CN204936013U - For the forming module of thermosetting resin encapsulation tablet - Google Patents
For the forming module of thermosetting resin encapsulation tablet Download PDFInfo
- Publication number
- CN204936013U CN204936013U CN201520627153.9U CN201520627153U CN204936013U CN 204936013 U CN204936013 U CN 204936013U CN 201520627153 U CN201520627153 U CN 201520627153U CN 204936013 U CN204936013 U CN 204936013U
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- CN
- China
- Prior art keywords
- thermosetting resin
- mould
- tablet
- forming module
- matched moulds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model proposes a kind of forming module for thermosetting resin encapsulation tablet, comprise the first mould, the second mould, packing cavity and pressure valve.When after thermosetting resin heating, pressure valve pressurized heat thermosetting resin to the first matched moulds chamber, coated tablet, when pressure valve pressure release, flexible mould is positioned at extrusion position, flexible mould presses to the first matched moulds chamber and changes the first matched moulds chamber and forms the second matched moulds chamber, and the thermosetting resin Level Change of the first matched moulds chamber is the thermosetting resin height of the second matched moulds chamber, part thermosetting resin by the material returned of input and output material runner to pressure valve.The forming module of the utility model thermosetting resin encapsulation tablet can the technique of steady heat thermosetting resin encapsulation tablet, and the forming height of the thermosetting resin solidified can reduce and thinning, more can be close to the height of the tablet be wrapped by, meet producer's demand.
Description
Technical field
The utility model about a kind of forming module, espespecially a kind of for thermosetting resin encapsulation tablet forming module.
Background technology
Along with the progress of science and technology, the development of life, electronics technology product institute role is more and more important, becomes product indispensable in people's life gradually.Many electronic components are comprised in electronics technology product, in order to protect electronic component to be without prejudice, just must be shaping by electronic package, therefore how just to become more important from encapsulating electronic components tablet.
The mode of tradition tablet encapsulated moulding, inserts tablet in mould, recycling macromolecule raw material (such as thermosetting resin), after heating, to pressurize or the mode of ejection formation, makes its coated tablet and coagulation forming, follow-uply carries out other techniques again.No matter be by macromolecule raw material ejection formation or extrusion forming, due to technologic restriction, tablet is carried on the pedestal in chamber, when macromolecule raw material inputs the chamber in mould, mould liquid cannot cross the height of tablet and then the action covering tablet cannot be completed, the macromolecule raw material simultaneously inputted because of pressure larger, also collision can be caused to the tablet being positioned at pedestal, the effect of washing away, so that tablet displacement, more cannot reach the object of encapsulated moulding, therefore all must inject at present exceed tablet several times mould liquid, grind again after making the wafer on tablet completely coated, to reach required height.
Therefore, with the macromolecule raw material of volume pressurization input chamber, although can complete encapsulated moulding, but the shaping macromolecule raw material too much solidified is covered on tablet, does not meet actual frivolous demand.Therefore, producer often needs to pay more process costs to make up above-mentioned problem.
Utility model content
In view of this, how a kind of encapsulated moulding module is provided, in encapsulated moulding process, can the coated tablet of stability contorting macromolecule raw material, and the height of the macromolecule raw material solidified can be close to the height of tablet, meets customer demand, solves the problem, the utility model proposes a kind of forming module for thermosetting resin encapsulation tablet, it comprises the first mould, the second mould, packing cavity and pressure valve.First mould comprises shaping area.Second mould is positioned at the side of the first mould, and the second mould comprises die cavity, flexible mould and input and output material runner, and the corresponding above-mentioned shaping area of die cavity, the one side of flexible mould is positioned at this die cavity interior sidewall surface, and input and output material runner one end is communicated in this die cavity.Packing cavity is positioned at the first mould and is communicated in the other end of input and output material runner, and packing cavity holds thermosetting resin.Pressure valve is adjacent to packing cavity side.Wherein when the first mould is positioned at a die-closed position, die cavity covers shaping area and forms the first matched moulds chamber, when after thermosetting resin heating, pressure valve pressurized heat thermosetting resin to the first matched moulds chamber, coated tablet, when pressure valve pressure release, flexible mould is positioned at extrusion position, flexible mould presses to the first matched moulds chamber and changes the first matched moulds chamber and forms the second matched moulds chamber, the thermosetting resin Level Change of the first matched moulds chamber is the thermosetting resin height of the second matched moulds chamber, part thermosetting resin by the material returned of input and output material runner to pressure valve.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein the first mould comprises load bearing seat, and load bearing seat puts tablet.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein the first mould comprises at least one locating dowel, and locating dowel fixes tablet.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein tablet comprises wafer and circuit board, on wafer connecting circuit board.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein the second mould comprises at least one 3rd travel mechanism, and the 3rd travel mechanism connects flexible mould.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein pressure valve comprises connecting rod and piston, and piston is positioned at packing cavity, and connecting rod one end connects piston, and the connecting rod other end extends to packing cavity outside.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein the first mould comprises at least one first travel mechanism, and at least one first travel mechanism connects the first mould side.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein the second mould comprises at least one second travel mechanism, and at least one second travel mechanism connects the second mould side.In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein the first mould comprises at least one first ejecting mechanism, and at least one first ejecting mechanism one end extends to shaping area and contacts thermosetting resin.
In an embodiment, as the forming module of above-mentioned thermosetting resin encapsulation tablet, wherein the second mould comprises at least one second ejecting mechanism, and at least one second ejecting mechanism one end extends to die cavity and contacts thermosetting resin.
The forming module of thermosetting resin encapsulation tablet of the present utility model, at thermosetting resin after heating, with pressure valve pressurized heat thermosetting resin to the first matched moulds chamber to complete in coated step, flexible mould presses to the first matched moulds chamber and changes the first matched moulds chamber and forms the second matched moulds chamber, change the shaping height of thermosetting resin, the thermosetting resin of part by the material returned of input and output material runner to pressure valve.By above-mentioned running, can the technique of steady heat thermosetting resin encapsulation tablet, and the forming height of the thermosetting resin solidified can reduce and thinning, more can be close to the height of the tablet be wrapped by, realistic demand, thoroughly solves the problem that above-mentioned prior art meets with.
Below detailed features of the present utility model and advantage is described in embodiments in detail, its content is enough to make any relevant art of haveing the knack of understand the utility model technology contents and to implement according to this, and content disclosed by this description, claim and graphic, any relevant art of haveing the knack of can understand the relevant object of the utility model and advantage easily.
Accompanying drawing explanation
Figure 1A: for an embodiment of the present utility model is assembled in the schematic perspective view of board.
Figure 1B: for another embodiment of the present utility model is assembled in the schematic perspective view of board.
Fig. 2: be the decomposing schematic representation of an embodiment of the present utility model.
Fig. 3: for an embodiment of the present utility model puts the schematic appearance before tablet.
Fig. 4: for an embodiment of the present utility model puts the schematic appearance after tablet.
Fig. 5 A: be the schematic side view () when embodiment of the present utility model uses.
Fig. 5 B: be schematic side view when another embodiment of the present utility model uses.
Fig. 6: be the schematic side view (two) when embodiment of the present utility model uses.
Fig. 7: be the schematic side view (three) when embodiment of the present utility model uses.
Fig. 8: be the schematic side view (four) when embodiment of the present utility model uses.
Fig. 9: be the schematic side view (five) when embodiment of the present utility model uses.
Figure 10: be the plural finished product schematic diagram of an embodiment of the present utility model.
Figure 11: be the schematic side view of the thermosetting resin feed path of an embodiment of the present utility model.
Figure 12: be the schematic side view in the thermosetting resin discharging path of an embodiment of the present utility model.
Reference numeral
1 ... forming module
11 ... first mould
111 ... shaping area
112 ... load bearing seat
113 ... locating dowel
114 ... backstay
115 ... first ejecting mechanism
116 ... first travel mechanism
12 ... second mould
121 ... die cavity
122 ... flexible mould
123 ... input and output material runner
124 ... fit bar
125 ... second ejecting mechanism
126 ... second travel mechanism
126a ... interlocking element
127 ... 3rd travel mechanism
127a ... interlocking element
127b ... oil pipe
13 ... packing cavity
14 ... pressure valve
141 ... connecting rod
142 ... piston
16 ... first matched moulds chamber
17 ... second matched moulds chamber
2 ... tablet
21 ... wafer
22 ... circuit board
3 ... thermosetting resin
D1/D2 ... highly.
Detailed description of the invention
By specific embodiment, embodiment of the present utility model is described below, the personage being familiar with this skill can understand other advantages of the present utility model and effect easily by content disclosed in the present specification.
Structure, ratio, size etc. that this description institute accompanying drawings illustrates, content all only in order to coordinate description to disclose, for the understanding of personage and the reading of being familiar with this skill, and be not used to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, still all should drop on technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, quote in this description as " one ", " two ", " on " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the utility model.
Referring to Figure 1A, is the schematic perspective view of forming module one embodiment of the utility model thermosetting resin encapsulation tablet.The forming module 1 of thermosetting resin encapsulation tablet comprises the first mould 11, second mould 12, packing cavity 13 and pressure valve 14.First mould 11 comprises shaping area 111.Second mould 12 is positioned at the side of the first mould 11, second mould 12 comprises die cavity 121, flexible mould 122 and input and output material runner 123, the corresponding above-mentioned shaping area 111 of die cavity 121, the one side of flexible mould 122 is positioned at die cavity 121 interior sidewall surface, and input and output material runner 123 one end is communicated in die cavity 121.Packing cavity 13 is positioned at the first mould 11 and is communicated in the other end of input and output material runner 123, and packing cavity 13 can hold thermosetting resin 3.Pressure valve 14 is adjacent to packing cavity 13 side.
Then referring to Fig. 2 to 4, is respectively the partial schematic diagram of forming module one embodiment of the utility model thermosetting resin encapsulation tablet.First mould 11 comprises and can include load bearing seat 112 further, and tablet 2, in order to put tablet 2, in the present embodiment, also directly can be placed in the first mould 11 surface, can omit the setup cost of load bearing seat 112 by load bearing seat 112.At this, the first mould 11 comprises at least one locating dowel 113, and locating dowel 113 is then when blowing sheet 2, in order to fixing tablet 2.In addition, the first mould 11 comprises backstay 114, and the second mould 112 is relative to the first mould 111, then there is fit bar 124, the first mould 111 and the second mould 112 close to each other, compress time, backstay 114 and 124, fit bar can be mutually closely sealed, have the effect of location.
Then Fig. 5 A to Fig. 9 is referred to, respectively for thermosetting resin 3 of the present utility model encapsulates the use schematic diagram of forming module one embodiment of tablet 2.Fig. 5 A is the forming module original state that thermosetting resin 3 encapsulates tablet 2, and the load bearing seat 112 in the first mould 11 has a tablet 2, and thermosetting resin 3 Material Containment is in packing cavity 13.Fig. 6 shows the first mould 11 and is moved upward to die-closed position, load bearing seat 112 enters in the film chamber of the second mould 12, die cavity 121 covers shaping area 111 and forms the first matched moulds chamber 16, then after heat hot thermosetting resin 3, liquid status is moulded in its formation, refers to Fig. 7, now pressure valve 14 is pressurizeed, pyrogenicity thermosetting resin 3 (moulding liquid status) flows into the first matched moulds chamber 16 and coated tablet 2, and its flow direction and state refer to Figure 11.Then Fig. 8 is referred to, now by pressure valve 14 pressure release, and flexible mould 122 is down to extrusion position, the first matched moulds chamber 16 is made to form the second matched moulds chamber 17, because thermosetting resin 3 is for moulding liquid status, part thermosetting resin 3 by input and output material runner 123 material returned to pressure valve 14, by the thermosetting resin 3 height D2 mode thermosetting resin 3 of the first matched moulds chamber 16 height D1 being changed into the second matched moulds chamber 17, by unnecessary thermosetting resin 3 material returned to pressure valve 14, and make the thermosetting resin after coagulation forming 3, its thermosetting resin 3 height be encapsulated in outside tablet 2 can reduce and thinning, more can be close to the height of the tablet 2 be wrapped by, and, thermosetting resin 3 material returned of part is to the flow direction of pressure valve 14 and state, as shown in figure 12.
Referring again to Fig. 9, in this embodiment, thermosetting resin 3 encapsulates in the forming module of tablet 2, first mould 11 comprises at least one first ejecting mechanism 115, its one end extends to shaping area 111 and contacts thermosetting resin 3, and the setting of the first ejecting mechanism 115 is to help the finished product after thermosetting resin 3 encapsulated moulding to depart from the first mould 11.Relatively, in other embodiments, the finished product after thermosetting resin 3 encapsulated moulding takes shape in the second mould 12, then the second mould 12 comprises at least one second ejecting mechanism 125, and its one end extends to die cavity 121 and contacts thermosetting resin 3.The setting of the second ejecting mechanism 125 is to help the finished product after thermosetting resin 3 encapsulated moulding to depart from the second mould 12, and the utility model is not as restriction.
Referring again to Fig. 5 A to Fig. 9, thermosetting resin 3 of the present utility model encapsulates in the forming module of tablet 2, and the first mould 11 comprises at least one first travel mechanism 116, and at least one first travel mechanism 116 connects the first mould 11 side.First travel mechanism 116 provides power, assists the first mould 11 to move to the second mould 12, as shown in Figure 6.And in other examples, second mould 12 comprises at least one second travel mechanism 126, at least one second travel mechanism 126 connects the second mould 12 side, is then now that the second travel mechanism 126 provides power, helps the second mould 12 to move to the first mould 11.Moreover also have the first mould 11 to move relative to compressing with the second mould 12, the forming module that thermosetting resin 3 of the present utility model encapsulates tablet 2 does not limit above-mentioned arbitrary first mould 11 and the mutual mode compressed of the second mould 12.First travel mechanism 116 and the second travel mechanism 126 can be driven by oil hydraulic cylinder, or via screw mechanism transmission, when second travel mechanism 126 is with hydraulic cylinder structure, then lock at the second mould 12 top board (as shown in Figure 1B and Fig. 5 A) with interlocking element 126a, can also optionally change as motor drives, wherein motor can be the servo motor etc. that induction motor, stepper motor or precision are higher.
In addition, second mould 12 comprises at least one 3rd travel mechanism 127, at least one 3rd travel mechanism 127 connects flexible mould 122, at this, at least one 3rd travel mechanism 127 can be oil hydraulic cylinder (as 5A figure shown in) or motor (as Figure 1A, shown in Fig. 5 B) etc. element, when at least one 3rd travel mechanism 127 is with hydraulic cylinder structure, then lock at the second mould 12 top board (as shown in Figure 1B and Fig. 5 A) with interlocking element 127a, when at least one 3rd travel mechanism 127 is motor driving mechanism, motor can be embedded in the groove that the second mould 12 formed, and connect with oil pipe 127b and transmit power resources, at least one 3rd travel mechanism 127 presses down make the first matched moulds chamber 16 form the second matched moulds chamber 17 for promoting flexible mould 122.And in pressure valve 14, comprise connecting rod 141 and piston 142, piston 142 is positioned at packing cavity 13, connecting rod 141 one end connects piston 142, it is outside that connecting rod 141 other end extends to packing cavity 13, connecting rod 141 and 412, piston help pressure valve 14 to pressurize, and impels liquid thermosetting resin 3 to flow into the first matched moulds chamber 16.
Then Figure 10 is referred to, for thermosetting resin 3 of the present utility model encapsulates the plural finished product schematic diagram of an embodiment of the forming module of tablet 2.The plural finished product of plural number tablet 2 after the forming module processing that thermosetting resin 3 of the present utility model encapsulates tablet 2.The above embodiments (Fig. 5 A charts 9) are with the explanation of single tablet 2 encapsulated moulding, but, thermosetting resin 3 of the present utility model encapsulates the forming module of tablet 2, can be applicable to encapsulate plural tablet 2, at plural tablet 2 after the formed package that thermosetting resin 3 encapsulates tablet 2 covers, through cutter work, the tablet 2 encapsulated is cut into independent finished products one by one, follow-uply carry out other processing technologys again.
In the above-described embodiment, the tablet 2 of the utility model indication, can comprise wafer 21 and circuit board 22, and on wafer 21 connecting circuit board 22.In addition, in some embodiments, can be applicable to surface and paste weldering element (SurfaceMountDevice, SMD) or dual-in-line package element (DualIn-LinePackage, DIP) encapsulated moulding, the utility model is not as limit.
Comprehensively above-mentioned, can learn that the utility model thermosetting resin 3 encapsulates the forming module of tablet 2, carry out encapsulating in coated process at tablet 2, flexible mould 122 presses to the first matched moulds chamber 16 and changes the first matched moulds chamber 16 and forms the second matched moulds chamber 17, the height that thermosetting resin 3 is shaping can be changed, by part thermosetting resin 3 by input and output material runner 123 material returned to pressure valve 14.The forming height of the thermosetting resin 3 solidified can be reduced and thinning, more can be close to the height of the tablet 2 be wrapped by, that is, finished product can more realistic demand, and steady heat thermosetting resin 3 encapsulates the technique of tablet 2.
Above-described embodiment is only principle and effect thereof of this creation of illustrative, but not for limiting this creation.Any personage being familiar with this skill all without prejudice under spirit of the present utility model and category, can modify to above-described embodiment.Therefore rights protection scope of the present utility model, should listed by claim.
Claims (10)
1., for a forming module for thermosetting resin encapsulation tablet, it is characterized in that comprising:
One first mould, comprises a shaping area;
One second mould, be positioned at the side of this first mould, this second mould comprises a die cavity, a flexible mould and an input and output material runner, and this die cavity is to should shaping area, this flexible mould one side is positioned at this die cavity interior sidewall surface, and this input and output material runner one end is communicated in this die cavity;
One packing cavity, be positioned at this first mould and be communicated in this input and output material runner other end, this packing cavity holds this thermosetting resin; And
One pressure valve, adjacent to this packing cavity side;
Wherein, when this first mould is positioned at a die-closed position, this die cavity covers this shaping area and forms one first matched moulds chamber, this pressure valve pressurizes this thermosetting resin to this first matched moulds chamber, this tablet coated, when this pressure valve pressure release, this flexible mould is positioned at an extrusion position, this flexible mould presses to this first matched moulds chamber and changes this first matched moulds chamber formation one second matched moulds chamber, this thermosetting resin Level Change of this first matched moulds chamber is this thermosetting resin height of this second matched moulds chamber, part this thermosetting resin by this input and output material runner material returned to this pressure valve.
2., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this first mould comprises a load bearing seat, and this load bearing seat puts this tablet.
3., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this first mould comprises at least one locating dowel, and this locating dowel fixes this tablet.
4., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this tablet comprises a wafer and a circuit board, and this wafer connects on this circuit board.
5. as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this pressure valve comprises a connecting rod and a piston, and this piston is positioned at this packing cavity, this connecting rod one end connects this piston, and it is outside that this connecting rod other end extends to this packing cavity.
6., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this first mould comprises at least one first travel mechanism, and this at least one first travel mechanism connects this first mould side.
7., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this second mould comprises at least one second travel mechanism, and this at least one second travel mechanism connects this second mould side.
8., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this first mould comprises at least one first ejecting mechanism, and this at least one first ejecting mechanism one end extends to this shaping area and contacts this thermosetting resin.
9., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this second mould comprises at least one second ejecting mechanism, and this at least one second ejecting mechanism one end extends to this die cavity and contacts this thermosetting resin.
10., as claimed in claim 1 for the forming module of thermosetting resin encapsulation tablet, it is characterized in that, wherein this second mould comprises at least one 3rd travel mechanism, and this at least one 3rd travel mechanism connects this flexible mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520627153.9U CN204936013U (en) | 2015-08-19 | 2015-08-19 | For the forming module of thermosetting resin encapsulation tablet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520627153.9U CN204936013U (en) | 2015-08-19 | 2015-08-19 | For the forming module of thermosetting resin encapsulation tablet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204936013U true CN204936013U (en) | 2016-01-06 |
Family
ID=55003466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520627153.9U Expired - Fee Related CN204936013U (en) | 2015-08-19 | 2015-08-19 | For the forming module of thermosetting resin encapsulation tablet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204936013U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108982581A (en) * | 2017-06-02 | 2018-12-11 | 优肯科技股份有限公司 | Measuring equipment for relation between curing degree and specific volume of packaging material |
-
2015
- 2015-08-19 CN CN201520627153.9U patent/CN204936013U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108982581A (en) * | 2017-06-02 | 2018-12-11 | 优肯科技股份有限公司 | Measuring equipment for relation between curing degree and specific volume of packaging material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 Termination date: 20160819 |
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| CF01 | Termination of patent right due to non-payment of annual fee |