CN204772030U - Novel grind mould bonding structure - Google Patents
Novel grind mould bonding structure Download PDFInfo
- Publication number
- CN204772030U CN204772030U CN201520356843.5U CN201520356843U CN204772030U CN 204772030 U CN204772030 U CN 204772030U CN 201520356843 U CN201520356843 U CN 201520356843U CN 204772030 U CN204772030 U CN 204772030U
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- China
- Prior art keywords
- polished part
- ball mould
- sphere
- centre
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a novel grind mould bonding structure, it includes the polished part, the polished part be the hemisphere thin slice, the internal surface of polished part be connected with the ball mould, polished part and ball mould between fill and have the binder, the surface of internal surface and ball mould of polished part between the distance between 0.001 to 5 millimeter, the utility model has the advantages of convenient to use, simple structure, with low costs, the function is practical, dependable performance, longe -lived.
Description
Technical field
The utility model belongs to milling tool technical field, is specifically related to a kind of new grinding die bonds structure.
Background technology
In recent years, in the attrition process field of attrition process especially eyeglass, the consume of emery wheel is large, cause production cost high, in order to reduce costs, improving the performance of grinding mould, need a kind of adhesive structure to improve grinding mould, therefore need a kind of new grinding die bonds structure.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and provides a kind of easy to use, structure is simple, cost is low, practical function, dependable performance, life-span are long new grinding die bonds structure.
The purpose of this utility model is achieved in that a kind of new grinding die bonds structure, it comprises polished part, described polished part is hemispherical thin slice, the inner surface of described polished part is connected with ball mould, be filled with binding agent between described polished part and ball mould, the distance between the inner surface of described polished part and the outer surface of ball mould is between 0.001 to 5 millimeter.
Described binding agent is cold anaerobic adhesive.
Described binding agent is bi-component epoxide-resin glue.
The centre of sphere of the inner surface of described polished part is consistent with the centre of sphere of the outer surface of ball mould.
The centre of sphere of the inner surface of the centre of sphere of the outer surface of described polished part is consistent.
The beneficial effects of the utility model: the utility model constitutes a kind of new grinding die bonds structure by polished part, binding agent, ball mould, have conveniently, structure are simple, cost is low, advantage that practical function, dependable performance, life-span are long; The utility model is bonded together polished part and ball mould by adopting the bonding mode of binding agent, has that structure is simple, easy to use, cost is low, the advantage of dependable performance; The advantage that total, the utility model has conveniently, structure is simple, cost is low, practical function, dependable performance, life-span are long.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of new grinding die bonds of the utility model structure.
In figure: 1, polished part 2, binding agent 3, ball mould.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described further.
Embodiment 1
As shown in Figure 1, a kind of new grinding die bonds structure, it comprises polished part 1, described polished part 1 is hemispherical thin slice, the inner surface of described polished part 1 is connected with ball mould 3, be filled with binding agent 2 between described polished part 1 and ball mould 3, the distance between the inner surface of described polished part 1 and the outer surface of ball mould 3 is between 0.001 to 5 millimeter.
The utility model constitutes a kind of new grinding die bonds structure by polished part, binding agent, ball mould, has conveniently, structure is simple, cost is low, advantage that practical function, dependable performance, life-span are long.
When the utility model is implemented, first ball mould is fixed and is installed, then by coating uniform binding agent on ball mould, then the positioning requirements of polished part according to ball mould, aim at the centre of sphere polished part and ball mould are fit together, make it bond firm, then the utility model can be come into operation, after in use ball mould being fixed, polishing operation can be carried out; The utility model is bonded together polished part and ball mould by adopting the bonding mode of binding agent, has that structure is simple, easy to use, cost is low, the advantage of dependable performance; The advantage that total, the utility model has conveniently, structure is simple, cost is low, practical function, dependable performance, life-span are long.
Embodiment 2
As shown in Figure 1, a kind of new grinding die bonds structure, it comprises polished part 1, described polished part 1 is hemispherical thin slice, the inner surface of described polished part 1 is connected with ball mould 3, be filled with binding agent 2 between described polished part 1 and ball mould 3, the distance between the inner surface of described polished part 1 and the outer surface of ball mould 3 is between 0.001 to 5 millimeter.
Described binding agent 2 is cold anaerobic adhesive.
The centre of sphere of the inner surface of described polished part 1 is consistent with the centre of sphere of the outer surface of ball mould 3.
The centre of sphere of the inner surface of the centre of sphere of the outer surface of described polished part 1 is consistent.
The utility model constitutes a kind of new grinding die bonds structure by polished part, binding agent, ball mould, has conveniently, structure is simple, cost is low, advantage that practical function, dependable performance, life-span are long.
When the utility model is implemented, first ball mould is fixed and is installed, then by coating uniform binding agent on ball mould, then the positioning requirements of polished part according to ball mould, aim at the centre of sphere polished part and ball mould are fit together, make it bond firm, then the utility model can be come into operation, after in use ball mould being fixed, polishing operation can be carried out; Binding agent of the present utility model is cold anaerobic adhesive, has that cost is low, the advantage of dependable performance; The centre of sphere of the inner surface of polished part of the present utility model is consistent with the centre of sphere of the outer surface of ball mould, has the advantage that coating performance is good, cost is low, durable; The centre of sphere of the inner surface of the centre of sphere of the outer surface of polished part of the present utility model is consistent, by the centering centre of sphere, improves its service life, reduces operating cost; The advantage that total, the utility model has conveniently, structure is simple, cost is low, practical function, dependable performance, life-span are long.
Claims (5)
1. a new grinding die bonds structure, it comprises polished part, it is characterized in that: described polished part is hemispherical thin slice, the inner surface of described polished part is connected with ball mould, be filled with binding agent between described polished part and ball mould, the distance between the inner surface of described polished part and the outer surface of ball mould is between 0.001 to 5 millimeter.
2. a kind of new grinding die bonds structure according to claim 1, is characterized in that: described binding agent is cold anaerobic adhesive.
3. a kind of new grinding die bonds structure according to claim 1, is characterized in that: described binding agent is bi-component epoxide-resin glue.
4. a kind of new grinding die bonds structure according to claim 1, is characterized in that: the centre of sphere of the inner surface of described polished part is consistent with the centre of sphere of the outer surface of ball mould.
5. a kind of new grinding die bonds structure according to claim 1, is characterized in that: the centre of sphere of the inner surface of the centre of sphere of the outer surface of described polished part is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520356843.5U CN204772030U (en) | 2015-05-29 | 2015-05-29 | Novel grind mould bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520356843.5U CN204772030U (en) | 2015-05-29 | 2015-05-29 | Novel grind mould bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204772030U true CN204772030U (en) | 2015-11-18 |
Family
ID=54512155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520356843.5U Expired - Fee Related CN204772030U (en) | 2015-05-29 | 2015-05-29 | Novel grind mould bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204772030U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111300160A (en) * | 2020-02-24 | 2020-06-19 | 大连理工大学 | Ultraprecise processing method and device for quartz harmonic oscillator |
-
2015
- 2015-05-29 CN CN201520356843.5U patent/CN204772030U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111300160A (en) * | 2020-02-24 | 2020-06-19 | 大连理工大学 | Ultraprecise processing method and device for quartz harmonic oscillator |
| CN111300160B (en) * | 2020-02-24 | 2021-07-06 | 大连理工大学 | Ultraprecise processing method and device for quartz harmonic oscillator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20210529 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |