little (integral action is strong) can make system unstable, but can eliminate steady-state error, improves the control precision of system.
3. differential control D is on the impact of systematic function: the derivative action can improve dynamic characteristic, and when D is bigger than normal, overshoot is comparatively large, and regulating time is shorter; When D is less than normal, overshoot is also comparatively large, and regulating time is also longer; Only have D suitable, overshoot just can be made less, shorten regulating time.
Figure is as follows for summary simulation control of PID:
The discretization of 1.PID control law
PID controller is a kind of linear regulator, this adjuster is ratio (P), integration (I), the differential (D) of the control deviation c=r-y formed by the set-point r of system and real output value yy, controlled quentity controlled variable is formed, so be called for short PID controller by linear combination.Simulation control of PID rule in continuous control system is:
In formula, u (t) is the output of controller above, and e (t) is the deviation of system specified rate and output variable, K
pproportionality coefficient, T
iintegration time constant, T
dit is derivative time constant.Its respective transfer functions is:
The effect of proportional controller, integral controller and differential regulator
(1) proportional controller: proportional controller is immediate reaction to deviation, deviation is once occur, adjuster produces control action immediately, and make output variable towards the direction change reducing deviation, the power of control action depends on Proportional coefficient K
p.Although proportional controller is simple and quick, there is static difference in the control object being finite value for system responses.Strengthen Proportional coefficient K
pcan static difference be reduced, but, K
ptime excessive, the dynamic mass of system can be made to degenerate, cause output variable to vibrate, even cause closed-loop system unstable.
(2) proportional and integral controller: in order to eliminate the remaining static difference in proportion adjustment, integral adjustment can be added on the basis of proportion adjustment.Integral adjustment has accumulation composition, as long as deviation e is non-vanishing, it will affect controlled quentity controlled variable u by cumulative function, thus reduces deviation, until deviation is zero.If integration time constant T
igreatly, integral action is weak, otherwise is strong.Increase T
iby the process eliminating static difference that slows down, but can overshoot be reduced, improve stability.The cost introducing integration word joint is the rapidity of reduction system.
(3) proportional integral derivative controller: in order to accelerate control procedure, is necessary the moment occurring in deviation or change, controls by the trend of change of error, and deviation is eliminated in bud, the principle of differential adjustment that Here it is.Adding of the derivative action will contribute to reducing overshoot, overcome vibration, system is tended towards stability.
Because computer system is a kind of sampling control system, can only calculate controlled quentity controlled variable according to the deviate of sampling instant, therefore, utilize boundary rectangle method to carry out numerical integration, single order backward difference carries out numerical differentiation, when the sampling period is T,
Meddlesome,
If the sampling period is enough little, this discrete approximation is quite accurate.U in above formula
ifor full dose exports, the position that actuator's i-th sampling instant that it corresponds to controlled device should reach, therefore, i above formula is called that PID position type controls formula.
Can find out, when calculating by above formula, output valve is with all states are relevant in the past.What need when actuator is not the absolute figure of controlled quentity controlled variable, but during its increment, can derive formula below:
Incremental controls formula and has the following advantages:
(1) computer only exports controlling increment, i.e. the changing unit of actuator position, and thus misoperation impact is little.
(2) at the output u in i moment
i, only need use the deviation in this moment, and previous moment, the deviation e in front two moment
i-1, e
i-2, and previous output valve u
i-1, this has saved internal memory and computing time greatly.
(3) when carrying out manauto and switching, controlled quentity controlled variable is impacted little, can transition more smoothly; The computer of control procedure requires very strong real-time, during with microcomputer as digitial controller, due to the restriction of word length and arithmetic speed, necessary method must be adopted to accelerate computational speed.
Calculate control by PID, then regulated by PWM, output duty cycle.Temperature curve target temperature after control 180 degree of corresponding data points, as shown in Figure 9.
Figure 11 shows concrete software simulating step:
Step 1: code starts
Step 2: initialization MCU, AD, I/O port state, timer etc.
Step 3: can target setting temperature T by key user
Step 4: I the temperature T set by user is compared with the temperature T0 fed back, calculating error values, thus regulation output.If be greater than design temperature, step 5 stops exporting, otherwise step 6 opens unlatching PWM value according to PID calculating.
Step 5: go the temperature (such as, 10 milliseconds of monitorings once) of monitoring heater, according to circuit with certain period frequency, feedback device is connected in the middle of circuit, monitoring AD needs ceaselessly to power, but heater temperature can be caused to raise after power supply, measures inaccurate, therefore when needs, open metal-oxide-semiconductor Q2 to power, first back up the output valve in PWM before opening, carry out thermometric, Q2 is closed immediately, reduction PWM output valve after closing after thermometric.This situation testing time is short, general needs 30 microsecond thermometric, does not affect the temperature parameter of calandria but has and measure temperature very accurately.Calculate to measure while the temperature come outputs to step 7OLED display and also feed back to step 4 by step 8, carry out next step regulation output.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (10)
1. the temperature control system of an electronic cigarette heater, it is characterized in that, this temperature control system comprises central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, heating module, heating detecting AD feedback module and keyboard input module, the output of described heating detecting AD feedback module connects the input of described central processor MCU, the output of described central processor MCU connects the input of described heating module, the output of described central processor MCU connects the input of described display module, the output of described keyboard input module connects the input of described central processor MCU, described power supply module is electrically connected described power management module, described power management module connects described central processor MCU two-way communication, the output of described detecting voltage module connects the input of described central processor MCU, the input of described detecting voltage module connects the output of described power supply module, the input of described cell anti-reverse connection module connects described power supply module, the output of described cell anti-reverse connection module connects the input of described central processor MCU, described power supply module is electrically connected described display module and central processor MCU respectively.
2. temperature control system according to claim 1, it is characterized in that, described power management module comprises electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post P4, the 1st pin VBUS of described binding post P4 connects the positive pole of electric capacity C19 respectively, the 4th pin VCC of chip U5, 8 pin CE, one end of the 7th pin CHRG contact resistance R11 of described chip U5, the 2nd pin PROG of described chip U5 is by resistance R12 ground connection, the 5th pin BAT of described chip U5 connects the positive pole of described electric capacity C20, the negative pole of described electric capacity C20 connects the 1st pin TEMP and the ground connection of described chip U5, the 3rd pin GND of described chip U5, 6 pin STDBY, the negative pole of electric capacity C19, the 4th pin GND of binding post P4, the equal ground connection of 5 pin SHLD.
3. temperature control system according to claim 2, it is characterized in that, described cell anti-reverse connection module comprises resistance R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of described metal-oxide-semiconductor Q4 connects one end of described resistance R14, the drain electrode of described metal-oxide-semiconductor Q4 connects the drain electrode of metal-oxide-semiconductor Q3 and the 2nd pin of binding post P5 respectively, one end of the grid contact resistance R13 of described metal-oxide-semiconductor Q3, the other end of described resistance R13, the other end of resistance R14 and the 1st pin of binding post P5 connect the 5th pin VCC of described chip U5 respectively, the source ground of described metal-oxide-semiconductor.
4. temperature control system according to claim 3, it is characterized in that, the second power supply unit that described power supply module comprises first power supply unit of powering for display module and powers for central processing unit, described first power supply unit is identical with the structure of described second power supply unit, described first power supply unit comprises electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L 1, the Vin pin of described chip U2 connects the positive pole of described electric capacity C7 and one end of electric capacity C8 respectively, the Vout pin of described chip U2 connects one end of described electric capacity C9 respectively, the positive pole of electric capacity C10 and one end of inductance L, the negative pole of described electric capacity C7, the other end of electric capacity C8, the GND pin of chip U2, one end of electric capacity C9 and the equal ground connection of negative pole of electric capacity C10, second power supply unit comprises electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14 and inductance L 2, the Vin pin of described chip U3 connects the positive pole of described electric capacity C11 and one end of electric capacity C12 respectively, the Vout pin of described chip U3 connects one end of described electric capacity C13, the positive pole of electric capacity C14 and one end of inductance L respectively, the equal ground connection of negative pole of the negative pole of described electric capacity C11, the other end of electric capacity C12, the GND pin of chip U3, one end of electric capacity C13 and electric capacity C14.
5. temperature control system according to claim 4, it is characterized in that, described display module comprises chip U1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, the 28th pin VPP of described chip U1 is through described electric capacity C6 ground connection, the 27th pin VCOMH of described chip U1 is through described electric capacity C5 ground connection, the 26th pin IPEF of described chip U1 is through described resistance R1 ground connection, the 9th pin VDD1 of described chip U1 is through described electric capacity C3 ground connection, the 6th pin VDD2 of chip U1 is through described electric capacity C4 ground connection, described chip U1 the 4th pin C2P connects the 5th pin C2N of described chip U1 through described electric capacity C2, described chip U1 the 2nd pin CIN connects the 3rd pin CIP of described chip U1 through described electric capacity C1, the 8th pin VSS of described chip U1, 11 pin IM1, 12 pin IM2, 16 pin WRB, 17 pin RDB, 20 pin D2, 21 pin D3, 22 pin D4, 23 pin D5, 24 pin D6, the equal ground connection of 25 pin D7.
6. temperature control system according to claim 5, it is characterized in that, described central processor MCU comprises chip U4, electric capacity C15, electric capacity C16, interrupteur SW 1 and interrupteur SW 2,7th pin VDD, the 8 pin VDD of described chip U4 are respectively through described electric capacity C15 ground connection, the 13rd pin VDD1 of described chip U4 is through described electric capacity C16 ground connection, the 19th pin EICKP1.0 of described chip U4 connects one end of described interrupteur SW 1, the 20th pin EIDKP1.1 of described chip U4 connects one end of described interrupteur SW 2, the 18th pin VSS1 of described chip U4,10 pin VSS ground connection.
7. temperature control system according to claim 6, it is characterized in that, described heating detecting AD feedback module comprises resistance R10, triode Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding post P3 and electric capacity C18, one end of described resistance R10 connects the base stage of described triode Q1, the collector electrode of described triode Q1 connects the grid of described metal-oxide-semiconductor Q2 and one end of resistance R9 respectively, the drain electrode of described metal-oxide-semiconductor connects the 1st pin of binding post P3, the 2nd pin one end of resistance R7 and one end of resistance R8 respectively of described binding post P3, the other end of described resistance R8 is through electric capacity C18 ground connection, the other end of described resistance R7 and the equal ground connection of emitter of triode Q1.
8. temperature control system according to claim 7, is characterized in that, described heating module comprises resistance Rt.
9. temperature control system according to claim 8, it is characterized in that, described keyboard input module comprises resistance R2, resistance R3, resistance R4, button S1, button S2 and button S3, one end of described resistance R2 connects one end of described button S1, one end of described resistance R3 connects one end of described button S2, one end of described resistance R4 connects one end of described button S3, the equal ground connection of the other end of the described other end of button S1, the other end of button S2 and button S3.
10. temperature control system according to claim 9, it is characterized in that, described detecting voltage module comprises resistance R5, resistance R6 and electric capacity C17, one end of described resistance R5 connects one end of described resistance R6 and one end of electric capacity C17 respectively, the other end of described resistance R6 and the equal ground connection of the other end of electric capacity C17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520412908.3U CN205017611U (en) | 2015-06-15 | 2015-06-15 | Temperature control system of electron cigarette heat -generating body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520412908.3U CN205017611U (en) | 2015-06-15 | 2015-06-15 | Temperature control system of electron cigarette heat -generating body |
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| Publication Number | Publication Date |
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| CN205017611U true CN205017611U (en) | 2016-02-03 |
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| CN201520412908.3U Withdrawn - After Issue CN205017611U (en) | 2015-06-15 | 2015-06-15 | Temperature control system of electron cigarette heat -generating body |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902595A (en) * | 2015-06-15 | 2015-09-09 | 深圳葆威道科技有限公司 | Temperature control system for electronic cigarette heat-generating body |
| CN105901776A (en) * | 2016-06-17 | 2016-08-31 | 深圳瀚星翔科技有限公司 | Detection circuit and method for electronic atomization device |
| CN106292772A (en) * | 2016-08-18 | 2017-01-04 | 陈镇江 | A kind of electronic cigarette temperature control system based on joule pattern |
| CN108563255A (en) * | 2018-02-28 | 2018-09-21 | 深圳瀚星翔科技有限公司 | A kind of temperature control circuit, electronic cigarette temperature control method and computer readable storage medium |
| CN109744580A (en) * | 2019-01-11 | 2019-05-14 | 东阳市人民医院 | Intelligent tobacco control method and device |
| CN113686602A (en) * | 2021-08-13 | 2021-11-23 | 深圳市基克纳科技有限公司 | Heat-generating body test equipment |
-
2015
- 2015-06-15 CN CN201520412908.3U patent/CN205017611U/en not_active Withdrawn - After Issue
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902595A (en) * | 2015-06-15 | 2015-09-09 | 深圳葆威道科技有限公司 | Temperature control system for electronic cigarette heat-generating body |
| CN105901776A (en) * | 2016-06-17 | 2016-08-31 | 深圳瀚星翔科技有限公司 | Detection circuit and method for electronic atomization device |
| CN106292772A (en) * | 2016-08-18 | 2017-01-04 | 陈镇江 | A kind of electronic cigarette temperature control system based on joule pattern |
| CN108563255A (en) * | 2018-02-28 | 2018-09-21 | 深圳瀚星翔科技有限公司 | A kind of temperature control circuit, electronic cigarette temperature control method and computer readable storage medium |
| CN108563255B (en) * | 2018-02-28 | 2020-08-14 | 深圳瀚星翔科技有限公司 | Temperature control circuit, electronic cigarette temperature control method and computer readable storage medium |
| CN109744580A (en) * | 2019-01-11 | 2019-05-14 | 东阳市人民医院 | Intelligent tobacco control method and device |
| CN113686602A (en) * | 2021-08-13 | 2021-11-23 | 深圳市基克纳科技有限公司 | Heat-generating body test equipment |
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