CN204925673U - Gas turbine cryogenic temperature analog system - Google Patents
Gas turbine cryogenic temperature analog system Download PDFInfo
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- CN204925673U CN204925673U CN201520488411.XU CN201520488411U CN204925673U CN 204925673 U CN204925673 U CN 204925673U CN 201520488411 U CN201520488411 U CN 201520488411U CN 204925673 U CN204925673 U CN 204925673U
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Abstract
The utility model relates to a gas turbine cryogenic temperature analog system, include: low temperature temperature controller, a plurality of temperature sensor and with the signal conditioning circuit of each temperature sensor one -to -one, two at least electrical heating boards and at least two semiconductor refrigeration pieces group, a plurality of temperature sensor are used for acquireing temperature field central part's temperature signal, be used for enlargeing temperature signal with the signal conditioning circuit of each temperature sensor one -to -one, low temperature temperature controller is used for generating control signal according to the temperature signal after enlargeing to be transmitted respectively to at least two electrical heating boards and at least two semiconductor refrigeration pieces group, two at least electrical heating boards are used for heating the temperature field according to control signal when the temperature field temperature reduces, at least two semiconductor refrigeration pieces group is used for refrigerating to the temperature field according to control signal when the temperature field temperature risees. The embodiment of the utility model provides a can overcome that electronic simulation temperature sensor is bulky, resolution ratio is poor and unstable scheduling problem.
Description
Technical field
The utility model relates to gas turbine simulation system, particularly relates to a kind of gas turbine cryogenic temperature simulation system.
Background technology
At present, such as there are the semi physical testing table of oneself in GE, Mitsubishi, Siemens and Alstom Deng Ge great gas turbine company.Gas turbine control system semi physical testing table gathers on mathematic simulated mode basis in combustion engine, accesses the parts such as such as controller, sensor and topworks total state emulation experiment of carrying out control system in loop in kind.In turbine control system semi-physical simulation, combustion engine temperature signal thermal resistance/thermopair is measured, and wherein thermal resistance measures compressor inlet temperature T1, and thermopair is used for measuring turbine outlet temperature T4.Thermal resistance/thermocouple signal imitation research has certain difficulty and complicacy, and domestic research is in this respect done seldom.
Thermal resistance temperature sensor adopts following several method usually: the combination that method (1) utilizes relay or electronic switch to switch different resistance in precision resistance case obtains variable resistance.But the volume of the method is large, differentiates rate variance, and make precise decreasing because being connected in series relay contacts resistance.Method (2) utilizes digital regulation resistance to obtain variable resistance by switching semiconductor resistor.But the method seals in larger switch conduction resistance, temperature stability is poor, and can not ensure the precision of thermal resistance, is also difficult to have higher resolution.Method (3) obtains variable resistance by driven by servomotor potentiometer.But the method volume is large, and need to adopt high-resolution scrambler and AD converter, therefore cost is high.
Utility model content
One of them object of the present utility model is to provide a kind of gas turbine cryogenic temperature simulation system, to solve the technical matters that precision resistance casing in prior art amasss greatly, cost is high and resolution is low.
For this purpose, the utility model proposes a kind of gas turbine cryogenic temperature simulation system, comprise: cryogenic temperature controller, multiple temperature sensor and with each temperature sensor signal conditioning circuit one to one, at least two electric boiling plates and at least two semiconductor chilling plate groups; The signal output part of each temperature sensor connects with the signal input part of corresponding signal conditioning circuit; The connection of the signal input part of described cryogenic temperature controller and the signal output part of described signal conditioning circuit, signal output part is connected with the signal input part of described at least two electric boiling plates and described at least two semiconductor chilling plate groups respectively; Wherein,
Described multiple temperature sensor is for obtaining the temperature signal of temperature field center part;
With each temperature sensor one to one signal conditioning circuit be used for described temperature signal is amplified;
Described cryogenic temperature controller be used for according to after described amplification temperature signal generate control signal transfer to respectively described at least two electric boiling plates and described at least two semiconductor chilling plate groups;
Described at least two electric boiling plates are used for heating temperature field according to control signal when temperature field temperature reduces;
Described at least two semiconductor chilling plate groups are used for freezing to temperature field according to control signal when temperature field temperature raises.
Alternatively, described temperature field is hollow cubic body, and the side plate in described temperature field is connected with base plate, and top board and wherein side plate are rotatably connected.
Alternatively, the side plate in described temperature field, base plate and top board adopt metallic copper to make.
Alternatively, described multiple temperature sensor is separately positioned on the top board in described temperature field and the top corner regions of base plate.
Alternatively, described multiple temperature sensor is platinum resistance thermometer sensor.
Alternatively, described at least two semiconductor chilling plate groups are arranged on the outside in described temperature field, and are separately fixed on the side plate in described temperature field.
Alternatively, at least two electric boiling plates are arranged on the outside in described temperature field, and are separately fixed on residue two side plates in described temperature field.
Alternatively, also comprise DC fan, it is inner that described DC fan is arranged on described temperature field, and be fixed on the base plate in described temperature field, for realizing the homogeneous temperature distribution in temperature field.
Alternatively, also comprise and each semiconductor chilling plate group axial flow blower one to one, described axial flow blower is fixed on the hot side of corresponding semiconductor chilling plate group, for discharging the heat that corresponding semiconductor chilling plate group hot side produces in time.
Alternatively, described cryogenic temperature controller adopts STM32 microprocessor.
The utility model embodiment adopts temperature physical simulating method, by applying excitation to temperature sensor, temperature sensor can be included in gas turbine cryogenic temperature simulation system, thus can to overcome in prior art electronic simulation temperature sensor volume large, differentiate the problem such as rate variance and instability.
Accompanying drawing explanation
Can understanding feature and advantage of the present utility model clearly by reference to accompanying drawing, accompanying drawing is schematic and should not be construed as and carry out any restriction to the utility model, in the accompanying drawings:
Fig. 1 is a kind of gas turbine cryogenic temperature simulation system theory diagram that the utility model embodiment provides;
Fig. 2 is a kind of gas turbine cryogenic temperature simulation system structural representation that the utility model embodiment provides;
Fig. 3 is the digital electronic device signal wiring schematic diagram that the utility model embodiment provides.
Embodiment
In order to more clearly understand above-mentioned purpose of the present utility model, feature and advantage, below in conjunction with the drawings and specific embodiments, the utility model is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the utility model; but; the utility model can also adopt other to be different from other modes described here and implement, and therefore, protection domain of the present utility model is not by the restriction of following public specific embodiment.
The utility model embodiment provides a kind of gas turbine cryogenic temperature simulation system, comprise: cryogenic temperature controller, multiple temperature sensor and with each temperature sensor signal conditioning circuit one to one, at least two electric boiling plates and at least two semiconductor chilling plate groups; The signal output part of each temperature sensor connects with the signal input part of corresponding signal conditioning circuit; The connection of the signal input part of cryogenic temperature controller and the signal output part of signal conditioning circuit, signal output part is connected with the signal input part of at least two electric boiling plates and at least two semiconductor chilling plate groups respectively; Wherein,
Multiple temperature sensor is for obtaining the temperature signal of temperature field center part;
With each temperature sensor one to one signal conditioning circuit be used for temperature signal is amplified;
Cryogenic temperature controller is used for the temperature signal generation control signal after according to amplification and transfers at least two electric boiling plates and at least two semiconductor chilling plate groups respectively;
At least two electric boiling plates are used for heating temperature field according to control signal when temperature field temperature reduces;
At least two semiconductor chilling plate groups are used for freezing to temperature field according to control signal when temperature field temperature raises.
Compared with prior art, the utility model embodiment adopts temperature physical simulating method, by applying excitation to temperature sensor, temperature sensor can be included in gas turbine cryogenic temperature simulation system, thus can to overcome in prior art electronic simulation temperature sensor volume large, differentiate the problem such as rate variance and instability.
As shown in Figures 1 to 3, a kind of gas turbine cryogenic temperature simulation system that the utility model embodiment provides comprises: cryogenic temperature controller 100, electric heater or semiconductor chilling plate group 200, temperature field 300, temperature sensor 400 and signal conditioning circuit 500.
Wherein, cryogenic temperature controller 100 for the treatment of the real time temperature data from temperature field 300, and generates the temperature control instruction controlling electric heater or semiconductor chilling plate group 200 work in conjunction with temperature instruction.
As shown in Figure 3, cryogenic temperature controller 100 is also communicated with host computer by universal serial bus RS-422, received temperature signal is transferred to liquid crystal display, for realizing the real-time Presentation Function of temperature data, both the temperature value of thermal resistance collection can have been shown, various duty can be shown again, facilitate host computer to carry out real-time state monitoring.Cryogenic temperature controller 100 is also connected with electric heater or semiconductor chilling plate group 200 by universal serial bus RS-422, according to the controlled quentity controlled variable output pwm signal calculated, completes and controls temperature field 300.In addition, cryogenic temperature controller 100 also comprises synchronous serial Peripheral Interface (SerialPeripheralInterface, SPI), electrically-erasable storer (E2ROM), joint test working group interface ((JointTestActionGroup, JTAG) etc., those skilled in the art can be arranged as the case may be, and the utility model is not construed as limiting.
As shown in Figures 1 and 2, temperature field 300 is hollow cubic body, and caloic is atmospheric air.Wherein the base plate in temperature field 300 is connected with side plate, more preferably, base plate and side plate one-body molded.The top board in temperature field 300 can be opened, and more preferably, in the utility model embodiment, top board and wherein side plate are rotatably connected, and namely top board side can be movable around the side of this side plate; When top board contacts with all sides, temperature field 300 seals, and internal heat is not easily spread; When top board is with when rotating around this side plate, now temperature field 300 is interior laying temperature meter or other measuring equipments can carry out temperature survey.More preferably, temperature field 300 base plate, side plate and top board adopt that coefficient of heat conductivity is high, the fast metallic copper that conducts heat is made, to realize Quick temperature adjustment.In practical application, temperature field 300 is of a size of 10cm*10cm*10cm.The cryogenic temperature simulation system that the utility model embodiment provides also comprises DC fan, and DC fan is arranged on inside, temperature field, and is fixed on the base plate in temperature field, for realizing the homogeneous temperature distribution in temperature field.
As shown in Figure 2, in the utility model embodiment, electric heater or semiconductor chilling plate group 200 comprise two electric heaters 201 and semiconductor chilling plate 202.For realizing temperature field 300 Fast Heating, in the utility model embodiment, two electric heaters 201 or two semiconductor chilling plate groups 202 are separately positioned on two side plates (two side plates can adjacent also can relatively) in temperature field 300, and be fixed on side plate by heat-conducting glue, realize side plate and electric heater 201 and semiconductor chilling plate group 202 flash heat transfer between the two.Wherein, two electric heaters 201 are for heating temperature field according to control signal when temperature field 300 temperature reduces.In practical application, the power of two electric heaters 201 is 150W.For realizing controlling the temperature of electric heater, also being provided with the heat-insulation unit corresponding one by one with each electric heater in the utility model embodiment, diffusing in time above the side plate in temperature field 300 with the heat making electric heater 201 and produce for preventing heat loss.
Two semiconductor chilling plate groups 202 are for freezing to temperature field according to control signal when temperature field temperature raises.In practical application, each semiconductor chilling plate group 202 adopts 4 chip semiconductor cooling pieces to be in series, and each semiconductor chilling plate rated voltage is 12V, and rated current is 4A.Certainly, those skilled in the art also can select according to embody rule occasion, and the utility model is not construed as limiting.As shown in Figure 2, also comprise in the utility model embodiment and each semiconductor chilling plate group axial flow blower one to one, axial flow blower is fixed on the hot side of corresponding semiconductor chilling plate group, the heat that the hot side for discharging corresponding semiconductor chilling plate group in time produces.Axial flow blower is connected with semiconductor chilling plate group by the heat radiator being of a size of 60cm*60cm*15cm.Wherein, the rated power of axial flow blower is 40W.
Temperature sensor 400 is for the real time temperature of collecting temperature field 300.As shown in Figure 2, wherein more preferably, the workspace core in temperature field 300 is provided with output temperature sensor, for cryogenic temperature controller 100 output temperature simulating signal.Temperature sensor 400 also comprises 8 temperature sensors, is separately positioned on the top corner regions of temperature field 300 base plate and top board, i.e. four corners of base plate and top board, can the temperature regime of feedback temperature field.For protection temperature field, the utility model embodiment also arranges monitoring sensor in inside, temperature field 300, and whether the temperature that this monitoring sensor is used for inside, monitor temperature field 300 is positioned within temperature tolerance range; When temperature exceeds tolerance range, this monitoring sensor is used for sending alarm signal to cryogenic temperature controller 100.When cryogenic temperature controller 100 receives this signal, cut off all power supplys in temperature field in time, to reach the object in protection temperature field.Wherein more preferably, temperature sensor 400 adopts platinum resistance thermometer sensor.
The utility model embodiment adopts temperature physical simulating method, by applying excitation to temperature sensor, temperature sensor can be included in gas turbine cryogenic temperature simulation system, thus can to overcome in prior art electronic simulation temperature sensor volume large, differentiate the problem such as rate variance and instability.
It should be noted that in description of the present utility model, term " on ", the orientation of the instruction such as D score or position relationship be based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.Unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
Also it should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operational zone, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
Above embodiment only in order to the technical solution of the utility model to be described, is not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (10)
1. a gas turbine cryogenic temperature simulation system, it is characterized in that, comprise: cryogenic temperature controller, multiple temperature sensor and with each temperature sensor signal conditioning circuit one to one, at least two electric boiling plates and at least two semiconductor chilling plate groups; The signal output part of each temperature sensor connects with the signal input part of corresponding signal conditioning circuit; The connection of the signal input part of described cryogenic temperature controller and the signal output part of described signal conditioning circuit, signal output part is connected with the signal input part of described at least two electric boiling plates and described at least two semiconductor chilling plate groups respectively; Wherein,
Described multiple temperature sensor is for obtaining the temperature signal of temperature field center part;
With each temperature sensor one to one signal conditioning circuit be used for described temperature signal is amplified;
Described cryogenic temperature controller be used for according to after described amplification temperature signal generate control signal transfer to respectively described at least two electric boiling plates and described at least two semiconductor chilling plate groups;
Described at least two electric boiling plates are used for heating temperature field according to control signal when temperature field temperature reduces;
Described at least two semiconductor chilling plate groups are used for freezing to temperature field according to control signal when temperature field temperature raises.
2. gas turbine cryogenic temperature simulation system according to claim 1, is characterized in that, described temperature field is hollow cubic body, and the side plate in described temperature field is connected with base plate, and top board and wherein side plate are rotatably connected.
3. gas turbine cryogenic temperature simulation system according to claim 2, is characterized in that, the side plate in described temperature field, base plate and top board adopt metallic copper to make.
4. gas turbine cryogenic temperature simulation system according to claim 1, is characterized in that, described multiple temperature sensor is separately positioned on the top board in described temperature field and the top corner regions of base plate.
5. the gas turbine cryogenic temperature simulation system according to claim 1 or 4, is characterized in that, described multiple temperature sensor is platinum resistance thermometer sensor.
6. the gas turbine cryogenic temperature simulation system according to Claims 1 to 4 any one, is characterized in that, described at least two semiconductor chilling plate groups are arranged on the outside in described temperature field, and are separately fixed on the side plate in described temperature field.
7. gas turbine cryogenic temperature simulation system according to claim 6, it is characterized in that, at least two electric boiling plates are arranged on the outside in described temperature field, and are separately fixed on residue two side plates in described temperature field.
8. gas turbine cryogenic temperature simulation system according to claim 1 and 2, it is characterized in that, also comprise DC fan, it is inner that described DC fan is arranged on described temperature field, and be fixed on the base plate in described temperature field, for realizing the homogeneous temperature distribution in temperature field.
9. gas turbine cryogenic temperature simulation system according to claim 1, it is characterized in that, also comprise and each semiconductor chilling plate group axial flow blower one to one, described axial flow blower is fixed on the hot side of corresponding semiconductor chilling plate group, for discharging the heat that corresponding semiconductor chilling plate group hot side produces in time.
10. gas turbine cryogenic temperature simulation system according to claim 1, is characterized in that, described cryogenic temperature controller adopts STM32 microprocessor.
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| CN201520488411.XU CN204925673U (en) | 2015-07-08 | 2015-07-08 | Gas turbine cryogenic temperature analog system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105955070A (en) * | 2016-06-30 | 2016-09-21 | 北京瑞禾四方科技有限公司 | Temperature field simulation device and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105955070A (en) * | 2016-06-30 | 2016-09-21 | 北京瑞禾四方科技有限公司 | Temperature field simulation device and system |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Gas turbine cryogenic temperature analog system Effective date of registration: 20161104 Granted publication date: 20151230 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: Beijing Huatsing Gas Turbine & IGCC Technology Co., Ltd. Registration number: 2016990000853 |
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| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191211 Granted publication date: 20151230 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: Beijing Huatsing Gas Turbine & IGCC Technology Co., Ltd. Registration number: 2016990000853 |