CN204790806U - Machine case heat dissipation mechanism - Google Patents
Machine case heat dissipation mechanism Download PDFInfo
- Publication number
- CN204790806U CN204790806U CN201520438619.0U CN201520438619U CN204790806U CN 204790806 U CN204790806 U CN 204790806U CN 201520438619 U CN201520438619 U CN 201520438619U CN 204790806 U CN204790806 U CN 204790806U
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- water
- cooling
- heat
- liquid cooling
- heat dissipation
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Abstract
The utility model discloses a machine case heat dissipation mechanism belongs to the computer accessories field, and it includes liquid cooling subassembly and air inlet fan, and liquid cooling subassembly and air inlet fan are all established at quick -witted incasement, the liquid cooling subassembly is including heat dissipation chamber, liquid cooling pipeline and liquid cooling water pump, liquid cooling pipeline equipartition the heat dissipation intracavity, the liquid cooling water pump communicates in the return circuit of liquid cooling pipeline to liquid cooling carries out, the air intake in the heat dissipation chamber is established to the air inlet fan, and the heat dissipation chamber still is equipped with the air outlet to the heat of liquid cooling pipeline is taken away to the air inlet. This kind of computer machine case heat dissipation mechanism goes out the inlet air alone, carries out liquid cooling, can not make quick -witted incasement accessory laying dust, and the radiating effect is good in addition.
Description
Technical field
The present invention relates to computer fittings field, particularly relate to a kind of case radiation mechanism.
Background technology
Cabinet is as the part in computer fittings; the Main Function that it rises places and fixing each computer fittings; play a support and protective effect; in addition; because the accessories such as CPU, video card, mainboard can generate heat when operating, cabinet also will have corresponding cooling mechanism, but traditional cooling mechanism goes out inlet air in radiation processes; easily bring dust into accessories such as CPU, video card, mainboards, affect main frame accessory performance.
Summary of the invention
For solving the above problems, the invention provides a kind of computer case radiation mechanism, going out inlet air separately, carrying out water-cooling, accessory laying dust in cabinet can not be made, and good heat dissipation effect.
The technical solution used in the present invention is: a kind of case radiation mechanism, comprises water-cooling assembly and air intake blower fan, and water-cooling assembly and air intake blower fan are all located in cabinet; Water-cooling assembly comprises heat dissipation cavity, water-cooling pipeline and water-cooling water pump; Water-cooling pipeline is distributed in heat dissipation cavity, and water-cooling water pump is communicated with in the loop of water-cooling pipeline, to carry out water-cooling; Air intake blower fan is located at the air inlet of heat dissipation cavity, and heat dissipation cavity is also provided with air outlet, takes away the heat of water-cooling pipeline with air intake.
In technique scheme, water-cooling assembly comprises two groups, to strengthen heat radiation.
In technique scheme, cabinet side board is provided with the heat radiation mesh corresponding with the air inlet of heat dissipation cavity and air outlet.
In technique scheme, water-cooling water pump bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.
In technique scheme, heat dissipation cavity medial surface is heat interchange heat sink, and heat interchange heat sink can take away the heat in cabinet, to strengthen heat radiation.
The invention has the beneficial effects as follows: this kind of case radiation mechanism, comprise water-cooling assembly, the accessories such as CPU, video card, mainboard are dispelled the heat, air intake and air-out are all carried out in heat dissipation cavity, can not to accessory laying dusts such as CPU, video card, mainboards in radiation processes, the accessory performance impacts such as CPU, video card, mainboard are minimized, and water-cooling is effective.
Accompanying drawing explanation
Fig. 1 is embodiments of the invention one and casing structure schematic diagram;
Fig. 2 is embodiments of the invention one overall perspective view;
Fig. 3 is embodiments of the invention two and casing structure schematic diagram;
Fig. 4 is embodiments of the invention two overall perspective view.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further detailed explanation.
Embodiment one:
Fig. 1 and Fig. 2 show schematically show a kind of case radiation mechanism according to one embodiment of the present invention.
A kind of case radiation mechanism, comprise water-cooling assembly 1 and air intake blower fan 2, water-cooling assembly 1 and air intake blower fan 2 are all located in cabinet 3.
Water-cooling assembly 1 comprises two groups, and water-cooling assembly 1 is located at air intake blower fan about 2 two ends, to strengthen heat radiation.Water-cooling assembly 1 comprises heat dissipation cavity 11, water-cooling pipeline 12 and water-cooling water pump 13.Water-cooling pipeline 12 is distributed in heat dissipation cavity 11, and water-cooling water pump 13 is communicated with in the loop of water-cooling pipeline 12, to carry out water-cooling.Heat dissipation cavity 11 medial surface is heat interchange heat sink 15, and heat interchange heat sink 15 can take away the heat in cabinet 3, to strengthen heat radiation.Water-cooling water pump 13 bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.Air intake blower fan 2 is located at the air inlet of heat dissipation cavity 11, and heat dissipation cavity 11 is also provided with air outlet 14, takes away the heat of water-cooling pipeline 12 with air intake.
Above-mentioned, cabinet side board 4 is provided with the heat radiation mesh 41 corresponding with the air inlet of heat dissipation cavity 11 and air outlet 14.
Embodiment two:
Fig. 3 and Fig. 4 show schematically show a kind of cabinet 3 cooling mechanism according to one embodiment of the present invention.
A kind of case radiation mechanism, comprise water-cooling assembly 1 and air intake blower fan 2, water-cooling assembly 1 and air intake blower fan 2 are all located in cabinet 3.
Water-cooling assembly 1 comprises one group, and water-cooling assembly 1 is located at air intake blower fan 2 upper end.Water-cooling assembly 1 comprises heat dissipation cavity 11, water-cooling pipeline 12 and water-cooling water pump 13.Water-cooling pipeline 12 is distributed in heat dissipation cavity 11, and water-cooling water pump 13 is communicated with in the loop of water-cooling pipeline 12, to carry out water-cooling.Heat dissipation cavity 11 medial surface is heat interchange heat sink 15, and heat interchange heat sink 15 can take away the heat in cabinet 3, to strengthen heat radiation.Water-cooling water pump 13 bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.Air intake blower fan 2 is located at the air inlet of heat dissipation cavity 11, and heat dissipation cavity 11 is also provided with air outlet 14, takes away the heat of water-cooling pipeline 12 with air intake.
Above-mentioned, cabinet side board 4 is provided with the heat radiation mesh 41 corresponding with the air inlet of heat dissipation cavity 11 and air outlet 14.
Above embodiment is merely illustrative and not limiting to the invention, therefore all equivalences done according to the method described in patent claim of the present invention change or modify, and are included in patent claim of the present invention.
Claims (5)
1. a case radiation mechanism, is characterized in that, comprises wind cooling radiating component and water-cooling assembly, and wind cooling radiating component and water-cooling assembly are fixed in cabinet; Wind cooling radiating component comprises fan and air-cooled fixed head, and fan is fixed on air-cooled fixed head, to carry out wind-cooling heat dissipating; Water-cooling assembly comprises water-cooling pump, water-cooling pipe and water-cooling plate; Water-cooling pipe is distributed on water-cooling plate, and water-cooling pipe two-port all connects water-cooling pump, to carry out water-cooling.
2. a kind of case radiation mechanism according to claim 1, is characterized in that: water-cooling assembly comprises two groups, to strengthen heat radiation.
3. a kind of case radiation mechanism according to claim 1, is characterized in that: water-cooling water pump bottom surface is heat sink, carries out heat interchange can be arranged on the accessories such as CPU, video card, mainboard.
4. a kind of case radiation mechanism according to claim 1, is characterized in that: cabinet side board is provided with the heat radiation mesh corresponding with the air inlet of heat dissipation cavity and air outlet.
5. a kind of case radiation mechanism according to claim 1, is characterized in that: heat dissipation cavity medial surface is heat interchange heat sink, and heat interchange heat sink can take away the heat in cabinet, to strengthen heat radiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520438619.0U CN204790806U (en) | 2015-06-24 | 2015-06-24 | Machine case heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520438619.0U CN204790806U (en) | 2015-06-24 | 2015-06-24 | Machine case heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204790806U true CN204790806U (en) | 2015-11-18 |
Family
ID=54530813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520438619.0U Expired - Fee Related CN204790806U (en) | 2015-06-24 | 2015-06-24 | Machine case heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204790806U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104914961A (en) * | 2015-06-24 | 2015-09-16 | 东莞运宏模具有限公司 | Computer case radiating mechanism |
-
2015
- 2015-06-24 CN CN201520438619.0U patent/CN204790806U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104914961A (en) * | 2015-06-24 | 2015-09-16 | 东莞运宏模具有限公司 | Computer case radiating mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 |