CN204819982U - A multi -wire saw for silicon chip - Google Patents
A multi -wire saw for silicon chip Download PDFInfo
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- CN204819982U CN204819982U CN201520616741.2U CN201520616741U CN204819982U CN 204819982 U CN204819982 U CN 204819982U CN 201520616741 U CN201520616741 U CN 201520616741U CN 204819982 U CN204819982 U CN 204819982U
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- mortar
- metal wire
- box body
- pipe
- silicon chip
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Abstract
The utility model discloses a can improve a multi -wire saw for silicon chip of silicon chip cutting quality. This multi -wire saw is including the cutting box, the hod, heat exchanger, the metal wire, through first mortar pipe intercommunication between hod and heat exchanger's the import, heat exchanger's exit linkage has second mortar pipe, the end -to -end connection of second mortar pipe has the mortar feeding device who is arranged in adhering to the metal wire surface with the mortar at cutting process, the mortar gets into in the box body and fills it along the mortar feed pipe, the edge that the curb plate can be followed in mortar continuation supply spills over to the cutting incasement, because metal wire and the contact point of compression roller and the height that the distance between the bottom plate is less than the curb plate, therefore, the metal wire can be impressed in the mortar in the box body by the compression roller, the mortar feeding device of this kind of immersion can so that the metal wire surface be stained with the mortar and realize even adhering to, can improve the cutting quality of silicon chip greatly. Be fit for the field popularization and application at cutting equipment.
Description
Technical field
The utility model relates to cutting equipment field, especially a kind of multi-line cutting machine for silicon chip.
Background technology
Multi-wire saw is one of very effective method of cutting silicon wafer.Multi-wire saw is with its high production efficiency and piece rate, and silicon chip of cutting has the features such as flexibility is little, angularity is little, the depth of parallelism is good, gross thickness tolerance (TTV) discreteness is little, cutting edge cutting loss is little, surface damage layer is shallow, silicon chip surface roughness is little; Its cutting material cover all kinds semi-conducting material, as silicon, germanium, lithium niobate, GaAs, indium phosphide, synthetic cut stone, carborundum etc., therefore the application of multi-wire saw technology is also more and more extensive.
A kind of mixed-abrasive-cutting mortar (hereinafter referred to as mortar) with mobility must be used in multi-wire saw.In actual cutting process, mortar is taken to cutting area by reciprocating steel wire, and the mortar be brought into determines the cut quality of silicon chip; And steel wire grain type with silicon carbide micro-powder contained in mortar and granularity, be the key determining cutting material finished product sheet any surface finish degree and cutting power.If the grain type rule of silicon carbide micro-powder, the finished product sheet surface smoothness cut out will be fine; The even particle size distribution of silicon carbide micro-powder, can improve the cutting power of cutting machine.
The existing multi-line cutting machine for silicon chip, comprise cutting casing, hod, heat exchanger, metal wire, be communicated with by the first mortar pipe between hod and the import of heat exchanger, the outlet of heat exchanger is connected with the second mortar pipe, described first mortar pipe is provided with the first mortar pump, two line rollers parallel to each other are provided with in described cutting casing, line roller surface is provided with multiple annular wire casing, metal wire to be arranged in annular wire casing and successively to walk around two line rollers and tightens, the end of described second mortar pipe is connected with the mortar feedway for mortar being attached to metal line surface, be provided with mortar bottom cutting box and collect mouth, mortar is collected on mouth and is connected with mortar collecting pipe, the end of mortar collecting pipe is connected with hod, when cutting, mortar in hod is introduced in heat exchanger the temperature of carrying out heat exchange and making the temperature of its mortar reach certain under the effect of mortar pump, then mortar enters mortar feedway along the second mortar pipe, mortar is attached to metal line surface so that cutting silicon rod by mortar feedway, the waste mortar produced after cutting silicon rod flows back to hod again to utilize by the mortar collection hole bottom cutting box along mortar collection hole, existing mortar feedway mostly adopts the mode of spray to realize, namely side arranges nozzle over the metal lines, nozzle is connected with the second mortar pipe, whether mortar can be attached to metal line surface uniformly has a great impact for the cut quality of silicon chip, although existing mortar spray mode can realize the attachment of mortar, but because the mortar flow being supplied to mortar nozzle has fluctuation, the mortar of mortar nozzle ejection is even not, so just cannot ensure that the mortar be sprayed onto on metal wire can adhere to over the metal lines uniformly, make the cut quality of silicon chip can not reach best, there are quality problems in the silicon chip that sometimes also there will be cutting.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of multi-line cutting machine for silicon chip that can improve silicon chip cut quality.
The utility model solves the technical scheme that its technical problem adopts: this is used for the multi-line cutting machine of silicon chip, comprise cutting casing, hod, heat exchanger, metal wire, be communicated with by the first mortar pipe between hod and the import of heat exchanger, the outlet of heat exchanger is connected with the second mortar pipe, described first mortar pipe is provided with the first mortar pump, two line rollers parallel to each other are provided with in described cutting casing, line roller surface is provided with multiple annular wire casing, metal wire to be arranged in annular wire casing and successively to walk around two line rollers and tightens, the end of described second mortar pipe is connected with the mortar feedway for mortar being attached to metal line surface, be provided with mortar bottom cutting box and collect mouth, mortar is collected on mouth and is connected with mortar collecting pipe, the end of mortar collecting pipe is connected with hod, described mortar feedway comprises the box body be arranged between two line rollers, described box body is made up of base plate and the side plate being positioned at base plate surrounding, described box body is connected with mortar supply pipe, the end of described mortar supply pipe is communicated with the second mortar pipe, the side plate top of the left and right sides of described box body is respectively arranged with the first backing roll, second backing roll, pressure roller is provided with above described box body, described pressure roller and box body lay respectively at the both sides up and down of upper strata metal wire, described first backing roll, second backing roll lays respectively at the left and right sides of pressure roller, orthogonal and the length of box body of the direction of motion of described box body length direction and metal wire is greater than the length of line roller, the first backing roll walked around successively by described metal wire, pressure roller, second backing roll is V-shaped, distance between the contact point of described metal wire and pressure roller and base plate is less than the height of side plate.
Further, mini-sized blender is provided with in described box body.
Further, be provided with agitating device in described hod, described agitating device comprises the rotating shaft being arranged on hod central authorities, and described rotating shaft is provided with multiple stirring vane.
Further, the diameter of described metal wire is 0.1mm.
Further, described metal wire is steel wire.
The beneficial effects of the utility model are: in cutting process, mortar to enter in box body along mortar supply pipe and is filled, mortar continues supply and can be spilled in cutting box along the edge of side plate, because the distance between the contact point of metal wire and pressure roller and base plate is less than the height of side plate, therefore, metal wire can be pressed in the mortar in box body by pressure roller, metal wire automatically can be stained with mortar at metal line surface in motion process, this mode can not be subject to the impact of mortar fluctuation, and the mortar feedway of this immersion can make metal line surface be stained with mortar and realize uniform attachment, greatly can improve the cut quality of silicon chip.
Accompanying drawing explanation
Fig. 1 the utility model is used for the structural representation of the multi-line cutting machine of silicon chip;
The A partial enlarged drawing of this Fig. 1 of Fig. 2;
Description of symbols in figure: cutting casing 1, hod 2, heat exchanger 3, metal wire 4, first mortar pipe 5, second mortar pipe 6, first mortar pump 7, line roller 8, mortar feedway 9, box body 901, base plate 9011, side plate 9012, mortar supply pipe 902, first backing roll 903, second backing roll 904, pressure roller 905, mini-sized blender 906, mortar collect mouth 10, mortar collecting pipe 11, agitating device 22, rotating shaft 2201, stirring vane 2202.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is further illustrated.
As Fig. 1, shown in 2, this is used for the multi-line cutting machine of silicon chip, comprise cutting casing 1, hod 2, heat exchanger 3, metal wire 4, be communicated with by the first mortar pipe 5 between hod 2 and the import of heat exchanger 3, the outlet of heat exchanger 3 is connected with the second mortar pipe 6, described first mortar pipe 5 is provided with the first mortar pump 7, two line rollers 8 parallel to each other are provided with in described cutting casing 1, line roller 8 surface is provided with multiple annular wire casing, metal wire 4 to be arranged in annular wire casing and successively to walk around two line rollers 8 and tightens, the end of described second mortar pipe 6 is connected with the mortar feedway 9 for mortar being attached to metal wire 4 surface, be provided with mortar bottom cutting box and collect mouth 10, mortar is collected on mouth 10 and is connected with mortar collecting pipe 11, the end of mortar collecting pipe 11 is connected with hod 2, described mortar feedway 9 comprises the box body 901 be arranged between two line rollers 8, described box body 901 is made up of base plate 9011 and the side plate 9012 being positioned at base plate 9011 surrounding, described box body 901 is connected with mortar supply pipe 902, the end of described mortar supply pipe 902 is communicated with the second mortar pipe 6, side plate 9012 top of the left and right sides of described box body 901 is respectively arranged with the first backing roll 903, second backing roll 904, pressure roller 905 is provided with above described box body 901, described pressure roller 905 and box body 901 lay respectively at the both sides up and down of upper strata metal wire 4, described first backing roll 903, second backing roll 904 lays respectively at the left and right sides of pressure roller 905, orthogonal and the length that is box body 901 of the direction of motion of described box body 901 length direction and metal wire 4 is greater than the length of line roller 8, the first backing roll 903 walked around successively by described metal wire 4, pressure roller 905, second backing roll 904 is V-shaped, distance between the contact point of described metal wire 4 and pressure roller 905 and base plate 9011 is less than the height of side plate 9012.When cutting, mortar in hod 2 is introduced in heat exchanger 3 temperature of carrying out heat exchange and making the temperature of its mortar reach certain under the effect of the first mortar pump 7, then a part of mortar enters mortar feedway 9 along the second mortar pipe 6, mortar is attached to metal wire 4 surface so that cutting silicon rod by mortar feedway 9, the waste mortar produced after cutting silicon rod flows back to hod 2 again to utilize by the mortar collection hole bottom cutting box along mortar collection hole, in cutting process, mortar to enter in box body 901 along mortar supply pipe 902 and is filled, mortar continues supply and can be spilled in cutting box along the edge of side plate 9012, because the distance between the contact point of metal wire 4 and pressure roller 905 and base plate 9011 is less than the height of side plate 9012, therefore, metal wire 4 can be pressed in the mortar in box body 901 by pressure roller 905, metal wire 4 automatically can be stained with mortar on metal wire 4 surface in motion process, this mode can not be subject to the impact of mortar fluctuation, and the mortar feedway 9 of this immersion can make metal wire 4 surface be stained with mortar and realize uniform attachment, greatly can improve the cut quality of silicon chip.
Because the proportion of mortar is comparatively large, long-time standing rear mortar can deposit to bottom, in order to improve the uniformity of mortar mixing material, thus ensureing that the mortar being attached to metal wire 4 surface is more even, being provided with mini-sized blender 906 in described box body 901.
In order to ensure the uniformity consistency of mortar in whole cutting process, and then the Si wafer quality uniformity of cutting is better before and after ensureing, agitating device 22 is provided with in described hod 2, described agitating device 22 comprises the rotating shaft 2201 being arranged on hod 2 central authorities, and described rotating shaft 2201 is provided with multiple stirring vane 2202.By agitating device 22, the mortar in hod 2 is mixed all the time, avoid local silica flour in hod 2 to flock together.
The diameter of described metal wire 4 is the smaller the better under normal circumstances, if but the diameter of metal wire 4 is too little, metal wire 4 easily ruptures, therefore, under having the prerequisite of enough tensile strength at guarantee metal wire 4, make the diameter of metal wire 4 little as much as possible, the diameter of described metal wire 4 is preferably 0.1mm.Further, described metal wire 4 can adopt the good metal of existing various tensile strength to make, as preferably: described metal wire 4 is steel wire, and steel wire not only tensile strength is good, and wearability is good, and service life is longer.
Claims (5)
1. for the multi-line cutting machine of silicon chip, comprise cutting casing (1), hod (2), heat exchanger (3), metal wire (4), be communicated with by the first mortar pipe (5) between hod (2) and the import of heat exchanger (3), the outlet of heat exchanger (3) is connected with the second mortar pipe (6), described first mortar pipe (5) is provided with the first mortar pump (7), two line rollers (8) parallel to each other are provided with in described cutting casing (1), line roller (8) surface is provided with multiple annular wire casing, metal wire (4) to be arranged in annular wire casing and successively to walk around two line rollers (8) and tightens, the end of described second mortar pipe (6) is connected with the mortar feedway (9) for mortar being attached to metal wire (4) surface, be provided with mortar bottom cutting box and collect mouth (10), mortar is collected on mouth (10) and is connected with mortar collecting pipe (11), the end of mortar collecting pipe (11) is connected with hod (2), it is characterized in that: described mortar feedway (9) comprises the box body (901) be arranged between two line rollers (8), described box body (901) is made up of base plate (9011) and the side plate (9012) that is positioned at base plate (9011) surrounding, described box body (901) is connected with mortar supply pipe (902), the end of described mortar supply pipe (902) is communicated with the second mortar pipe (6), side plate (9012) top of the left and right sides of described box body (901) is respectively arranged with the first backing roll (903), second backing roll (904), described box body (901) top is provided with pressure roller (905), described pressure roller (905) and box body (901) lay respectively at the both sides up and down of upper strata metal wire (4), described first backing roll (903), second backing roll (904) lays respectively at the left and right sides of pressure roller (905), orthogonal and the length that is box body (901) of the direction of motion of described box body (901) length direction and metal wire (4) is greater than the length of line roller (8), the first backing roll (903) walked around successively by described metal wire (4), pressure roller (905), second backing roll (904) is V-shaped, distance between the contact point of described metal wire (4) and pressure roller (905) and base plate (9011) is less than the height of side plate (9012).
2., as claimed in claim 1 for the multi-line cutting machine of silicon chip, it is characterized in that: in described box body (901), be provided with mini-sized blender (906).
3. as claimed in claim 2 for the multi-line cutting machine of silicon chip, it is characterized in that: in described hod (2), be provided with agitating device (22), described agitating device (22) comprises the rotating shaft (2201) being arranged on hod (2) central authorities, described rotating shaft (2201) is provided with multiple stirring vane (2202).
4., as claimed in claim 3 for the multi-line cutting machine of silicon chip, it is characterized in that: the diameter of described metal wire (4) is 0.1mm.
5., as claimed in claim 4 for the multi-line cutting machine of silicon chip, it is characterized in that: described metal wire (4) is steel wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520616741.2U CN204819982U (en) | 2015-08-14 | 2015-08-14 | A multi -wire saw for silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520616741.2U CN204819982U (en) | 2015-08-14 | 2015-08-14 | A multi -wire saw for silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204819982U true CN204819982U (en) | 2015-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520616741.2U Expired - Fee Related CN204819982U (en) | 2015-08-14 | 2015-08-14 | A multi -wire saw for silicon chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204819982U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106363826A (en) * | 2016-09-07 | 2017-02-01 | 江西赛维Ldk太阳能高科技有限公司 | Device and method for cutting silicon ingot |
| CN108044819A (en) * | 2017-12-07 | 2018-05-18 | 苏州阿特斯阳光电力科技有限公司 | A kind of silicon rod cutting method |
-
2015
- 2015-08-14 CN CN201520616741.2U patent/CN204819982U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106363826A (en) * | 2016-09-07 | 2017-02-01 | 江西赛维Ldk太阳能高科技有限公司 | Device and method for cutting silicon ingot |
| CN106363826B (en) * | 2016-09-07 | 2017-12-15 | 江西赛维Ldk太阳能高科技有限公司 | Cut the device and method of silicon ingot |
| CN108044819A (en) * | 2017-12-07 | 2018-05-18 | 苏州阿特斯阳光电力科技有限公司 | A kind of silicon rod cutting method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20200814 |