CN204991661U - Novel automatic bonding die machine of chip - Google Patents

Novel automatic bonding die machine of chip Download PDF

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Publication number
CN204991661U
CN204991661U CN201520645207.4U CN201520645207U CN204991661U CN 204991661 U CN204991661 U CN 204991661U CN 201520645207 U CN201520645207 U CN 201520645207U CN 204991661 U CN204991661 U CN 204991661U
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CN
China
Prior art keywords
suction nozzle
head
slide rail
rotating machine
electric rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520645207.4U
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Chinese (zh)
Inventor
黄杰明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan core Electronics Co., Ltd.
Original Assignee
Sichuan Xinlianfa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Xinlianfa Electronics Co Ltd filed Critical Sichuan Xinlianfa Electronics Co Ltd
Priority to CN201520645207.4U priority Critical patent/CN204991661U/en
Application granted granted Critical
Publication of CN204991661U publication Critical patent/CN204991661U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Coating Apparatus (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)

Abstract

The utility model discloses a novel automatic bonding die machine of chip, it includes frame and workstation, the conveyer belt is installed to workstation one side, the plate mat has been placed on the conveyer belt, system control device one side has the crossbeam, install on the crossbeam and get the piece device, universal head with spout the mucilage binding and put, it includes the slide rail to get the piece device, install rotating electrical machines and telescopic cylinder on the slide rail, be connected with the backup pad on the main shaft of rotating electrical machines, install lift cylinder and stretching cyli on the lower surface of backup pad, stretching cyli's piston rod and lifting air cylinder connected, a suction nozzle is installed to the lower extreme of lift cylinder, the suction nozzle is including the connecting piece that has hollow gas circuit pipeline, suction nozzle portion installs on the connecting piece, be equipped with the suction head in the suction nozzle portion, the head of suction head is the toper boss, and the head terminal surface shape of suction head is circular, and the center of suction head is equipped with inhales the hole. The beneficial effects of the utility model are that: it has to get the flich just work efficiency is high glues advantage of high quality with spouting.

Description

The automatic die Bonder of a kind of novel chip
Technical field
The utility model relates to chip encapsulation technology field, particularly the automatic die Bonder of a kind of novel chip.
Background technology
Existing die Bonder cannot realize getting sheet and film releasing process automation, components and parts possibility run-off the straight after film releasing, later stage glue spraying is had an impact, product quality is caused to decline, bonding quality and adhering speed do not reach the requirement of large-scale production, and existing die Bonder, when getting sheet, the components and parts at a certain position on disc can only be got, thus the replacement frequency of disc is improved, affect bonding die efficiency, and, the die Bonder suction nozzle that semiconductor packaging industry is used, general is all adopt wolfram steel suction nozzle, stainless steel suction nozzle, high temperature plastics suction nozzle or rubber suction nozzle.The head hardness of wolfram steel suction nozzle, stainless steel suction nozzle and high temperature plastics suction nozzle is higher, easily causes chip surface to scratch and impression; Although rubber suction nozzle can not cause chip surface to scratch and impression, rubber suction nozzle is not wear-resisting, so the life-span is shorter.Wolfram steel suction nozzle, stainless steel suction nozzle and high temperature plastics suction nozzle are generally one-body molded, if there is breakage, whole part all must be changed, and such cost will be higher.
Utility model content
The purpose of this utility model is the shortcoming overcoming prior art, provides that a kind of production cost is low, operating efficiency is high and the automatic die Bonder of the measured novel chip of glue spraying matter.
The purpose of this utility model is achieved through the following technical solutions: the automatic die Bonder of a kind of novel chip it comprise frame with can the workbench of relative machine frame movement, installation system control device on workbench, described workbench side is provided with conveyer belt, conveyer belt is placed with disc, system control device side has crossbeam, described crossbeam is provided with slice getting device, the side of slice getting device is provided with Universal-head, Universal-head side is provided with glue-spraying device, Universal-head and glue-spraying device are installed on crossbeam, described slice getting device comprises a slide rail, described slide rail is slidably fitted with an electric rotating machine and pulls the telescopic cylinder of electric rotating machine movement on slide rail, the main shaft of electric rotating machine is fixedly connected with a supporting bracket, one end lower surface of supporting bracket be slidably fitted with a lift cylinder and be installed with a draft cylinder, the piston rod of described draft cylinder is connected with lift cylinder, the lower end of described lift cylinder is provided with a suction nozzle, described suction nozzle comprises the connector of the gas path pipe with hollow, described connector is provided with nozzle section, suction nozzle is provided with in described nozzle section, the head of described suction nozzle is cone boss, the head end shape of described suction nozzle is circular, the center of described suction nozzle is provided with sucker.
Described Universal-head is provided with an image catching device, system control device is provided with a display be connected with image catching device, and described display is electrically connected with system control device.
On described disc, interval is evenly provided with two circle components and parts standing grooves, and the number of each circle components and parts standing groove is identical.
Described slide rail offers the chute of electric rotating machine movement, the two ends, left and right of chute are provided with travel switch.
One end of described nozzle section is provided with square hole, and one end of described connector is provided with the square knuckle matched with this square hole.
The utility model has the following advantages: the automatic die Bonder of novel chip of the present utility model, components and parts get sheet and the automation of film releasing process implementation, and by Universal-head, inching is carried out to components and parts product during film releasing, ensure that its product can maintain an equal level and be convenient to the glue spraying of postorder, thus make glue spraying effective; Be provided with electric rotating machine, lifting motor, telescope motor and stretching motor, thus make suction nozzle arbitrarily angledly on disc can carry out absorption components and parts, thus make suction nozzle feeding convenient, but also the stacking quantity of components and parts on disc can be increased, thus reduce the replacement frequency of disc, shorten the bonding die time, improve operating efficiency; , whole die Bonder suction nozzle employing connector adds nozzle section and adds this composite type design of suction nozzle, and arbitrary parts are damaged, only need independently to change, and nozzle section adopts quality of rubber materials, during work, can play the effect of buffering and damping preferably, thus reduction production cost.
Accompanying drawing explanation
Fig. 1 is schematic front view of the present utility model;
Fig. 2 is schematic top plan view of the present utility model;
Fig. 3 is that schematic diagram is looked on a left side of the present utility model;
Fig. 4 is the structural representation of suction nozzle;
Fig. 5 is the structural representation of the nozzle section of suction nozzle;
Fig. 6 is the structural representation of the suction nozzle of suction nozzle;
In figure, 1-frame, 2-workbench, 3-system control device, 4-conveyer belt, 5-disc, 6-crossbeam, 7-slice getting device, 8-Universal-head, 9-glue-spraying device, 10-slide rail, 11-electric rotating machine, 12-supporting bracket, 13-lift cylinder, 14-draft cylinder, 15-suction nozzle, 16-display, 17-components and parts standing groove, 18-chute, 19-telescopic cylinder, 151-connector, 152-nozzle section, 153-suction nozzle, 154-sucker, 155-square hole.
Embodiment
Be further described the utility model below in conjunction with accompanying drawing, protection range of the present utility model is not limited to the following stated:
As Fig. 1, shown in Fig. 2 and Fig. 3, the automatic die Bonder of a kind of novel chip, it comprise frame 1 with can relative to the workbench 2 of frame 1 movement, installation system control device 3 on workbench 2, described workbench 2 side is provided with conveyer belt 4, conveyer belt 4 is placed with disc 5, system control device 3 side has crossbeam 6, described crossbeam 6 is provided with slice getting device 7, the side of slice getting device 7 is provided with Universal-head 8, Universal-head 8 side is provided with glue-spraying device 9, Universal-head 8 and glue-spraying device 9 are installed on crossbeam 6, described slice getting device 7 comprises a slide rail 10, described slide rail 10 is slidably fitted with an electric rotating machine 11 and pulls the telescopic cylinder 19 of electric rotating machine 11 movement on slide rail 10, the main shaft of electric rotating machine 11 is fixedly connected with a supporting bracket 12, one end lower surface of supporting bracket 12 be slidably fitted with a lift cylinder 13 and be installed with a draft cylinder 14, the piston rod of described draft cylinder 14 is connected with lift cylinder 13, the lower end of described lift cylinder 13 is provided with a suction nozzle 15, as Fig. 4, Fig. 5 and Fig. 6, described suction nozzle 15 comprises the connector 151 of the gas path pipe with hollow, described connector 151 is provided with nozzle section 152, suction nozzle 153 is provided with in described nozzle section 152, suction nozzle 153 and nozzle section 152 adopt interference fit, the head of described suction nozzle 153 is cone boss, the head end shape of described suction nozzle 153 is circular, the center of described suction nozzle 153 is provided with sucker 154, .Whole die Bonder suction nozzle employing connector 151 adds nozzle section 152 and adds this composite type design of suction nozzle 153, and one of them parts is damaged, and only needs are independent changes these parts, do not need integral replacing, the time of replacing can either be reduced, can production cost be reduced again, improve the utilance of parts.The material of nozzle section 153 is rubber, can play the effect of buffering and damping in the process of absorption chip.
In the present embodiment, described Universal-head 8 is provided with an image catching device, system control device 3 is provided with a display 16 be connected with image catching device, described display 16 is electrically connected with system control device 3, by image catching device and display 16, thus the position of components and parts is aligned by Universal-head 8, thus improve the glue spraying quality of components and parts.
In the present embodiment, on described disc 5, interval is evenly provided with two circle components and parts standing grooves 17, thus make disc 5 can fill multiple components and parts, thus improve the bonding die efficiency of components and parts, and in the present embodiment, the number of each circle components and parts standing groove 17 is identical, and the angle between adjacent two the components and parts standing grooves 17 of same circle is 30 °, thus the angle making electric rotating machine rotate is 30 ° at every turn, reduce the difficulty controlling electric rotating machine and rotate, when specific works, on disc 5, wherein a components and parts placement 17 is positioned at immediately below suction nozzle 15.
In the present embodiment, described slide rail 10 offers the chute 18 of electric rotating machine 11 movement, the two ends, left and right of chute 18 are provided with travel switch, and when electric rotating machine 11 touches travel switch, electric rotating machine quits work.
In the present embodiment, described workbench 2 is provided with the square groove preventing components and parts.
In the present embodiment, one end of described nozzle section 152 is provided with square hole 155, and one end of described connector 151 is provided with the square knuckle matched with this square hole 155, schemes not shown, in the sheathed square knuckle being arranged on connector 151 of nozzle section 152.Adopt the connected mode of this square knuckle, nozzle section 152 can not be rotated, and does not need other connection assists.
The course of work of the present utility model is as follows: disc 5 is transported to workbench 2 side by conveyer belt 4, lift cylinder 13 is descending, suction nozzle 15 holds components and parts, then lift cylinder 13 resets, telescopic cylinder 19 shrinks, electric rotating machine 11 and lift cylinder 13 are toward movable workbench, after electric rotating machine 11 touches travel switch, electric rotating machine 11 stops mobile, lift cylinder 13 is descending, components and parts are placed in square groove, then workbench 2 moves, square groove is moved to below Universal-head 8, Universal-head 8 adjusts the position of components and parts, after adjusting, workbench 2 moves, square groove is moved to below glue-spraying device 9, after glue-spraying device 9 glue spraying, components and parts are sent in subsequent processing, then workbench 2 and electric rotating machine 11 reset, carry out second time bonding die, before second time bonding die, electric rotating machine 11 rotates to an angle by a direction, then the descending feeding of lift cylinder 13, after feeding completes, electric rotating machine 11 another mistake direction rotates same angle, then telescopic cylinder 19 works, later work and above-mentioned operation class are seemingly, after the first lap components and parts feeding on disc 5, draft cylinder 14 shrinks certain distance, suction nozzle 15 is made to be positioned at directly over the components and parts standing groove 17 of the second circle, and then above-mentioned operation principle is installed carries out work.

Claims (5)

1. the automatic die Bonder of novel chip, it comprise frame (1) with can relative to the workbench (2) of frame (1) movement, the upper installation system control device (3) of workbench (2), described workbench (2) side is provided with conveyer belt (4), conveyer belt (4) is placed with disc (5), system control device (3) side has crossbeam (6), described crossbeam (6) is provided with slice getting device (7), the side of slice getting device (7) is provided with Universal-head (8), Universal-head (8) side is provided with glue-spraying device (9), Universal-head (8) and glue-spraying device (9) are installed on crossbeam (6), it is characterized in that: described slice getting device (7) comprises a slide rail (10), described slide rail (10) is slidably fitted with an electric rotating machine (11) and pulls electric rotating machine (11) at the telescopic cylinder (19) of the upper movement of slide rail (10), the main shaft of electric rotating machine (11) is fixedly connected with a supporting bracket (12), one end lower surface of supporting bracket (12) be slidably fitted with a lift cylinder (13) and be installed with a draft cylinder (14), the piston rod of described draft cylinder (14) is connected with lift cylinder (13), the lower end of described lift cylinder (13) is provided with a suction nozzle (15), described suction nozzle (15) comprises the connector (151) of the gas path pipe with hollow, described connector (151) is provided with nozzle section (152), suction nozzle (153) is provided with in described nozzle section (152), the head of described suction nozzle (153) is cone boss, the head end shape of described suction nozzle (153) is circular, the center of described suction nozzle (153) is provided with sucker (154).
2. the automatic die Bonder of a kind of novel chip according to claim 1, it is characterized in that: described Universal-head (8) is provided with an image catching device, system control device (3) is provided with a display be connected with image catching device (16), and described display (16) is electrically connected with system control device (3).
3. the automatic die Bonder of a kind of novel chip according to claim 1, is characterized in that: the upper interval of described disc (5) is evenly provided with two circle components and parts standing grooves (17), and the number of each circle components and parts standing groove (17) is identical.
4. the automatic die Bonder of a kind of novel chip according to claim 1, is characterized in that: the chute (18) described slide rail (10) offering electric rotating machine (11) movement, the two ends, left and right of chute (18) are provided with travel switch.
5. the automatic die Bonder of a kind of novel chip according to claim 1, is characterized in that: one end of described nozzle section (152) is provided with square hole (155), and one end of described connector (151) is provided with the square knuckle matched with this square hole (155).
CN201520645207.4U 2015-08-25 2015-08-25 Novel automatic bonding die machine of chip Expired - Fee Related CN204991661U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520645207.4U CN204991661U (en) 2015-08-25 2015-08-25 Novel automatic bonding die machine of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520645207.4U CN204991661U (en) 2015-08-25 2015-08-25 Novel automatic bonding die machine of chip

Publications (1)

Publication Number Publication Date
CN204991661U true CN204991661U (en) 2016-01-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520645207.4U Expired - Fee Related CN204991661U (en) 2015-08-25 2015-08-25 Novel automatic bonding die machine of chip

Country Status (1)

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CN (1) CN204991661U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110364446A (en) * 2019-07-22 2019-10-22 嘉兴怀莲贸易有限公司 A kind of one-time formed plastic packaging photoelectrical coupler

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110364446A (en) * 2019-07-22 2019-10-22 嘉兴怀莲贸易有限公司 A kind of one-time formed plastic packaging photoelectrical coupler
CN110364446B (en) * 2019-07-22 2021-04-09 深圳市得润光学有限公司 Manufacturing device of plastic packaging photoelectric coupler

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 629000 No. 6, Phase III, Electronic Industry Park, Suining Development Zone, Sichuan Province

Patentee after: Sichuan core Electronics Co., Ltd.

Address before: 629000 No. 6, Phase III, Electronic Industry Park, Suining Development Zone, Sichuan Province

Patentee before: SICHUAN XINLIANFA ELECTRONICS CO., LTD.

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160120

Termination date: 20180825

CF01 Termination of patent right due to non-payment of annual fee