CN204757233U - Controllable cultivation room of temperature - Google Patents

Controllable cultivation room of temperature Download PDF

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Publication number
CN204757233U
CN204757233U CN201520473389.1U CN201520473389U CN204757233U CN 204757233 U CN204757233 U CN 204757233U CN 201520473389 U CN201520473389 U CN 201520473389U CN 204757233 U CN204757233 U CN 204757233U
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CN
China
Prior art keywords
culturing room
valve
outlet valve
fan
guide duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520473389.1U
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Chinese (zh)
Inventor
陈群
Original Assignee
陈群
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 陈群 filed Critical 陈群
Priority to CN201520473389.1U priority Critical patent/CN204757233U/en
Application granted granted Critical
Publication of CN204757233U publication Critical patent/CN204757233U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a controllable cultivation room of temperature, including cultivateing the room, be provided with a changes in temperature gas feeding mechanism on the lateral wall of cultivation room, changes in temperature gas feeding mechanism includes a semiconductor refrigeration components and control circuit, semiconductor refrigeration components's refrigeration face sets up in first guide duct, the one end of first guide duct is provided with first fan, and the other end is provided with first admission valve and first air outlet valve, semiconductor refrigeration components's the face of heating sets up in the second guide duct, the one end of second guide duct is provided with the second fan, and the other end is provided with second admission valve and second air outlet valve, first air outlet valve and second air outlet valve give vent to anger the end all set up in cultivate in the air outlet of room, cultivate the indoor temperature sensor that still is provided with. The utility model discloses simple structure can provide cold, steam for cultivateing the room according to cultivateing indoor temperature conditions, has better use value.

Description

A kind of temperature-controllable culturing room
Technical field
The utility model relates to temperature control technology field, particularly a kind of temperature-controllable culturing room.
Background technology
The requirement of culturing room to temperature is harsher, and needs the air in holding chamber to flow, and traditional culturing room is all the adjustment transferring to realize temperature by Interior Space, because air-conditioning adopts compressor principle, therefore its not only cost is high, and waste of energy is serious.
Utility model content
For overcoming the problems referred to above, the purpose of this utility model is to provide a kind of temperature-controllable culturing room, can realize semiconductor refrigerating assembly for culturing room and provide cold and hot source of the gas.
The utility model adopts following scheme to realize: a kind of temperature-controllable culturing room, comprises culturing room; It is characterized in that: the sidewall of described culturing room is fixedly installed a support, described support is provided with an air-conditioning feeding mechanism, described air-conditioning feeding mechanism comprises semiconductor cooling assembly and control circuit, and the chill surface of described semiconductor refrigerating assembly is arranged in the first guide duct; One end of described first guide duct is provided with the first fan, and the other end is provided with the first intake valve and the first air outlet valve; The face that heats of described semiconductor refrigerating assembly is arranged in the second guide duct; One end of described second guide duct is provided with the second fan, and the other end is provided with the second intake valve and the second air outlet valve; The inlet end of described first intake valve and the second intake valve enters air inlet pipeline separately and is connected in described culturing room; The outlet side of described first air outlet valve and the second air outlet valve is all arranged in the air outlet of described culturing room; The first described fan, the second fan, the first air inlet valve, the first outlet valve, the second air inlet valve and the second outlet valve control by described control circuit; Described control circuit is also provided with temperature sensor, and this temperature sensor is arranged in described culturing room.
In the utility model one embodiment, described control circuit comprises a MCU, and described MCU is connected with bluetooth communication circuit, semiconductor refrigeration chip drive circuit, the first fan drive circuit, the second fan drive circuit, the first air inlet valve, the first outlet valve, the second air inlet valve and the second outlet valve; The output of described semiconductor refrigeration chip drive circuit is connected with described semiconductor refrigerating assembly.
In the utility model one embodiment, described control circuit is arranged in a control box, and described control box is arranged in described first guide duct.
In the utility model one embodiment, described support comprises a support panel, and described support panel is arranged with a support bar, and described support bar one end is fixed on the downside of panel, and the other end is fixed on the outer wall of described culturing room.
The utility model structure is simple, utilizes the characteristic of semiconductor refrigerating assembly, cold air and hot gas is carried out pipeline and is separated, be supplied to culturing room, have good practical value.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model control circuit theory diagram.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is described further.
As shown in Figure 1, the present embodiment provides a kind of temperature-controllable culturing room, comprises culturing room 1; It is characterized in that: the sidewall of described culturing room is fixedly installed a support 2, described support is provided with an air-conditioning feeding mechanism, described air-conditioning feeding mechanism comprises semiconductor cooling assembly 3 and control circuit, and the chill surface 4 of described semiconductor refrigerating assembly is arranged in the first guide duct 5; One end of described first guide duct is provided with the first fan 6, and the other end is provided with the first intake valve 7 and the first air outlet valve 8; The face that heats 9 of described semiconductor refrigerating assembly is arranged in the second guide duct 10; One end of described second guide duct is provided with the second fan 11, and the other end is provided with the second intake valve 12 and the second air outlet valve 13; The inlet end of described first intake valve and the second intake valve enters air inlet pipeline 14 separately and is connected in described culturing room; The outlet side of described first air outlet valve and the second air outlet valve is all arranged in the air outlet 15 of described culturing room; The first described fan, the second fan, the first air inlet valve, the first outlet valve, the second air inlet valve and the second outlet valve control by described control circuit; Described control circuit is also provided with temperature sensor, and this temperature sensor is arranged in described culturing room.
Please continue see Fig. 2, in the utility model one embodiment, described control circuit comprises a MCU, and described MCU is connected with bluetooth communication circuit, semiconductor refrigeration chip drive circuit, the first fan drive circuit, the second fan drive circuit, the first air inlet valve, the first outlet valve, the second air inlet valve and the second outlet valve; The output of described semiconductor refrigeration chip drive circuit is connected with described semiconductor refrigerating assembly.Described control circuit is arranged in a control box 16, and described control box is arranged in described first guide duct.Be cold air due to what circulate in the first guide duct, therefore can also provide radiating effect for control box.
In the utility model one embodiment, described support comprises a support panel 17, and described support panel is arranged with a support bar 18, and described support bar one end is fixed on the downside of panel, and the other end is fixed on the outer wall of described culturing room.
The utility model in use, when providing cold air, rotating forward as long as user's Bluetooth of mobile phone opens the first fan, carrying out air blast; Open the second fan to reverse, carry out exhausting; Close the first air intake valve, open the first air-out valve, close the second air-out valve, open the second air intake valve, because semiconductor refrigerating assembly has heating face and chill surface, like this, the cold air in the first wind-guiding pipeline at chill surface place will be blowed to out culturing room; The hot gas heated in the second wind-guiding pipeline at place, face is extracted out; In like manner, when providing hot gas, rotating forward as long as user opens the second fan by Bluetooth of mobile phone, carrying out air blast; Open the first fan to reverse, carry out exhausting; Close the second air intake valve, open the second air-out valve, close the first air-out valve, open the first air intake valve, because semiconductor refrigerating assembly has heating face and chill surface, like this, the hot gas heated in the second wind-guiding pipeline at place, face will be blowed to out culturing room; Cold air in the first wind-guiding pipeline at chill surface place is extracted out.
The foregoing is only preferred embodiment of the present utility model, all equalizations done according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.

Claims (4)

1. a temperature-controllable culturing room, comprises culturing room; It is characterized in that: the sidewall of described culturing room is fixedly installed a support, described support is provided with an air-conditioning feeding mechanism, described air-conditioning feeding mechanism comprises semiconductor cooling assembly and control circuit, and the chill surface of described semiconductor refrigerating assembly is arranged in the first guide duct; One end of described first guide duct is provided with the first fan, and the other end is provided with the first intake valve and the first air outlet valve; The face that heats of described semiconductor refrigerating assembly is arranged in the second guide duct; One end of described second guide duct is provided with the second fan, and the other end is provided with the second intake valve and the second air outlet valve; The inlet end of described first intake valve and the second intake valve enters air inlet pipeline separately and is connected in described culturing room; The outlet side of described first air outlet valve and the second air outlet valve is all arranged in the air outlet of described culturing room; The first described fan, the second fan, the first air inlet valve, the first outlet valve, the second air inlet valve and the second outlet valve control by described control circuit; Described control circuit is also provided with temperature sensor, and this temperature sensor is arranged in described culturing room.
2. a kind of temperature-controllable culturing room according to claim 1, it is characterized in that: described control circuit comprises a MCU, described MCU is connected with bluetooth communication circuit, semiconductor refrigeration chip drive circuit, the first fan drive circuit, the second fan drive circuit, the first air inlet valve, the first outlet valve, the second air inlet valve and the second outlet valve; The output of described semiconductor refrigeration chip drive circuit is connected with described semiconductor refrigerating assembly.
3. a kind of temperature-controllable culturing room according to claim 1, it is characterized in that: described control circuit is arranged in a control box, described control box is arranged in described first guide duct.
4. a kind of temperature-controllable culturing room according to claim 1, it is characterized in that: described support comprises a support panel, described support panel is arranged with a support bar, and described support bar one end is fixed on the downside of panel, and the other end is fixed on the outer wall of described culturing room.
CN201520473389.1U 2015-07-04 2015-07-04 Controllable cultivation room of temperature Expired - Fee Related CN204757233U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520473389.1U CN204757233U (en) 2015-07-04 2015-07-04 Controllable cultivation room of temperature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520473389.1U CN204757233U (en) 2015-07-04 2015-07-04 Controllable cultivation room of temperature

Publications (1)

Publication Number Publication Date
CN204757233U true CN204757233U (en) 2015-11-11

Family

ID=54471936

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520473389.1U Expired - Fee Related CN204757233U (en) 2015-07-04 2015-07-04 Controllable cultivation room of temperature

Country Status (1)

Country Link
CN (1) CN204757233U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114110838A (en) * 2021-11-08 2022-03-01 浙江汉恒热电科技有限公司 Semiconductor heat exchanger device with multiple air outlets

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114110838A (en) * 2021-11-08 2022-03-01 浙江汉恒热电科技有限公司 Semiconductor heat exchanger device with multiple air outlets

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151111

Termination date: 20160704