CN204790091U - Emission of light subassembly - Google Patents

Emission of light subassembly Download PDF

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Publication number
CN204790091U
CN204790091U CN201520510391.1U CN201520510391U CN204790091U CN 204790091 U CN204790091 U CN 204790091U CN 201520510391 U CN201520510391 U CN 201520510391U CN 204790091 U CN204790091 U CN 204790091U
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CN
China
Prior art keywords
light
laser instrument
pipe cap
light emission
slide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520510391.1U
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Chinese (zh)
Inventor
杨欣
马强
黄平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yuandu Communication Co Ltd
Original Assignee
Shenzhen Yuandu Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201520510391.1U priority Critical patent/CN204790091U/en
Application granted granted Critical
Publication of CN204790091U publication Critical patent/CN204790091U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to an emission of light subassembly, including flexible circuit board, base, chip, laser instrument, pipe cap, branch slide and the adapter surveyed in a poor light. The branch photo polymerization of light through dividing the slide that sends from the laser instrument, partly light see through and divide the slide to jet out through the through -hole at the pipe cap top orientation along the adapter again, and partly light is through dividing the slide reflection, owing to divide the slide and the angle that the plane became at laser instrument place be 43-47, and the size of laser instrument is lighter than to be shaded from the sun and surveys the size of chip, consequently follow the light that the branch slide reflects back and can not enter into the laser instrument, so can effectively solve interfering signal's problem. Be shaded from the sun from the light directive that divides the slide reflect back and survey the chip, be shaded from the sun and survey the chip according to the strong and weak electric current that forms of light, then according to the size of the electric current of production, the power of the light that the judgement laser instrument appeared through minute slide.

Description

Light emission component
Technical field
The utility model relates to optical communication technology field, particularly relates to a kind of light emission component.
Background technology
Often use various optical device in modern optical communication system, wherein light emission component is a kind of conventional optical device.In traditional light emission component, the light of light splitting piece reflection can enter into laser instrument, causes again being reflected back in fibre-optic transmission system (FOTS) forming undesired signal, causes poor signal quality.
Utility model content
Based on this, be necessary for above-mentioned technical matters, provide a kind of light of can effectively avoiding to enter into the light emission component of laser instrument.
A kind of light emission component, comprising:
Flexible PCB, has an installed surface;
Pedestal, be arranged on described flexible PCB, described pedestal comprises main body and pin, and described main body is arranged on described installed surface, and described pin runs through described flexible PCB;
Backlight detection chip, is arranged in described main body, is electrically connected with described flexible PCB;
Laser instrument, for emission of light, be arranged in described backlight detection chip, the size of described laser instrument is less than the size of described backlight detection chip;
Pipe cap, cover in described main body, the top of described pipe cap offers through hole;
Light splitting piece, is arranged between the top of described pipe cap and described laser instrument, and the plane angulation at described light splitting piece and described laser instrument place is 43 ° ~ 47 °; And
Adapter, is arranged on described pipe cap.
Wherein in an embodiment, described main body is round pie, described main body is radially outwardly formed with the first bulge loop near the end face of described installed surface, described pipe cap is radially outwardly formed with the second bulge loop near the end face of described installed surface, and the bottom surface of described second bulge loop and the end face of described first bulge loop fit.
Wherein in an embodiment, between described first bulge loop and the periphery of described main body, be provided with the first rounding, between described second bulge loop and the periphery of described pipe cap, be provided with the second rounding.
Wherein in an embodiment, also be provided with packing ring, described packing ring is arranged at the inside top of described pipe cap, the one side at described packing ring described pipe cap top is dorsad inclined-plane, the plane angulation at described inclined-plane and described laser instrument place is 43 ° ~ 47 °, and described light splitting piece is arranged on described inclined-plane.
Wherein in an embodiment, described inclined-plane offers groove, the bottom surface of described groove parallels with described inclined-plane, and described light splitting piece is arranged on the bottom surface of described groove.
Wherein in an embodiment, described packing ring is fixed on the inside top of described pipe cap by viscose glue.
Wherein in an embodiment, described adapter offers accepting groove near one end of described pipe cap, and described pipe cap stretches in described accepting groove.
Wherein in an embodiment, described adapter also offers support slot.
Wherein in an embodiment, described laser instrument is vertical cavity surface emitting laser.
Wherein in an embodiment, described pedestal is metal base.
Above-mentioned light emission component at least has the following advantages:
The light sent from laser instrument is through point light action of light splitting piece, the through hole of part light therethrough light splitting piece again through pipe cap top penetrates along the direction of adapter, part light reflects through light splitting piece, because the plane angulation at light splitting piece and laser instrument place is 43 ° ~ 47 °, and the size of laser instrument is less than the size of backlight detection chip, therefore the light be reflected back from light splitting piece can not enter into laser instrument, therefore, it is possible to effectively solve the problem of undesired signal.From the light directive backlight detection chip that light splitting piece is reflected back, backlight detection chip forms electric current according to the power of light, then according to the size of the electric current produced, judges the power of the light that laser instrument is appeared by light splitting piece.
Accompanying drawing explanation
Fig. 1 is the cut-open view of light emission component in an embodiment;
Fig. 2 is the partial schematic diagram in Fig. 1.
Embodiment
For enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in detail embodiment of the present utility model below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the utility model.But the utility model can be much different from alternate manner described here to implement, those skilled in the art can when doing similar improvement without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public concrete enforcement.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in instructions of the present utility model herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this instructions is recorded.
Referring to Fig. 1 and Fig. 2, is the light emission component 10 in an embodiment, comprises flexible PCB 100, pedestal 200, backlight detection chip 300, laser instrument 400, pipe cap 500, light splitting piece 600 and adapter 700.
Flexible PCB 100 has an installed surface 110.Pedestal 200 is arranged on flexible PCB 100, and pedestal 200 can be metal base.Pedestal 200 comprises main body 210 and pin 220, and main body 210 is arranged on installed surface 110, and pin 220 runs through flexible PCB 100 and stretches out in flexible PCB 100, and pin 220 for receiving electric signal, and provides electric energy to laser instrument 400.
Main body 210 is round pie, and main body 210 is radially outwardly formed between the first bulge loop 211, first bulge loop and the periphery of main body 210 near the end face of installed surface 110 and is provided with the first rounding (scheming not mark).
Backlight detection chip 300 is arranged in main body 210, and is electrically connected with flexible PCB 100.Backlight detection chip 300 can receive the light reflected through light splitting piece 600, according to the strong and weak generation current of light, then can judge the power of the light that laser instrument 400 sends according to the size of generation current.Backlight detection chip 300 can be rectangle or circle, and backlight detection chip 300 is silicon (Si) material.
Laser instrument 400 is for emission of light.Specific in present embodiment, laser instrument 400 is vertical cavity surface emitting laser (VCSEL).Laser instrument 400 is arranged in backlight detection chip 300, and the size of laser instrument 400 is less than the size of backlight detection chip 300.Laser instrument 400 can be rectangle, also can be circular.
Pipe cap 500 covers in main body 210, and the top of pipe cap 500 offers through hole 510.Particularly, pipe cap 500 can be arranged in main body 210 by viscose glue.The shape of through hole 510 can be rectangular opening or circular port.Laser instrument 400, backlight detection chip 300 are contained in pipe cap 500.
The end face of pipe cap 500 near bottom surface and the first bulge loop 211 that the end face of installed surface 110 is radially outwardly formed with the second bulge loop 520, second bulge loop 520 fits.First bulge loop 211 and the second bulge loop 520 are set and add contact area between pipe cap 500 and main body 210, be conducive to pipe cap 500 and be more firmly arranged in main body 210.The second rounding (scheming not mark) is provided with between second bulge loop 520 and the periphery of pipe cap 500.
Light splitting piece 600 is arranged between the top 500a of pipe cap 500 and laser instrument 400, and light splitting piece 600 is 43 ° ~ 47 ° with the plane angulation α at laser instrument 400 place.Such as can be 45 °.Light splitting piece 600 is for being applicable to the light splitting piece 600 of 850nm wavelength.
Specific in present embodiment, light splitting piece 600 can be arranged between the top 500a of pipe cap 500 and laser instrument 400 by packing ring 800.Packing ring 800 is arranged at inside the top 500a of pipe cap 500, the one side of packing ring 800 pipe cap 500 top 500a is dorsad inclined-plane 810, inclined-plane 810 is 43 ° ~ 47 ° with the plane angulation at laser instrument 400 place, light splitting piece 600 is arranged on inclined-plane 810, and therefore light splitting piece 600 is 43 ° ~ 47 ° with the plane angulation at laser instrument 400 place.
Groove 811 can also be offered in the inclined-plane 810 of packing ring 800, and the bottom surface of groove 811 parallels with inclined-plane 810.Light splitting piece 600 is arranged on 811 bottom surfaces of groove, and therefore, light splitting piece 600 is still 43 ° ~ 47 ° with the plane angulation at laser instrument 400 place.Inclined-plane 810 is offered groove 811, the more compact structure of light splitting piece 600 and pipe cap 500 can be made.Packing ring 800 is fixed on inside the top 500a of pipe cap 500 by viscose glue 900, can improve the fastness of packing ring 800.Viscose glue 900 can be high-temp glue.
Adapter 700 is arranged on pipe cap 500.Such as, adapter 700 can be arranged on pipe cap 500 by the mode of laser bonding or viscose glue.Specific in present embodiment, adapter 700 offers accepting groove 710 near one end of pipe cap 500, and pipe cap 500 stretches in accepting groove 710.Adapter 700 also offers support slot 720, is conducive to the fastness that raising adapter 700 is connected with other element.
Above-mentioned light emission component 10 at least has the following advantages:
The light sent from laser instrument 400 is through point light action of light splitting piece 600, the through hole of part light therethrough light splitting piece 600 again through pipe cap 500 top penetrates along the direction of adapter 700, part light reflects through light splitting piece 600, because light splitting piece 600 and the plane angulation at laser instrument 400 place are 43 ° ~ 47 °, and the size of laser instrument 400 is less than the size of backlight detection chip 300, therefore the light be reflected back from light splitting piece 600 can not enter into laser instrument 400, therefore, it is possible to effectively solve the problem of undesired signal.From the light directive backlight detection chip 300 that light splitting piece 600 is reflected back, backlight detection chip 300 forms electric current according to the power of light, then according to the size of the electric current produced, judges the power of the light that laser instrument 400 is appeared by light splitting piece 600.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.

Claims (10)

1. a light emission component, is characterized in that, comprising:
Flexible PCB, has an installed surface;
Pedestal, be arranged on described flexible PCB, described pedestal comprises main body and pin, and described main body is arranged on described installed surface, and described pin runs through described flexible PCB;
Backlight detection chip, is arranged in described main body, is electrically connected with described flexible PCB;
Laser instrument, for emission of light, be arranged in described backlight detection chip, the size of described laser instrument is less than the size of described backlight detection chip;
Pipe cap, cover in described main body, the top of described pipe cap offers through hole;
Light splitting piece, is arranged between the top of described pipe cap and described laser instrument, and the plane angulation at described light splitting piece and described laser instrument place is 43 ° ~ 47 °; And
Adapter, is arranged on described pipe cap.
2. light emission component according to claim 1, it is characterized in that, described main body is round pie, described main body is radially outwardly formed with the first bulge loop near the end face of described installed surface, described pipe cap is radially outwardly formed with the second bulge loop near the end face of described installed surface, and the bottom surface of described second bulge loop and the end face of described first bulge loop fit.
3. light emission component according to claim 2, is characterized in that, is provided with the first rounding between described first bulge loop and the periphery of described main body, is provided with the second rounding between described second bulge loop and the periphery of described pipe cap.
4. light emission component according to claim 1, it is characterized in that, also be provided with packing ring, described packing ring is arranged at the inside top of described pipe cap, the one side at described packing ring described pipe cap top is dorsad inclined-plane, the plane angulation at described inclined-plane and described laser instrument place is 43 ° ~ 47 °, and described light splitting piece is arranged on described inclined-plane.
5. light emission component according to claim 4, is characterized in that, described inclined-plane offers groove, and the bottom surface of described groove parallels with described inclined-plane, and described light splitting piece is arranged on the bottom surface of described groove.
6. light emission component according to claim 4, is characterized in that, described packing ring is fixed on the inside top of described pipe cap by viscose glue.
7. light emission component according to claim 1, is characterized in that, described adapter offers accepting groove near one end of described pipe cap, and described pipe cap stretches in described accepting groove.
8. light emission component according to claim 1, is characterized in that, described adapter also offers support slot.
9. light emission component according to claim 1, is characterized in that, described laser instrument is vertical cavity surface emitting laser.
10. light emission component according to claim 1, is characterized in that, described pedestal is metal base.
CN201520510391.1U 2015-07-14 2015-07-14 Emission of light subassembly Expired - Fee Related CN204790091U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520510391.1U CN204790091U (en) 2015-07-14 2015-07-14 Emission of light subassembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520510391.1U CN204790091U (en) 2015-07-14 2015-07-14 Emission of light subassembly

Publications (1)

Publication Number Publication Date
CN204790091U true CN204790091U (en) 2015-11-18

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Family Applications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107861197A (en) * 2017-10-31 2018-03-30 深圳市易飞扬通信技术有限公司 Light emission component, packaging technology and optical module
CN109700432A (en) * 2018-12-21 2019-05-03 上海英诺伟医疗器械有限公司 Detection encapsulating structure and internal detection device based on flexible pipe
CN109814223A (en) * 2019-02-26 2019-05-28 武汉电信器件有限公司 A kind of WDM device and method for optical module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107861197A (en) * 2017-10-31 2018-03-30 深圳市易飞扬通信技术有限公司 Light emission component, packaging technology and optical module
CN107861197B (en) * 2017-10-31 2020-09-18 深圳市易飞扬通信技术有限公司 Light emitting assembly, packaging process and optical module
CN109700432A (en) * 2018-12-21 2019-05-03 上海英诺伟医疗器械有限公司 Detection encapsulating structure and internal detection device based on flexible pipe
CN109700432B (en) * 2018-12-21 2024-06-07 上海英诺伟医疗器械股份有限公司 Detection packaging structure and in-vivo detection device based on flexible pipe
CN109814223A (en) * 2019-02-26 2019-05-28 武汉电信器件有限公司 A kind of WDM device and method for optical module

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151118

Termination date: 20170714