CN104902595A - Temperature control system for electronic cigarette heat-generating body - Google Patents
Temperature control system for electronic cigarette heat-generating body Download PDFInfo
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- CN104902595A CN104902595A CN201510331222.6A CN201510331222A CN104902595A CN 104902595 A CN104902595 A CN 104902595A CN 201510331222 A CN201510331222 A CN 201510331222A CN 104902595 A CN104902595 A CN 104902595A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
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- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
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- Control Of Resistance Heating (AREA)
- Control Of Temperature (AREA)
Abstract
The invention relates to a temperature control system for an electronic cigarette heat-generating body. According to the temperature control system, the output end of a heating detecting AD feedback module is connected with the input end of a central processor; the output end of the central processor is connected with the input end of a heating module and the input end of a display module; the output end of a key input module is connected with the input end of the central processor; a power supply module is electrically connected with a power management module; the power management module is connected with the central processor and is in bidirectional communication with the central processor; the output end of a voltage detecting module is connected with the input end of the central processor; the input end of the voltage detecting module is connected with the output end of the power supply module; the input end of a battery anti-reverse-connection module is connected with the power supply module; the output end of the battery anti-reverse-connection module is connected with the input end of the central processor; and the power management module is electrically connected with the display module and the central processor. The temperature control system is simple in structure and low in cost.
Description
Technical field
The invention belongs to electronic technology field, particularly relate to a kind of temperature control system of electronic cigarette heater.
Background technology
For market is all be in power adjustments or NTC regulating and controlling to current electronic cigarette method for heating and controlling.Power adjustments causes the non-constant of temperature, easily low during height during boiling hot mouth temperature, likely causes smell of scorching.Atomizer NTC temperature is adopted to control, if be placed on complexity and compatibility that atomizer can cause atomizer to be connected with battery case at NTC, as on control board with or other power devices on detection can cause the inaccurate, error larger of actual temperature and detected temperatures.But use electronic cigarette heater temperature control technology, by the change of heating-up temperature, thus cause the change of heater resistance value, system is by determining the monitoring to temperature to the detecting of resistance value.
Summary of the invention
The object of the present invention is to provide a kind of temperature control system of electronic cigarette heater, be intended to solve above-mentioned technical problem.
The present invention realizes like this, a kind of temperature control system of electronic cigarette heater, this temperature control system comprises central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, heating module, heating detecting AD feedback module and keyboard input module, the output of described heating detecting AD feedback module connects the input of described central processor MCU, the output of described central processor MCU connects the input of described heating module, the output of described central processor MCU connects the input of described display module, the output of described keyboard input module connects the input of described central processor MCU, described power supply module is electrically connected described power management module, described power management module connects described central processor MCU two-way communication, the output of described detecting voltage module connects the input of described central processor MCU, the input of described detecting voltage module connects the output of described power supply module, the input of described cell anti-reverse connection module connects described power supply module, the output of described cell anti-reverse connection module connects the input of described central processor MCU, described power supply module is electrically connected described display module and central processor MCU respectively.
Further technical scheme of the present invention is: described power management module comprises electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post P4, 1st pin of described binding post P4 connects the positive pole of electric capacity C19 respectively, the 4th of chip U5, 8 pin, one end of the 7th pin contact resistance R11 of described chip U5, 2nd pin of described chip U5 is by resistance R12 ground connection, 5th pin of described chip U5 connects the positive pole of described electric capacity C20, the negative pole of described electric capacity C20 connects the 1st pin and the ground connection of described chip U5, the 3rd of described chip U5, 6 pin, the negative pole of electric capacity C19, connect the 4th of lower terminal P4 the, the equal ground connection of 5 pin.
Further technical scheme of the present invention is: described cell anti-reverse connection module comprises resistance R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of described metal-oxide-semiconductor Q4 connects one end of described resistance R14, the drain electrode of described metal-oxide-semiconductor Q4 connects the drain electrode of metal-oxide-semiconductor Q3 and the 2nd pin of binding post P5 respectively, one end of the grid contact resistance R13 of described metal-oxide-semiconductor Q3,1st pin of the other end of described resistance R13, the other end of resistance R14 and binding post P5 connects the 5th pin of described chip U5, the source ground of described metal-oxide-semiconductor respectively.
Further technical scheme of the present invention is: the second power supply unit that described power supply module comprises first power supply unit of powering for display module and powers for central processing unit, described first power supply unit is identical with the structure of described second power supply unit, described first power supply unit comprises electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L 1, the Vin pin of described chip U2 connects the positive pole of described electric capacity C7 and one end of electric capacity C8 respectively, the Vout pin of described chip U2 connects one end of described electric capacity C9 respectively, the positive pole of electric capacity C10 and one end of inductance L, the negative pole of described electric capacity C7, the other end of electric capacity C8, the GND pin of chip U2, one end of electric capacity C9 and the equal ground connection of negative pole of electric capacity C10, second power supply unit comprises electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14 and inductance L 2, the Vin pin of described chip U3 connects the positive pole of described electric capacity C11 and one end of electric capacity C12 respectively, the Vout pin of described chip U3 connects one end of described electric capacity C13, the positive pole of electric capacity C14 and one end of inductance L respectively, the equal ground connection of negative pole of the negative pole of described electric capacity C11, the other end of electric capacity C12, the GND pin of chip U3, one end of electric capacity C13 and electric capacity C14.
Further technical scheme of the present invention is: described display module comprises chip U1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, 29th pin of described chip U1 is through described electric capacity C6 ground connection, 28th pin of described chip U1 is through described electric capacity C8 ground connection, 27th pin of described chip U1 is through described resistance R1 ground connection, 9th pin of described chip U1 is through described electric capacity C3 ground connection, 6th pin of chip U1 is through described electric capacity C4 ground connection, described electric capacity C2 is connected the 5th pin of described chip U1 by described chip U1 the 4th pin, described electric capacity C1 is connected the 3rd pin of described chip U1 by described chip U1 the 2nd pin, the 8th of described chip U1, 11, 12, 16, 17, the equal ground connection of 20-25 pin.
Further technical scheme of the present invention is: described central processor MCU comprises chip U4, electric capacity C15, electric capacity C16, interrupteur SW 1 and interrupteur SW 2, described chip U4 the 7th, 8 pin are respectively through described electric capacity C15 ground connection, 13rd pin of described chip U4 is through described electric capacity C16 ground connection, 19th pin of described chip U4 connects one end of described interrupteur SW 1,20th pin of described chip U4 connects one end of described interrupteur SW 2, the 18th, the 10 pin ground connection of described chip U4.
Further technical scheme of the present invention is: described heating detecting AD feedback module comprises resistance R10, triode Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding post P3 and electric capacity C18, one end of described resistance R10 connects the base stage of described triode Q1, the collector electrode of described triode Q1 connects the grid of described metal-oxide-semiconductor Q2 and one end of resistance R9 respectively, the drain electrode of described metal-oxide-semiconductor connects the 1st pin of binding post P3, the 2nd pin one end of resistance R7 and one end of resistance R8 respectively of described binding post P3, the other end of described resistance R8 is through electric capacity C18 ground connection, the other end of described resistance R7 and the equal ground connection of emitter of triode Q1.
Further technical scheme of the present invention is: described heating module comprises resistance Rt.
Further technical scheme of the present invention is: described keyboard input module comprises resistance R2, resistance R3, resistance R4, button S1, button S2 and button S3, one end of described resistance R2 connects one end of described button S1, one end of described resistance R3 connects one end of described button S2, one end of described resistance R4 connects one end of described button S3, the equal ground connection of the other end of the described other end of button S1, the other end of button S2 and button S3.
Further technical scheme of the present invention is: described detecting voltage module block comprises resistance R5, resistance R6 and electric capacity C17, one end of described resistance R5 connects one end of described resistance R6 and one end of electric capacity C17 respectively, the other end of described resistance R6 and the equal ground connection of the other end of electric capacity C17.
The invention has the beneficial effects as follows: the application's structure is simple, easy to use, with low cost; Detect more accurate, control globality stability and the harmony of effectively implementation system more easily.Adopt built-in boosting, improve communication speed, operation stability is strong.
Accompanying drawing explanation
Fig. 1 is the structured flowchart of the temperature control system of the electronic cigarette heater that the embodiment of the present invention provides;
Fig. 2 is the electrical schematic diagram of the power supply module that the embodiment of the present invention provides;
Fig. 3 be the embodiment of the present invention provide power management module, cell anti-reverse connection module electrical schematic diagram;
Fig. 4 is the electrical schematic diagram of the display module that the embodiment of the present invention provides;
Fig. 5 is the electrical schematic diagram of the central processing unit that the embodiment of the present invention provides;
Fig. 6 is the electrical schematic diagram of the heating detecting AD feedback module that the embodiment of the present invention provides;
Fig. 7 is the electrical schematic diagram of the keyboard input module that the embodiment of the present invention provides;
Fig. 8 is the electrical schematic diagram of the detecting voltage module that the embodiment of the present invention provides;
Fig. 9 is the curve relation figure of the temperature that provides of the embodiment of the present invention and AD value;
Figure 10 is the temperature curve target temperature 180 degree of corresponding data points after the control that provides of the embodiment of the present invention;
Figure 11 is that the embodiment of the present invention provides PID control software design control flow chart.
Embodiment
Fig. 1 shows the temperature control system of electronic cigarette heater provided by the invention, this temperature control system comprises central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, heating module, heating detecting AD feedback module and keyboard input module, the output of described heating detecting AD feedback module connects the input of described central processor MCU, the output of described central processor MCU connects the input of described heating module, the output of described central processor MCU connects the input of described display module, the output of described keyboard input module connects the input of described central processor MCU, described power supply module is electrically connected described power management module, described power management module connects described central processor MCU two-way communication, the output of described detecting voltage module connects the input of described central processor MCU, the input of described detecting voltage module connects the output of described power supply module, the input of described cell anti-reverse connection module connects described power supply module, the output of described cell anti-reverse connection module connects the input of described central processor MCU, described power supply module is electrically connected described display module and central processor MCU respectively.
Described power management module comprises electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post P4, 1st pin of described binding post P4 connects the positive pole of electric capacity C19 respectively, the 4th of chip U5, 8 pin, one end of the 7th pin contact resistance R11 of described chip U5, 2nd pin of described chip U5 is by resistance R12 ground connection, 5th pin of described chip U5 connects the positive pole of described electric capacity C20, the negative pole of described electric capacity C20 connects the 1st pin and the ground connection of described chip U5, the 3rd of described chip U5, 6 pin, the negative pole of electric capacity C19, connect the 4th of lower terminal P4 the, the equal ground connection of 5 pin.
Described cell anti-reverse connection module comprises resistance R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of described metal-oxide-semiconductor Q4 connects one end of described resistance R14, the drain electrode of described metal-oxide-semiconductor Q4 connects the drain electrode of metal-oxide-semiconductor Q3 and the 2nd pin of binding post P5 respectively, one end of the grid contact resistance R13 of described metal-oxide-semiconductor Q3,1st pin of the other end of described resistance R13, the other end of resistance R14 and binding post P5 connects the 5th pin of described chip U5, the source ground of described metal-oxide-semiconductor respectively.
The second power supply unit that described power supply module comprises first power supply unit of powering for display module and powers for central processing unit, described first power supply unit is identical with the structure of described second power supply unit, described first power supply unit comprises electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L 1, the Vin pin of described chip U2 connects the positive pole of described electric capacity C7 and one end of electric capacity C8 respectively, the Vout pin of described chip U2 connects one end of described electric capacity C9 respectively, the positive pole of electric capacity C10 and one end of inductance L, the negative pole of described electric capacity C7, the other end of electric capacity C8, the GND pin of chip U2, one end of electric capacity C9 and the equal ground connection of negative pole of electric capacity C10, second power supply unit comprises electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14 and inductance L 2, the Vin pin of described chip U3 connects the positive pole of described electric capacity C11 and one end of electric capacity C12 respectively, the Vout pin of described chip U3 connects one end of described electric capacity C13, the positive pole of electric capacity C14 and one end of inductance L respectively, the equal ground connection of negative pole of the negative pole of described electric capacity C11, the other end of electric capacity C12, the GND pin of chip U3, one end of electric capacity C13 and electric capacity C14.
Described display module comprises chip U1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, 29th pin of described chip U1 is through described electric capacity C6 ground connection, 28th pin of described chip U1 is through described electric capacity C8 ground connection, 27th pin of described chip U1 is through described resistance R1 ground connection, 9th pin of described chip U1 is through described electric capacity C3 ground connection, 6th pin of chip U1 is through described electric capacity C4 ground connection, described electric capacity C2 is connected the 5th pin of described chip U1 by described chip U1 the 4th pin, described electric capacity C1 is connected the 3rd pin of described chip U1 by described chip U1 the 2nd pin, the 8th of described chip U1, 11, 12, 16, 17, the equal ground connection of 20-25 pin.
Described central processor MCU comprises chip U4, electric capacity C15, electric capacity C16, interrupteur SW 1 and interrupteur SW 2, described chip U4 the 7th, 8 pin are respectively through described electric capacity C15 ground connection, 13rd pin of described chip U4 is through described electric capacity C16 ground connection, 19th pin of described chip U4 connects one end of described interrupteur SW 1,20th pin of described chip U4 connects one end of described interrupteur SW 2, the 18th, the 10 pin ground connection of described chip U4.
Described heating detecting AD feedback module comprises resistance R10, triode Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding post P3 and electric capacity C18, one end of described resistance R10 connects the base stage of described triode Q1, the collector electrode of described triode Q1 connects the grid of described metal-oxide-semiconductor Q2 and one end of resistance R9 respectively, the drain electrode of described metal-oxide-semiconductor connects the 1st pin of binding post P3, the 2nd pin one end of resistance R7 and one end of resistance R8 respectively of described binding post P3, the other end of described resistance R8 is through electric capacity C18 ground connection, the other end of described resistance R7 and the equal ground connection of emitter of triode Q1.
Described heating module comprises resistance Rt.
Described keyboard input module comprises resistance R2, resistance R3, resistance R4, button S1, button S2 and button S3, one end of described resistance R2 connects one end of described button S1, one end of described resistance R3 connects one end of described button S2, one end of described resistance R4 connects one end of described button S3, the equal ground connection of the other end of the described other end of button S1, the other end of button S2 and button S3.
Described detecting voltage module block comprises resistance R5, resistance R6 and electric capacity C17, and one end of described resistance R5 connects one end of described resistance R6 and one end of electric capacity C17 respectively, the other end of described resistance R6 and the equal ground connection of the other end of electric capacity C17.
Display module adopts built-in boosting, SPI tri-line communication interface pattern, stable at a high speed.
Power management module, have employed Q3, and Q4 two MOS prevent battery reversal connection to the burnout phenomenon of other devices of circuit.
Power supply module, have employed two-way Power supply mode, a road powers to OLED, due to the built-in boosting of display module, prevents power supply disturbance MCU power supply, causes AD to calculate inaccurate, so the mode that have employed isolation is powered.
MCU (SN8F27E93L) central processing unit, has 1K RAM, 16K ROM, and 12 high-precision adc input channels, have the PWM of built in hardware module, detects more smart Zhu, controls globality stability and the harmony of effectively implementation system more easily.
Data between heater actual temperature and actual measurement AD value are as shown in the table.
The curve relation figure of temperature and AD value is as shown in 9 figure.
According to above-mentioned mass data, data fitting analysis obtains the calculated relationship of AD and temperature T
T=753.3-1.556ad+0.000787ad*ad, above-mentioned calculated relationship is different according to heat-generating system, and the calculated relationship generated is not identical yet, and therefore above-mentioned calculated relationship refers to as is that an embodiment is to support this heat-generating system.
Can calculate the temperature value T0 corresponding to different AD by this formula, output display, feeds back to MCU simultaneously, and MCU acquisition value of feedback is only seen with set point and compared, and utilizes pid algorithm to realize the thermostatic control realized accurately heater.
In process control, the PID controller (also known as PID adjuster) carrying out controlling in the ratio (P) of deviation, integration (I) and differential (D) is a kind of automatic controller be most widely used.It is simple that it has principle, is easy to realize, and widely applicable, controling parameters is separate, the advantage such as selected fairly simple of parameter; And can prove in theory, for the typical subject of process control---the control object of " first-order lag+purely retarded " and " second-order lag+purely retarded ", PID controller is a kind of optimal control.PID Rule adjusting is a kind of effective ways that continuous system dynamic quality corrects, and its way of self-regulation is easy, structural change flexibly (PI, PD ...).
The selection of parameter:
1. proportionality coefficient P is on the impact of systematic function: proportionality coefficient strengthens, and makes being active in one's movements of system, and speed is accelerated, and steady-state error reduces; P is bigger than normal, and the number of oscillation is added, and regulating time lengthens; When P is too large, system can be tending towards unstable; P is too little, can make the slow in one's movements of system again.P can select negative, and this is mainly determined by the characteristic of actuator, transducer and control object.If the symbol of P select improper object measured value will from the set point of control objectives more and more away from, the symbol if there is such situation P just must negate.Simultaneously it should be noted that the P parameter of the PID controll block of the strategy controller of power control is the gain in PID control.
2. integral control I is on the impact of systematic function: integral action makes the stability of system decline, and I little (integral action is strong) can make system unstable, but can eliminate steady-state error, improves the control precision of system.
3. differential control D is on the impact of systematic function: the derivative action can improve dynamic characteristic, and when D is bigger than normal, overshoot is comparatively large, and regulating time is shorter; When D is less than normal, overshoot is also comparatively large, and regulating time is also longer; Only have D suitable, overshoot just can be made less, shorten regulating time.
Figure is as follows for summary simulation control of PID:
The discretization of 1.PID control law
PID controller is a kind of linear regulator, this adjuster is ratio (P), integration (I), the differential (D) of the control deviation c=r-y formed by the set-point r of system and real output value yy, controlled quentity controlled variable is formed, so be called for short PID controller by linear combination.Simulation control of PID rule in continuous control system is:
In formula, u (t) is the output of controller above, and e (t) is the deviation of system specified rate and output variable, K
pproportionality coefficient, T
iintegration time constant, T
dit is derivative time constant.Its respective transfer functions is:
The effect of proportional controller, integral controller and differential regulator
(1) proportional controller: proportional controller is immediate reaction to deviation, deviation is once occur, adjuster produces control action immediately, and make output variable towards the direction change reducing deviation, the power of control action depends on Proportional coefficient K
p.Although proportional controller is simple and quick, there is static difference in the control object being finite value for system responses.Strengthen Proportional coefficient K
pcan static difference be reduced, but, K
ptime excessive, the dynamic mass of system can be made to degenerate, cause output variable to vibrate, even cause closed-loop system unstable.
(2) proportional and integral controller: in order to eliminate the remaining static difference in proportion adjustment, integral adjustment can be added on the basis of proportion adjustment.Integral adjustment has accumulation composition, as long as deviation e is non-vanishing, it will affect controlled quentity controlled variable u by cumulative function, thus reduces deviation, until deviation is zero.If integration time constant T
igreatly, integral action is weak, otherwise is strong.Increase T
iby the process eliminating static difference that slows down, but can overshoot be reduced, improve stability.The cost introducing integration word joint is the rapidity of reduction system.
(3) proportional integral derivative controller: in order to accelerate control procedure, is necessary the moment occurring in deviation or change, controls by the trend of change of error, and deviation is eliminated in bud, the principle of differential adjustment that Here it is.Adding of the derivative action will contribute to reducing overshoot, overcome vibration, system is tended towards stability.
Because computer system is a kind of sampling control system, can only calculate controlled quentity controlled variable according to the deviate of sampling instant, therefore, utilize boundary rectangle method to carry out numerical integration, single order backward difference carries out numerical differentiation, when the sampling period is T,
Meddlesome,
If the sampling period is enough little, this discrete approximation is quite accurate.U in above formula
ifor full dose exports, the position that actuator's i-th sampling instant that it corresponds to controlled device should reach, therefore, i above formula is called that PID position type controls formula.
Can find out, when calculating by above formula, output valve is with all states are relevant in the past.What need when actuator is not the absolute figure of controlled quentity controlled variable, but during its increment, can derive formula below:
Above formula is called that incremental PID controls formula.
Incremental controls formula and has the following advantages:
(1) computer only exports controlling increment, i.e. the changing unit of actuator position, and thus misoperation impact is little.
(2) at the output u in i moment
i, only need use the deviation in this moment, and previous moment, the deviation e in front two moment
i-1, e
i-2, and previous output valve u
i-1, this has saved internal memory and computing time greatly.
(3) when carrying out manauto and switching, controlled quentity controlled variable is impacted little, can transition more smoothly; The computer of control procedure requires very strong real-time, during with microcomputer as digitial controller, due to the restriction of word length and arithmetic speed, necessary method must be adopted to accelerate computational speed.
Calculate control by PID, then regulated by PWM, output duty cycle.Temperature curve target temperature after control 180 degree of corresponding data points, as shown in Figure 9.
Figure 11 shows concrete software simulating step:
Step 1: code starts
Step 2: initialization MCU, AD, I/O port state, timer etc.
Step 3: can target setting temperature T by key user
Step 4: I the temperature T set by user is compared with the temperature T0 fed back, calculating error values, thus regulation output.If be greater than design temperature, step 5 stops exporting, otherwise step 6 opens unlatching PWM value according to PID calculating.
Step 5: go the temperature (such as, 10 milliseconds of monitorings once) of monitoring heater, according to circuit with certain period frequency, feedback device is connected in the middle of circuit, monitoring AD needs ceaselessly to power, but heater temperature can be caused to raise after power supply, measures inaccurate, therefore when needs, open metal-oxide-semiconductor Q2 to power, first back up the output valve in PWM before opening, carry out thermometric, Q2 is closed immediately, reduction PWM output valve after closing after thermometric.This situation testing time is short, general needs 30 microsecond thermometric, does not affect the temperature parameter of calandria but has and measure temperature very accurately.Calculate to measure while the temperature come outputs to step 7OLED display and also feed back to step 4 by step 8, carry out next step regulation output.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the temperature control system of an electronic cigarette heater, it is characterized in that, this temperature control system comprises central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, heating module, heating detecting AD feedback module and keyboard input module, the output of described heating detecting AD feedback module connects the input of described central processor MCU, the output of described central processor MCU connects the input of described heating module, the output of described central processor MCU connects the input of described display module, the output of described keyboard input module connects the input of described central processor MCU, described power supply module is electrically connected described power management module, described power management module connects described central processor MCU two-way communication, the output of described detecting voltage module connects the input of described central processor MCU, the input of described detecting voltage module connects the output of described power supply module, the input of described cell anti-reverse connection module connects described power supply module, the output of described cell anti-reverse connection module connects the input of described central processor MCU, described power supply module is electrically connected described display module and central processor MCU respectively.
2. temperature control system according to claim 1, it is characterized in that, described power management module comprises electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post P4, 1st pin of described binding post P4 connects the positive pole of electric capacity C19 respectively, the 4th of chip U 5, 8 pin, one end of the 7th pin contact resistance R11 of described chip U5, 2nd pin of described chip U5 is by resistance R12 ground connection, 5th pin of described chip U5 connects the positive pole of described electric capacity C20, the negative pole of described electric capacity C20 connects the 1st pin and the ground connection of described chip U5, the 3rd of described chip U5, 6 pin, the negative pole of electric capacity C19, connect the 4th of lower terminal P4 the, the equal ground connection of 5 pin.
3. temperature control system according to claim 2, it is characterized in that, described cell anti-reverse connection module comprises resistance R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of described metal-oxide-semiconductor Q4 connects one end of described resistance R14, the drain electrode of described metal-oxide-semiconductor Q4 connects the drain electrode of metal-oxide-semiconductor Q3 and the 2nd pin of binding post P5 respectively, one end of the grid contact resistance R13 of described metal-oxide-semiconductor Q3, the other end of described resistance R13, the other end of resistance R14 and the 1st pin of binding post P5 connect the 5th pin of described chip U5 respectively, the source ground of described metal-oxide-semiconductor.
4. temperature control system according to claim 3, it is characterized in that, the second power supply unit that described power supply module comprises first power supply unit of powering for display module and powers for central processing unit, described first power supply unit is identical with the structure of described second power supply unit, described first power supply unit comprises electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L 1, the Vin pin of described chip U2 connects the positive pole of described electric capacity C7 and one end of electric capacity C8 respectively, the Vout pin of described chip U2 connects one end of described electric capacity C9 respectively, the positive pole of electric capacity C10 and one end of inductance L, the negative pole of described electric capacity C7, the other end of electric capacity C8, the GND pin of chip U2, one end of electric capacity C9 and the equal ground connection of negative pole of electric capacity C10, second power supply unit comprises electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14 and inductance L 2, the Vin pin of described chip U3 connects the positive pole of described electric capacity C11 and one end of electric capacity C12 respectively, the Vout pin of described chip U3 connects one end of described electric capacity C13, the positive pole of electric capacity C14 and one end of inductance L respectively, the equal ground connection of negative pole of the negative pole of described electric capacity C11, the other end of electric capacity C12, the GND pin of chip U3, one end of electric capacity C13 and electric capacity C14.
5. temperature control system according to claim 4, it is characterized in that, described display module comprises chip U1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, 29th pin of described chip U1 is through described electric capacity C6 ground connection, 28th pin of described chip U1 is through described electric capacity C8 ground connection, 27th pin of described chip U1 is through described resistance R1 ground connection, 9th pin of described chip U1 is through described electric capacity C3 ground connection, 6th pin of chip U1 is through described electric capacity C4 ground connection, described electric capacity C2 is connected the 5th pin of described chip U1 by described chip U1 the 4th pin, described electric capacity C1 is connected the 3rd pin of described chip U1 by described chip U1 the 2nd pin, the 8th of described chip U1, 11, 12, 16, 17, the equal ground connection of 20-25 pin.
6. temperature control system according to claim 5, it is characterized in that, described central processor MCU comprises chip U4, electric capacity C15, electric capacity C16, interrupteur SW 1 and interrupteur SW 2, described chip U4 the 7th, 8 pin are respectively through described electric capacity C15 ground connection, 13rd pin of described chip U4 is through described electric capacity C16 ground connection, 19th pin of described chip U4 connects one end of described interrupteur SW 1, and the 20th pin of described chip U4 connects one end of described interrupteur SW 2, the 18th, the 10 pin ground connection of described chip U4.
7. temperature control system according to claim 6, it is characterized in that, described heating detecting AD feedback module comprises resistance R10, triode Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding post P3 and electric capacity C18, one end of described resistance R10 connects the base stage of described triode Q1, the collector electrode of described triode Q1 connects the grid of described metal-oxide-semiconductor Q2 and one end of resistance R 9 respectively, the drain electrode of described metal-oxide-semiconductor connects the 1st pin of binding post P3, the 2nd pin one end of resistance R7 and one end of resistance R8 respectively of described binding post P3, the other end of described resistance R8 is through electric capacity C18 ground connection, the other end of described resistance R7 and the equal ground connection of emitter of triode Q1.
8. temperature control system according to claim 7, is characterized in that, described heating module comprises resistance Rt.
9. temperature control system according to claim 8, it is characterized in that, described keyboard input module comprises resistance R2, resistance R3, resistance R4, button S1, button S2 and button S3, one end of described resistance R2 connects one end of described button S1, one end of described resistance R3 connects one end of described button S2, one end of described resistance R4 connects one end of described button S3, the equal ground connection of the other end of the described other end of button S1, the other end of button S2 and button S3.
10. temperature control system according to claim 9, it is characterized in that, described detecting voltage module comprises resistance R5, resistance R6 and electric capacity C17, one end of described resistance R5 connects one end of described resistance R6 and one end of electric capacity C17 respectively, the other end of described resistance R6 and the equal ground connection of the other end of electric capacity C17.
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| CN201510331222.6A CN104902595B (en) | 2015-06-15 | 2015-06-15 | Temperature control system for electronic cigarette heat-generating body |
| PCT/CN2015/096043 WO2016201911A1 (en) | 2015-06-15 | 2015-11-30 | Temperature control system for electronic cigarette heating member |
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| CN201510331222.6A CN104902595B (en) | 2015-06-15 | 2015-06-15 | Temperature control system for electronic cigarette heat-generating body |
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| WO2016201911A1 (en) | 2016-12-22 |
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