CN204925620U - Light -emitting -diode array heads positioning method and image forming apparatus - Google Patents

Light -emitting -diode array heads positioning method and image forming apparatus Download PDF

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Publication number
CN204925620U
CN204925620U CN201520552815.0U CN201520552815U CN204925620U CN 204925620 U CN204925620 U CN 204925620U CN 201520552815 U CN201520552815 U CN 201520552815U CN 204925620 U CN204925620 U CN 204925620U
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CN
China
Prior art keywords
resin material
laser
processing system
image processing
light source
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Expired - Fee Related
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CN201520552815.0U
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Chinese (zh)
Inventor
益田宜尚
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Toshiba Corp
Toshiba TEC Corp
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Toshiba Corp
Toshiba TEC Corp
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Priority to CN201520552815.0U priority Critical patent/CN204925620U/en
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Abstract

The utility model provides a light -emitting -diode array heads positioning method and image forming apparatus has: laser lamp -house, and resin casing. Laser lamp -house produces the laser that forms the electrostatic latent image. The resin casing use 1 resin material, and the 2 resin material that 1 resin material is different comes integrative taking shape. The resin casing has: the 1st part that constitutes by 1 resin material, and constitute and with the 2nd part that laser lamp -house is fixed by 2 resin material, 2 resin material, with 1 resin material compares, and coefficient of linear expansion is less.

Description

Image processing system
Technical field
The utility model relates to a kind of image processing system.
Background technology
Have a kind of image processing system, this image processing system makes laser beam flying photosensitive drums, forms sub-image.In image processing system, carry out the device section of laser beam flying, need the mutual position relationship making optics to keep fixing.Carry out that the device section of laser beam flying is many to be made up of laser scan unit.Optics is fixed on housing by laser scan unit.Position relationship between optics, by the dimensional stability of housing self, is kept fixing by housing.As housing, from the viewpoint of reducing costs, weight, adopt resin-case more.
Resin-case needs to suppress the change in size because thermal expansion causes and distortion.The many uses of resin-case comprise the resin material of filler.The resin material price that the containing ratio of filler is high is high.When forming the high resin material of the containing ratio of filler, need the mould using high price.In addition, if the resin material that the containing ratio forming filler is high, so, die life easily shortens.The component costs of the resin-case that the containing ratio of filler is high is high.
In laser scan unit, what especially need high dimensional stability is LASER Light Source.Light from laser diode is concentrated by collimation lens by LASER Light Source.LASER Light Source makes the diverging light of laser diode become directional light.Focus on from the depth of parallelism impact of the laser of LASER Light Source injection.If the distance of laser diode and collimation lens changes, so, the depth of parallelism changes.This result is, in image planes, generation defocuses.The spot diameter of the image planes of laser becomes large.Therefore, if the distance of laser diode and collimation lens changes, so, image quality reduces.
The distance of LASER Light Source to laser diode and collimation lens is mounted with adjusting.LASER Light Source becomes the distance of laser diode and collimation lens is kept fixing laser cell.LASER Light Source is fixed on resin-case as laser cell.
Therefore, the components number of laser scan unit is many.Especially, in the image processing system of full color, LASER Light Source needs four, and therefore, the cost of laser scan unit increases.
Utility model content
The utility model provides a kind of for above-mentioned deficiency can have cheapness and the image processing system of superperformance.
Image processing system of the present utility model, possesses:
LASER Light Source, sends the laser beam forming electrostatic latent image; And
Resin-case, use the 1st resin material and 2nd resin material different from described 1st resin material integrally formed, and there is the part 1 that is made up of described 1st resin material and be made up of described 2nd resin material, and the part 2 of fixing described LASER Light Source.
Described 2nd resin material, compared with described 1st resin material, linear expansion coefficient is less.
Image processing system of the present utility model, possesses:
LASER Light Source, sends the laser beam forming electrostatic latent image; And
Resin-case, use the 1st resin material and 2nd resin material different from described 1st resin material integrally formed, and there is the part 1 that is made up of described 1st resin material and be made up of described 2nd resin material, and the part 2 of fixing described LASER Light Source
Described 2nd resin material, compared with described 1st resin material, the anisotropy of linear expansion coefficient is less.
Image processing system of the present utility model, possesses:
LASER Light Source, sends the laser beam forming electrostatic latent image; And
Resin-case, use the 1st resin material and 2nd resin material different from described 1st resin material integrally formed, and there is the part 1 that is made up of described 1st resin material and be made up of described 2nd resin material, and the part 2 of fixing described LASER Light Source
Described 2nd resin material, compared with described 1st resin material, pyroconductivity is higher.
The utility model has LASER Light Source and resin-case, and this resin-case has the part 1 that is made up of the 1st resin material and is made up of the 2nd resin material different from the 1st resin material, and the part 2 of fixed laser light source.Therefore, by adopting high performance material compared with the 1st resin material as the 2nd resin material, can provide and there is cheapness and the image processing system of superperformance.
Accompanying drawing explanation
Fig. 1 is the profile schema diagram of the one-piece construction example of the image processing system representing the utility model embodiment;
Fig. 2 is the profile schema diagram of the structure example of the laser scan unit of the image processing system representing the utility model embodiment;
Fig. 3 is the plane model figure of the structure example of the laser scan unit of the image processing system representing the utility model embodiment;
Fig. 4 A is the three-dimensional pattern figure of the major part of the laser scan unit of the image processing system representing the utility model embodiment;
Fig. 4 B is the A-A sectional view in Fig. 4 A;
Fig. 5 is the plane model figure of the structure example of the laser scan unit of the image processing system of the variation (the 1st variation) representing the utility model embodiment;
Fig. 6 is the plane model figure of the structure example of the laser scan unit of the image processing system of the variation (the 2nd variation) representing the utility model embodiment;
Fig. 7 is the plane model figure of the structure example of the laser scan unit of the image processing system of the variation (the 3rd variation) representing the utility model embodiment;
Fig. 8 is the profile schema diagram of the structure example of the laser scan unit of the image processing system of the variation (the 4th variation) representing the utility model embodiment;
Fig. 9 is the three-dimensional pattern figure of the major part representing the laser scan unit used in the image processing system of the variation (the 5th variation) of the utility model embodiment;
Figure 10 is the plane model figure of the major part representing the laser scan unit used in the image processing system of the variation (the 5th variation) of the utility model embodiment.
Embodiment
The image processing system of a kind of embodiment of the present utility model has: LASER Light Source and resin-case.LASER Light Source produces the laser forming electrostatic latent image.Resin-case uses the 1st resin material and 2nd resin material different from described 1st resin material to come integrally formed.Resin-case has: the part 1 be made up of the 1st resin material and to be made up of the 2nd resin material and by part 2 fixing for LASER Light Source.
(embodiment)
Below, with reference to accompanying drawing, the image processing system 100 of embodiment is described.In addition, in each figure, if be not particularly limited, for same structure, mark identical label.
Fig. 1 is the profile schema diagram of the one-piece construction example of the image processing system 100 representing the utility model embodiment.Fig. 2 is the profile schema diagram of the structure example of the laser scan unit 26 of the image processing system 100 representing the utility model embodiment.Fig. 3 is the plane model figure of the structure example of the laser scan unit 26 of the image processing system 100 representing the utility model embodiment.Fig. 4 A is the three-dimensional pattern figure of the major part of the laser scan unit 26 of the image processing system 100 representing the utility model embodiment.Fig. 4 B is the A-A sectional view in Fig. 4 A.
As shown in Figure 1, the image processing system 100 of embodiment has: control panel 1, scanner portion 2, printer portion 3, thin slice supply unit 4, delivery section 5 and control part 6.
Control panel 1 is that the information being used for operating image processing system 100 is carried out a part for the input part inputted by operator.Control panel 1 has: touch pad and various hardkey.
Scanner portion 2 reads the image information of duplicating object, is used as the light and shade of light.Scanner portion 2 exports the image information of reading to printer portion 3.
The image information that printer portion 3 reads based on scanner portion 2 or the picture signal from outside, by comprising the developer of toner etc., form output image (hereinafter referred to as toner image).
Toner image is transferred on the surface of thin slice S by printer portion 3.Toner image on the surface of the 3 couples of thin slice S in printer portion applies heat and pressure, is fixed on by toner image on thin slice S.
Thin slice supply unit 4 coordinates printer portion 3 to form the time of toner image, and thin slice S is supplied to printer portion 3 one by one.
Thin slice supply unit 4 has multiple paper feeding cassette 20A, 20B, 20C.Each paper feeding cassette 20A, 20B, 20C receive the thin slice S of default size and kind respectively.Each paper feeding cassette 20A, 20B, 20C have pickup roller 21A, 21B, 21C respectively.Thin slice S takes out from each paper feeding cassette 20A, 20B, 20C by each pickup roller 21A, 21B, 21C one by one.The thin slice S of taking-up is supplied to delivery section 5 by pickup roller 21A, 21B, 21C.
Delivery section 5 has: conveying roller 23 and register roller 24.The thin slice S supplied from pickup roller 21A, 21B, 21C is delivered to register roller 24 by delivery section 5.Toner image is transferred to the time of thin slice S by register roller 24 according to printer portion 3, conveying thin slice S.
Conveying roller 23 makes the nip N of the front end crash register roller 24 of the throughput direction of thin slice S.Conveying roller 23 bends by making thin slice S, arranges the position of the front end of the thin slice S on throughput direction.
The front end of thin slice S is integrated by register roller 24 in nip N.In addition, thin slice S is delivered to transfer section 28 side described later by register roller 24.
Then, the detailed construction in printer portion 3 is described.
Printer portion 3 has: image forming part 25Y, 25M, 25C, 25K; Laser scan unit 26, intermediate transfer belt 27, transfer section 28, fuser 29 and transfer belt cleaning unit 31.
Image forming part 25Y, 25M, 25C, 25K, respectively according to the picture signal from scanner portion 2 or outside, form toner image.
Image forming part 25Y, 25M, 25C, 25K have photosensitive drums respectively.
The toner image of the toner based on yellow, pinkish red, bluish-green, black is formed in photosensitive drums by image forming part 25Y, 25M, 25C, 25K respectively.
Around each photosensitive drums, well-known charged device, developer, 1 transfer roll, cleaning unit are set and remove electrical equipment.Charged device makes the surface of photosensitive drums charged.Developer respectively collecting bag containing the developer of the toner of yellow, pinkish red, bluish-green and black.Each developer develops to the electrostatic latent image in photosensitive drums respectively.This result is, in photosensitive drums, forms the toner image of the toner based on colors respectively.
1 time transfer roll is relative with each photosensitive drums.Intermediate transfer belt 27 described later is clipped between transfer roll and photosensitive drums respectively at 1 time.
1 time the toner image on the surface of photosensitive drums is transferred to intermediate transfer belt 27 1 time by transfer roll.
The non-transfer toner on the surface of each photosensitive drums after 1 transfer printing such as scrapes off and removes by cleaning unit.Except electrical equipment irradiates light to the surface of the photosensitive drums through cleaning unit.Except electrical equipment carries out except electricity photosensitive drums.
Laser scan unit 26 described later is positioned at the below of charged device and developer.
Laser scan unit 26 is respectively to surperficial illuminating laser beam L1, L2, L3, L4 of photosensitive drums.Laser beam L1, L2, L3, L4, based on from scanner portion 2 or the outside picture signal sent, modulate.From scanner portion 2 or externally to laser scan unit 26 send picture signal corresponding with the image be formed in thin slice S.
Laser scan unit 26, according to picture signal, photosensitive drums forms electrostatic latent image.The irradiation position of each laser beam is charged device in each photosensitive drums and between developer.
As shown in Figure 2,3, laser scan unit 26 has: shell 40 (resin-case), LASER Light Source 53 (with reference to Fig. 3) and write optical system 35.
LASER Light Source 53 and write optical system 35 are remained fixing position relationship by shell 40.
Shell 40 is housings of the box-shaped of at least upper opening.The opening of the top of shell 40, except being the opening allowing laser beam L1, L2, L3, L4 pass through, is lived by not shown cap seal.
Shell 40 use the 1st resin material and 2nd resin material different from the 1st resin material integrally formed.At this, the 1st resin material is different from the 2nd resin material to be referred to, the meaning that respective physical property is different.In present embodiment, the linear expansion coefficient of the 2nd resin material is less than the 1st resin material.
Such as, as the linear expansion coefficient of the 2nd resin material, 2.1 × 10 can be enumerated - 5k -1~ 3.3 × 10 -5k -1example.As the example of the 2nd such resin material, PPE, PC can be set forth in independent; Or the example etc. containing 20% ~ 50% filler in the resin alloy of PPE+PS, PC+ABS etc.
Such as, as the linear expansion coefficient of the 1st resin material, 3 × 10 can be enumerated -5k - 1~ 6 × 10 -5k -1example.As the example of the 1st such resin material, PPE, PC can be set forth in independent; Or the example etc. containing 0% ~ 20% filler in the resin alloy of PPE+PS, PC+ABS etc.
The linear expansion coefficient of the 2nd resin material according to be configured in use the 2nd resin material position parts needed for configuration precision decide.
In shell 40, at least the position of fixed laser light source 53 is formed by the 2nd resin material.
1st resin material and the 2nd resin material comprise the fillers such as glass fibre respectively.When 2nd resin material comprises filler, filler containing ratio is higher than the filler containing ratio of the 1st resin material.
As the example of the filler used in the 2nd resin material, glass, aluminium oxide, mica etc. can be enumerated.Such as, filler can change the physical property as resin material, the linear expansion coefficient of such as the 2nd resin material, vertical elasticity coefficient, pyroconductivity, proportion, hardness etc.
As the example of the containing ratio of the filler used in the 2nd resin material, can 20% ~ 50% be enumerated.
In addition, in this instructions, when mentioning resin material, refer to the composition of the filler beyond base resin and base resin, additive etc.But when being only shaped by base resin, base resin is resin material.
Such as, as the 1st resin material, the resin material that with the addition of filler 20% is used in base resin.At this moment, in identical base resin, the resin material of filler 50% has been coordinated to be different resin materials.At this moment, as the 2nd resin material, the resin material that with the addition of filler 50% in identical base resin can be used in.
2nd resin material can use compares the 1st resin material, the resin material that the anisotropy of linear expansion coefficient is less.When there is linear expansion coefficient poor based on direction, the anisotropy of linear expansion coefficient is represented by the ratio of the difference of the maxima and minima of the linear expansion coefficient of the mean value relative to linear expansion coefficient.
In shell 40, as shown in Figure 3, fix the part 2 S1 of 4 LASER Light Source 53, S2, S3, S4 are formed by the 2nd resin material.Part 1 S0 as other positions of shell 40 is formed by the 1st resin material.
As the example of the base resin of the 1st resin material used in such shell 40, PPE, PC etc. can be enumerated.As the example of the base resin of the 2nd resin material used in shell 40, PPE, PC etc. can be enumerated.
Such as, shell 40 can by the manufacturing process manufacture being called as colour mixture shaping or two material formings etc.Such as, in the mould that shell 40 is shaped, from door injection the 2nd resin material being arranged at part 2 S1, S2, S3, S4.From the 1st resin materials of other injections at the peripheral part of part 2 S1, S2, S3, S4, with the 2nd resin material contacts and one harden inseparably.
If part 1 S0 and part 2 S1, boundary line sectoral integration between S2, S3, S4 can be made, so, the curring time of two resin materials and the number of molds of use are not particularly limited.In addition, part 1 S0 and part 2 S1, boundary line part between S2, S3, S4 do not need to form clear and definite boundary line.That is, also can be the colour mixture region that the ratio of the 1st resin material and the 2nd resin material is moved.
Boundary line in Fig. 3 shown in double dot dash line schematically illustrates average boundary line.
In Fig. 4 A, 4B, illustrate the structure of the vicinity of the part 2 S1 (S2, S3, S4) of shell 40.
On the base plate 40a of shell 40, stand and side plate 40c is set.Side plate 40c is formed in the side of shell 40.
At the thickness direction of side plate 40c, peristome 40e is through.Around the peristome 40e of the exterior side of side plate 40c, form the press-in hole 40d be pressed into by laser diode 50 described later.The internal diameter of press-in hole 40d is greater than the internal diameter of peristome 40e.In addition, the internal diameter of press-in hole 40d is the size that the flange of laser diode 50 can be made to be pressed into.
Peristome 40e is size and the shape of not blocking the laser beam L1 (L2, L3, L4) dispersed from the laser diode 50 of press-in press-in hole 40d.
Press-in hole 40d, peristome 40e are arranged coaxially with the optical axis OL of laser beam L1, L2, L3, L4 respectively.
On the base plate 40a of the inner side relative to side plate 40c, form rib 40b.Rib 40b, in plan view, extends with the U-shaped clipping peristome 40e from the inner side of side plate 40c.From height lower than the side plate 40c from base plate 40a of the height of the rib 40b of base plate 40a.
In rib 40b, in the position relative with peristome 40e, form the lens acceptance division 40f being used for fixing collimation lens 52.Lens acceptance division 40f is V shape groove.
Lens acceptance division 40f is in part 2 S1, S2, S3, S4, and the lens axis of each collimation lens 52 keeps the height identical with the optical axis OL of laser beam L1, L2, L3, L4.
The width along optical axis OL of lens acceptance division 40f it is possible to the width of the amount of movement needed for collimation adjustment guaranteeing collimation lens 52.Such as, the width along optical axis OL of lens acceptance division 40f is longer than following length, that is, in the length of the lens profile of collimation lens 52, add the length of the size becoming collimation setting range.But in the scope of collimation adjustment, the center of gravity of collimation lens 52 is accommodated in the inside of lens acceptance division 40f.At this moment, the length of the lens profile of collimation lens 52 can be shorter than along the width of the optical axis OL of lens acceptance division 40f.
Part 2 S1 (S2, S3, S4) is, as shown in boundary line portion B in Fig. 4 A, on base plate 40a, surrounds the region of the U-shaped of rib 40b.Part 2 S1 (S2, S3, S4) is, upper at side plate 40c, the rectangular-shaped region of width roughly the same with the region of the U-shaped of base plate 40a.
Press-in hole 40d, rib 40b and lens acceptance division 40f are formed at part 2 S1 (S2, S3, S4).In addition, the base plate 40a between press-in hole 40d and lens acceptance division 40f and side plate 40c is also formed at part 2 S1 (S2, S3, S4).
LASER Light Source 53 has: laser diode 50 (laser diode) and collimation lens 52.
LASER Light Source 53 arranges four.Each LASER Light Source 53 forms laser beam L1, L2, L3, L4 respectively.Laser beam L1, L2, L3, L4 each photosensitive drums to image forming part 25Y, 25M, 25C, 25K scan.
Laser diode 50 and Laser Driven substrate 51 are electrically connected.Laser Driven substrate 51 can be connected communicatedly with control part 6.Laser Driven substrate 51, based on the picture signal sent from control part 6, is modulated laser diode 50.
Once flow out drive current from Laser Driven substrate 51, so, laser diode 50 is luminous.Laser diode 50 is launched diverging light and is used as laser beam L1 (L2, L3, L4).
Laser diode 50 is pressed in the press-in hole 40d of shell 40.
The diverging light penetrated from laser diode 50 is concentrated by collimation lens 52.Configuration collimation lens 52, this collimation lens 52 makes focal position align with the luminous point of laser diode 50.Collimation lens 52 makes to become parallel beam from the diverging light of laser diode 50.
Collimation lens 52 bonds according to the LASER Light Source 53 being configured at lens acceptance division 40f.
During the bonding of collimation lens 52, carry out collimation adjustment, determine fixed position.When carrying out collimation adjustment, remained on by shell 40 in adjustment fixture, wherein, this shell 40 has been pressed in each press-in hole 40d by laser diode 50.Adjustment fixture has: the moving adjusting mechanism of collimation lens 52, the bonding mechanism of collimation lens 52, the mensuration optical system measured the emerging beam carrying out self-focus lens 52.
Measuring optical system makes laser diode 50 luminous, and measures the collimation of emerging beam.Adjustment person moves the position of collimation lens 52, until the collimation of emerging beam becomes allowed band.If the collimation of emerging beam becomes allowed band, so, collimation lens 52, by bonding mechanism, is bonded in lens acceptance division 40f by adjustment person.
So, adjustment person carries out the collimation adjustment of each LASER Light Source 53, is fixed by each collimation lens 52.
As shown in Figure 2, write optical system 35 to have: omit illustrated cylindrical lens and polygon motor 41.In addition, write optical system 35 to have: 1f θ lens 42A, 42B; And 2f θ lens 43A, 43B.In addition, write optical system 35 to possess: mirror 44A, 44B, 45A, 45B, 46A, 46B, 47A, 47B, 48A, 48B, 49A, 49B.
Cylindrical lens is imaged as wire by from each laser beam L1 of each LASER Light Source 53, L2, L3, L4 respectively.Each cylindrical lens is configured between LASER Light Source 53 and polygon motor 41.
Polygon motor 41 makes each laser beam be partial to scanning.Polygon motor 41 makes rotor 41b rotate.On rotor 41b, secure polygonal mirror 41a.Polygonal mirror 41a has multiple deflection face in the position of the rotation O distance equidistance from rotor 41b.Observe from the direction along rotation O, multiple deflection face is configured to regular polygon shape.Polygon motor 41 can use DC motor.
In embodiment, polygon motor 41 is 1.In addition, polygon motor 41 makes laser beam L1, L2 and laser beam L3, L4 distributes to mutual relative direction.Polygon motor 41 is fixed on the central part below shell 40.The rotation O of polygonal mirror 41a vertically extends at base plate 40a.
First, the write optical system 35 relevant to laser beam L1, L2 is described.
The laser beam L1, the L2 that are undertaken by the polygonal mirror 41a of polygon motor 41 being partial to carry out light harvesting by 1f θ lens 42A.Laser beam L1, L2 through 1f θ lens 42A are reflected by mirror 44A.Light harvesting is carried out by 2f θ lens 43A by laser beam L1, L2 that mirror 44A reflects.The specific spot diameter in image planes is imaged as by laser beam L1, the L2 of 1f θ lens 42A, 2f θ lens 43A.In addition, if polygonal mirror 41a rotates with fixed speed, so, laser beam L1, L2 have been endowed the f θ characteristic of image planes being carried out to constant scanning.
Reflected successively by mirror 46A, 47A by the laser beam L1 that mirror 45A reflects.Laser beam L1 reflects towards the photosensitive drums of image forming part 25Y by mirror 47A.
Reflected successively by mirror 48A, 49A by the laser beam L2 that mirror 45A reflects.Laser beam L2 reflects towards the photosensitive drums of image forming part 25M by mirror 49A.
Then, the write optical system 35 relevant to laser beam L3, L4 is described.
The write optical system 35 relevant to laser beam L3, L4 has following structure, that is, the write optical system 35 relevant to laser beam L1, L2 is configured at roughly symmetric position.The configuration attitude of mirror 47B, 49B described later is different from above-mentioned mirror 47A, 49A.This is the incident angle for each photosensitive drums for coordinating laser beam L1, L2, L3, L4.
The laser beam L3, the L4 that are undertaken by polygonal mirror 41a being partial to carry out light harvesting by 1f θ lens 42B.Laser beam L3, L4 through 1f θ lens 42B are reflected by mirror 44B.Light harvesting is carried out by 2f θ lens 43B by laser beam L3, L4 that mirror 44B reflects.Be imaged as by laser beam L3, the L4 of 1f θ lens 42B, 2f θ lens 43B: specific spot diameter in image planes.In addition, if polygonal mirror 41a rotates with fixed speed, so, laser beam L3, L4 have been endowed the f θ characteristic of image planes being carried out to constant scanning.
Reflected successively by mirror 46B, 47B by the laser beam L4 that mirror 45B reflects.Mirror 47B makes laser beam L4 reflect towards the photosensitive drums of image forming part 25C.
Reflected successively by mirror 48B, 49B by the laser beam L3 that mirror 45B reflects.Mirror 49B makes laser beam L3 reflect towards the photosensitive drums of image forming part 25K.
1f θ lens 42A, 42B can adopt mutually isostructural lens.Similarly, 2f θ lens 43A, 43B also can adopt mutually isostructural lens.
Above-mentioned write optical system 35 is all fixed on shell 40.But each parts directly can be fixed with shell 40, or by miscellaneous part, indirectly fix.In embodiment, as an example, each parts of write optical system 35 are all fixed with part 1 S0.
In addition, eliminate diagram, in write optical system 35, comprise synchronization detecting sensor.In addition, the mirror that can also comprise and laser beam L1, L2, L3, L4 be guided to synchronization detecting sensor is write in optical system 35.These parts also can be fixed on shell 40 directly or indirectly.
About fixing means write optical system 35 being fixed on shell 40, be not particularly limited.Fixing means according to the characteristic of parts, can adopt suitable fixing means.Such as bonding, screw fastening can be adopted, fixed by the pressing of planar spring.
As shown in Figure 1, intermediate transfer belt 27 is made up of endless belt.Multiple roller abuts with the inner peripheral surface of intermediate transfer belt 27.Multiple roller gives tension force to intermediate transfer belt 27.Intermediate transfer belt 27 is supported for flat with stretching by multiple roller.
Intermediate transfer belt 27 is positioned at the top of each photosensitive drums of image forming part 25Y, 25M, 25C, 25K.Intermediate transfer belt 27 supports along the direction of each photosensitive drums arrangement of image forming part 25Y, 25M, 25C, 25K with being stretched.
The end of inner peripheral surface in draw direction of intermediate transfer belt 27, abuts with backing roll 28a.Inner peripheral surface another end in draw direction of intermediate transfer belt 27, abuts with transfer belt roller 32.
Backing roll 28a forms a part for transfer section 28 described later.Intermediate transfer belt 27 is guided to 2 transfer position by backing roll 28a.
Intermediate transfer belt 27 is guided to cleaning position by transfer belt roller 32.
Backing roll 28a and transfer belt roller 32 with eliminate illustrated intermediate transfer belt CD-ROM drive motor and be connected.Intermediate transfer belt CD-ROM drive motor makes backing roll 28a and transfer belt roller 32 counter clockwise direction in FIG rotate.
In intermediate transfer belt 27, transfer section 28 is positioned at the position adjacent with image forming part 25K.
Transfer section 28 has: backing roll 28a and 2 time above-mentioned transfer roll 28b.Backing roll 28a and 2 time intermediate transfer belt 27 clamps by transfer roll 28b.The position that 2 transfer roll 28b and intermediate transfer belt 27 abut mutually is 2 transfer position.
The toner image that 1 time is transferred on intermediate transfer belt 27 is transferred on the surface of the thin slice S in 2 transfer position by transfer section 28.Transfer section 28 gives transfer bias to 2 transfer position.Toner image on intermediate transfer belt 27 is transferred on thin slice S by transfer bias by transfer section 28.
Fuser 29 couples of thin slice S give heat and pressure.Fuser 29 passes through heat and pressure, by fixing for the toner image be transferred on thin slice S.
Transfer belt cleaning unit 31 is relative with transfer belt roller 32.Transfer belt cleaning unit 31 clamps intermediate transfer belt 27.Transfer belt cleaning unit 31 strikes off the toner on the surface of intermediate transfer belt 27.The toner struck off is recycled in useless powder box by transfer belt cleaning unit 31.
Printer portion 3 also has inverting units 30.The thin slice S that inverting units 30 will be discharged from fuser 29, is reversed by zigzaggery.Thin slice S after reversion is delivered in the conveying guiding element in face of register roller 24 by inverting units 30 again.In order to form image overleaf, thin slice S reverses by inverting units 30.
Control part 6 carries out the control of each device section of image processing system 100.
The action of the image processing system 100 with above-mentioned structure is described.
In image processing system 100, from control panel 1 or outside, control part 6 input is carried out to the instruction of image formation.Control part 6 makes printer portion 3 start to carry out image formation.The thin slice S of suitable size is supplied to register roller 24 from thin slice supply unit 4 by printer portion 3.
Printer portion 3, by laser scan unit 26, each photosensitive drums of image forming part 25Y, 25M, 25C, 25K forms sub-image.That is, each LASER Light Source 53 penetrate modulate based on image information laser beam L1, L2, L3, L4.
As shown in Figure 2, such as, laser beam L1, L2, L3, L4 are by omitting illustrated cylindrical lens, imaging on polygonal mirror 41a.Laser beam L1, L2, L3, L4, by the rotation of polygonal mirror 41a, carry out deflection scanning at main scanning direction.Wherein, the direction of scanning of laser beam L1, L2 is contrary direction with the direction of scanning of laser beam L3, L4.In order to make image not produce mirror image, coordinate direction of scanning supply picture signal.
Such as, after laser beam L1 (L4) is reflected by polygonal mirror 41a, via 1f θ lens 42A (42B), mirror 44A (44B), 2f θ lens 43A (43B), mirror 45A (45B), mirror 46A (46B), mirror 47A (47B), arrive photosensitive drums.
Such as, after laser beam L2 (L3) is reflected by polygonal mirror 41a, via 1f θ lens 42A (42B), mirror 44A (44B), 2f θ lens 43A (43B), mirror 45A (45B), mirror 48A (48B), mirror 49A (49B), arrive photosensitive drums.
So, in each photosensitive drums of image forming part 25Y, 25M, 25C, 25K, form the electrostatic latent image corresponding with picture signal.
Each electrostatic latent image that each photosensitive drums is formed develops respectively by developer by image forming part 25Y, 25M, 25C, 25K.Image forming part 25Y, 25M, 25C, 25K, on the surface of each photosensitive drums, form the toner image corresponding with electrostatic latent image.
Each toner image is transferred to intermediate transfer belt 27 1 time by each transfer roll.At this moment, 1 transfer time, according to the allocation position of image forming part 25Y, 25M, 25C, 25K, suitably staggers by control part 6.Therefore, each toner image, along with the movement of intermediate transfer belt 27, does not produce gamut ground overlapping successively.Intermediate transfer belt 27 makes each toner image move to transfer section 28.
The thin slice S being supplied to transfer section 28 from register roller 24 arrives transfer section 28.The toner image arriving transfer section 28 is transferred to thin slice S 2 times by transfer section 28.Fuser 29 by fixing for the toner image of 2 transfer printings on thin slice S.The thin slice S of fixing toner image is discharged to the outside of image processing system 100.
Be transferred band cleaning unit 31 by transfer section 28 transfer residual toner be not transferred on thin slice S to strike off.Transfer belt cleaning unit 31 can be reused and clean intermediate transfer belt 27.
Above, the image completed for 1 thin slice S is formed.
If image processing system 100 carries out action as described above, so, the built-in temperature of image processing system 100 rises.Especially, in laser scan unit 26, because polygon motor 41 High Rotation Speed, so polygon motor 41 becomes pyrotoxin.Due to heating or the built-in temperature rising of polygon motor 41, so there is thermal expansion in shell 40.
Especially, if the interval variation of laser diode 50 and collimation lens 52, so laser beam L1, L2, L3, L4 defocus.The laser beam L1 of image planes, the spot diameter of L2, L3, L4 become large.If spot diameter becomes exceed allowed band greatly, so, the image quality deterioration of image processing system 100.
But in image processing system 100, each LASER Light Source 53 is arranged at part 2 S1, S2, S3, S4.Laser diode 50 is determined by the part 2 S1 of the light path along laser beam L1, L2, L3, L4, the thermal expansion of S2, S3, S4 with the change of the distance of collimation lens 52.
In image processing system 100, part 2 S1, S2, S3, S4 use the 2nd resin material that linear expansion coefficient is little.Therefore, it is possible to suppress the laser beam L1 because the impact of thermal expansion causes, the defocusing of L2, L3, L4.
In addition, in image processing system 100, laser diode 50 and collimation lens 52 are directly fixed on shell 40.Therefore, the parts such as the lens barrel of the holding member keeping laser diode 50 and maintenance collimation lens 52 are not used.Therefore, the structure of laser scan unit 26 becomes simple.The number of components of laser scan unit 26 can be reduced.
According to laser scan unit 26, only use as the part 2 S1 of the some of shell 40, S2, S3, S4 the 2nd resin material that linear expansion coefficient is little.The most part 1 S0 occupying shell 40 is the 1st resin material that linear expansion coefficient is larger.1st resin material compares the 2nd resin material, more cheaply.Therefore, when comparing shell 40 entirety use the 2nd resin material, shell 40 becomes cheap.
Below, the variation of above-mentioned embodiment is described.
1st variation is described.
As shown in Figure 1, the image processing system 100A of the 1st variation replaces the laser scan unit 26 of above-mentioned embodiment, and has laser scan unit 26A.Below, be described centered by the point different from above-mentioned embodiment.
Fig. 5 is the plane model figure of the structure example of the laser scan unit 26A of the image processing system 100A of the variation (the 1st variation) representing the utility model embodiment.
Laser scan unit 26A replaces the shell 40 of the laser scan unit 26 of above-mentioned embodiment, and has shell 60 (resin-case).
As shown in Fig. 4 B, 5, shell 60 has the shape identical with shell 40.Wherein, the following difference of shell 60, that is, replace the part 2 S1 of shell 40, S2, S3, S4, and have part 2 S10.
Part 2 S10 is formed by with the part 2 S1 of above-mentioned embodiment, the 2nd resin material that S2, S3, S4 are identical.As shown in Figure 5, part 2 S10 be formed in continuously secure 4 LASER Light Source 53 region on the whole.In shell 60,4 LASER Light Source 53 are fixed on continuous print part 2 S10.
Such as, shell 60, can by being called as the manufacturing process manufacture of colour mixture shaping or two material formings etc. in the same manner as shell 40.
According to image processing system 100A, in the same manner as the image processing system 100 of above-mentioned embodiment, part 2 S10 uses the 1st resin material comparing part 1 S0, the 2nd resin material that linear expansion coefficient is less.Therefore, it is possible to suppress the laser beam L1 because the impact of thermal expansion causes, the defocusing of L2, L3, L4.
In addition, also same with image processing system 100 in image processing system 100A, laser diode 50 and collimation lens 52 are directly fixed on shell 60.Therefore, the structure of laser scan unit 26A becomes simple.The number of components of laser scan unit 26A can be reduced.
In shell 60, because make part 2 S10 be formed continuously, so, the quantity of door can be reduced.Therefore, it is possible to reduce the cost of manufacture of mould.
2nd variation is described.
As shown in Figure 1, the image processing system 100B of the 2nd variation replaces the laser scan unit 26A of the 1st above-mentioned variation, and has laser scan unit 26B.Below, be described centered by the point that the 1st variation from above-mentioned is different.
Fig. 6 is the plane model figure of the structure example of the laser scan unit 26B of the image processing system 100B of the variation (the 2nd variation) representing the utility model embodiment.
Laser scan unit 26B replaces the shell 60 of the laser scan unit 26A of the 1st above-mentioned variation, has shell 70 (resin-case).
As shown in Figure 6, shell 70 has the shape same with shell 60.In addition, shell 70, in the same manner as shell 60, has part 2 S10.Wherein, shell 70 have part 2 S11 this point different from shell 60.
Part 2 S11, in the position of the shell 70 of fixing polygon motor 41, is formed in the scope larger than polygon motor 41.
Part 2 S11 is made up of the 2nd resin material different from the 1st resin material of part 1 S0.Wherein, the 2nd resin material in part 2 S11 is by the 1st resin material comparing part 1 S0, and the resin material that pyroconductivity is high is formed.
Such as, the 1st resin material used in part 1 S0 is PC+GF30 (pyroconductivity: 0.3W/ (mK)).At this moment, as part 2 S11, high heat transfer PC (pyroconductivity: 4.9W/ (mK)), high heat transfer PBT (pyroconductivity 3W/ (mK)) etc. can be enumerated.At this, " PC+GF30 " represents resin based on polycarbonate resin, coordinates the resin material of the glass fibre of 30%.
Such as, shell 70, in the same manner as shell 60, can be manufactured by the manufacturing process being called as colour mixture shaping or two material formings etc.
According to image processing system 100B, in the same manner as the image processing system 100A of the 1st above-mentioned variation, there is part 2 S10.Therefore, it is possible to suppress the laser beam L1 because the impact of thermal expansion causes, the defocusing of L2, L3, L4.In addition, the structure of laser scan unit 26B becomes simple.The number of components of laser scan unit 26B can be reduced.
In addition, according to image processing system 100B, on image processing system 100A, add part 2 S11.Part 2 S11 compares part 1 S0, and pyroconductivity is higher.Therefore, compare part 1 S0, be passed to the thermal capacitance easily movement of part 2 S11.The thermal capacitance being passed to part 2 S11 is easily distributed from the surface of part 2 S11.
On part 2 S11, the fixing polygon motor 41 by rotating heating.The heat transmitted from polygon motor 41 is distributed from part 2 S11.Compare polygon motor 41 when being fixed on part 1 S0, the temperature that slow down polygon motor 41 rises.
Such as, if part 2 S11 to be formed in the position easily contacted with Cryogenic air, so, the temperature slowing down polygon motor 41 further rises.
In addition, the heat transmitted from polygon motor 41 is difficult to other parts being passed to shell 70 by part 1 S0.Slow down as shell 70 overall temperature rise.Therefore, the temperature rising of part 2 S10 self tails off.The change in size that further minimizing causes due to the thermal expansion of part 2 S10.
3rd variation is described.
As shown in Figure 1, the image processing system 100C of the 3rd variation replaces the laser scan unit 26 of above-mentioned embodiment, has laser scan unit 26C.Below, be described centered by the point different from above-mentioned embodiment.
Fig. 7 is the plane model figure of the structure example of the laser scan unit 26C of the image processing system 100C of the variation (the 3rd variation) representing the utility model embodiment.
Laser scan unit 26C replaces the shell 40 of the laser scan unit 26 of above-mentioned embodiment, has shell 80 (resin-case).
As shown in Figure 7, shell 80 has the shape identical with shell 40.Wherein, the following point of shell 80 is different from shell 40, that is, replace part 2 S1, S2, S3, S4, and have part 2 S21.
The orientation direction f of the filler comprised in the 2nd resin material of part 2 S21 is along optical axis OL.In Fig. 7, illustrate the example of orientation direction f along optical axis OL of the general entirety of boundary line portion B.But orientation direction f is at least along the optical axis OL in the base plate 40a (reference area 40g) between side plate 40c and lens acceptance division 40f.
At this, orientation direction f refers to along optical axis OL, and the orientation of the evenness of filler is almost parallel relative to optical axis OL (such as, the angle of orientation direction f and optical axis OL is-10 ° ~+10 °).
Shell 80, in the same manner as shell 40, can be manufactured by the manufacturing process being called as colour mixture shaping or two material formings etc.
At this moment, in the region becoming part 2 S21, form the flowing along optical axis OL.Such as, form flowing and resolve, determine door design conditions and the injection condition of mould.
According to image processing system 100C, the orientation direction f of the filler in part 2 S21 at least in the 40g of region, along optical axis OL.The linear expansion coefficient of the 2nd resin material, in orientation direction f, becomes minimum.Therefore, it is possible to configure along following direction, that is, the direction of the variation of the optical distance of filler can be suppressed.This result is, even if the use level of filler is few, also effectively can suppresses and defocus relevant thermal expansion.Therefore, it is possible to compare shell 40 to manufacture shell 80 at an easy rate.
4th variation is described.
As shown in Figure 1, the image processing system 100D of the 4th variation replaces the laser scan unit 26 of above-mentioned embodiment, and has laser scan unit 26D.Below, be described centered by the point different from above-mentioned embodiment.
Fig. 8 is the profile schema diagram of the structure example of the laser scan unit of the image processing system of the variation (the 4th variation) representing the utility model embodiment.
Laser scan unit 26D replaces the shell 40 of the laser scan unit 26 of the 1st above-mentioned variation, and has shell 90 (resin-case).
As shown in Figure 8, shell 90 replaces press-in hole 40d, the lens acceptance division 40f of shell 40, and has press-in hole 90d, lens acceptance division 90f.
In addition, laser scan unit 26D has the 1st holding member 91 and the 2nd holding member 92.
1st holding member 91 keeps laser diode 50.1st holding member 91 is pressed in the press-in hole 90d described later of shell 90.The position of laser diode 50 relative to shell 90 is fixed by the 1st holding member 91.
1st holding member 91 is tubuloses.1st holding member 91 has: inner peripheral surface 91a and outer peripheral face 91b.Inner peripheral surface 91a and outer peripheral face 91b is coaxial barrel surface.
Inner peripheral surface 91a has the internal diameter of the peripheral part of the flange that can be pressed into laser diode 50.Laser diode 50 is pressed into fixing by inner peripheral surface 91a.
Outer peripheral face 91b has the external diameter of the press-in hole 90d that can be pressed into shell 90 described later.The position of laser diode 50 relative to shell 90, by outer peripheral face 91b is pressed into press-in hole 90d, is fixed by the 1st holding member 91.
The material of the 1st holding member 91 is not particularly limited.Such as, the 1st holding member 91 can be synthetic resin, pottery and metal.Such as, the 1st holding member 91 can use the metal material that the pyroconductivity such as aluminium alloy, brass alloys is large.At this moment, because the 1st holding member 91 compares part 2 S1, S2, S3, S4, pyroconductivity is higher, so the heat radiation of laser diode 50 becomes good.The temperature of laser diode 50 is suppressed to rise.
2nd holding member 92 keeps collimation lens 52.2nd holding member 92 is bonded in the lens acceptance division 90f described later of shell 90.
The position of collimation lens 52 relative to shell 90 is fixed by the 2nd holding member 92.
2nd holding member 92 is tubuloses.2nd holding member 92 has: inner peripheral surface 92a and outer peripheral face 92b.Inner peripheral surface 92a and outer peripheral face 92b is coaxial barrel surface.
Inner peripheral surface 92a has the internal diameter that can be fitted together to or be pressed into the peripheral part of collimation lens 52.Collimation lens 52 is fixed by boning or being pressed into by inner peripheral surface 92a.
Outer peripheral face 92b has the external diameter of the lens acceptance division 90f that can be placed in shell 90 described later.The position of collimation lens 52 relative to shell 90, by being bonded in by outer peripheral face 92b on lens acceptance division 90f, is fixed by the 2nd holding member 92.
The material of the 2nd holding member 92 is not particularly limited.Such as, the 2nd holding member 92 may be synthetic resin and metal.
In Fig. 8, collimation lens 52 is described to single element lens.But collimation lens 52 is not limited to single element lens.Can also be, such as, the lens of cemented lens or many pieces of structures.Even if when collimation lens 52 is lens of many pieces of structures, collimation lens 52 also can be held in lens acceptance division 90f by the 2nd holding member 92 integratedly.At this moment, collimate adjustment and become easy.
Press-in hole 90d is the hole portion be pressed into by the outer peripheral face 91b of the 1st holding member 91.Press-in hole 90d is made up of the cylinder hole coaxial with optical axis OL.The internal diameter of press-in hole 90d is the size that can be pressed into the 1st holding member 91.
Lens acceptance division 90f is the V shape groove identical with lens acceptance division 40f.But the 2nd holding member 92 is fixed by lens acceptance division 90f, and the lens axis being held in the collimation lens 52 of the 2nd holding member 92 is kept and optical axis OL phase co-altitude.Therefore, lens acceptance division 90f size according to the external diameter of the 2nd holding member 92 and length different from lens acceptance division 40f.
Above-mentioned embodiment is following example, that is, laser diode 50 and collimation lens 52 are directly fixed on shell 40.Image processing system 100D becomes following example, that is, laser diode 50 and collimation lens 52 are indirectly fixed respectively by the 1st holding member 91 and the 2nd holding member 92.
Image processing system 100D, except the difference of the fixing means of such laser diode 50 and collimation lens 52, has the effect same with above-mentioned embodiment.
If use metal material to form the 1st holding member 91, the temperature of laser diode 50 so can be suppressed to rise.
By the 2nd holding member 92, fixing collimation lens 52, therefore, compares the situation that independent collimation lens 52 carry out collimating adjustment, can improve the workability of collimation adjustment.
5th variation is described.
Fig. 9 is the three-dimensional pattern figure of the major part representing the laser scan unit used in the image processing system of the variation (the 5th variation) of the utility model embodiment.Figure 10 is the plane model figure of the major part representing the laser scan unit used in the image processing system of the variation (the 5th variation) of the utility model embodiment.
5th variation is the variation of the shape of resin-case about the laser scan unit used in image processing system.As shown in Figure 9, the laser scan unit 126 of the 5th variation uses single laser diode and single polygon motor 41.At this, single laser diode can be the element being similar to the such transmitting Dan Shu of laser diode 50.In addition, single laser diode can also be the diode laser matrix element launching multi beam.
In Fig. 9,10, as an example, illustrate the situation that single laser diode is made up of laser diode 50.
When laser scan unit 126 is used for the image processing system of full color, according to the bundle number of laser diode, change the number of laser scan unit 126.
Such as, when laser diode is the diode laser matrix of 4 bundles, can by laser scan unit 126 monomer displacement laser scan unit 26.But, need to arrange the difference optical system of penetrate from laser scan unit 126 4 bundles being carried out difference in addition.
Such as, when laser diode is laser diode 50, laser scan unit 126 uses 4.
There is the image processing system of laser scan unit 126 for black and white of laser diode 50.
As shown in Fig. 9,10, laser scan unit 126 has: shell 140 (resin-case), the LASER Light Source 53 identical with above-mentioned embodiment and write optical system 135.
LASER Light Source 53 and write optical system 135 are remained fixing position relationship by shell 140.
Shell 140 is housings of the box-shaped of top and side opening.The opening of the top of shell 140 is omitted illustrated capping plug.From peristome 140d (with reference to Fig. 9) outgoing laser beam of side.
Shell 140 is same with the shell 40 of above-mentioned embodiment, has part 1 S0 and part 2 S1.In addition, shell 140 is same with the shell 70 of the 2nd above-mentioned variation, keeps part 2 S11.
Such as, shell 140 and shell 40,70 same, be shaped or the manufacturing process manufacture of two material formings etc. by being called as colour mixture.
Below, be described centered by the point different from above-mentioned embodiment and the 2nd variation.
As shown in Figure 10, near the part 2 S1 of shell 140, on the base plate 140a of shell 140, stand and side plate 140c is set.Side plate 140c is formed in the side of shell 140.In addition, the C-C sectional view in Figure 10 is as shown in Figure 4 B, identical with shell 40.
At the thickness direction of side plate 140c, as shown in Figure 4 B, peristome 40e, the press-in hole 40d identical with above-mentioned embodiment is formed.
On the base plate 140a of the inner side relative with side plate 140c, form the rib 40b identical with above-mentioned embodiment, lens acceptance division 40f.
Part 2 S1 in shell 140 is, as shown in boundary line portion B1 in Figure 10, on base plate 140a, surrounds the region of the U-shaped of rib 40b.Part 2 S1 is, on side plate 140c, and the rectangular-shaped region of width roughly the same with the region of the U-shaped of base plate 140a.
Press-in hole 40d, rib 40b and lens acceptance division 40f are formed on part 2 S1.In addition, the base plate 140a between press-in hole 40d and lens acceptance division 40f and side plate 140c is also formed on part 2 S1.
LASER Light Source 53 has laser diode 50, collimation lens 52 and Laser Driven substrate 51 in the same manner as above-mentioned embodiment.But, following different, that is, in shell 140,1 LASER Light Source 53 is set.The laser beam that LASER Light Source 53 produces, scans any one photosensitive drums in image forming part 25Y, 25M, 25C, 25K.
As shown in Figure 10, write optical system 135 to have: cylindrical lens 154 and the polygon motor 41 same with above-mentioned embodiment.In addition, write optical system 135 to have: 1f θ lens 142 and 2f θ lens 143.1f θ lens 142,2f θ lens 143 are and the 1f θ lens 42A of above-mentioned embodiment, lens that 2f θ lens 43A is identical respectively.
Laser beam image from LASER Light Source 53 is wire by cylindrical lens 154.Cylindrical lens 154 is configured between LASER Light Source 53 and polygon motor 41.
Polygon motor 41 is fixed on the part 2 S11 surrounded by the boundary line portion B2 with part 1 S0.The deflection face of the polygonal mirror 41a of polygon motor 41 is positioned at the focal position of cylindrical lens 154.
Polygon motor 41 makes the laser beam of being carried out light harvesting by cylindrical lens 154 carry out deflection scanning.1f θ lens 142,2f θ lens 143 are injected by the laser beam that polygonal mirror 41a is partial to.Laser beam image is image planes by 1f θ lens 142,2f θ lens 143.Carry out the laser beam of deflection scanning by peristome 140d by polygonal mirror 41a, penetrate the outside to shell 140.The surface in alignment of the photosensitive drums of the image planes of laser beam and the outside of shell 140.If polygonal mirror 41a rotates with fixed speed, so, laser beam is endowed the f θ characteristic of constant scanning image planes.
Shell 140 and omit between illustrated photosensitive drums, can arrange the reflective mirror that laser beam is bent as required.
The laser scan unit 126 of such structure is described above, and the sub-image that can carry out the image processing system of such as same with image processing system 100 full color or the image processing system of black and white is formed.
Laser scan unit 126 is compared with the laser scan unit 26 of above-mentioned embodiment and the laser scan unit 26B of the 2nd variation, and only the number of the shape of shell and LASER Light Source 53 is different.For the laser diode 50 of shell 140 and collimation lens 52 fixing and polygon motor 41 fixing respectively with shell 40,70 identical.
Therefore, laser scan unit 126 in the same manner as laser scan unit 26,26B, defocusing of the laser beam that the impact due to thermal expansion can be suppressed to cause.In addition, the structure of laser scan unit 126 becomes simple, can reduce the number of components of laser scan unit 126.In addition, the temperature that can slow down polygon motor 41 rises.
The image processing system of laser scan unit 126 is used also to have same effect.
In above-mentioned embodiment and the explanation of variation, when resin-case is fixed 4 LASER Light Source, the part 2 of 4 or 1 fixed laser light sources is set.But the quantity of the part 2 of fixed laser light source is not limited thereto.Such as, 2 or 3 LASER Light Source can also be fixed in part 2.In addition, when laser scan unit has more than 5 LASER Light Source, also can fix more than 5.
In the 2nd above-mentioned variation and the explanation of the 5th variation, describe the pyroconductivity of the resin material of the part 2 S11 of fixing polygon motor 41 higher than part 1 S0.But, compare the thermal diffusivity of polygon motor 41, when the impact that the thermal deformation due to the fixed part of polygon motor 41 causes becomes problem, linear expansion coefficient can be made to be less than part 1 S0.
In addition, the resin material such as part 2 S1 of fixed laser light source is also not limited to the resin material that linear expansion coefficient is less than part 1 S0.Such as, the resin material of part 2 S1 etc. can be the resin material of pyroconductivity higher than part 1 S0.
In the explanation of the 4th above-mentioned variation, describe following example, that is, laser diode 50 is kept by the 1st holding member 91, and collimation lens 52 is kept by the 2nd holding member 92.But the side in laser diode 50 and collimation lens 52 can directly be fixed on shell 40.
In the 2nd above-mentioned variation, describe following example, that is, on shell 60, the polygon motor 41 as the parts beyond LASER Light Source 53 is fixed on part 2 S11.But, on resin-case, the parts beyond polygon motor 41 can also be fixed in part 2.Such as cylindrical lens, various mirror, f θ lens etc. can be fixed.
In addition, the part 2 that linear expansion coefficient is little can also be arranged at, in write optical system 35, beyond the region of the light path between laser diode 50 and collimation lens 52.Such as, can arrange along the suitable light path wanted stable for optical path length.
In above-mentioned embodiment and variation, describe following example, that is, the 2nd resin material compares the 1st resin material, the example that linear expansion coefficient is less; The example that the anisotropy of linear expansion coefficient is less; And the example that pyroconductivity is larger.
The difference of the 2nd resin material and the 1st resin material is not limited thereto.2nd resin material can be different from other physical property of the 1st resin material.Such as, the 2nd resin material can be compare the 1st resin material, the resin material that rigidity is larger.Such as, in resin-case, want to suppress the position of distortion or vibration to use the 2nd resin material that rigidity is larger.
By at least one embodiment described above, image processing system has LASER Light Source and resin-case.In addition, resin-case has: the part 1 be made up of the 1st resin material; And being made up of the 2nd resin material different from the 1st resin material, and the part 2 of fixed laser light source.Therefore, image processing system compares the 1st resin material, high performance resin material by making the 2nd resin material utilize, and can have cheapness and the laser scan unit of superperformance.
Although the description of several embodiment of the present utility model, but these embodiments are propose as an example, are not intended to limit scope of the present utility model.These new embodiments, can implement in other various modes, in the scope of main idea not departing from utility model, can carry out various omission, displacement, combination and change.These embodiments and its distortion are all contained in scope of the present utility model and main idea, and in the utility model be contained in described in claims and equivalency range thereof.

Claims (10)

1. an image processing system, possesses:
LASER Light Source, sends the laser beam forming electrostatic latent image; And
Resin-case, use the 1st resin material and 2nd resin material different from described 1st resin material integrally formed, and there is the part 1 that is made up of described 1st resin material and be made up of described 2nd resin material, and the part 2 of fixing described LASER Light Source
Described 2nd resin material, compared with described 1st resin material, linear expansion coefficient is less.
2. an image processing system, possesses:
LASER Light Source, sends the laser beam forming electrostatic latent image; And
Resin-case, use the 1st resin material and 2nd resin material different from described 1st resin material integrally formed, and there is the part 1 that is made up of described 1st resin material and be made up of described 2nd resin material, and the part 2 of fixing described LASER Light Source
Described 2nd resin material, compared with described 1st resin material, the anisotropy of linear expansion coefficient is less.
3. an image processing system, possesses:
LASER Light Source, sends the laser beam forming electrostatic latent image; And
Resin-case, use the 1st resin material and 2nd resin material different from described 1st resin material integrally formed, and there is the part 1 that is made up of described 1st resin material and be made up of described 2nd resin material, and the part 2 of fixing described LASER Light Source
Described 2nd resin material, compared with described 1st resin material, pyroconductivity is higher.
4. image processing system according to claim 1, wherein,
Described LASER Light Source, has:
Laser diode and
Light from described laser diode is carried out the collimation lens of light harvesting,
Described laser diode and described collimation lens, be fixed on separately the continuous print region in described part 2.
5. image processing system according to claim 2, wherein,
Described LASER Light Source, has:
Laser diode and
Light from described laser diode is carried out the collimation lens of light harvesting,
Described laser diode and described collimation lens, be fixed on separately the continuous print region in described part 2.
6. image processing system according to claim 3, wherein,
Described LASER Light Source, has:
Laser diode and
Light from described laser diode is carried out the collimation lens of light harvesting,
Described laser diode and described collimation lens, be fixed on separately the continuous print region in described part 2.
7. the image processing system according to any one of claim 4-6, wherein,
Described laser diode, is pressed into described part 2,
Described collimation lens, is bonded in described part 2.
8. the image processing system according to any one of claim 4-6, wherein,
Described laser diode, is fixed by the 1st holding member and described part 2,
Described collimation lens, is fixed by the 2nd holding member and described part 2.
9. the image processing system according to any one of claim 1-3, wherein,
Described 2nd resin material, comprises:
Filler,
In described part 2, described filler carries out orientation along the light path of described laser beam.
10. the image processing system according to any one of claim 1-3, wherein,
Described LASER Light Source has multiple,
Described part 2, is formed in multiple position,
Described LASER Light Source is individually fixed in described part 2.
CN201520552815.0U 2015-07-28 2015-07-28 Light -emitting -diode array heads positioning method and image forming apparatus Expired - Fee Related CN204925620U (en)

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