CN203077482U - Energy-saving and efficient silicon wafer cutting steel wire - Google Patents
Energy-saving and efficient silicon wafer cutting steel wire Download PDFInfo
- Publication number
- CN203077482U CN203077482U CN 201220744491 CN201220744491U CN203077482U CN 203077482 U CN203077482 U CN 203077482U CN 201220744491 CN201220744491 CN 201220744491 CN 201220744491 U CN201220744491 U CN 201220744491U CN 203077482 U CN203077482 U CN 203077482U
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- China
- Prior art keywords
- steel wire
- saving
- cutting steel
- energy
- silicon wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model relates to a cutting steel wire, in particular to an energy-saving and efficient silicon wafer cutting steel wire which is used for tools for cutting silicon materials. The energy-saving and efficient silicon wafer cutting steel wire comprises a steel wire body, and the steel wire body is coated with a silicon carbide abradant layer. The energy-saving and efficient silicon wafer cutting steel wire is simple in structure, convenient to operate and high in working efficiency. Product quality is enhanced.
Description
Technical field
The utility model relates to a kind of cutting steel wire, relates in particular to a kind of efficient energy-saving silicon chip cutting steel wire, is used for the cutting tool of silicon materials.
Background technology
Silicon chip cutting in the market mainly contains modes such as the cutting of corundum line, the cutting of steel wire band sand liquid.The complex manufacturing technology and the cost of carborundum line are too high, have restricted its development in the silicon chip cutting.And that traditional line adds the cutting efficiency of sand liquid is not high, only has the carbonization silica sand about 10% to participate in cutting.
The utility model content
The utility model mainly is to solve the deficiencies in the prior art, and a kind of compact conformation is provided, cutting intensity height, the efficient energy-saving silicon chip of enhancing productivity cutting steel wire.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals:
A kind of efficient energy-saving silicon chip cutting steel wire comprises the steel wire body, the external silicon carbide abrasive layer that is covered with of described steel wire.
As preferably, be provided with the brass plating layer between described silicon carbide abrasive layer and steel wire body.
As preferably, the thickness of described silicon carbide abrasive layer is 9 μ m, and the diameter of described steel wire body is 0.12mm.
Therefore, efficient energy-saving silicon chip cutting steel wire of the present utility model, simple in structure, easy to operate, high efficiency promotes product quality.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment 1: as shown in Figure 1, a kind of efficient energy-saving silicon chip cutting steel wire comprises steel wire body 1, the described steel wire body 1 outer silicon carbide abrasive layer 2 that is covered with.1 of described silicon carbide abrasive layer 2 and steel wire body are provided with brass plating layer 3.The thickness of described silicon carbide abrasive layer 2 is 9 μ m, and the diameter of described steel wire body 1 is 0.12mm.
Claims (3)
1. an efficient energy-saving silicon chip cutting steel wire is characterized in that: comprise steel wire body (1), the outer silicon carbide abrasive layer (2) that is covered with of described steel wire body (1).
2. efficient energy-saving silicon chip cutting steel wire according to claim 1 is characterized in that: be provided with brass plating layer (3) between described silicon carbide abrasive layer (2) and steel wire body (1).
3. efficient energy-saving silicon chip cutting steel wire according to claim 1 and 2, it is characterized in that: the thickness of described silicon carbide abrasive layer (2) is 9 μ m, and the diameter of described steel wire body (1) is 0.12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220744491 CN203077482U (en) | 2012-12-31 | 2012-12-31 | Energy-saving and efficient silicon wafer cutting steel wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220744491 CN203077482U (en) | 2012-12-31 | 2012-12-31 | Energy-saving and efficient silicon wafer cutting steel wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203077482U true CN203077482U (en) | 2013-07-24 |
Family
ID=48823351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220744491 Expired - Fee Related CN203077482U (en) | 2012-12-31 | 2012-12-31 | Energy-saving and efficient silicon wafer cutting steel wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203077482U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105364734A (en) * | 2015-12-01 | 2016-03-02 | 苏州市汇峰机械设备有限公司 | Highly abrasion-resistant composite metal cutting wire |
-
2012
- 2012-12-31 CN CN 201220744491 patent/CN203077482U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105364734A (en) * | 2015-12-01 | 2016-03-02 | 苏州市汇峰机械设备有限公司 | Highly abrasion-resistant composite metal cutting wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130724 Termination date: 20141231 |
|
| EXPY | Termination of patent right or utility model |