CN204879505U - Light and ligthing paraphernalia - Google Patents

Light and ligthing paraphernalia Download PDF

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Publication number
CN204879505U
CN204879505U CN201520184103.8U CN201520184103U CN204879505U CN 204879505 U CN204879505 U CN 204879505U CN 201520184103 U CN201520184103 U CN 201520184103U CN 204879505 U CN204879505 U CN 204879505U
Authority
CN
China
Prior art keywords
substrate
bonding agent
illuminating lamp
fin
groove portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520184103.8U
Other languages
Chinese (zh)
Inventor
池谷博文
野口卓志
铃木康弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of CN204879505U publication Critical patent/CN204879505U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

In light, the straight tube that utilizes the bonding agent to bond the base plate with cooling parts appears light and ligthing paraphernalia, prevent that the bonding agent from winding the substrate surface side. Possess: base plate (12), it supplies LED (11) ( light emitting component ) installation, cooling parts (7), it is formed with wall portion (8), just has confession base plate (12) between wall portion (8) and carries the face of putting put (4) that carries, and bonding agent (9), it bonds base plate (12) and cooling parts (7) to close carrying the face put (4), is formed with slot part (3) at cooling parts (7), and this slot part (3) are used for holding bonding agent (9) of extension.

Description

Illuminating lamp and ligthing paraphernalia
The utility model patent application is the divisional application for entering the National Phase in China date is on August 28th, 2014, Chinese Patent Application No. is 201490000118.8, denomination of invention is " illuminating lamp, Straight illuminating lamp and ligthing paraphernalia " utility application and proposing.
Technical field
The utility model relates to the illuminating lamp and Straight illuminating lamp that use the light-emitting components such as LED (LightEmittingDiode), and possesses the ligthing paraphernalia of this illuminating lamp or Straight illuminating lamp.
Background technology
As illuminating lamp in the past, the substrate possess the straight tube of strip, installing for LED and being arranged in straight tube and the fin that the heat produced by LED is distributed.The surface of fin is configured to plane, and loads substrate in its surface.And substrate is bonding by bonding agent in mounting surface with fin.(for example, referring to patent document 1).
Patent document 1: Japanese Unexamined Patent Publication 2012-069303 publication
In illuminating lamp as described above, substrate and fin are all formed as plane, and therefore, when carrying out bonding to substrate with fin, bonding agent is expanded towards the outside immediately below substrate.Therefore, when use be formed with the fin of wall portion, the bonding agent of expansion sometimes along wall portion wall and around the table table side to substrate.Its result, the bonding agent around the face side to substrate likely causes harmful effect to light distribution characteristic, becomes at random, or produce unfavorable condition etc. because being attached to light-emitting component as foreign matter.
Utility model content
The utility model completes to solve problem as described above, its object is to, and in illuminating lamp substrate is bonding with thermal component by bonding agent, Straight illuminating lamp and ligthing paraphernalia, prevents bonding agent around arriving substrate surface side.
Lighting of the present utility model is standby: substrate, and it is installed for light-emitting component; Thermal component, it is formed with wall portion, and between wall portion, have the mounting surface of substrate mounting; And bonding agent, it, for substrate is bonding in mounting surface with radiating part material, is formed with groove portion at thermal component, and this groove portion is for holding the bonding agent of expansion.
In addition, Straight lighting of the present utility model is standby: the bobbin of straight tube-like; Substrate, it is arranged in bobbin, and installs for light-emitting component; Thermal component, it is formed with wall portion in the mode of the pipe axis along bobbin, and between a pair wall portion, have the mounting surface of substrate mounting; And bonding agent, it is bonding in mounting surface with thermal component by substrate, is formed with groove portion at thermal component, and this groove portion is for holding the bonding agent of expansion.
According to the utility model, be formed with groove portion at thermal component, this groove portion is for holding the bonding agent of expansion, therefore, it is possible to prevent when substrate is bonding with thermal component, bonding agent is around the face side to substrate.
Accompanying drawing explanation
Fig. 1 is the stereogram of the illuminating lamp that embodiment 1 is shown.
Fig. 2 is from the partial top view after the illuminating lamp removing bobbin of embodiment 1.
Fig. 3 is the sectional view of the illuminating lamp that embodiment 1 is shown.
Fig. 4 is the sectional view of the illuminating lamp that comparative example is shown.
Fig. 5 is the side view of the illuminating lamp that embodiment 2 is shown.
Fig. 6 is from the top view after the illuminating lamp removing diffuser of embodiment 2.
Fig. 7 is the sectional view of the illuminating lamp that embodiment 2 is shown.
Detailed description of the invention
Embodiment 1.
Fig. 1 to Fig. 3 is the figure of the structure of the illuminating lamp that embodiment 1 is shown, Fig. 1 is stereogram, and Fig. 2 is that Fig. 3 is sectional view from the partial top view after illuminating lamp removing bobbin.In addition, in following each figure, identical Reference numeral represents identical or suitable structure.
As shown in Figure 1, the illuminating lamp 1 of embodiment 1 is the illuminating lamp of Straight, and possesses the bobbin 2 of straight tube-like.As long as the shape straight tube-like of bobbin 2, can be cylindric, also can be the such shape of square tube.The material of bobbin 2 can be set to glass or resin, and when being set to resin, this resin material can be such as acrylic acid or Merlon.Bobbin 2 is made up of glass or resin, therefore, makes the light transmission penetrated from aftermentioned illuminating part 10.
The both ends of this bobbin 2 are provided with a pair lamp holder.The lamp holder being arranged at an end of bobbin 2 is the confession socket 20a of power supply, and is configured to comprise: for socket framework 21a, the lamp holder framework that its mode becoming the end covering bobbin 2 is fitted together to; And cross section is two power supply terminal 22a of L-shaped, they are arranged at the face of the opposition side of the bobbin 2 of this confession socket framework 21a.The sweep of the L-shaped of two power supply terminal 22a is arranged at for socket framework 21a in mutual mode toward the outer side.
In addition, the lamp holder being arranged at the other end of bobbin 2 is earthy ground connection lamp holder 20b, and is configured to comprise: ground connection lamp holder framework 21b, the lamp holder framework that its mode becoming the other end covering bobbin 2 is fitted together to; And ground terminal 22b, it is arranged at the face of the opposition side of the straight tube 2 of this ground connection lamp holder framework 21b.
In addition, these can be configured to for socket 20a and ground connection lamp holder 20b, utilize screw and are fixed on fin 7 described later.
As shown in Figure 2, light source portion 10 is equipped with in the inside of bobbin 2.Light source portion 10 possesses the axially extended substrate 12 of multiple pipe along bobbin 2.At each substrate 12, in the mode that the pipe with bobbin 2 is axially parallel, multiple LED11 as light-emitting component is installed.
Light source portion 10 possesses the connector 13 as attaching parts.Connector 13 is arranged at the surface 6 of substrate 12, and adjacent substrate 12 is electrically connected by connector 13 each other.In addition, though connector 13 is used as attaching parts herein, attaching parts are not limited to connector 13, as long as the parts be electrically connected to each other by adjacent substrate 12.
As shown in Figure 3, in the inside of bobbin 2, as the thermal component for making the heat produced from light source portion 10 distribute, be provided with the axially extended fin 7 of pipe along bobbin 2.The face contacted with bobbin 2 of fin 7 is formed as arc-shaped in the mode of the inwall along bobbin 2, utilizes not shown bonding agent or jointing tape etc. that fin 7 is bonding with bobbin 2 herein.In addition, though show the structure making the face contacted with bobbin 2 of fin 7 be formed as arc-shaped herein, the shape in face is not limited to this.In addition, also can utilize inserted structure and fin and bobbin be fixed.
Axially extended a pair wall portion 8 of pipe along bobbin 2 is integrally formed with at fin 7.Utilize this pair wall portion 8, the shadow producing connector 13 grade because of the irradiation of the light of LED11 can be prevented.According to for which angle to prevent the shadow produced because of the irradiation of the light of LED11 from, and suitably determine the height of wall portion 8.
The mounting surface 4 that substrate 12 loads is formed between a pair wall portion 8 of fin 7.Mounting surface 4 is formed as plane, and substrate 12 is bonding by bonding agent 9 in mounting surface 4 with fin 7.Bonding agent 9 for assisting from substrate 12 towards the heat transfer of fin 7, such as, is made up of the resin material of thermal conductivity.In addition, in embodiment 1, only utilize bonding agent 9 that substrate 12 is bonding with fin 7, but bonding agent 9 also can be utilized to carry out bonding and utilize the fixed parts such as screw to be fixed.
Groove portion 3 is formed with, the bonding agent 9 expanded towards the outside immediately below substrate 12 when this groove portion 3 is for being contained in substrate 12 is bonding with fin 7 in the mounting surface 4 of fin 7.This groove portion 3 is to be formed at the two ends of mounting surface 4 along the axially extended mode of pipe of bobbin 2, its cross sectional shape is roughly rectangle.The bonding agent 9 expanded towards the outside immediately below substrate 12 when substrate 12 is bonding with fin 7 is there is in the inside in groove portion 3.
Next, the effect in the groove portion 3 that the fin 7 for the illuminating lamp 1 at embodiment 1 is formed, compares explanation with the illuminating lamp of comparative example.
Fig. 4 is the sectional view of the illuminating lamp that comparative example is shown.The illuminating lamp 1 of embodiment 1 has groove portion 3 in the mounting surface 4 of fin 7, and on the other hand, the illuminating lamp of comparative example does not have groove portion 3.Except above-mentioned difference, the structure of the illuminating lamp of comparative example is identical with the structure of the illuminating lamp 1 of embodiment 1, therefore omits the description.
In the illuminating lamp of the comparative example shown in Fig. 4, when utilizing bonding agent 9 that substrate 12 is bonding with fin 7, bonding agent 9 is expanded towards the outside immediately below substrate 12.Therefore, expansion bonding agent 9 along wall portion 8 wall 5 and around to the surface 6 of substrate 12.Its result, the bonding agent 9 around the surface 6 to substrate 12 likely causes harmful effect to light distribution characteristic, becomes at random, or produce unfavorable condition etc. because being attached to LED11 as foreign matter.
On the other hand, in the illuminating lamp 1 of the embodiment 1 shown in Fig. 3, the axially extended groove portion 3 of pipe along bobbin 2 is formed at the two ends of mounting surface 4, therefore, when utilizing bonding agent 9 that substrate 12 is bonding with fin 7, the bonding agent 9 expanded towards the outside immediately below substrate 12 enters into groove portion 3.Therefore, it is possible to prevent the bonding agent 9 of expansion along the wall 5 of wall portion 12 around the surface 6 to substrate 12.
As described above, according to embodiment 1, forming the groove portion 3 of the bonding agent 9 for holding expansion at fin 7, therefore, when substrate 12 is bonding with fin 7, bonding agent 9 can be prevented around the surface 6 to substrate 12.
Its result, can prevent the light distribution characteristic of bonding agent 9 pairs of illuminating lamps 1 from causing harmful effect, become at random, or produce unfavorable condition etc. because being attached to light-emitting component as foreign matter.
In addition, the pipe along bobbin 2 axially and at the two ends of mounting surface 4 forms groove portion 3, therefore, it is possible to reliably hold the bonding agent 9 of expansion in groove portion 3.
In addition, for the quantity of the cross sectional shape in groove portion 3, width, forming position, formation, suitably can determine according to product specification.In addition, the forming position in groove portion 3 is not limited to mounting surface 4, even if also can obtain the effect identical with embodiment 1 in the bottom of wall 5.
In addition, in embodiment 1, show the example being provided with fin 7 in the inside of bobbin 2, but be not limited to this.Such as, as the illuminating lamp in the mode covering light source portion, diffuser being installed on thermal component, the effect identical with the mode 1 implemented also can be obtained.
Embodiment 2.
Fig. 5 to Fig. 7 is the figure of the illuminating lamp that embodiment 2 is shown, Fig. 5 is side view, and Fig. 6 is the top view after being removed by diffuser, and Fig. 7 is sectional view.
As shown in Figure 5, the illuminating lamp 1a of embodiment 2 possesses the lamp holder 23 of diffuser 2a, fin 7a and power supply.Although illustrate the example being only made up of framework fin 7a herein, as miscellaneous part, also can in the inside configuration of fin 7a as having the resin component of insulating properties.In addition, the material of diffuser 2a can be set to glass or resin, and when being set to resin, this resin material such as can be set to acrylic acid or Merlon, thus makes the light transmission from illuminating part 10a injection described later.
As shown in Figure 6, illuminating lamp 1a possesses light source portion 10a.Multiple LED11 as light-emitting component that light source portion 10a possesses discoideus substrate 12a and installs in the mode of the circumferential array along substrate 12a.In addition, as shown in Figure 7, illuminating lamp 1a possesses bright light circuit, and this bright light circuit has bright light circuit substrate 24 and is installed on the electronic component 25 of this bright light circuit substrate 24.The electric power produced by this bright light circuit is supplied to above-mentioned light source portion 10a.In addition, bright light circuit is held in the inside of fin 7a herein by not shown maintaining part.
As shown in Fig. 6 and 7, be formed with wall portion 8a at fin 7a in the mode of being surrounded by discoideus substrate 12a.The mounting surface 4a that substrate 12a loads is formed between the wall portion 8a of fin 7a.Mounting surface 4a is formed as plane, and substrate 12a is bonding by bonding agent 9 at mounting surface 4a with fin 7a.In addition, bonding agent 9 is identical with embodiment 1, therefore omits the description.In addition, in embodiment 2, although only utilize bonding agent 9 that substrate 12a is bonding with fin 7a, bonding agent 9 also can be utilized to carry out bonding, and utilize the fixed parts such as screw to be fixed.
Groove portion 3a is formed with, the bonding agent 9 expanded towards the outside immediately below substrate 12a when this groove portion 3a is for being contained in substrate 12a is bonding with fin 7a at the mounting surface 4a of fin 7a.This groove portion 3a is to be formed at the end of mounting surface 4a along the mode of wall portion 8a, its cross sectional shape is roughly rectangle.The bonding agent 9 expanded towards the outside immediately below substrate 12a when substrate 12a is bonding with fin 7a is there is in the inside of groove portion 3a.
In the illuminating lamp 1a of embodiment 2, groove portion 3a is to be formed at the end of mounting surface 4a along the mode of wall portion 8a, therefore, when utilizing bonding agent 9 that substrate 12a is bonding with fin 7a, the bonding agent 9 expanded towards the outside immediately below substrate 12a enters groove portion 3a.Therefore, it is possible to prevent the sticker 9 of expansion along the wall 5a of wall portion 8a around the surperficial 6a to substrate 12a.
As described above, according to embodiment 2, form the groove portion 3a of the bonding agent 9 for holding expansion at fin 7a, therefore, it is possible to prevent when being bonded by substrate 12a and fin 7a, bonding agent 9 is around the surperficial 6a to substrate 12a.
Its result, can prevent the light distribution characteristic of bonding agent 9 couples of illuminating lamp 1a from causing harmful effect, become at random, or produce unfavorable condition etc. because being attached to light-emitting component as foreign matter.
In addition, groove portion 3a is formed in the end of mounting surface 4a, therefore, it is possible to reliably hold the bonding agent 9 of expansion at groove portion 3a.
In addition, for the quantity of the cross sectional shape of groove portion 3a, width, forming position, formation, suitably can determine according to product specification.In addition, the forming position of groove portion 3a is not limited to mounting surface 4a, even if also can obtain identical effect in the bottom of wall 5a.
Embodiment 3.
Next, the ligthing paraphernalia of the illuminating lamp 1a of the illuminating lamp 1 or embodiment 2 that possess embodiment 1 is described.Illuminating lamp 1 or illuminating lamp 1a can be arranged at ceiling and ligthing paraphernalia as ceiling uses or is arranged at wall and as ligthing paraphernalia use etc.In addition, the ligthing paraphernalia possessing illuminating lamp 1 or illuminating lamp 1a is not limited to these purposes, also can become other ligthing paraphernalia.
The explanation of Reference numeral
1,1a... illuminating lamp; 2... bobbin; 2a... diffuser; 3,3a... groove portion; 4,4a... mounting surface; 5,5a... wall; 6,6a... surface; 7,7a... fin; 8,8a... wall portion; 9... bonding agent; 10,10a... light source portion; 11...LED; 12,12a... substrate; 13... connector; 20a... is for socket; 20b... ground connection lamp holder; 21a... is for socket framework; 21b... ground connection lamp holder framework; 22a... power supply terminal; 22b... ground terminal; 23... lamp holder; 24... bright light circuit substrate; 25... electronic component.

Claims (6)

1. an illuminating lamp, is characterized in that, possesses:
Discoideus substrate (12a), it is installed for light-emitting component;
Thermal component (7a), it is formed with wall portion (8a), described substrate (12a) surrounds by this wall portion (8a), and between described wall portion (8a), have the mounting surface (4a) loaded for described substrate (12a); And
Bonding agent (9), it is bonding in described mounting surface (4a) with described thermal component (7a) by described substrate (12a),
Described thermal component (7a) is formed with groove portion (3a), and this groove portion (3a) is for holding the described bonding agent (9) of expansion.
2. illuminating lamp according to claim 1, is characterized in that,
Described groove portion (3a) is formed along described wall portion (8a).
3. illuminating lamp according to claim 2, is characterized in that,
Described groove portion (3a) is formed at described mounting surface (4a).
4. illuminating lamp according to claim 3, is characterized in that,
Described groove portion (3a) is formed at the end of described mounting surface (4a).
5. illuminating lamp according to claim 2, is characterized in that,
Described groove portion (3a) is formed at wall (5a) bottom of described wall portion (8a).
6. a ligthing paraphernalia, is characterized in that, possesses:
Illuminating lamp according to any one of claim 1 to 5.
CN201520184103.8U 2013-06-19 2014-02-25 Light and ligthing paraphernalia Expired - Fee Related CN204879505U (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013128489 2013-06-19
JP2013-128489 2013-06-19
CN201490000118.8U CN204285364U (en) 2013-06-19 2014-02-25 Illuminating lamp, Straight illuminating lamp and ligthing paraphernalia

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201490000118.8U Division CN204285364U (en) 2013-06-19 2014-02-25 Illuminating lamp, Straight illuminating lamp and ligthing paraphernalia

Publications (1)

Publication Number Publication Date
CN204879505U true CN204879505U (en) 2015-12-16

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CN201490000118.8U Expired - Fee Related CN204285364U (en) 2013-06-19 2014-02-25 Illuminating lamp, Straight illuminating lamp and ligthing paraphernalia
CN201520184103.8U Expired - Fee Related CN204879505U (en) 2013-06-19 2014-02-25 Light and ligthing paraphernalia

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Application Number Title Priority Date Filing Date
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JP (2) JP5956685B2 (en)
CN (2) CN204285364U (en)
MY (1) MY180622A (en)
WO (1) WO2014203435A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6614792B2 (en) * 2015-04-28 2019-12-04 三菱電機株式会社 Light source unit and lighting device
JP7398882B2 (en) * 2019-05-09 2023-12-15 三菱電機株式会社 Light source units, lamps and lighting equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119568A (en) * 2002-09-25 2004-04-15 Kyocera Corp Ceramic circuit board
JP4762349B2 (en) * 2010-01-14 2011-08-31 シャープ株式会社 Lighting device
JP2011204444A (en) * 2010-03-25 2011-10-13 Toshiba Lighting & Technology Corp Light emitting device and lighting equipment
JP2012069303A (en) * 2010-09-21 2012-04-05 Panasonic Corp Lamp and lighting system
JP5842145B2 (en) * 2010-11-17 2016-01-13 パナソニックIpマネジメント株式会社 STRUCTURE AND LIGHTING DEVICE PROVIDED WITH STRUCTURE
JP5535249B2 (en) * 2011-02-25 2014-07-02 京セラ株式会社 Lighting device
JP5562383B2 (en) * 2012-07-19 2014-07-30 パナソニック株式会社 Lamp and lighting device
JP5156138B2 (en) * 2012-07-19 2013-03-06 パナソニック株式会社 Lamp and lighting device

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Publication number Publication date
WO2014203435A1 (en) 2014-12-24
JP2016181519A (en) 2016-10-13
JP6184559B2 (en) 2017-08-23
JPWO2014203435A1 (en) 2017-02-23
CN204285364U (en) 2015-04-22
MY180622A (en) 2020-12-03
JP5956685B2 (en) 2016-07-27

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151216

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CF01 Termination of patent right due to non-payment of annual fee