CN204885213U - A mould for making LED filament - Google Patents
A mould for making LED filament Download PDFInfo
- Publication number
- CN204885213U CN204885213U CN201520681391.8U CN201520681391U CN204885213U CN 204885213 U CN204885213 U CN 204885213U CN 201520681391 U CN201520681391 U CN 201520681391U CN 204885213 U CN204885213 U CN 204885213U
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- Prior art keywords
- mould
- cavity
- led silk
- hole
- glue
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Abstract
The utility model discloses a mould for making LED filament, including set gradually cool off on the mould, upward add the hot mold, go up mould, bed die, add the hot mold down and cool off the mould under and, the die cavity is personally experienced sth. Part of the body on being provided with a plurality of on the side the that upward mould is relative with the bed die, is provided with the lower mould cavity that quantity and position and the last die cavity body corresponds on the bed die, goes up the die cavity body and lower mould cavity and cooperates the fashioned die cavity of constitution LED filament, upward be provided with the quantity injecting glue hole the same with last die cavity and exhaust and excessive gluey hole on the mould, each injecting glue hole and exhaust and excessive gluey hole and corresponding last die cavity body intercommunication, on cool off the mould and cool off under with and all be provided with the cooling water passageway in the mould, the utility model discloses a but setting up a plurality of LED filaments of once shaping of beginning to speak on the mould, simultaneously behind the injecting glue, heating, mode such as cooling, the filament shaping is fast, has improved production efficiency greatly.
Description
Technical field
The utility model relates to LED silk manufacturing technology, particularly for making the mould of LED silk.
Background technology
LED silk adopts LED as light source, and have good luminous efficiency, its application is more and more extensive.At present, although LED silk kind is many, on glass or metal substrate, mainly still place the filamentray structure of tube core, bonding wire and encapsulation fluorescent glue.At present, the production method of LED silk is generally by the upper and lower millet cake glue directly at substrate, this mode once can only a shaping LED silk, though energy small lot batch manufacture, but this mode of production can cause the side of filament not have fluorescent glue to cover, bright dipping is even not, there is the problems such as aberration, and production efficiency is low.And the external form of the filament naturally putting gum forming also there are differences, product appearance disunity, product quality is not high.
Thus prior art need to improve.
Utility model content
In view of above-mentioned the deficiencies in the prior art part, the purpose of this utility model is to provide a kind of mould for making LED silk, and to solve, prior art production efficiency is low, the skimble-scamble problem of product appearance.
In order to achieve the above object, the utility model takes following technical scheme:
For making a mould for LED silk, it comprises the upper cooling frame set gradually, upper heated mould, mold, bed die, lower heated mould and lower cooling frame; The side that described mold is relative with bed die is provided with several patrix cavitys, described bed die is provided with quantity and the position counterdie cavity corresponding with described patrix cavity, described patrix cavity and counterdie cavity coordinate and form the shaping die cavity of LED silk; Described mold is provided with the quantity hole for injecting glue identical with upper cavity and exhaust and excessive glue hole, each hole for injecting glue is communicated with corresponding patrix cavity with exhaust and excessive glue hole; Cooling-water duct is provided with in described upper cooling frame and lower cooling frame.
Described for making in the mould of LED silk, the end face at the two ends of described die cavity is cambered surface.
Described for making in the mould of LED silk, described hole for injecting glue is communicated with the cambered surface of one end of upper cavity, and described exhaust and excessive glue hole are communicated with the cambered surface of the other end of upper cavity.
Described for making in the mould of LED silk, the circular in cross-section of described die cavity, ellipse, rectangle.
Described for making in the mould of LED silk, described cooling-water duct coils in upper cooling frame and upper cooling frame.
Described for making in the mould of LED silk, the side that described bed die is relative with mold is provided with the groove of the bin for placing LED silk.
Compared to prior art, the mould for making LED silk that the utility model provides, its mould comprises the upper cooling frame set gradually, upper heated mould, mold, bed die, lower heated mould and lower cooling frame; The side that described mold is relative with bed die is provided with several patrix cavitys, described bed die is provided with quantity and the position counterdie cavity corresponding with described patrix cavity, described patrix cavity and counterdie cavity coordinate and form the shaping die cavity of LED silk; Described mold is provided with the quantity hole for injecting glue identical with upper cavity and exhaust and excessive glue hole, each hole for injecting glue is communicated with corresponding patrix cavity with exhaust and excessive glue hole; Cooling-water duct is provided with in described upper cooling frame and lower cooling frame, the utility model is by mould being arranged multiple plastic multiple LED silk of beginning to speak once, simultaneously after injecting glue, carry out heating, the mode such as cooling, filament is soon shaping, substantially increase production efficiency, and adopt formed in mould mode to make product design consistent, refer to the quality of product.
Accompanying drawing explanation
Fig. 1 is that the utility model is for making the longitudinal cross-section structural representation of the mould of LED silk.
Fig. 2 is that the utility model is for making the lateral cross section structural representation of the mould of LED silk.
Fig. 3 is the flow chart of the molding forming method of LED silk.
Fig. 4 is the schematic flow sheet of the molding forming method of LED silk.
Embodiment
The utility model is provided for the mould making LED silk, for making the purpose of this utility model, technical scheme and effect clearly, clearly, further describes the utility model referring to the accompanying drawing embodiment that develops simultaneously.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1 and Fig. 2, what the utility model provided comprises for the mould making LED silk the upper cooling frame 11, upper heated mould 21, mold 31, bed die 41, lower heated mould 51 and the lower cooling frame 61 that set gradually.Mold 31 and bed die 41 are mainly used in shaping filament, upper heated mould 21 and lower heated mould 51 for making glue rapid curing after injecting glue, be provided with cooling-water duct 111 in described upper cooling frame 11 and lower cooling frame 61, make the rapid cooling down of the fluorescent glue of heating.More preferably, described cooling-water duct 111 coils in upper cooling frame 11 and upper cooling frame 11, and its film-cooled heat is large, and accelerate cooling rate further, compare the mode of nature forming and hardening, shaping speed of the present utility model significantly improves.
Wherein, the side that described mold 31 is relative with bed die 41 is provided with several patrix cavitys 311, described bed die 41 is provided with quantity and the position counterdie cavity 411 corresponding with described patrix cavity 311, the die cavity (not marking in figure) that described patrix cavity 311 and counterdie cavity 411 coordinate formation LED silk shaping, the shape of die cavity is the outer shape of LED silk.In the present embodiment, described die cavity is more than 36, and make mould once plastic 36 LED silks, compare the mode of an one-shot forming filament, its operating efficiency at least improves 36 times.
Described mold 31 be provided with the quantity hole for injecting glue identical with upper cavity 312 and be vented and excessive glue hole 313, each hole for injecting glue 312 is communicated with corresponding patrix cavity 311 with exhaust and excessive glue hole 313, the utility model adopts injecting glue on upper cavity, and on upper cavity exhaust and the mode of overflowing glue, its injecting glue speed is fast, and it is even to enter glue speed, binder removal and binder removal effective, do not have flaw after making formed product, product shape consistency is good.
In the present embodiment, the circular in cross-section of described die cavity, ellipse, rectangle or other shape, specifically according to the die cavity of product needed design respective shapes.Please continue to refer to Fig. 1 and Fig. 2, the end face at the two ends of described die cavity is cambered surface, the two ends of LED silk is seamlessly transitted to the electrode place of filament, optimizes the outward appearance of filament further.
Described hole for injecting glue 312 is positioned at one end of patrix cavity 311, described exhaust and excessive glue hole 313 are positioned at the other end of patrix cavity 311, fluorescent glue is injected from one end of die cavity, flow to the other end of die cavity, and the gas in die cavity and unnecessary glue are discharged from the other end, make fluorescent glue can be full of whole die cavity.More preferably, described hole for injecting glue 312 is communicated with the cambered surface of one end of patrix cavity 311, described exhaust and excessive glue hole 313 are communicated with the cambered surface of the other end of patrix cavity 311, the utility model adopts the mode of cambered surface injecting glue and the exhaust exhaust glue being arranged on filament two ends, fluorescent glue can be made to be full of whole die cavity on the one hand, on the other hand shaping from mould time, filament outward appearance does not have flaw.
Particularly, the length of die cavity is: more than 5mm, as 22mm, 32mm, 62mm, its length arrange mainly based on the length of filament product light-emitting area, the aperture of described hole for injecting glue 312 is: 0.3-3mm, and exhaust and the aperture in excessive glue hole 313 are: 0.3-3mm, guarantee injecting glue and exhaust velocity fast, glue can be made again fully to fill, do not have bubble.During the viscosity of described fluorescent glue: 3000mPa.s, composition is: the mixture of silica gel or epoxy resin and fluorescent material, and wherein, silica gel uses single component silica gel or double-component silicon, and fluorescent material uses the fluorescence part within four kinds, specifically requires allotment according to colour temperature.
In specific implementation process, if need to configure white light source, need use two component silica gel and a kind of fluorescent material, it comprises: the BR531 fluorescent glue mixing of the 705A silica gel of 30-60%, the 705B silica gel of 30-60% and 8-20%.Wherein, 705A and 705B is the model of silica gel, and BR531 is the model of fluorescent glue.Preferably, white light source by the 705A silica gel of 43%, the 705B silica gel of 43% with 4% BR531 fluorescent glue mix.
If need configuration colour temperature to be 2700KLED filament, then need use two component silica gel and three kinds of fluorescent material, it comprises: the BR532 fluorescent glue mixing of the 705A silica gel of 30-50%, the 705B silica gel of 30-50%, the BR531 fluorescent glue of 1-3%, the BR036B fluorescent glue of 1-3% and 2-6%.Wherein, 705A and 705B is the model of silica gel, and BR531, BR036B and BR532 are the model of fluorescent glue.Preferably, colour temperature 2700KLED filament by: the 705A silica gel of 46%, the 705B silica gel of 46%, the BR531 fluorescent glue of 2%, the BR036B fluorescent glue of 1.5% and 4.5% BR532 fluorescent glue mix.
If need configuration colour temperature to be 4000KLED filament, then need use two component silica gel and two kinds of fluorescent material, it comprises: the BR531 fluorescent glue of the 705A silica gel of 25-60%, the 705B silica gel of 25-60%, 10-25%, the BR036B fluorescent glue mixing of 0.8-2%.Wherein 705A and 705B is the model of silica gel, and BR531, BR036B are the model of fluorescent glue.Preferably, colour temperature 4000KLED filament by: the 705A silica gel of 38.5%, the 705B silica gel of 38.5%, 22% BR531 fluorescent glue, 1% BR036B fluorescent glue mix.
The side that described bed die 41 is relative with mold 31 is provided with bin 10(for placing LED silk as shown in Figure 4) groove 412, this groove 412 is rectangular, and it is adaptive with the edge of the bin 10 of LED silk, after preventing upper and lower mold clamp, LED silk bin 10 is shifted, and causes injecting glue bad.
The utility model is the corresponding molding forming method providing a kind of LED silk also, and refer to Fig. 1, Fig. 3 and Fig. 4, it comprises the steps:
S100, the bin 10 of the LED silk of die bond bonding wire is put into counterdie cavity 411, and bin 10 is stretched to the axis of lower mode cavity body 411; As shown in the A in Fig. 4.
S200, mold 31 is declined to close up with bed die 41, and patrix cavity 311 is coordinated with corresponding counterdie cavity 411 form the shaping die cavity of LED silk; As shown in the B in Fig. 4.
S300, in each hole for injecting glue 312, flow into fluorescent glue, make fluorescent glue be full of each die cavity, and air and unnecessary fluorescent glue are got rid of from exhaust and excessive glue hole 313; As shown by c in fig 4.
In S400, heating, heated mould 21 and lower heated mould 51 make fluorescent glue solidify; As shown in the D in Fig. 4.
The cooling-water duct 111 of S500, upwards cooling frame 11, lower cooling frame 61 injects cold water and cools; As shown in the E in Fig. 4.
S600, rise mold 31 make upper and lower mould 41 open taking-up filament, as shown in the F in Fig. 4.
Due to existing mold after formation, all by thimble, product is ejected, and LED silk is soft and thinner, ejecting easy distortion, the utility model adopts the step increasing spray release agent between step S100 and step S200, that is: described molding forming method is also included in patrix cavity 311 and counterdie cavity 411 and evenly sprays release agent, again upper/lower die 41 is combined, therefore, when from mould, only needing without the need to using thimble to make upper and lower mould separately, directly can take out the bin 10 of LED silk.In the present embodiment, described release agent is high temperature modified extraordinary organopolysiloxane.
Particularly, in step S300, when injecting glue, injection pressure is more than 200G, and the viscosity of described fluorescent glue is: below 3000mPa.s, guarantees into glue speed and mobility, and injection time is more than 31 seconds, guarantees to fill glue in die cavity.Because the component of fluorescent glue has been described in detail above, repeated no more herein.
Wherein, specifically comprise when being heating and curing: upper heated mould 21 and lower heated mould 51 are made to more than 100 DEG C (being generally heated to 140 DEG C ~ 270 DEG C), and continue fluorescent glue to be solidified in more than 3 seconds.When cooling, specifically comprise: inject within cold water makes mold 31 and bed die 41 cool 1 minute at the cooling-water duct 111 of upper cooling frame 11, lower cooling frame 61, make mold 31 and bed die 41 be cooled to less than 90 DEG C.
In sum, the mould for making LED silk that the utility model provides, its mould comprises the upper cooling frame set gradually, upper heated mould, mold, bed die, lower heated mould and lower cooling frame; The side that described mold is relative with bed die is provided with several patrix cavitys, described bed die is provided with quantity and the position counterdie cavity corresponding with described patrix cavity, described patrix cavity and counterdie cavity coordinate and form the shaping die cavity of LED silk; Described mold is provided with the quantity hole for injecting glue identical with upper cavity and exhaust and excessive glue hole, each hole for injecting glue is communicated with corresponding patrix cavity with exhaust and excessive glue hole; Cooling-water duct is provided with in described upper cooling frame and lower cooling frame, the utility model is by mould being arranged multiple plastic multiple LED silk of beginning to speak once, simultaneously after injecting glue, carry out heating, the mode such as cooling, filament is soon shaping, substantially increase production efficiency, and adopt formed in mould mode to make product design consistent, refer to the quality of product.
Be understandable that; for those of ordinary skills; can be equal to according to the technical solution of the utility model and utility model design thereof and replace or change, and all these change or replace the protection range that all should belong to the claim appended by the utility model.
Claims (6)
1. for making a mould for LED silk, it is characterized in that, comprising the upper cooling frame set gradually, upper heated mould, mold, bed die, lower heated mould and lower cooling frame; The side that described mold is relative with bed die is provided with several patrix cavitys, described bed die is provided with quantity and the position counterdie cavity corresponding with described patrix cavity, described patrix cavity and counterdie cavity coordinate and form the shaping die cavity of LED silk; Described mold is provided with the quantity hole for injecting glue identical with upper cavity and exhaust and excessive glue hole, each hole for injecting glue is communicated with corresponding patrix cavity with exhaust and excessive glue hole; Cooling-water duct is provided with in described upper cooling frame and lower cooling frame.
2. the mould for making LED silk according to claim 1, is characterized in that, the end face at the two ends of described die cavity is cambered surface.
3. the mould for making LED silk according to claim 2, is characterized in that, described hole for injecting glue is communicated with the cambered surface of one end of upper cavity, and described exhaust and excessive glue hole are communicated with the cambered surface of the other end of upper cavity.
4. the mould for making LED silk according to claim 1, is characterized in that, the circular in cross-section of described die cavity, ellipse, rectangle.
5. the mould for making LED silk according to claim 1, is characterized in that, described cooling-water duct coils in upper cooling frame and lower cooling frame.
6. the mould for making LED silk according to claim 1, is characterized in that, the side that described bed die is relative with mold is provided with the groove of the bin for placing LED silk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520681391.8U CN204885213U (en) | 2015-09-06 | 2015-09-06 | A mould for making LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520681391.8U CN204885213U (en) | 2015-09-06 | 2015-09-06 | A mould for making LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204885213U true CN204885213U (en) | 2015-12-16 |
Family
ID=54829552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520681391.8U Expired - Fee Related CN204885213U (en) | 2015-09-06 | 2015-09-06 | A mould for making LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204885213U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070815A (en) * | 2015-09-06 | 2015-11-18 | 深圳市源磊科技有限公司 | Mold for making LED filaments and molding method |
| CN108855800A (en) * | 2018-08-27 | 2018-11-23 | 广东华辉煌光电科技有限公司 | A kind of dispenser of the bottom plate and application of the dispensing bottom plate |
-
2015
- 2015-09-06 CN CN201520681391.8U patent/CN204885213U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070815A (en) * | 2015-09-06 | 2015-11-18 | 深圳市源磊科技有限公司 | Mold for making LED filaments and molding method |
| CN108855800A (en) * | 2018-08-27 | 2018-11-23 | 广东华辉煌光电科技有限公司 | A kind of dispenser of the bottom plate and application of the dispensing bottom plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20200906 |