CN204925831U - Semiconductor laser temperature control device based on fuzzy control - Google Patents
Semiconductor laser temperature control device based on fuzzy control Download PDFInfo
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- CN204925831U CN204925831U CN201520715077.7U CN201520715077U CN204925831U CN 204925831 U CN204925831 U CN 204925831U CN 201520715077 U CN201520715077 U CN 201520715077U CN 204925831 U CN204925831 U CN 204925831U
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Abstract
The utility model discloses a semiconductor laser temperature control device based on fuzzy control, the device include power module, single chip microcomputer system, TEC drive circuit, TEC temperature control chip, heat -conducting plate, laser diode, temperature sensor system, keyboard control, display module and alarm module, last keyboard control, alarm module, display module and the temperature sensor system of being connected with of single chip microcomputer system, single chip microcomputer system is connected to TEC drive circuit one end, and the TEC temperature control chip is connected to the other end, and the TEC temperature control chip utilizes silica gel to paste the one side at the heat -conducting plate, and laser diode is pasted to the silica gel for the another side of heat -conducting plate, sensor zonulae occludens heat -conducting plate in the temperature sensor system. The utility model discloses a semiconductor laser temperature control device based on fuzzy control, singlechip read the numerical value of temperature sensor system, and the singlechip drives the TEC temperature control chip according to temperature sensor's numerical value, and control accuracy is high, and efficiency improves greatly moreover.
Description
Technical field
The utility model relates to the semiconductor laser temperature control device based on fuzzy control, belongs to field of semiconductor lasers.
Background technology
Along with developing rapidly of infotech, semiconductor laser has been widely used in the fields such as optical fiber communication, Fibre Optical Sensor and laser radar, has broad application prospects.Temperature is one of principal element affecting laser performance index, when the temperature of laser instrument raises, its output wavelength is drifted about to long wavelength direction gradually, simultaneously, temperature controlled precision also affects live width and the power of laser instrument, therefore, noise spectra of semiconductor lasers must adopt suitable temperature control technology, thus ensure that semiconductor laser or system can normally work.For this reason, researchist is studied work in temperature control system, obtains certain progress.2007, the application number that the people such as Lou Qihong propose was the utility model patent of 200710045711.0, utilizes the bridge-drive chip design driving circuit of thermoelectric refrigerating unit, and the temperature achieving semiconductor laser controls; 2014, (application number: 201410480407.9) adopted the temperature detection amplifying circuit of Wheatstone bridge and Design of Amplifiers, realizes the control of semiconductor laser temperature the semiconductor laser automatic temperature-adjusting control system that Zhu Jun proposes.
Above technology has certain application reference and is worth, but, what the temperature collection circuit of these utility models adopted is mimic channel, therefore temperature collection circuit is relatively complicated, mainly due to temperature collection circuit utilization is that bridge diagram causes, do not have high-precision algorithm to control simultaneously, make to there will be temperature fluctuation phenomenon in temperature control process, cause laser temperature change, all will there is wave phenomenon in the wavelength causing laser instrument to export, live width and power, the system follow-up for it affects.
Utility model content
Utility model object: in order to overcome the deficiencies in the prior art, the utility model proposes a kind of semiconductor laser temperature control device based on fuzzy control, can control the temperature of laser diode more accurately.
Technical scheme: for solving the problems of the technologies described above, the semiconductor laser temperature control device based on fuzzy control of the present utility model, comprises for whole device provides the power module of power supply, Single Chip Microcomputer (SCM) system and laser diode; Described Single Chip Microcomputer (SCM) system is connected with Keyboard Control, display module and temperature sensor system, described Single Chip Microcomputer (SCM) system and TEC driving circuit one end, the TEC driving circuit other end connects TEC temperature control chip, TEC temperature control chip utilizes silica gel to be pasted onto the one side of heat-conducting plate, laser diode pasted by the another side silica gel of heat-conducting plate, the sensor compact siro spinning technology heat-conducting plate in temperature sensor system.
As preferably, described heat-conducting plate is aluminium sheet or red copper.
As preferably, described TEC driving circuit comprises driving chip L298N, power supply and some diodes, 1st, 8 and 15 pin ground connection of described driving chip, 4th is connected power supply with 9 pins, 5th is connected Single Chip Microcomputer (SCM) system with 7 pins, 2nd pin connects power module by diode D1,2nd pin is by diode D2 ground connection simultaneously, 3rd pin connects power module by diode D4,3rd pin is by diode D3 ground connection simultaneously, and the 2nd and 3 pins are connected respectively to positive pole and the negative pole of described TEC temperature control chip.
As preferably, described Single Chip Microcomputer (SCM) system is also connected with warning system.
In the utility model, described temperature sensor system comprises temperature sensor DS18B20, power supply and resistance, the 1st pin ground connection of temperature sensor DS18B20, and the 2nd pin connects Single Chip Microcomputer (SCM) system, 3rd pin connects power supply, and the 2nd pin connects the 3rd pin by resistance R1.Described display module is liquid crystal display or LED display, and Single Chip Microcomputer (SCM) system is the one in common singlechip controller, dsp controller or ARM controller.
Beneficial effect: the semiconductor laser temperature control device based on fuzzy control of the present utility model, the numerical value of single-chip microcomputer reading temperature sensor system, single-chip microcomputer drives TEC temperature control chip according to the numerical value of temperature sensor, control accuracy is high, and efficiency improves greatly, and control system can realize the processing capacities such as data communication, data processing and Systematical control, automaticity is high, speed measures that efficiency is high soon, and error is little, easy to operate.
Accompanying drawing explanation
Fig. 1 is that system of the present utility model connects block diagram;
Fig. 2 is temperature sensor system schematic diagram in embodiment;
Fig. 3 is TEC driving circuit schematic diagram in embodiment;
Fig. 4 is Fuzzy PID structural representation in embodiment;
Fig. 5 is the temperature control data plot obtained in embodiment 1.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
Embodiment 1
As shown in Figures 1 to 4, power module 100, Single Chip Microcomputer (SCM) system 101, TEC driving circuit 102, TEC temperature control chip 103, laser diode 104, heat-conducting plate 105, temperature sensor system 106, display module 107, Keyboard Control 108 and alarm module 109 is comprised.Described Single Chip Microcomputer (SCM) system is connected with TEC driving circuit 102, temperature sensor system 106, display module 107, Keyboard Control 108 and alarm module 109, TEC driving circuit 102 one end connects Single Chip Microcomputer (SCM) system 101, the other end connects TEC temperature control chip 103, TEC temperature control chip 103 utilizes silica gel to be pasted onto the one side of heat-conducting plate 105, the another side of heat-conducting plate 105 pastes laser diode 104 with silica gel, sensor compact siro spinning technology heat-conducting plate 105 in temperature sensor system 106, temperature sensor system 106 other end connects Single Chip Microcomputer (SCM) system 101, power module 100 is powered for whole system.
Wherein, what power module 100 was selected is greenly raises YB1732A D.C. regulated power supply, and Single Chip Microcomputer (SCM) system 101 comprises Freescale single-chip microcomputer MC9S12XS128MAL chip, clock circuit, reset circuit and JIAG structure.That TEC temperature control chip 103 is selected is semiconductor chilling plate TEC1-12706, and what heat-conducting plate 105 was selected is aluminium sheet,
Concrete, as shown in Figure 2, TEC driving circuit 102 comprises driving chip L298N and 4 diode, and L298N is the product of SGS (Tongbiao Standard Technology Service Co., Ltd) company, be that 15 pin Multiwatt encapsulate, its inside comprises 4 channel logic driving circuits.Include the high voltage of two H bridges, big current enjoys a double blessing bridge driver, receive standard TTL logic level signal, the motor of 46V, below 2A can be driven.1st, the 8 and 15 pin ground connection of driving chip L298N, 4th is connected power supply with 9 pins, 5th is connected Single Chip Microcomputer (SCM) system with 7 pins, 2nd pin connects power supply by diode D1,2nd pin is by diode D2 ground connection simultaneously, 3rd pin connects power supply by diode D4, and the 3rd pin is by diode D3 ground connection simultaneously, and the 2nd and 3 pins are connected respectively to positive pole and the negative pole of described TEC temperature control chip.
As shown in Figure 3, temperature sensor system 106 comprises temperature sensor DS18B20, power supply and resistance R1 (10K ohm), and DS18B20 digital temperature sensor provides 9-12 position Celsius temperature to measure and has a programmable warning function do not changed because power supply disappears triggered by low and high level.Its temperature-measuring range is-55 ~+125 DEG C, the 1st pin ground connection of temperature sensor DS18B20, and the 2nd pin connects Single Chip Microcomputer (SCM) system, and the 3rd pin connects power supply, and the 2nd pin connects the 3rd pin by resistance R1.
Fig. 4 is Fuzzy PID structural representation, wherein x is system input quantity, be the temperature of the laser diode of temperature sensor detection in the present embodiment, y is system output quantity, for the temperature of single-chip microcomputer after control algolithm process, for the input temp of TEC temperature control chip, e (t)=x-y is the input that deviate does that integration is separated PD control algolithm and Fuzzy PID, ec (t)=de (t)/dt is the input that system deviation rate of change makes Fuzzy PID, gauge tap is selected with deviation threshold ε as standard, control mode (| e|> ε) when large deviation, simple integration is selected to be separated the output quantity of PD control algolithm as controlled quentity controlled variable u
1, during little deviation (| e|≤ε) then adopt Fuzzy PID to export as controlled quentity controlled variable u
2, three controling parameters (K of pid control algorithm
pfor proportional action coefficient, K
ifor integral action coefficient, K
dfor derivative coefficient) on-line tuning, improves the performance of pid control algorithm further, improves the Parameters variation of temperature control system.Two control modes of this embodiment system, setting is worked as | and e|>3 (i.e. ε=3) takes PD control algolithm, when | take Fuzzy PID to control temperature time e|≤3 (i.e. ε=3).
The flow process of its temperature control system is: after startup self-detection, the temperature of the TEC temperature control chip stored when shutting down last time is read from the EEPROM storage chip of the data processing unit Single Chip Microcomputer (SCM) system, if do not have storing temperature when last time shuts down, read the temperature of current TEC temperature control chip during start, the setting of temperature is carried out by keyboard, arrange after controlling temperature at keyboard, start Fuzzy PID, the controlled quentity controlled variable exported drives the work of TEC temperature control chip on the one hand, signal feedback carries out the accurate control of temperature to temperature acquisition system on the other hand.
As shown in Figure 5, the temperature of semiconductor laser is 27 DEG C upon start, when the temperature of setting is 14 DEG C, temperature control system noise spectra of semiconductor lasers of the present utility model is utilized to carry out temperature control, the relation of the temperature and time of semiconductor laser as shown in Figure 5, as can be seen from Figure 5, the regulating time of control device is about 30s, system non-overshoot amount; The error of system is ± 0.05 DEG C.
The above is only preferred implementation of the present utility model; be noted that for those skilled in the art; under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (4)
1. based on the semiconductor laser temperature control device of fuzzy control, it is characterized in that: comprise for whole device provides the power module of power supply, Single Chip Microcomputer (SCM) system and laser diode; Described Single Chip Microcomputer (SCM) system is connected with Keyboard Control, display module and temperature sensor system, described Single Chip Microcomputer (SCM) system and TEC driving circuit one end, the TEC driving circuit other end connects TEC temperature control chip, TEC temperature control chip utilizes silica gel to be pasted onto the one side of heat-conducting plate, laser diode pasted by the another side silica gel of heat-conducting plate, the sensor compact siro spinning technology heat-conducting plate in temperature sensor system.
2. the semiconductor laser temperature control device based on fuzzy control according to claim 1, is characterized in that: described heat-conducting plate is aluminium sheet or red copper.
3. the semiconductor laser temperature control device based on fuzzy control according to claim 1, it is characterized in that: described TEC driving circuit comprises driving chip L298N, power supply and some diodes, the 1st of described driving chip, 8 and 15 pin ground connection, 4th is connected power supply with 9 pins, 5th is connected Single Chip Microcomputer (SCM) system with 7 pins, 2nd pin connects power module by diode D1, 2nd pin is by diode D2 ground connection simultaneously, 3rd pin connects power module by diode D4, 3rd pin is by diode D3 ground connection simultaneously, 2nd and 3 pins are connected respectively to positive pole and the negative pole of described TEC temperature control chip.
4. the semiconductor laser temperature control device based on fuzzy control according to claim 1, is characterized in that: described Single Chip Microcomputer (SCM) system is also connected with warning system.
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| CN201520715077.7U CN204925831U (en) | 2015-09-15 | 2015-09-15 | Semiconductor laser temperature control device based on fuzzy control |
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| CN201520715077.7U CN204925831U (en) | 2015-09-15 | 2015-09-15 | Semiconductor laser temperature control device based on fuzzy control |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105223977A (en) * | 2015-09-15 | 2016-01-06 | 盐城工学院 | A kind of semiconductor laser temperature control device based on fuzzy control and control method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105223977A (en) * | 2015-09-15 | 2016-01-06 | 盐城工学院 | A kind of semiconductor laser temperature control device based on fuzzy control and control method |
| CN105223977B (en) * | 2015-09-15 | 2017-09-26 | 盐城工学院 | A kind of control method of the semiconductor laser temperature control device based on fuzzy control |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 Termination date: 20160915 |