CN204805999U - LED lamp of high heat dissipating ability improves structure - Google Patents
LED lamp of high heat dissipating ability improves structure Download PDFInfo
- Publication number
- CN204805999U CN204805999U CN201520364003.3U CN201520364003U CN204805999U CN 204805999 U CN204805999 U CN 204805999U CN 201520364003 U CN201520364003 U CN 201520364003U CN 204805999 U CN204805999 U CN 204805999U
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- Prior art keywords
- led
- shell
- high heat
- circuit board
- cooling duct
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a LED lamp of high heat dissipating ability improves structure, including shell, lamp shade, circuit board, LED lamp pearl and electron device, the circuit board with be provided with the heat -conducting layer between the upper surface of shell, be provided with a plurality of cooling channel on the shell, cooling channel's central line with the shell upper surface becomes the contained angle. This technical scheme is provided with the coolant liquid through set up cooling channel on the shell in cooling channel, through the contained angle between cooling channel and the shell upper surface, the automatic cooling channel's that flows back of gravity lower extreme is passed through to the coolant liquid after the cooling, and this cooling channel has improved the cooling effect of radiator, and the life who has improved LED can stabilize LED's luminous intensity.
Description
Technical field
The utility model belongs to LED field, specifically refers to a kind of LED modified node method of high heat dispersion.
Background technology
LED is since invention, high with luminous efficiency, long service life and substitute incandescent lamp and fluorescent lamp gradually.Present LED is more and more wider in the application of lighting field, but LED is in the process by electric energy conversion being light, and the transformation efficiency of present stage is still not high, and the energy utilization efficiency of state-of-the-art technology is no more than 30%, and remaining energy is all come out in the mode of heat.
The impact that the luminescence of LED is subject to temperature is larger, LED is emitting semiconductor, it is along with the rising of temperature, luminous efficiency also reduces gradually, although in theory, the life-span of LED was more than 100,000 hours, but because heat is on the impact of LED, in actual use, LED is after application a period of time, and the intensity of light is just weakening.The heat how solving LED, on the impact of service life and actual value, is the technical problem that this area is being made great efforts always.
The problem affecting the LED life-span of now having generally acknowledged mainly contains two aspects, and one is the impact of heat on emitting semiconductor of emitting semiconductor itself, the luminous intensity problem of this some effects major effect emitting semiconductor; Another is that in the circuit realizing emitting semiconductor work, each electronic devices and components also produce heat problem in the course of the work, and the heat of electronic devices and components causes the life-span of electronic devices and components cannot match with the service life of LED.
In order to improve the service life of LED, in high-power LED, be provided with thermal component to improve radiating effect, to reduce because heat is on the impact of emitting semiconductor and electronic devices and components operating efficiency.But still there is bottleneck problem in the heat transmission between thermal component and electronic devices and components and emitting semiconductor.
Utility model content
The purpose of this utility model proposes improvement opportunity scheme to existing LED, by the technical program, can improve the radiating effect of LED, improve the service life of LED.
The utility model is achieved through the following technical solutions:
A LED modified node method for high heat dispersion, includes shell, lampshade, circuit board, LED lamp bead and electronic device;
The upper surface of described shell is connected with described lampshade; The lower surface that described shell is relative with described lampshade is provided with wing fin; Described LED lamp bead and described electronic device are arranged on described circuit board; Described circuit board is arranged in the space that surrounds between described shell and described lampshade;
Heat-conducting layer is provided with between described circuit board and the upper surface of described shell;
Be provided with multiple cooling duct on the housing; The center line of described cooling duct becomes angle with described upper surface of outer cover.
Described cooling duct is parallel to each other.
Angle between the center line of described cooling duct and described upper surface of outer cover is between 0-15 degree.
The thickness of described heat-conducting layer is less than the minimum range of described upper surface of outer cover to described cooling duct sidewall.
The both sides of described shell are respectively provided with a bulge-structure.
The inner side of described bulge-structure and the upper surface connection of described shell are provided with the first groove; The both sides of described circuit board are connected in described first groove.
The second groove is had in the arranged outside of each described bulge-structure; Described lampshade is connected in described second groove.
The beneficial effects of the utility model are:
The technical program by arranging cooling duct on shell, cooling fluid is provided with in cooling duct, by the angle between cooling duct and upper surface of outer cover, cooled cooling fluid is by the lower end of gravity automatic back flow to cooling duct, this cooling duct improves the cooling effect of radiator, improves the luminous intensity also can stablizing LED service life of LED.
Accompanying drawing explanation
Fig. 1 is the sectional view of the utility model LED.
Description of reference numerals
1 shell, 2 lampshades, 3 circuit boards, 4LED lamp pearl, 5 electronic devices, 6 wing fin, 7 cooling ducts, 8 bulge-structures, 9 first grooves, 10 second grooves, 11 heat-conducting layers.
Detailed description of the invention
Describe the technical solution of the utility model in detail by the following examples, following embodiment is only exemplary, only can be used for explaining and the technical solution of the utility model being described, and can not be interpreted as being the restriction to technical solutions of the utility model.
The utility model provides a kind of LED modified node method of high heat dispersion, as shown in Figure 1, includes shell 1, lampshade 2, circuit board 3, LED lamp bead 4 and electronic device 5.
In this application, lampshade is prior art, usually adopts acrylic plastic production, does not belong to the improvement project of the application, so there is no be described in detail the structure of lampshade.
In this application, circuit board, LED lamp bead and electronic device and annexation etc. are prior art, not within the protection domain of the application.
In this application, shell 1 is aluminum or aluminum alloy material, refers to the surface relative with lampshade at the upper surface of the shell of the application.The both sides of described shell 1 are respectively provided with a bulge-structure 8.
The inner side of described bulge-structure 8 and the upper surface connection of described shell are provided with the first groove 9; The both sides of described circuit board 3 are connected in described first groove 9.
The second groove 10 is had in the arranged outside of each described bulge-structure 8; Described lampshade 2 is connected in described second groove 10.
The upper surface of described shell 1 is connected with described lampshade 2; The lower surface that described shell 1 is relative with described lampshade is provided with wing fin 6; Described LED lamp bead 4 and described electronic device 5 are arranged on described circuit board 3; Described circuit board is arranged in the space that surrounds between described shell and described lampshade, between described circuit board 3 and the upper surface of described shell 1, be provided with heat-conducting layer 11; In this application, heat-conducting layer 11 is heat conductive silica gel, and along with the progress of technology and the needs of reality, heat-conducting layer also can be other material.
Described shell 1 is provided with multiple cooling duct 7; The center line of described cooling duct 7 becomes angle with described upper surface of outer cover;
The thickness of described heat-conducting layer 11 is less than the minimum range of described upper surface of outer cover to described cooling duct sidewall; Such structural design, can ensure that the heat produced by LED lamp bead and electronics unit device effectively can be supplied to the cooling fluid in cooling duct, in this application, heat-conducting layer thickness be preferably described upper surface of outer cover to described cooling duct sidewall minimum range 1/1 to three/2nd.
Described cooling duct is parallel to each other.Angle between the center line of described cooling duct and described upper surface of outer cover is between 0-15 degree.Cooling fluid is provided with in cooling duct, in this application, the volume of cooling fluid account for cooling duct volume 1/1 to three/4th between, like this, the heat produced by the LED lamp bead on circuit board and electronic device, by moving upward after the evaporation of cooling fluid, the bottom flowing by gravity back to cooling duct after contacting with radiator after release heat circulates, and realizes heat sinking function.
Although be described in detail the technical solution of the utility model, those skilled in the art is all clear, by the amendment carried out the technical program, replacement and modification etc., and all should within the protection domain of the application.
Claims (7)
1. a LED modified node method for high heat dispersion, includes shell, lampshade, circuit board, LED lamp bead and electronic device; It is characterized in that:
The upper surface of described shell is connected with described lampshade; The lower surface that described shell is relative with described lampshade is provided with wing fin; Described LED lamp bead and described electronic device are arranged on described circuit board; Described circuit board is arranged in the space that surrounds between described shell and described lampshade;
Heat-conducting layer is provided with between described circuit board and the upper surface of described shell;
Be provided with multiple cooling duct on the housing; The center line of described cooling duct becomes angle with described upper surface of outer cover.
2. the LED modified node method of high heat dispersion according to claim 1, is characterized in that: described cooling duct is parallel to each other.
3. the LED modified node method of high heat dispersion according to claim 1 and 2, is characterized in that: the angle between the center line of described cooling duct and described upper surface of outer cover is between 0-15 degree.
4. the LED modified node method of high heat dispersion according to claim 1, is characterized in that: it is characterized in that: the thickness of described heat-conducting layer is less than the minimum range of described upper surface of outer cover to described cooling duct sidewall.
5. the LED modified node method of high heat dispersion according to claim 1, is characterized in that: the both sides of described shell are respectively provided with a bulge-structure.
6. the LED modified node method of high heat dispersion according to claim 5, is characterized in that: the inner side of described bulge-structure and the upper surface connection of described shell are provided with the first groove; The both sides of described circuit board are connected in described first groove.
7. the LED modified node method of high heat dispersion according to claim 5, is characterized in that: have the second groove in the arranged outside of each described bulge-structure; Described lampshade is connected in described second groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520364003.3U CN204805999U (en) | 2015-05-29 | 2015-05-29 | LED lamp of high heat dissipating ability improves structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520364003.3U CN204805999U (en) | 2015-05-29 | 2015-05-29 | LED lamp of high heat dissipating ability improves structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204805999U true CN204805999U (en) | 2015-11-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520364003.3U Expired - Fee Related CN204805999U (en) | 2015-05-29 | 2015-05-29 | LED lamp of high heat dissipating ability improves structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204805999U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113803654B (en) * | 2021-09-18 | 2024-03-22 | 厦门东昂科技股份有限公司 | High heat dissipation lamp structure using LED lamp |
-
2015
- 2015-05-29 CN CN201520364003.3U patent/CN204805999U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113803654B (en) * | 2021-09-18 | 2024-03-22 | 厦门东昂科技股份有限公司 | High heat dissipation lamp structure using LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20200529 |