CN204992243U - Cooling of 3D printing technique preparation is heat sink - Google Patents
Cooling of 3D printing technique preparation is heat sink Download PDFInfo
- Publication number
- CN204992243U CN204992243U CN201520748330.9U CN201520748330U CN204992243U CN 204992243 U CN204992243 U CN 204992243U CN 201520748330 U CN201520748330 U CN 201520748330U CN 204992243 U CN204992243 U CN 204992243U
- Authority
- CN
- China
- Prior art keywords
- cooling
- layer
- microchannel
- heat sink
- cooling layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a cooling of 3D printing technique preparation is heat sink, including even join in marriage structure and the cooling space of entrying, entry and even join in marriage the structure and include inhalant canal, unhurried current chamber and diffluence pass, the cooling space is by last face, the cooling layer, the layer of turning one's coat, the collection liquid layer is constituteed with the play water layer, be provided with cooling layer microchannel on the cooling layer, cooling layer microchannel is linked together with the chamber of flowing slowly, it is equipped with the hole of turning one's coat to turn one's coat layer middle part, the hole one end of turning one's coat and a cooling layer microchannel communicate with each other, the other end is linked together with heat sink album of liquid layer microchannel, the one end and the liquid collecting cavity of heat sink album of liquid layer microchannel communicate with each other, rivers flow from the heat sink export that goes out on the water layer after the liquid collecting cavity converges. This structure adopts 3D printing technique integrated into one piece, avoids adopting nickel base alloys powder or tungsten copper alloy powder as the printing material because of welding the thermal stress and extra thermal resistance that leads to, has the good characteristics of corrosion -resistant, longe -lived, hot matching factor, traditional preparation mode produced drawing breakage and deformations problems also can not appear.
Description
Technical field
The utility model belongs to Semiconductor Laser encapsulation technology field, is specifically related to cooling heat sink prepared by a kind of 3D of employing printing technique.
Background technology
At present, along with the development of high power semiconductor lasers technology, it has obtained in industry, military affairs, scientific research and the field such as medical treatment and material processed and has applied widely.Extending the application of high power laser to expand further, improving constantly device electro-optical performance, and reliability and life-span become the only way of current development high-performance laser technology.But, along with the continuous increase of laser output power, it produces heat and is also improving constantly, dispel the heat badly will cause that chip of laser temperature raises, electro-optical efficiency reduction and the negative effect such as excitation wavelength red shift, therefore good heat dispersion heat sink has vital impact to laser.
The utility model adopts this emerging technology of 3D printing technique, based on Layered manufacturing thought, with powder, cad model is converted to part.Due to it not only adopt in, low-power laser melts constituency metal dust fast, fully, and adopt quick cooled and solidified technology, so can obtain nonequilibrium state supersaturated solid solution and evenly tiny metallographic structure, density is close to 100%, and mechanical performance and forging are quite.The relative traditional handicraft of 3D printing technique has unique advantage, its brand-new one-body molded characteristic, and the diversity of Material selec-tion is the new path that solution traditional handicraft weak point is brought, integrated heat exchanger sealing is compared traditional handicraft and is greatly improved, traditional batch is avoided to weld the drawing crack problem that may occur, there is no traditional welding stress, thus the life-span improves greatly, and its manufacture degree of freedom of 3D printing technique is high, channel size that can be shaping is little, and thus the structure of some uniquenesses is easy to just can realize.
Utility model content
The purpose of this utility model is the technical advantage making full use of 3D printing technique, provides cooling heat sink prepared by a kind of 3D printing technique, to have the region radiates heat problem of certain thermal source under solving chip size.
In order to solve the problems of the technologies described above, the utility model realizes in the following manner:
Cooling heat sink prepared by a kind of 3D printing technique, adopt 3D printing technique one-body molded, symmetrical structure is become about it, include the even distribution structure of water and cooling zone, described enter the even distribution structure of water comprise intake tunnel, unhurried current chamber and the diffluence pass being connected intake tunnel and unhurried current chamber, cooling zone is from top to bottom successively by upper face, cooling layer, to turn one's coat layer, acquisition layer and water-yielding stratum composition, cooling layer is provided with cooling layer microchannel, cooling layer microchannel is connected with unhurried current chamber, turn one's coat in the middle part of layer and be provided with hole of turning one's coat, one end, hole of turning one's coat communicates with cooling layer microchannel, the other end is connected with heat sink acquisition layer microchannel, one end of heat sink acquisition layer microchannel communicates with liquid collecting cavity, current flow out from the heat sink outlet water-yielding stratum after liquid collecting cavity confluxes.
Further, described cooling layer microchannel comprises cooling layer microchannel I and cooling layer microchannel II, and described cooling layer microchannel I is larger than the distance of cooling layer microchannel II from the distance of upper face, and cooling layer microchannel II communicates with unhurried current chamber.
Compared with prior art, the beneficial effect that the utility model has: the powder of this structure using the tungsten-copper alloy powder of nickel-base alloy or different ratio as preparation, adopt 3D printing technique one-body molded, avoid the thermal stress that causes because of welding and extra thermal resistance, adopt Co-based alloy powder or tungsten-copper alloy powder as printed material, there is corrosion-resistant, that the life-span long, hot matching factor is good feature, reduce micro-logical heat sink production cost, the drawing crack that also there will not be traditional preparation method to produce and problem on deformation simultaneously.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure, each mark is respectively: 1, enter the even distribution structure of water, and 2, cooling zone, 3, intake tunnel, 4, diffluence pass, 5, unhurried current chamber, 6, upper face, 7, cooling layer, 8, layer of turning one's coat, 9, acquisition layer, 10, water-yielding stratum, 11-1, cooling layer microchannel I, 11-2, cooling layer microchannel II, 12, hole of turning one's coat, 13, heat sink acquisition layer microchannel, 14, heat sink outlet.
Embodiment
Below in conjunction with the drawings and specific embodiments, embodiment of the present utility model is described in further detail.
As shown in Figure 1, cooling heat sink prepared by a kind of 3D printing technique, adopt 3D printing technique one-body molded, symmetrical structure is become about it, include the even distribution structure 1 of water and cooling zone 2, described enter the even distribution structure of water comprise intake tunnel 3, unhurried current chamber 5 and the diffluence pass 4 being connected intake tunnel and unhurried current chamber, cooling zone is from top to bottom successively by upper face 6, cooling layer 7, to turn one's coat layer 8, acquisition layer 9 and water-yielding stratum 10 form, current enter from intake tunnel, in intake tunnel, be provided with diffluence pass shunt, the effect of buffering is played in unhurried current chamber, it makes current keep substantially all pressing at each microchannel entrance when entering the microchannel of cooling zone, thus play the effect regulating current.
Current enter the cooling layer of cooling zone from unhurried current chamber, cooling layer is provided with cooling layer microchannel I11-1 and cooling layer microchannel II11-2, cooling layer microchannel II communicates with unhurried current chamber, and cooling layer microchannel I is larger than the distance of cooling layer microchannel II from the distance of upper face, chip of laser is a circle, the line of demarcation of cooling layer microchannel I and cooling layer microchannel II is in the marginal zone of chip, because chip is circular, cooling layer microchannel I and II line of demarcation, cooling layer microchannel constitute a circle, and segmentation cooling layer micro-tunnel length sum is the same, the end of cooling layer microchannel is in heat sink middle part, namely at hole 12 place that turns one's coat of layer of turning one's coat.
Current enter the hole 12 of turning one's coat of layer of turning one's coat from the middle part of cooling layer, then heat sink acquisition layer microchannel 13 is entered, hole of turning one's coat is the microcellular structure that row are corresponding with cooling layer microchannel, the length of heat sink acquisition layer microchannel 13 is inconsistent, its effect is the pressure drop being regulated each passage by the length of passage, thus affects the current of microchannel; The length of heat sink acquisition layer microchannel is decided by the characteristic of the chip thermal source in upper face district, the region of the cooling layer microchannel I that usual heat source density is high, chip is corresponding is longer, it is just short that it is heat sink acquisition layer microchannel is arranged, such guarantee flow rate of water flow is than very fast, thus take away more heat, the contrary heat sink acquisition layer microchannel corresponding in the area that heat source density is low is longer, and to make current slow down, the temperature of final guarantee chip region is relatively uniform.Final current flow out from the heat sink outlet 14 water-yielding stratum after liquid collecting cavity confluxes
The above is only execution mode of the present utility model; again state; for those skilled in the art; under the prerequisite not departing from the utility model principle; can also carry out some improvement to the utility model, these improvement are also listed in the protection range of the utility model claim.
Claims (2)
1. the cooling heat sink prepared of a 3D printing technique, adopt 3D printing technique one-body molded, symmetrical structure is become about it, it is characterized in that: include the even distribution structure of water (1) and cooling zone (2), described enter the even distribution structure of water comprise intake tunnel (3), unhurried current chamber (5) and the diffluence pass (4) being connected intake tunnel and unhurried current chamber, cooling zone is from top to bottom successively by upper face (6), cooling layer (7), to turn one's coat layer (8), acquisition layer (9) and water-yielding stratum (10) composition, cooling layer is provided with cooling layer microchannel, cooling layer microchannel is connected with unhurried current chamber, turn one's coat in the middle part of layer and be provided with hole of turning one's coat (12), one end, hole of turning one's coat communicates with cooling layer microchannel, the other end is connected with heat sink acquisition layer microchannel (13), one end of heat sink acquisition layer microchannel communicates with liquid collecting cavity, current flow out from the heat sink outlet (14) water-yielding stratum after liquid collecting cavity confluxes.
2. the cooling heat sink prepared of a kind of 3D printing technique according to claim 1, it is characterized in that: described cooling layer microchannel comprises cooling layer microchannel I (11-1) and cooling layer microchannel II (11-2), described cooling layer microchannel I is larger than the distance of cooling layer microchannel II from the distance of upper face, and cooling layer microchannel II communicates with unhurried current chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520748330.9U CN204992243U (en) | 2015-09-24 | 2015-09-24 | Cooling of 3D printing technique preparation is heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520748330.9U CN204992243U (en) | 2015-09-24 | 2015-09-24 | Cooling of 3D printing technique preparation is heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204992243U true CN204992243U (en) | 2016-01-20 |
Family
ID=55126572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520748330.9U Active CN204992243U (en) | 2015-09-24 | 2015-09-24 | Cooling of 3D printing technique preparation is heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204992243U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107537415A (en) * | 2017-09-18 | 2018-01-05 | 中山盈安商贸有限公司 | A kind of new micro passage reaction |
| CN107919509A (en) * | 2016-10-10 | 2018-04-17 | 保时捷股份公司 | Cell apparatus and the method for producing cell apparatus |
| CN109830465A (en) * | 2018-12-12 | 2019-05-31 | 南方科技大学 | A kind of chip-packaging structure and chip packaging method |
| CN114094435A (en) * | 2021-11-19 | 2022-02-25 | 北京工业大学 | Semiconductor laser microchannel heat dissipation device for 3D printing |
-
2015
- 2015-09-24 CN CN201520748330.9U patent/CN204992243U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107919509A (en) * | 2016-10-10 | 2018-04-17 | 保时捷股份公司 | Cell apparatus and the method for producing cell apparatus |
| CN107537415A (en) * | 2017-09-18 | 2018-01-05 | 中山盈安商贸有限公司 | A kind of new micro passage reaction |
| CN107537415B (en) * | 2017-09-18 | 2023-03-28 | 中山致安化工科技有限公司 | Microchannel reactor |
| CN109830465A (en) * | 2018-12-12 | 2019-05-31 | 南方科技大学 | A kind of chip-packaging structure and chip packaging method |
| CN109830465B (en) * | 2018-12-12 | 2024-05-14 | 南方科技大学 | Chip packaging structure and chip packaging method |
| CN114094435A (en) * | 2021-11-19 | 2022-02-25 | 北京工业大学 | Semiconductor laser microchannel heat dissipation device for 3D printing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204992243U (en) | Cooling of 3D printing technique preparation is heat sink | |
| CN101722406B (en) | Method for manufacturing pin shaft through forging | |
| CN102492906B (en) | Forging method of high-temperature alloy fine-grained bars | |
| CN105112708B (en) | Rapid manufacturing method for laser remelting scanning carbide dispersion strengthened aluminum alloy | |
| CN104711468A (en) | High strength and high heat resistant aluminum alloy material and preparation method thereof | |
| CN108277378B (en) | A kind of high-strength highly-conductive Cu-Cr-Ag alloy short flow process | |
| CN109591210A (en) | A kind of diamond fretsaw and preparation method thereof | |
| CN106563919A (en) | Method for preparing middle bezel and rear cover of mobile phone | |
| CN110280765B (en) | Diamond tool preparation method based on laser additive manufacturing technology | |
| CN110091035A (en) | A kind of high-entropy alloy increasing material manufacturing device and increasing material manufacturing method | |
| CN109743425B (en) | High-efficient radiating cell-phone center | |
| CN110396688B (en) | Preparation method of diamond tool | |
| CN105312563B (en) | A kind of manufacture method of Ni-based double-alloy blisk | |
| CN105180700B (en) | A kind of porous wall heat exchanger tube with the fixed nucleus of boiling and preparation method thereof | |
| CN107523771B (en) | A kind of method of In-sltu reinforcement Cu-Cr-Zr alloy high temperature softening resistance | |
| CN102615482A (en) | Production method of oversized-diameter anode phosphorus copper ball | |
| CN105478511A (en) | Extrusion die | |
| CN202662472U (en) | Silver-nickel/copper-nickel composite electrical contact | |
| CN206956150U (en) | A kind of forced cooling device for laser melting coating directional solidificating alloy | |
| CN207381504U (en) | A kind of water cooling plant of new energy car battery | |
| CN103419005B (en) | A kind of small heat pipe manufacture craft | |
| CN207695828U (en) | A kind of double tungsten electrode arc coupling TIG weldering devices | |
| CN115635031A (en) | Manufacturing die and method for flat plate compression joint type IGBT multi-rack ceramic tube shell | |
| CN111922343A (en) | Method for preparing CuW60-CuW90 material by adopting spherical tungsten powder | |
| CN109926592A (en) | A kind of secondary infiltration process for gear forming |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |