CN204849088U - Electroplate cistern system - Google Patents
Electroplate cistern system Download PDFInfo
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- CN204849088U CN204849088U CN201520596758.6U CN201520596758U CN204849088U CN 204849088 U CN204849088 U CN 204849088U CN 201520596758 U CN201520596758 U CN 201520596758U CN 204849088 U CN204849088 U CN 204849088U
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- 239000007788 liquid Substances 0.000 claims abstract description 397
- 239000012530 fluid Substances 0.000 claims abstract description 34
- 238000001914 filtration Methods 0.000 claims description 19
- 210000005056 cell body Anatomy 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 abstract description 40
- 238000007747 plating Methods 0.000 abstract description 26
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 10
- 238000001802 infusion Methods 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 2
- KOKOYYJFGZIZPY-UHFFFAOYSA-N CCCC[Ni] Chemical compound CCCC[Ni] KOKOYYJFGZIZPY-UHFFFAOYSA-N 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 229910052759 nickel Inorganic materials 0.000 description 11
- 239000000047 product Substances 0.000 description 8
- 239000003814 drug Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000013589 supplement Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000002045 lasting effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model belongs to the technical field of electroplate and specifically relates to an electroplate cistern system is related to, including the female groove of plating solution, its characterized in that: the female tank bottom portion of plating solution is provided with circulation inlet and circulation liquid outlet, has a plating solution route between circulation inlet and the circulation liquid outlet, is provided with on the plating solution route and filters the fluid infusion device. The utility model discloses an electroplate cistern system has can carry out continuous electroplating, and the even advantage of plating layer in the electroplating process especially is fit for the electroplating operation of the husky butyl nickel electroplating liquid of K4.
Description
[technical field]
The utility model relates to field of electroplating, especially relates to a kind of electric bath groove system.
[background technology]
When metal uses under various varying environment, create metallic corrosion due to extraneous medium chemistry on the metal surface and electrochemical action.The result of metallic corrosion, is not only the loss of metal itself, and loses due to the damage of metal products structure the waste that use value causes manpower and materials, much bigger times of its value ratio metal itself.Therefore, while a large amount of production metal and metal products, just must wage a struggle with corrosion of metal.Electroplating technology increases one of metal protection performance and the most effective means improving metallic surface quality.It is exactly to protect metal do not improve the performance of metal products by burn into and increase the attractive in appearance of product surface that metal products carries out electroplating.
The electroplating process of metal is all carry out in electric bath groove usually.Traditional electric bath groove only has single or multiple independently electric bath groove usually.In this case, when product electroplated layer of metal to carry out lower one deck Metal plating time, with regard to needs product mentioned to be transported in another one electric bath groove to put down from an electric bath groove again and electroplates.This electric bath groove makes to need to increase transportation equipment during plating and product is transported to other electric bath grooves from an electric bath groove, so both adds equipment investment cost, is difficult to again ensure the continuity of whole electroplating process and the quality of plating.
Except electric bath groove itself can have an impact to the quality of electroplating activity, when the liquid medicine in electric bath groove is different, also can produce different requirements to electric bath groove.Such as this ionogen of the husky fourth nickel of K4, its effective constituent particle is larger, easily occur decompose and produce throw out in filtration cycle and fluid infusion process, thus the work-ing life of the husky fourth nickel plating solution of K4 is shortened, and the husky fourth nickel coating of the K4 that plating is produced is in uneven thickness.
[utility model content]
Can not electroplate continuously for overcoming existing electric bath groove device, and the shortcoming that in electroplating process, plating thickness is uneven, the utility model provides one to carry out continuous electroplating, the uniform electric bath groove system of electrolytic coating in electroplating process.
The scheme of the utility model technical solution problem is to provide a kind of electric bath groove system, comprise the female groove of electroplate liquid, the female trench bottom of electroplate liquid is provided with circulation fluid inlet and circulation liquid outlet, there is an electroplate liquid path between circulation fluid inlet and circulation liquid outlet, electroplate liquid path is provided with filtration liquid supply device.
Preferably, arrange a liquid level dividing plate in the female groove of described electroplate liquid, female for electroplate liquid groove is divided into intercepting basin and feed tank by liquid level dividing plate.
Preferably, the height of described liquid level dividing plate is 4/1 to five/3rds of the female groove height of electroplate liquid.
Preferably, comprise Article 2 electroplate liquid path between described intercepting basin and feed tank, this electroplate liquid channel setting is above liquid level dividing plate.
Preferably, the female groove of described electroplate liquid is provided with a pair concave notches.
Preferably, described electroplate liquid pilot trench is also the cell body being concave notches that a upper surface opens wide, and electroplate liquid pilot trench is positioned at the top of the female groove of electroplate liquid.
Preferably, be provided with pilot trench dividing plate in described electroplate liquid pilot trench, pilot trench dividing plate is provided with multiple hole.
Preferably, be provided with total fluid level controller in the female groove of described electroplate liquid, total fluid level controller comprises level sensor and lower level sensor.
Preferably, described intercepting basin, between feed tank and electroplate liquid pilot trench, comprise Article 3 electroplate liquid passage, this electroplate liquid passage is provided with filtration liquid supply device.
Preferably, described filtration liquid supply device comprises filtration unit and liquid supply device.
Compared with prior art, a kind of electric bath groove system that the utility model provides comprises the female groove of electroplate liquid that bottom is provided with circulation fluid inlet and circulation liquid outlet, and between circulation fluid inlet and circulation liquid outlet, be also provided with the first electroplate liquid path, this electroplate liquid path is provided with filtration liquid supply device, compared with existing electric bath groove device, can filter the intrasystem electroplate liquid of electric bath groove and fluid infusion operation simultaneously, thus can supplement in time the intrasystem electroplate liquid of electroplate liquid, make the intrasystem bath concentration of electroplate liquid homogeneous.A liquid level dividing plate is also provided with in the female groove of described electroplate liquid, female for this electroplate liquid groove is divided into intercepting basin and feed tank by this liquid level dividing plate, the height of this liquid level dividing plate is 4/1 to five/3rds of the female groove height of electroplate liquid, wherein, to be stored in intercepting basin and the old liquid (reacted electroplate liquid) be arranged in above intercepting basin enters feed tank through liquid level dividing plate, after new liquid (unreacted electroplate liquid) in feed tank mixes with old liquid, enter in electroplate liquid pilot trench through upper liquid level pump and react.Arranging like this can make the old liquid of part reenter in electroplate liquid pilot trench to react, thus can reduce the usage quantity of electroplate liquid, minimizing production cost.Electroplate liquid pilot trench inside is provided with a pilot trench dividing plate, described electroplate liquid pilot trench is divided into a plating space (not shown) and a cavity structure by described pilot trench dividing plate, described plating space (not shown) is positioned at above cavity structure, pilot trench dividing plate is provided with multiple hole, the corresponding position on pilot trench dividing plate of pilot trench Link Port and the multiple hole location on described pilot trench dividing plate stagger, and the bottom of cavity structure is provided with a pilot trench Link Port.Like this effect can playing streaming buffer when electroplate liquid enters into electroplate liquid pilot trench is set, alleviate the disturbance to electroplate liquid.The female groove of electroplate liquid arranges total fluid level controller, total fluid level controller comprises level sensor, lower level sensor and total liquid level tube, described total liquid level tube is provided with electronics magnet valve switch (not shown), described electronics magnet valve switch (not shown) is electrically connected at level sensor and lower level sensor, total fluid level controller can play control action kou to the intrasystem total liquid level of electric bath groove, prevents the too high spilling of liquid level from wasting and preventing that liquid level is too low causes machinery equipment fault.In addition, by filtering the continuous circulation that liquid supply device, upper liquid level pump and lower liquid level pump realize electroplate liquid, can remove the throw out that electroplating activity produces in the short period of time, the electroplate liquid that continuous additional mass is good, ensure that the quality of electroplating activity.Especially the Electroplating Production of the husky fourth nickel plating solution of K4 is applicable to.
[accompanying drawing explanation]
Fig. 1 is the schematic diagram of electric bath groove device first embodiment in the utility model;
Fig. 2 is the schematic diagram of electric bath groove device second embodiment in the utility model;
Fig. 3 is the schematic diagram of electric bath groove device the 3rd embodiment in the utility model;
Fig. 4 is the schematic diagram of electric bath groove device the 4th embodiment in the utility model.
[embodiment]
In order to make the purpose of this utility model, technical scheme and advantage are clearly understood, below in conjunction with accompanying drawing and embodiment, are further elaborated to the utility model.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, the utility model provides a kind of electric bath groove system 5, and this electric bath groove system 5 comprises the female groove 51 of electroplate liquid, electroplate liquid pilot trench 52, filters liquid supply device 53, upper liquid level pump 54 and lower liquid level pump 55.Wherein, this electroplate liquid pilot trench 52 to be located at above the female groove 51 of electroplate liquid (in all embodiments, upper and lower, left and right, the position qualifier such as inside and outside are only limitted to the relative position in given view, but not absolute location), upper liquid level pump 54 one end is connected with the bottom of electroplate liquid pilot trench 52, and the other end stretches in feed tank 513.Lower liquid level pump 55 one end is connected with the bottom of the female groove 51 of electroplate liquid, and the other end is connected with filtration liquid supply device 53.
The female groove 51 of electroplate liquid is the cell body that a upper surface opens wide, one piece of liquid level dividing plate 511 is provided with in the female groove 51 of this electroplate liquid, female for electroplate liquid groove 51 is divided into intercepting basin 512 and feed tank 513 by this liquid level dividing plate 511, and intercepting basin 512 and feed tank 513 separate completely in the altitude range of liquid level dividing plate 511.Female groove 51 base plate of electroplate liquid is provided with circulation liquid outlet 514 and circulation fluid inlet 515, circulation liquid outlet 514 runs through bottom intercepting basin 512, circulation fluid inlet 515 runs through bottom feed tank 513, has at least one first electroplate liquid path between circulation liquid outlet 514 and circulation fluid inlet 515.Intercepting basin 512, electroplate liquid pilot trench 52 and feed tank 513 form the second electroplate liquid path.Mother-son groove syndeton 516 is also provided with, for connecting the female groove 51 of electroplate liquid and electroplate liquid pilot trench 52 in the female groove 51 of electroplate liquid.In addition, be also provided with total fluid level controller 517 in the female groove 51 of electroplate liquid, be used for controlling the total liquid level in electric bath groove system 5.The pair of sidewalls of the female groove 51 of electroplate liquid on electroplating activity direction is provided with the female groove concave notches 518 of electroplate liquid, and convenient formation electroplating activity path, to realize continuous electroplating.
Liquid level dividing plate 511 is one piece of rectangular parallelepiped thin plate, its direction along electroplating activity is arranged on the base plate of the female groove 51 of electroplate liquid, connection is closed with the base plate of the female groove 51 of electroplate liquid in the bottom of liquid level dividing plate 511, and the two side ends of liquid level dividing plate 511 is closed with the two side of electroplate liquid mother groove 51 respectively and is connected.Make liquid level dividing plate 511 within the scope of oneself height, female for electroplate liquid groove 51 can be divided into intercepting basin 512 and feed tank 513 like this, prevent the electroplate liquid lower than liquid level dividing plate 511 height from interpenetrating in two grooves, affect the quality of electroplate liquid.The junction of liquid level dividing plate 511 bottom and female groove 51 base plate of electroplate liquid is on the trisection line of female groove 51 base plate of electroplate liquid, the space size of feed tank 513 and intercepting basin 512 is made to be the relation of 1:2 like this, such design mainly ensures that intercepting basin 512 is enough large, can collect abundant electroplate liquid.The height of liquid level dividing plate 511 accounts for 4/1 to five/3rds of female groove 51 Sidewall Height of electroplate liquid, make to enter electroplate liquid in intercepting basin 512 so directly to overflow when the height of liquid level higher than liquid level dividing plate 511 and flow in feed tank 513, ensure that the lasting supply of feed tank 513 pairs of electroplate liquids.
Intercepting basin 512 is larger one in space in the relatively independent space of two of being divided into by liquid level dividing plate 511 in the female groove 51 of electroplate liquid, and it is mainly used in the electroplate liquid collecting electroplate liquid pilot trench 52 spilling.
Feed tank 513 is less one in space in the relatively independent space of two of being divided into by liquid level dividing plate 511 in the female groove 51 of electroplate liquid, and it is mainly used in providing electroplate liquid to electroplate liquid pilot trench 52.
Circulation liquid outlet 514 is arranged on the base plate of intercepting basin 512 and through base plate, is mainly used in the discharge of electroplate liquid in intercepting basin 512, is one of necessary parts of electroplate liquid circulation in whole electric bath groove system 5.
Circulation fluid inlet 515 is arranged on the base plate of feed tank 513 and through base plate, is mainly used in treated electroplate liquid and enters into feed tank 513, is also one of necessary parts of electroplate liquid circulation in whole electroplate liquid system 5.
Mother-son groove syndeton 516 is elongated rectangular parallelepiped blocks, it is by arranging perpendicular to electroplating activity direction, two ends are connected with the two side of the female groove 51 of electroplate liquid, are provided with concave notches (not shown), are mainly used in erection electroplate liquid pilot trench 52.
Total fluid level controller 517 is arranged on the sidewall of the female groove 51 of electroplate liquid, and it comprises level sensor 5171, lower level sensor 5172 and total liquid level tube 5173.Upper level sensor 5171 is arranged on the top of total liquid level tube 5173, lower level sensor 5172 is arranged on the bottom of total liquid level tube 5173, between the two at a distance of the distance of female groove 51 height of 1/1 to two/3rd electroplate liquid, upper level sensor 5171 is connected with total liquid level tube 5173 by circuit respectively with lower level sensor 5172.
Upper level sensor 5171 is a kind of liquid induction installations, when on upper level sensor 5171 from absence of liquid contact become have liquid comes into contact time, namely trigger upper level sensor 5171, upper level sensor 5171 produces signal immediately, and transfers signals to total liquid level tube 5173 by circuit.
Lower level sensor 5172 is also a kind of liquid induction installation, instantly on level sensor 5172 from have liquid comes into contact become absence of liquid contact time, namely trigger lower level sensor 5172, lower level sensor 5172 produces signal immediately, and transfers signals to total liquid level tube 5173 by circuit.
Total liquid level tube 5173 is the pipelines with electronics magnet valve switch (not shown), electronics magnet valve switch (not shown) is electrically connected at level sensor 5171 and lower level sensor 5172, when total liquid level tube 5173 receives the signal that upper level sensor 5171 transmits, electronics magnet valve switch (not shown) is closed automatically, and total liquid level tube 5173 stops to female groove 51 fluid infusion of electroplate liquid.When total liquid level tube 5173 receives the signal that lower level sensor 5172 transmits, electronics magnet valve switch (not shown) is opened automatically, and total liquid level tube 5173 starts to female groove 51 fluid infusion of electroplate liquid.
When the female groove concave notches 518 of electroplate liquid can facilitate electroplating activity, plated item passes through, and carries out continuous electroplating.
Electroplate liquid pilot trench 52 is also the cell body that a upper surface opens wide, and is the operating area of electroplating activity.Electroplate liquid pilot trench 52 is also provided with the outstanding edge of a wing 522 on the sidewall perpendicular to electroplating activity streamline direction, and the sidewall of this place, edge of a wing 522 electroplate liquid pilot trench 52 is symmetrically arranged with electroplate liquid pilot trench concave notches 521.This electroplate liquid pilot trench 52 is by being connected in the mother-son groove syndeton 516 of female groove 51 inside of electroplate liquid, and the edge of a wing 522 of electroplate liquid pilot trench 52 can prevent electroplate liquid pilot trench 52 from electroplating activity streamline direction, larger displacement occurring, and plays position-limiting action.In addition, the bottom of electroplate liquid pilot trench 52 is provided with a cavity structure 523, top is provided with a plating space (not shown), be provided with a pilot trench dividing plate 524 between this cavity structure 523 and plating space (not shown), the surrounding of this pilot trench dividing plate 524 is symmetrically arranged with the hole 525 running through pilot trench dividing plate 524.The lower surface of this cavity structure 523 is provided with the pilot trench Link Port 526 of a Through-cavity lower surface.Described pilot trench dividing plate 524 and not apertured hole, pilot trench Link Port 526 corresponding section.The special distribution of pilot trench dividing plate 524 Hole 525, the liquid medicine entering into cavity structure 523 from pilot trench Link Port 526 can be made can not to enter into electroplate liquid pilot trench 52 immediately, but to be introduced in cavity structure 523 and to be accumulated to certain liquid level, again by be arranged on pilot trench dividing plate 524 surrounding and directly the hole 525 relative with pilot trench Link Port 526 steadily enter into electroplate liquid pilot trench 52, thus can reduce to greatest extent because new liquid medicine fills into electroplate liquid liquid medicine generation disturbance in electroplate liquid pilot trench 52, thus effectively can suppress the decomposition of the organic composition of electroplate liquid in electroplate liquid pilot trench 52.
Electroplate liquid pilot trench concave notches 521 is the necessary parts forming electroplating activity path, and its size is can accessiblely be advisable by plated item.The little 1cm-3cm of the degree of depth of the female groove concave notches 518 of depth ratio electroplate liquid of electroplate liquid pilot trench concave notches 521, this also makes the liquid level difference of electroplate liquid in the female groove 51 of electroplate liquid and electroplate liquid in electroplate liquid pilot trench 52 be more or less the same, the liquid medicine in electroplate liquid pilot trench 52 can be made further to be back to the Distance Shortened of the female groove 51 of electroplate liquid, alleviate the disturbance to liquid medicine in electroplating activity process, thus the quality of electroplating activity can be ensured better.
The edge of a wing 522 is projecting edges of electroplate liquid pilot trench 52 sidewall, can play position-limiting action when electroplate liquid pilot trench 52 fixes in mother-son groove syndeton 516, prevents electroplate liquid pilot trench 52 landing.
Cavity structure 523 is positioned at the bottom of electroplate liquid pilot trench 52, mainly plays temporarily storing electroplate liquid in electroplate liquid pilot trench 52, and buffering electroplate liquid enters into the electroplating activity region on electroplate liquid pilot trench 52 top, alleviates disturbance.
Pilot trench dividing plate 524 is horizontally set on the middle part of electroplate liquid pilot trench 52, mainly electroplate liquid pilot trench 52 is divided into cavity structure 523 and plating area, top.In electroplate liquid pilot trench 52, pilot trench dividing plate 524 is 10cm to the distance of electroplate liquid pilot trench concave notches 521 lowest order, its distance also can adjust according to actual process demand, as 5cm-40cm, particularly, can be 5cm, 12cm, 15cm, 22cm, 25cm, 26cm, 40cm etc.
Hole 525 is arranged on pilot trench dividing plate 524, mainly makes the electroplate liquid in cavity structure 523 slowly pour in electroplating activity region.
Pilot trench Link Port 526 is arranged on electroplate liquid pilot trench 52 base plate, is the main entrance of electroplate liquid in electroplate liquid pilot trench 52.
Filter liquid supply device 53 one end to be connected with circulation liquid outlet 514, one end is connected with lower liquid level pump 55.Filter liquid supply device 53 and comprise filtration unit (not shown) and liquid supply device (not shown), filtration unit (not shown) and liquid supply device (not shown) accessible site are in one or be provided separately, filter liquid supply device 53 and be electrically connected at level sensor 54 and lower level sensor 55, filter liquid supply device 53 can carry out filtration to the electroplate liquid in intercepting basin 512 and supplement new electroplate liquid in time, particularly for this electroplate liquid of the husky fourth nickel of K4.The husky fourth nickel of K4, because its effective constituent particle is comparatively large, so easily occur decompose and produce throw out in electroplating activity process, thus shortened in the work-ing life of the husky fourth nickel plating solution of K4, and the K4 that plating is produced husky fourth nickel coating non-uniform film thickness is even.So when using the husky fourth nickel plating solution of K4 to carry out electroplating activity, need to filter reacted electroplate liquid in time, and supplement the husky fourth nickel plating solution of new K4 in time, such electroplating activity could go on by persistent loop.
Upper liquid level pump 54 comprises liquid level pump liquid-in pipe 541 and upper liquid level pump drain pipe 542, and upper liquid level pump 54 mainly extracts electroplate liquid and provides electroplate liquid to electroplate liquid pilot trench 52 in feed tank 513.Upper liquid level pump 54 is pump machines of a kind of low cutting force type, and namely feed flow is large, and pressure is little, and this function transfers realization by making its original per minute 1500 change per minute 300-800 into upper liquid level pump 54 frequency reducing power.In addition, according to the female groove 51 cumulative volume configuration of electroplate liquid, upper liquid level pump can exhaust electroplate liquid female groove 51 volume electroplate liquid for 54 1 hours, and can by adjustment motor rotary speed, be divided into 1/3rd, 2/3rds and whole open function switch.This pump machine is used to provide electroplate liquid suitably can alleviate disturbance to electroplate liquid.
Upper liquid level pump drain pipe 542 is connected with the pilot trench Link Port 526 of electroplate liquid pilot trench 52, can provide electroplate liquid to electroplate liquid pilot trench 52.
Upper liquid level pump liquid-in pipe 541 stretches in feed tank 513, and the mouth of pipe is positioned at lower liquid level induction less than 5172, as long as ensure to carry out electroplating activity, upper liquid level pump just can extract electroplate liquid from feed tank 513 to be continued to be supplied to electroplate liquid pilot trench 52.
Lower liquid level pump 55 comprises lower liquid level pump liquid-in pipe 551 and lower liquid level pump drain pipe 552.Electroplate liquid in intercepting basin 512 is mainly transported to feed tank 513 by lower liquid level pump 55.Lower liquid level pump 55 and upper liquid level pump 54 are same types, can alleviate the disturbance to electroplate liquid.
Lower liquid level pump liquid-in pipe 551 is connected with filtration liquid supply device 53, mainly the electroplate liquid through filtering fluid infusion is extracted out.
Lower liquid level pump drain pipe 552 is connected with circulation fluid inlet 515, mainly the electroplate liquid through filtering fluid infusion is sent into feed tank 513.
In electroplating activity working cycle, electroplate liquid is extracted by upper liquid level pump liquid-in pipe 541 from feed tank 513 by upper liquid level pump 54, again through the conveying of upper liquid level pump drain pipe 542, electroplate liquid enters in the cavity structure 523 of electroplate liquid pilot trench 52 from pilot trench Link Port 526.After electroplate liquid is full of in cavity structure 523, electroplate liquid enters into plating work area from the hole 525 pilot trench dividing plate 524.Along with in plating work area, the liquid level of electroplate liquid raises, and electroplate liquid overflows from electroplate liquid pilot trench concave notches 521, flow in intercepting basin 512.Due to the effect of lower liquid level pump 55, electroplate liquid in intercepting basin 512 enters into filter in liquid supply device 53 from circulation liquid outlet 514 and processes, and then through the conveying of lower liquid level pump drain pipe, reenters in feed tank 513 from circulation fluid inlet 515, so far, the loop ends of an electroplate liquid.
In the working cycle of electroplate liquid, filter liquid supply device 53 and both can filter electroplate liquid, constantly supplement new electroplate liquid, to ensure the quality of electroplate liquid simultaneously.
In the working cycle of electroplate liquid, when the height of the electroplate liquid liquid level in intercepting basin 512 higher than liquid level dividing plate 511, intercepting basin 512 internal surface also good electroplate liquid of improving quality can overflow from liquid level dividing plate 511, flows in feed tank 513, to ensure the lasting supply of electroplate liquid in feed tank 513.
Refer to Fig. 2, this embodiment changes mainly for the position relationship of the female groove 61 of electroplate liquid and electroplate liquid pilot trench 62.According to the actual needs of electroplating activity, in the present embodiment, electroplate liquid pilot trench 62 can be arranged at the middle part of the female groove 61 of electroplate liquid, to save the device space.Meanwhile, the height of liquid level dividing plate 611 can regulate arbitrarily.
Refer to Fig. 3, in this embodiment, electroplate liquid pilot trench 72 is arranged on the outside of the female groove 71 of electroplate liquid, and the base plate of electroplate liquid pilot trench 72 is concordant with the base plate of the female groove 71 of electroplate liquid.Electroplate liquid in electroplate liquid pilot trench 72 is back in the female groove 71 of electroplate liquid by the pipeline 73 be arranged on female groove 71 sidewall of electroplate liquid, thus realizes the circulation of electroplate liquid.Meanwhile, also can increase an electroplate liquid e Foerderanlage (not shown) in addition and the electroplate liquid in electroplate liquid pilot trench 72 is pumped in the female groove 71 of electroplate liquid, realize electroplate liquid circulation.
Refer to Fig. 4, in this embodiment, electroplate liquid pilot trench 82 is arranged on the outside of the female groove 81 of electroplate liquid, and the base plate of electroplate liquid pilot trench 82 is not concordant with the base plate of the female groove 81 of electroplate liquid, the main like this Appropriate application that can realize electroplate liquid pilot trench 82 bottom clearance spaces.Electroplate liquid in electroplate liquid pilot trench 82 is back in the female groove 81 of electroplate liquid by the pipeline 83 be arranged on female groove 81 sidewall of electroplate liquid, thus realizes the circulation of electroplate liquid.Meanwhile, also can increase an electroplate liquid e Foerderanlage (not shown) in addition and the electroplate liquid in electroplate liquid pilot trench 82 is pumped in the female groove 81 of electroplate liquid, realize electroplate liquid circulation.
Compared with prior art, a kind of electric bath groove system 5 that the utility model provides comprises the female groove 51 of electroplate liquid that bottom is provided with circulation fluid inlet 515 and circulation liquid outlet 514, and between circulation fluid inlet 515 and circulation liquid outlet 514, be also provided with the first electroplate liquid path, this electroplate liquid path is provided with and filters liquid supply device 53, compared with existing electric bath groove device, can filter the intrasystem electroplate liquid of electric bath groove and fluid infusion operation simultaneously, thus can supplement in time the intrasystem electroplate liquid of electroplate liquid, make the intrasystem bath concentration of electroplate liquid homogeneous.A liquid level dividing plate 511 is also provided with in the female groove of described electroplate liquid, female for this electroplate liquid groove 51 is divided into intercepting basin 512 and feed tank 513 by this liquid level dividing plate 511, the height of this liquid level dividing plate 511 is 4/1 to five/3rds of female groove 51 height of electroplate liquid, wherein, to be stored in intercepting basin 512 and the old liquid (reacted electroplate liquid) be arranged in above intercepting basin 512 enters feed tank 513 through liquid level dividing plate 511, after new liquid (unreacted electroplate liquid) in feed tank 513 mixes with old liquid, enter in electroplate liquid pilot trench 52 through upper liquid level pump 54 and react.Arranging like this can make the old liquid of part reenter in electroplate liquid pilot trench 52 to react, thus can reduce the usage quantity of electroplate liquid, minimizing production cost.Electroplate liquid pilot trench 52 inside is provided with a pilot trench dividing plate 524, described electroplate liquid pilot trench 52 is divided into a plating space (not shown) and a cavity structure 523 by described pilot trench dividing plate 524, described plating space (not shown) is positioned at above cavity structure 523, pilot trench dividing plate 524 is provided with multiple hole 525, stagger in the position of pilot trench Link Port 526 correspondence on pilot trench dividing plate 524 and multiple holes 525 position on described pilot trench dividing plate 524, the bottom of cavity structure 523 is provided with a pilot trench Link Port 526.Like this effect can playing streaming buffer when electroplate liquid enters into electroplate liquid pilot trench 52 is set, alleviate the disturbance to electroplate liquid.The female groove 51 of electroplate liquid arranges total fluid level controller 517, total fluid level controller 517 comprises level sensor 5171, lower level sensor 5172 and total liquid level tube 5173, described total liquid level tube 5173 is provided with electronics magnet valve switch (not shown), described electronics magnet valve switch (not shown) is electrically connected at level sensor 5171 and lower level sensor 5172, total fluid level controller 517 can play control action kou to the total liquid level in electric bath groove system 5, prevents the too high spilling of liquid level from wasting and preventing that liquid level is too low causes machinery equipment fault.In addition, by filtering the continuous circulation that liquid supply device 53, upper liquid level pump 54 and lower liquid level pump 55 pairs of electroplate liquids realize, can remove the throw out that electroplating activity produces in the short period of time, the electroplate liquid that continuous additional mass is good, ensure that the quality of electroplating activity.Especially the Electroplating Production of the husky fourth nickel plating solution of K4 is applicable to.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all any amendments done within principle of the present utility model, equivalent replacement and improvement etc. all should comprise within protection domain of the present utility model.
Claims (10)
1. an electric bath groove system, comprise the female groove of electroplate liquid, it is characterized in that: the female trench bottom of described electroplate liquid is provided with circulation fluid inlet and circulation liquid outlet, has an electroplate liquid path, electroplate liquid path is provided with filtration liquid supply device between circulation fluid inlet and circulation liquid outlet.
2. electric bath groove system as claimed in claim 1, is characterized in that: arrange a liquid level dividing plate in the female groove of described electroplate liquid, and female for electroplate liquid groove is divided into intercepting basin and feed tank by liquid level dividing plate.
3. electric bath groove system as claimed in claim 2, is characterized in that: the height of described liquid level dividing plate is 4/1 to five/3rds of the female groove height of electroplate liquid.
4. electric bath groove system as claimed in claim 2, it is characterized in that: comprise Article 2 electroplate liquid path between described intercepting basin and feed tank, this electroplate liquid channel setting is above liquid level dividing plate.
5. electric bath groove system as claimed in claim 1, is characterized in that: the female groove of described electroplate liquid is provided with a pair concave notches.
6. electric bath groove system as claimed in claim 5, is characterized in that: described electroplate liquid pilot trench is also the cell body being concave notches that a upper surface opens wide, and electroplate liquid pilot trench is positioned at the top of the female groove of electroplate liquid.
7. electric bath groove system as claimed in claim 6, is characterized in that: be provided with pilot trench dividing plate in described electroplate liquid pilot trench, pilot trench dividing plate is provided with multiple hole.
8. electric bath groove system as claimed in claim 7, is characterized in that: be provided with total fluid level controller in the female groove of described electroplate liquid, total fluid level controller comprises level sensor and lower level sensor.
9. electric bath groove system as claimed in claim 7, is characterized in that: described intercepting basin, comprise Article 3 electroplate liquid passage between feed tank and electroplate liquid pilot trench, and this electroplate liquid passage is provided with filtration liquid supply device.
10. electric bath groove system as claimed in any one of claims 1-9 wherein, is characterized in that: described filtration liquid supply device comprises filtration unit and liquid supply device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520596758.6U CN204849088U (en) | 2015-08-08 | 2015-08-08 | Electroplate cistern system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435695A (en) * | 2016-08-24 | 2017-02-22 | 谢彪 | Electroplating device and method |
| CN106835220A (en) * | 2017-02-20 | 2017-06-13 | 宣城托新精密科技有限公司 | Automotive upholstery electroplating surface handling process |
| CN108624939A (en) * | 2017-03-21 | 2018-10-09 | 宜兴北宸科技有限公司 | Energy conservation and environmental protection vertically plates staged continuous electroplating production system |
-
2015
- 2015-08-08 CN CN201520596758.6U patent/CN204849088U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435695A (en) * | 2016-08-24 | 2017-02-22 | 谢彪 | Electroplating device and method |
| CN106835220A (en) * | 2017-02-20 | 2017-06-13 | 宣城托新精密科技有限公司 | Automotive upholstery electroplating surface handling process |
| CN108624939A (en) * | 2017-03-21 | 2018-10-09 | 宜兴北宸科技有限公司 | Energy conservation and environmental protection vertically plates staged continuous electroplating production system |
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Effective date of registration: 20181217 Address after: 516000 Lingtou and Fox Hill (Tu Name) Sections of Xiahuang Formation, Qiugang Village, Longxi Town, Boluo County, Huizhou City, Guangdong Province Patentee after: Huizhou Antai Surface Treatment Technology Co., Ltd. Address before: 518104 Shenzhen City Baoan District Shajing Houting Maozhou Industrial Zone Jiechang Industrial Park P1 Workshop Shenzhen Jiechang Anpai Technology Co., Ltd. Patentee before: Xie Biao |