CN204833210U - Structure of broken string when preventing touch -sensitive screen inductive layer processing procedure - Google Patents
Structure of broken string when preventing touch -sensitive screen inductive layer processing procedure Download PDFInfo
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- CN204833210U CN204833210U CN201520570405.9U CN201520570405U CN204833210U CN 204833210 U CN204833210 U CN 204833210U CN 201520570405 U CN201520570405 U CN 201520570405U CN 204833210 U CN204833210 U CN 204833210U
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Abstract
The utility model discloses a structure of broken string when preventing touch -sensitive screen inductive layer processing procedure, include: first anticorrosion glue film at quarter, the printing is solidified and is formed on treating etching transparent conducting film, and second anticorrosion glue film at quarter, printing solidification is carved the glue film with first anticorrosion and is constituted anticorrosion glue film at quarter together on the glue film is carved in first anticorrosion for cover transparent conducting film wait protect the part and expose the part of treating the etching and getting rid of. The foundation the utility model discloses broken string problem in the time of can effective means touch -sensitive screen inductive layer processing procedure.
Description
Technical field
The utility model relates to a kind of structure preventing breaking during touch screen induction layer processing procedure.
Background technology
A step of touch-screen (TP, TouchPanel, also known as touch screen, contact panel) processing procedure is the processing procedure of inductive layer 5.See Fig. 1-3, be the processing procedure of clear display inductive layer 5, delete part-structure, the funtion part that the just transparency conducting layer that inductive layer 5 indicates in the drawings is formed.During processing procedure, first such as vacuum sputtering is adopted to form a transparent conductive film layer, the nesa coating 2 namely shown in Fig. 1 and Fig. 2, such as ito film on a surface of substrate 3 by transparent conductive material (such as ITO, i.e. tin indium oxide).In order to realize the induction to touching, need to carry out patterning to nesa coating 2, form the conductive traces of such as the first dimension, further, form the conductive traces (not shown) of other direction based on another dimension with the first dimension perpendicular in base plan, thus form inductive layer 5(sensor, and also referred to as functional sheet, functional areas).Ying Zhi, needs insulation course (not shown) between the conductive traces of two dimensions.
The production example of inductive layer 5 is as adopted chemical etching, and such as acid etching, in order to remove unwanted part on nesa coating, thus forms the conductive traces of predetermined dimension, ensures to be separated from each other between conductive traces, and can not break.Therefore, before carrying out such as chemical etching, need not needing the part removed to protect, the mode adopted is on nesa coating 2, print anti-etching glue, thus forms anti-etching glue-line 1.
The manufacture craft mainly silk-screen printing technique of current anti-etching glue-line 1; in printing process; half tone can not ensure absolute cleanliness; the lower glue uniformity coefficient of silk screen various piece is definitely consistent; thus some defect may be there is in the unit of the anti-etching glue-line 1 produced; defect point 4 such as shown in Fig. 2; the existence of this defect point; make in fact to expose out in protected position; thus not protected position has etching solution to enter when carrying out nesa coating 2 and etching; produce inductive layer 5 exist broken string defect, break point 6 as shown in Figure 4.Fig. 4 is the B-B cut-open view of Fig. 3, expression be the complete state of etching, wherein Fig. 3 is at the trace perpendicular to paper direction, and a certain trace does not form available protecting because of anti-etching glue, causes the break point 6 occurred in Fig. 4.
Although the maturation of silk-screen printing technique, occur that the probability of break point 6 is relatively low, for the touch-screen that specification is larger, such as 22 cun of screens, 25 cun of screens etc., required number of traces is larger, and therefore affect by this still can be larger for product yield.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of structure preventing breaking during touch screen induction layer processing procedure.
The utility model is by the following technical solutions:
According to the utility model, a kind of structure preventing breaking during touch screen induction layer processing procedure, comprising:
First anti-etching glue-line, printing is solidified to form on nesa coating to be etched; And
Second anti-etching glue-line, printing is solidificated on the first anti-etching glue-line, forms anti-etching glue-line together with the first anti-etching glue-line, in order to cover the part to be protected of nesa coating and to expose the part of removal to be etched.
Alternatively, the width of anti-etching glue-line is not more than 130 μm, and is not less than 70 μm.
Alternatively, the track width of the second anti-etching glue-line is 1/2nd of the first anti-etching glue-line respective traces width, and the trace of the second anti-etching glue-line is positioned at the centre of the first anti-etching glue-line respective traces.
Alternatively, the thickness of the second anti-etching glue-line is 1.5 ~ 2 times of the first anti-etching bondline thickness.
Alternatively, prevent the structure broken during touch screen induction layer processing procedure, described first anti-etching glue-line and the second anti-etching glue-line all adopt ultra-violet curing glue.
According to the utility model, the first anti-etching glue-line that the first impression is formed is by the second impression of superposition, in order to eliminate the defect point that serigraphy produces, thus can not because of the first impression produce the problem that defect point causes inductive layer to break, improve product yield.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram that known anti-etching glue prints on nesa coating.
Fig. 2 is the A-A sectional structure schematic diagram corresponding to Fig. 1.
Fig. 3 is the Facad structure schematic diagram that known etching forms transparent inductive layer afterwards.
Fig. 4 is the B-B sectional structure schematic diagram corresponding to Fig. 3.
Fig. 5 be according to of the present utility model a kind of prevent touch screen induction layer processing procedure time broken string structure schematic diagram.
Fig. 6 is the C-C sectional structure schematic diagram corresponding to Fig. 5.
Fig. 7 is according to a kind of method flow diagram preventing breaking during touch screen induction layer processing procedure of the present utility model.
In figure: 1. anti-etching glue-line, 2. nesa coating, 3. substrate.
4. defect point.
5. inductive layer.
6. break point.
11. first anti-etching glue-lines, 12. second anti-etching glue-lines, 121. defect points, 122. pits, 123. filling parts.
Embodiment
Should be appreciated that the object that exists of anti-etching glue-line 1 is as Figure 1-3 patterned transparent conductive layer, therefore, according to the utility model, not only can be applied to and have in the touch screen processing procedure of a nesa coating 2, such as, there is a nesa coating 2, and combine the technique of building bridge; Can also be applied to and have in the touch-screen processing procedure of two nesa coatings 2, two nesa coatings 2 all produce corresponding inductive layer by etch process.
The pattern of patterned transparent conducting film 2 is protection parts of anti-etching glue-line 1, and the space between pattern is etched the part of removal.Therefore, should be appreciated that by by serigraphy the tree lace of anti-etching glue-line 1 that formed should have the adaptability with patterned transparent conducting film 2, those skilled in the art should be expressly understood this.
Should be appreciated that and be applied to nesa coating 2 fabrication steps to inductive layer according to method and structure of the present utility model, and making of irrelevant touch-screen other parts, in the utility model, the processing procedure of other parts of touch-screen is repeated no more.
Should be appreciated that the processing procedure of inductive layer does not represent all inductive layers all to be made, and represent the inductive layer corresponding to patterning of nesa coating 2.Such as there is the touch-screen of two nesa coatings, can be understood as this touch-screen at this and there are two inductive layers.
See Figure of description 7, and with reference to accompanying drawing 1-6, a kind of method preventing breaking during touch screen induction layer processing procedure, for the processing procedure of touch screen induction layer, it comprises following basic step:
1) plated film, the one side predetermined at given substrate 1 makes nesa coating 2, usually for substrate 1, one is facing to user, can be understood as air surface, another face is the loading end of touch controllable function part, for realizing the carrying of the necessary rete of touch-control.
2) first impression, provides the first half tone, and the pattern of coupling required for inductive layer, nesa coating 2 prints the first anti-etching glue-line 11, covers nesa coating 2 part needing protection, and exposes the part needing etching to remove; As described in the background section, ideally, single anti-etching glue-line can meet the realization of above-mentioned functions, but serigraphy can not keep desirable operating mode constantly, thus printing quality does not have desirable consistance, described cover might not realize very desirable, the such as appearance of described defect point 4.
3) solidify, solidification the first anti-etching glue-line 11, makes printed glue-line be cured.
4) second impression, provides the second half tone, superposes the anti-etching glue-line 12 of printing second at the first anti-etching glue-line 11, and so defect point 4 is because the flowing of anti-etching glue, is filled as shown in Figure 6, forms filling part 123.Anti-etching glue-line formed on the whole can eliminate defect point 4.
In addition the serigraphy of touch screen rank comparative maturity, occurs that the probability of defect point 4 is inherently lower, even if twice printing adopts same half tone, occurs that the probability of defect point 4 belongs to the impossible event in Probability substantially in same position.
The second anti-etching glue-line 12 that the second impression produces may also can existing defects point, such as, defect point 121 shown in Fig. 6, but under this defect point, has covering of the first anti-etching glue-line, acid solution can not directly and protected portion divide and react.
5) solidify, solidification the second anti-etching glue-line 12, makes this second anti-etching glue-line 12 solidify.
6) etch, nesa coating 2 is etched.
Because anti-etching glue-line is after etching, after cleaning acid solution, then remove, the difficulty that the increase that anti-etching glue-line thicker a little can't be too much is removed.
As previously mentioned, because the second impression is known based on Probability, can effectively make defect point 4 up, thus the part of protection can be needed to realize good covering to nesa coating 2, and be unlikely to the breakpoint 6 that produces as shown in Figure 4, thus improve product yield.
About the anti-etching glue-line of the entirety that the first impression and the second impression are formed, its width can touch screen induction layer processing procedure of the same type with reference to routine time required anti-etching glue-line pattern, adopt wide anti-etching glue-line pattern, this pattern often shows as tree lace stitching, the pattern form on coupling sensing chip.
With the first impression and second impression superposition the entirety of formation tree lace for benchmark, tree lace width is not more than 130 μm, and is not less than 70 μm, the density of reasonable layout pattern, thus the precision meeting touch sensible.
In certain embodiments, the first impression and the second impression can be expressed as a kind of overprint technique, really, chromatography requires assorted domain literary composition printing re-posted alignment when referring generally to polychrome printing, the monochromatic forme of different cable angles namely will obtained after master copy color-dividing, according to forme look sequence successively overlapping fit, final printing obtains and original copy level, printing that tone is identical.In order to reduce costs, the anti-etching glue that the chromatography in the present embodiment uses can adopt same anti-etching glue.
In certain embodiments, the first impression adopts narrower structure, and the second impression adopts relatively wide structure, and during printing, the tree lace that the second impression produces covers on the tree lace that the first impression formed, and easily covers defect point according to this structure.
In certain embodiments, the first impression and the second impression can adopt the half tone of same half tone or same specification, produce the identical printed layers of track width.To this, need the aligning accuracy problem of consideration twice printing.
In certain embodiments, the second impression to form the width of trace narrow compared with superposed track width that the first impression is formed, be preferably 1/2nd, and the second impression formed trace be positioned at the superposed first impression form the centre of trace; The first impression and the second impression adopt identical alignment mode and identical alignment target, and thus, the aligning accuracy of twice printing requires not high.Meanwhile, the structure division due to its main bridging effect protective effect is in other words the trace that the first impression produces, and the second impression is repairing effect, instead of plays main bridging effect.
Due to the mobility before anti-etching adhesive curing, and defect point 4 has certain space characteristics, before anti-etching adhesive curing, resistance to flow is herein little, thus easily formed herein and good make up effect, form filling part 123 as shown in Figure 6, although because fill diverting from one use to another glue amount, there will be depression as shown in Figure 5, pit 122 as shown in Figure 6, but pit 122 can not produce any harmful effect to etching.
Because above-mentioned impact, based on the first impression, the width that its institute produces tree lace is final width, the minimizing of second time glue consumption, also can ensure the first impression produce the sharpness of border of trace, sawtooth is not obvious.
In addition, the tree lace width of the preferred second impression is 1/2nd of the tree lace width of the first impression, can avoid the generation of disconnection defect completely, and easily aim at.
Further, the second impression form trace thickness be the superposed first impression form 1.5 ~ 2 times of trace thickness; And second impression frictioning number of times is 2 ~ 3 times, in order to ensure the quality of the second impression.
In addition, when the first impression, frictioning number of times also adopts the mode of 2 ~ 3 times, at least ensures the quality of the first impression.
Generally speaking, the second impression form trace 1 times of thickness formed to by first impression trace thickness, substantially can meet making up defect point 4.And the thickness of the trace that the first impression is formed can be thinner than the print thickness of routine.
As shown in Figure 7, the anti-etching glue that the described first impression and the second impression use is ultraviolet (UV, ultraviolet abbreviation) and solidifies glue.
In chemical industry field of polymer technology, UV is also referred to as radiation curing, utilize in UV ultraviolet light, shortwave (300-800 nanometer) under uv radiation, light trigger irriate in liquid UV material becomes free radical or kation, thus cause the process that the macromolecular material (resin) containing active function groups aggregates into insoluble not molten solid paint film, be rise a kind of sixties in 20th century, environmental protection, the new technology of low VOC discharge, 80 years 20th century were developed rapidly in China later.
The first thinner etch-stop layer 11, can meet the rapid curing of UV, and the track width relative narrower of the second etch-stop layer 12, be also conducive to the rapid curing of UV.
See Figure of description 5 and 6, a kind of structure preventing breaking during touch screen induction layer processing procedure, its basic structure comprises:
First anti-etching glue-line 11, printing is solidified to form on nesa coating 2 to be etched; And
Second anti-etching glue-line 12, printing is solidificated on the first anti-etching glue-line 11, forms anti-etching glue-line together with the first anti-etching glue-line 11, in order to cover the part to be protected of nesa coating 2 and to expose the part of removal to be etched.
Should be appreciated that anti-etching glue-line hardboard is all acidproof not alkaline-resisting glue, to meet after chemical etching (acid etching), then remove anti-etching glue with alkali lye.
Make explanation in the preceding article about the width of two anti-etching glue-lines and thickness structure and selection reason thereof, do not repeated them here.
Claims (5)
1. prevent the structure broken during touch screen induction layer processing procedure, it is characterized in that, comprising:
First anti-etching glue-line (11), printing is solidified to form on nesa coating to be etched (2); And
Second anti-etching glue-line (12), printing is solidificated on the first anti-etching glue-line (11), forms anti-etching glue-line together with the first anti-etching glue-line (11), in order to cover the part to be protected of nesa coating (2) and to expose the part of removal to be etched.
2. the structure preventing breaking during touch screen induction layer processing procedure according to claim 1, is characterized in that, the width of anti-etching glue-line is not more than 130 μm, and is not less than 70 μm.
3. the structure preventing breaking during touch screen induction layer processing procedure according to claim 2, it is characterized in that, the track width of the second anti-etching glue-line (12) is 1/2nd of the first anti-etching glue-line (11) respective traces width, and the trace of the second anti-etching glue-line (12) is positioned at the centre of the first anti-etching glue-line (11) respective traces.
4. the structure preventing breaking during touch screen induction layer processing procedure according to claim 3, is characterized in that, the thickness of the second anti-etching glue-line (12) is 1.5 ~ 2 times of the first anti-etching glue-line (11) thickness.
5., according to the arbitrary described structure preventing breaking during touch screen induction layer processing procedure of claim 1-4, it is characterized in that, described first anti-etching glue-line (11) and the second anti-etching glue-line (12) all adopt ultra-violet curing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520570405.9U CN204833210U (en) | 2015-08-03 | 2015-08-03 | Structure of broken string when preventing touch -sensitive screen inductive layer processing procedure |
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| CN201520570405.9U CN204833210U (en) | 2015-08-03 | 2015-08-03 | Structure of broken string when preventing touch -sensitive screen inductive layer processing procedure |
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| CN204833210U true CN204833210U (en) | 2015-12-02 |
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| CN201520570405.9U Expired - Fee Related CN204833210U (en) | 2015-08-03 | 2015-08-03 | Structure of broken string when preventing touch -sensitive screen inductive layer processing procedure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105005414A (en) * | 2015-08-03 | 2015-10-28 | 山东华芯富创电子科技有限公司 | Method and structure for preventing wire breakage of touch panel sensor layer in preparation |
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2015
- 2015-08-03 CN CN201520570405.9U patent/CN204833210U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105005414A (en) * | 2015-08-03 | 2015-10-28 | 山东华芯富创电子科技有限公司 | Method and structure for preventing wire breakage of touch panel sensor layer in preparation |
| CN105005414B (en) * | 2015-08-03 | 2018-09-14 | 山东华芯富创电子科技有限公司 | Prevent the method and structure to break when touch screen induction layer processing procedure |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20170803 |
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| CF01 | Termination of patent right due to non-payment of annual fee |