CN204807372U - Infrared spectroscopic analysis sample wafer preforming mould - Google Patents
Infrared spectroscopic analysis sample wafer preforming mould Download PDFInfo
- Publication number
- CN204807372U CN204807372U CN201520475060.9U CN201520475060U CN204807372U CN 204807372 U CN204807372 U CN 204807372U CN 201520475060 U CN201520475060 U CN 201520475060U CN 204807372 U CN204807372 U CN 204807372U
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- China
- Prior art keywords
- die sleeve
- die
- interior
- sleeve
- mould base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an infrared spectroscopic analysis sample wafer preforming mould, including the mould base and with mould base matched with die sleeve, the die sleeve includes that outer die sleeve and cover locate interior die sleeve in the outer die sleeve, the centre form cover is the die sleeve in first interior die sleeve and second, the interior die sleeve of die sleeve and second is mutually supported to contact to connect and is formed in first interior die sleeve, mould base up end has and to stretch into column portion in the die cavity of interior die sleeve, the top of die sleeve have with the matched with of column portion is used for the fashioned pressure head of sample wafer, the up end of interior die sleeve has conical slot part, the tank bottom of conical slot part with the upper end of die cavity is open -minded. The utility model especially discloses a with in for die sleeve including first in and second die sleeve of interior die sleeve design, after taking off the overcoat, two halfbodies are opened into with interior die sleeve to the directness, so very conveniently take off the sample preforming in column portion.
Description
Technical field
The utility model belongs to scientific analysis Instrument technology field, is specifically related to a kind of Infrared spectroscopy print compression mold.
Background technology
Infrared spectrum belongs to molecular spectrum, is the powerful determining molecular composition and structure.Infrared spectroscopy application widely, can be said for any sample, as long as the amount of sample is abundant, can obtain an infrared spectrum.Obtain the infrared spectrogram of a high-quality sample, except there being the instrument of function admirable, select outside suitable making sample method, method for making sample is also very important.The main pressed disc method that adopts makes the print carrying out Infrared spectroscopy at present, is then put in reaction in-situ device and carries out Infrared spectroscopy.Current, print makes mould and is inconvenient to the good sample of pressure after compression, therefore, is necessary to be improved.
Utility model content
The purpose of this utility model is solve above-mentioned technical matters and provide a kind of Infrared spectroscopy print compression mold, to solve the bad problem of getting sheet of existing compression mold.
For realizing the purpose of this utility model, the utility model provides a kind of Infrared spectroscopy print compression mold, the die sleeve comprising mould base and match with described mould base, described die sleeve comprises outer die casing and is sheathed on the interior die sleeve in described outer die casing, described interior die sleeve to comprise in first die sleeve in die sleeve and second, in described first, in die sleeve and second, the die sleeve contact that cooperatively interacts is connected to form described interior die sleeve, described mould base upper surface has the columnar part in the die cavity that can stretch into described interior die sleeve, the top of described die sleeve has the pressure head shaping for print matched with described columnar part, the upper surface of described interior die sleeve has conical tank portion, the bottom land in described conical tank portion and the upper end of described die cavity open-minded.
Further, the height of described outer die casing is consistent with the height of described interior die sleeve.
Further, in die sleeve and second, the cooperation surface of contact of die sleeve has clamping bar and/or slot device in described first.
The utility model, compared with prior art, by the die sleeve including mould base and match with described mould base, described die sleeve comprises outer die casing and is sheathed on the interior die sleeve in described outer die casing, described interior die sleeve to comprise in first die sleeve in die sleeve and second, in described first, in die sleeve and second, the die sleeve contact that cooperatively interacts is connected to form described interior die sleeve, described mould base upper surface has the columnar part in the die cavity that can stretch into described interior die sleeve, and the top of described die sleeve has the pressure head shaping for print matched with described columnar part; The upper surface of described interior die sleeve has conical tank portion, the bottom land in described conical tank portion and the upper end of described die cavity open-minded, particularly sheathed for internal mold counting to be comprised in first die sleeve in die sleeve and second, after taking off overcoat, directly interior die sleeve is opened into two halfbodies, very convenient like this sample compressing tablet is taken off in columnar part.
Accompanying drawing explanation
Fig. 1 is the structural representation of Infrared spectroscopy print compression mold of the present utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and beneficial effect clearly understand, below in conjunction with embodiment, the utility model is further elaborated.Should be understood to specific embodiment described herein only in order to explain the utility model, be not limited to protection domain of the present utility model.
As shown in Figure 1, the utility model provides a kind of Infrared spectroscopy print compression mold, the die sleeve comprising mould base 1 and match with described mould base, described die sleeve comprises outer die casing 3 and is sheathed on the interior die sleeve in described outer die casing, described interior die sleeve to comprise in first die sleeve 5 in die sleeve 4 and second, in described first, in die sleeve and second, the die sleeve contact that cooperatively interacts is connected to form described interior die sleeve, described mould base upper surface has the columnar part 2 in the die cavity 6 that can stretch into described interior die sleeve, the top of described die sleeve has the pressure head 7 shaping for print matched with described columnar part, the upper surface of described interior die sleeve has conical tank portion 8, the bottom land in described conical tank portion 8 and the upper end of described die cavity open-minded.
Further, the height of described outer die casing is consistent with the height of described interior die sleeve.
Further, in die sleeve 4 and second, the cooperation surface of contact of die sleeve 5 has clamping bar and/or slot device in described first.
In specific implementation, in described first, in die sleeve 4 and second, die sleeve 5 is cross section is semicircular structure, a cylinder is formed after fastening contact, can be that the surface of contact that in described first, die sleeve 4 corresponds to die sleeve in described second is provided with clamping bar or slot device, correspondence surface of contact of die sleeve 5 in described second be provided with corresponding slot or clamping strip device.
The utility model, compared with prior art, by the die sleeve including mould base and match with described mould base, described die sleeve comprises outer die casing and is sheathed on the interior die sleeve in described outer die casing, described interior die sleeve to comprise in first die sleeve in die sleeve and second, in described first, in die sleeve and second, the die sleeve contact that cooperatively interacts is connected to form described interior die sleeve, described mould base upper surface has the columnar part in the die cavity that can stretch into described interior die sleeve, and the top of described die sleeve has the pressure head shaping for print matched with described columnar part; The upper surface of described interior die sleeve has conical tank portion, the bottom land in described conical tank portion and the upper end of described die cavity open-minded, particularly sheathed for internal mold counting to be comprised in first die sleeve in die sleeve and second, after taking off overcoat, directly interior die sleeve is opened into two halfbodies, very convenient like this sample compressing tablet is taken off in columnar part.
The above is only preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (3)
1. an Infrared spectroscopy print compression mold, it is characterized in that, the die sleeve comprising mould base and match with described mould base, described die sleeve comprises outer die casing and is sheathed on the interior die sleeve in described outer die casing, described interior die sleeve to comprise in first die sleeve in die sleeve and second, in described first, in die sleeve and second, the die sleeve contact that cooperatively interacts is connected to form described interior die sleeve, described mould base upper surface has the columnar part in the die cavity that can stretch into described interior die sleeve, and the top of described die sleeve has the pressure head shaping for print matched with described columnar part; The upper surface of described interior die sleeve has conical tank portion, the bottom land in described conical tank portion and the upper end of described die cavity open-minded.
2. Infrared spectroscopy print compression mold according to claim 1, it is characterized in that, the height of described outer die casing is consistent with the height of described interior die sleeve.
3. Infrared spectroscopy print compression mold according to claim 1, it is characterized in that, in described first, in die sleeve and second, the cooperation surface of contact of die sleeve has clamping bar and/or slot device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520475060.9U CN204807372U (en) | 2015-06-29 | 2015-06-29 | Infrared spectroscopic analysis sample wafer preforming mould |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520475060.9U CN204807372U (en) | 2015-06-29 | 2015-06-29 | Infrared spectroscopic analysis sample wafer preforming mould |
Publications (1)
Publication Number | Publication Date |
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CN204807372U true CN204807372U (en) | 2015-11-25 |
Family
ID=54592179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201520475060.9U Expired - Fee Related CN204807372U (en) | 2015-06-29 | 2015-06-29 | Infrared spectroscopic analysis sample wafer preforming mould |
Country Status (1)
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CN (1) | CN204807372U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108535209A (en) * | 2018-03-16 | 2018-09-14 | 湖南科技大学 | A kind of infrared spectrometer sample compression mold |
-
2015
- 2015-06-29 CN CN201520475060.9U patent/CN204807372U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108535209A (en) * | 2018-03-16 | 2018-09-14 | 湖南科技大学 | A kind of infrared spectrometer sample compression mold |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20190629 |