CN204968220U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN204968220U CN204968220U CN201520621733.7U CN201520621733U CN204968220U CN 204968220 U CN204968220 U CN 204968220U CN 201520621733 U CN201520621733 U CN 201520621733U CN 204968220 U CN204968220 U CN 204968220U
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- CN
- China
- Prior art keywords
- circuit board
- hole
- circuit layer
- conductive circuit
- basic unit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a circuit board, it includes a basic unit, the range upon range of setting in this basic unit no. 1 a first conducting wire layer and range upon range of second conducting wire layer on the surface of keeping away from this first conducting wire layer in this basic unit that sets up on the surface, this circuit board follows this first conducting wire layer, a mounting hole has been seted up to the range upon range of direction on a basic unit and a second conducting wire layer, be formed with a metallic coating on the pore wall of each mounting hole, this mounting hole is arranged in installing this circuit board in electron device through the fastener, this circuit board follows this first conducting wire layer, an at least through -hole has still been seted up to the range upon range of direction on a basic unit and a second conducting wire layer, each through -hole is formed with a metal level at least on its pore wall.
Description
Technical field
The utility model relates to a kind of circuit board.
Background technology
Usually offer the installing hole running through this circuit board in existing circuit board, it is for being installed on this circuit board in electronic installation by securing member (as screw etc.).The hole wall of such installing hole is formed with the coat of metal usually, in order to be electrically connected each conductive circuit layer in this circuit board.But, in the installation process of circuit board, owing to contacting with this coat of metal when securing member inserts installing hole, easily cause the junction of the coat of metal and each conductive circuit layer to be ruptured, thus cause this circuit board to lose efficacy.
Utility model content
In view of this, be necessary to provide a kind of circuit board not easily lost efficacy in installation process.
A kind of circuit board, it comprises a basic unit, stacked one first conductive circuit layer on this basic unit one surface and stacked this basic unit that is arranged at of being arranged at is away from one second conductive circuit layer on the surface of this first conductive circuit layer, this circuit board is along this one first conductive circuit layer, the stacked direction of basic unit and one second conductive circuit layer offers an installing hole, the hole wall of each installing hole is formed with a coat of metal, this installing hole is used for being installed in electronic installation by securing member by this circuit board, this circuit board is along this one first conductive circuit layer, the stacked direction of basic unit and one second conductive circuit layer also offers at least one through hole, each through hole is at least formed with a metal level on its hole wall.
Preferably, the pore size of this installing hole is 1.45mm, and the pore size of this through hole is 0.15mm.
Preferably, this metal level fills up this through hole.
Preferably, this circuit board is double sided board, it comprises a basic unit, stacked one first conductive circuit layer on this basic unit one surface and stacked this basic unit that is arranged at of being arranged at away from one second conductive circuit layer on the surface of this first conductive circuit layer, and this installing hole and through hole all run through this first conductive circuit layer, basic unit and the second conductive circuit layer.
Circuit board of the present utility model, it is along this first conductive circuit layer, the stacked direction of basic unit and the second conductive circuit layer is except offering installing hole, also offer through hole, the hole wall of described through hole is formed with a metal level to be electrically connected this first conductive circuit layer and the second conductive circuit layer, because in the installation process of circuit board, this through hole does not need to insert securing member to connect with electronic installation, the situation that the junction avoiding the coat of metal in circuit board installation process in installing hole and the first conductive circuit layer and the second conductive circuit layer causes circuit board to lose efficacy after rupturing.
Accompanying drawing explanation
Fig. 1 is the side structure schematic diagram of the circuit board of the utility model better embodiment.
Another angle schematic diagram that Fig. 2 is circuit board shown in Fig. 1.
Fig. 3 is the side structure schematic diagram of the circuit board of another execution mode of the utility model.
Main element symbol description
| Circuit board | 100 |
| Basic unit | 10 |
| First conductive circuit layer | 20 |
| Second conductive circuit layer | 30 |
| Installing hole | 40 |
| The coat of metal | 41 |
| Through hole | 50 |
| Metal level | 51 |
Following embodiment will further illustrate the utility model in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 and Fig. 2, the utility model better embodiment provides a kind of circuit board 100, and it is applied in electronic installation (not shown), and this electronic installation can be mouse, mobile phone, panel computer etc.
This circuit board 100 comprises a flexual basic unit 10 and is formed at the first conductive circuit layer 20 and the second conductive circuit layer 30 on this basic unit 10 liang of apparent surfaces respectively.This circuit board 100 offers at least one installing hole 40 and at least one through hole 50 along the stacked direction of this first conductive circuit layer 20, basic unit 10 and the second conductive circuit layer 30.Described installing hole 40 runs through this first conductive circuit layer 20, basic unit 10 and the second conductive circuit layer 30, and it is for being installed on this circuit board 100 in electronic installation by securing member (not shown).The hole wall of this installing hole 40 is formed with a coat of metal 41, in order to be electrically connected this first conductive circuit layer 20 and the second conductive circuit layer 30.This through hole 50 is at least formed with a metal level 51 on its hole wall, in order to be electrically connected this first conductive circuit layer 20 and the second conductive circuit layer 30.In present embodiment, the pore size of this installing hole 40 is roughly 1.45mm, and the pore size of this through hole 50 is roughly 0.15mm, and this metal level 51 fills up this through hole 50.Preferably, this circuit board 100 comprises an installing hole 40 and at least one through hole 50, and each through hole 50 this installing hole 40 contiguous is arranged.When this circuit board 100 comprises multiple installing holes 40 and multiple through hole 50, all contiguous wherein installing hole 40 of each through hole 50 is arranged.Be appreciated that the pore size of this installing hole 40 and this through hole 50 also can adjust as required, this metal level 51 can only be formed at the hole wall of through hole 50 and not fill up this through hole 50.
In other embodiments, refer to Fig. 3, first conductive circuit layer 20 of this circuit board 100 and the second conductive circuit layer 30 can also in conjunction with multiple conductive circuit layer (not shown) away from the side of basic unit 10, and this installing hole 40 and this through hole 50 only need be made to run through this circuit board 100 along the stacked direction of the plurality of conductive circuit layer.
Circuit board 100 of the present utility model, it is along this first conductive circuit layer, the stacked direction of basic unit and the second conductive circuit layer is except offering installing hole 40, also offer through hole 50, the hole wall of described through hole 50 is formed with a metal level 51 to be electrically connected this first conductive circuit layer 20 and the second conductive circuit layer 30, because in the installation process of circuit board 100, this through hole 50 does not need to insert securing member to connect with electronic installation, the situation that the junction avoiding the coat of metal 41 in circuit board 100 installation process in installing hole 40 and the first conductive circuit layer 20 and the second conductive circuit layer 30 causes circuit board 100 to lose efficacy after rupturing.
Claims (4)
1. a circuit board, it comprises a basic unit, stacked one first conductive circuit layer on this basic unit one surface and stacked this basic unit that is arranged at of being arranged at is away from one second conductive circuit layer on the surface of this first conductive circuit layer, this circuit board is along this one first conductive circuit layer, the stacked direction of basic unit and one second conductive circuit layer offers an installing hole, the hole wall of each installing hole is formed with a coat of metal, this installing hole is used for being installed in electronic installation by securing member by this circuit board, it is characterized in that: this circuit board is along this one first conductive circuit layer, the stacked direction of basic unit and one second conductive circuit layer also offers at least one through hole, each through hole is at least formed with a metal level on its hole wall.
2. circuit board as claimed in claim 1, it is characterized in that: the pore size of this installing hole is 1.45mm, the pore size of this through hole is 0.15mm.
3. circuit board as claimed in claim 2, is characterized in that: this metal level fills up this through hole.
4. circuit board as claimed in claim 3, it is characterized in that: this circuit board also comprises and is at least onely incorporated into this first conductive circuit layer or this second conductive circuit layer conductive circuit layer away from the side of this basic unit, and this installing hole and through hole all run through this first conductive circuit layer, basic unit, the second conductive circuit layer and conductive circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520621733.7U CN204968220U (en) | 2015-08-18 | 2015-08-18 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520621733.7U CN204968220U (en) | 2015-08-18 | 2015-08-18 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204968220U true CN204968220U (en) | 2016-01-13 |
Family
ID=55063252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520621733.7U Active CN204968220U (en) | 2015-08-18 | 2015-08-18 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204968220U (en) |
-
2015
- 2015-08-18 CN CN201520621733.7U patent/CN204968220U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Co-patentee after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-patentee before: Peng Ding Polytron Technologies Inc |
|
| CP03 | Change of name, title or address |