CN204753859U - Novel polyphenyl board of dampproofing resistance to compression - Google Patents

Novel polyphenyl board of dampproofing resistance to compression Download PDF

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Publication number
CN204753859U
CN204753859U CN201520417898.2U CN201520417898U CN204753859U CN 204753859 U CN204753859 U CN 204753859U CN 201520417898 U CN201520417898 U CN 201520417898U CN 204753859 U CN204753859 U CN 204753859U
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CN
China
Prior art keywords
board
damp proof
heated
resin
polyphenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520417898.2U
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Chinese (zh)
Inventor
王健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Yihongtianyi Science & Technology Development Co Ltd
Original Assignee
Tianjin Yihongtianyi Science & Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Yihongtianyi Science & Technology Development Co Ltd filed Critical Tianjin Yihongtianyi Science & Technology Development Co Ltd
Priority to CN201520417898.2U priority Critical patent/CN204753859U/en
Application granted granted Critical
Publication of CN204753859U publication Critical patent/CN204753859U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a novel polyphenyl board of dampproofing resistance to compression which characterized in that: including bonding board, division board, resin damp proof board, polyphenyl heated board, interlock groove, waterproof board, brace rod, resin damp proof board is installed to bonding board one side, resin damp proof board installs the division board in one side, the polyphenyl heated board is installed to division board one side, another resin damp proof board is installed to polyphenyl heated board one side, resin damp proof board installs the waterproof board in one side, waterproof board one side is equipped with the interlock groove. The utility model discloses at original structural waterproof board that has increased, if have in a small amount of water gets into the waterproof board, resin damp proof board can absorb it, avoids it to absorb water and loses the heat insulating ability, if ambient temperature is too high, or when having the burning things which may cause a fire disaster contact, sodium bicarbonate in the division board can prevent the burning of being heated of polyphenyl heated board, strengthening rib enhancement by a wide margin the crushing resistance of whole heated board, the interlock groove makes the heated board connect through the construction of pegging graft, and construction speed is fast, and it is also more convenient to dismantle when changing.

Description

A kind of moistureproof resistance to compression novel polyphenyl plate
Technical field
The utility model relates to a kind of polyphenyl plate, particularly relates to a kind of moistureproof resistance to compression novel polyphenyl plate.
Background technology
Polyphenyl plate full name polystyrene foam plate, have another name called cystosepiment or EPS plate, by the expandable polystyrene bead containing volatile fluid foaming agent, the white solid with fine hole-closing structure of hot briquetting in a mold after heating pre-sending out, form is as the shockproof foam inside our buyer's tool, be used for the insulation layer of construction wall, roof heat insulation, composite insulating board, according to prior art, its drawback is quite obvious, if there is water to enter in polyphenyl plate, polyphenyl plate can absorb moisture and expands in a large number, and its thermal insulation will gather reduction, makes it lose insulation effect; And itself is very fragile, under external impacts, very easily damage fragmentation; Its burning-point is low, is inflammable thing, very inflammable when meeting burning things which may cause a fire disaster, also can melt and discharge sharp aroma during high temperature; Most polyphenyl plate mounting means all adopts colligation to splice, and which required time is long, and extremely requires great effort when changing.
Summary of the invention
According to above technical problem, the utility model provides a kind of moistureproof resistance to compression novel polyphenyl plate, it is characterized in that: comprise adhesive board, division board, resin moist-proof board, polyphenylene heat insulation slab, occlusal crib, splash guard, brace rod, described adhesive board side is provided with resin moist-proof board, described resin moist-proof board side is provided with division board, described division board side is provided with polyphenylene heat insulation slab, described polyphenylene heat insulation slab side is provided with another resin moist-proof board, described resin moist-proof board side is provided with splash guard, and described splash guard side is provided with occlusal crib.
Containing a large amount of sodium acid carbonate in described division board.
In described polyphenylene heat insulation slab, brace rod is installed.
The beneficial effects of the utility model are: the utility model improves in original polyphenyl plate, namely structurally adds splash guard, prevent external source from touching polyphenylene heat insulation slab, avoid its water suction to lose heat insulating ability; If there is a small amount of water to enter in splash guard, resin moist-proof board can be absorbed, and avoids water directly to touch polyphenylene heat insulation slab; If ambient temperature is too high, or when having burning things which may cause a fire disaster to contact, the sodium acid carbonate in division board can absorb heat and discharge great amount of carbon dioxide, also can extinguish burning things which may cause a fire disaster around while cooling, prevents polyphenylene heat insulation slab heated combustion; Reinforcing rib adopts triangular support, it can arrive maximum supporting role, significantly strengthen the crushing resistance of whole warming plate while taking minimum volume; The setting of occlusal crib makes warming plate can be connected by grafting construction, and more traditional colligation connecting method speed of application is fast, and also convenient during dismounting and change.
Accompanying drawing explanation
Fig. 1 is the utility model plane structure chart.
Fig. 2 is brace rod structural representation.
Detailed description of the invention
According to Fig. 1, the utility model is further described:
As figure, adhesive board-1, division board-2, resin moist-proof board-3, polyphenylene heat insulation slab-4, occlusal crib-5, splash guard-6, brace rod-7.
Embodiment 1
A kind of moistureproof resistance to compression novel polyphenyl plate, comprise: adhesive board 1, division board 2, resin moist-proof board 3, polyphenylene heat insulation slab 4, occlusal crib 5, splash guard 6, brace rod 7, resin moist-proof board 3 is installed in adhesive board 1 side, division board 2 is installed in resin moist-proof board 3 side, polyphenylene heat insulation slab 4 is installed in division board 2 side, another resin moist-proof board 3 is installed in polyphenylene heat insulation slab 4 side, and splash guard 6 is installed in resin moist-proof board 3 side, and splash guard 6 side arranges occlusal crib 5.
The above is only preferred embodiment of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvement, these improvement also should be considered as protection domain of the present utility model.

Claims (3)

1. a moistureproof resistance to compression novel polyphenyl plate, it is characterized in that: comprise adhesive board, division board, resin moist-proof board, polyphenylene heat insulation slab, occlusal crib, splash guard, brace rod, described adhesive board side is provided with resin moist-proof board, described resin moist-proof board side is provided with division board, described division board side is provided with polyphenylene heat insulation slab, described polyphenylene heat insulation slab side is provided with another resin moist-proof board, and described resin moist-proof board side is provided with splash guard, and described splash guard side is provided with occlusal crib.
2. according to the moistureproof resistance to compression novel polyphenyl plate of one according to claim 1, it is characterized in that: containing a large amount of sodium acid carbonate in described division board.
3., according to the moistureproof resistance to compression novel polyphenyl plate of one according to claim 1, it is characterized in that: in described polyphenylene heat insulation slab, brace rod is installed.
CN201520417898.2U 2015-06-17 2015-06-17 Novel polyphenyl board of dampproofing resistance to compression Expired - Fee Related CN204753859U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520417898.2U CN204753859U (en) 2015-06-17 2015-06-17 Novel polyphenyl board of dampproofing resistance to compression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520417898.2U CN204753859U (en) 2015-06-17 2015-06-17 Novel polyphenyl board of dampproofing resistance to compression

Publications (1)

Publication Number Publication Date
CN204753859U true CN204753859U (en) 2015-11-11

Family

ID=54468582

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520417898.2U Expired - Fee Related CN204753859U (en) 2015-06-17 2015-06-17 Novel polyphenyl board of dampproofing resistance to compression

Country Status (1)

Country Link
CN (1) CN204753859U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107100288A (en) * 2017-06-22 2017-08-29 厦门派探特环保科技有限公司 A kind of environment-friendly type energy-saving warming plate and its installation method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107100288A (en) * 2017-06-22 2017-08-29 厦门派探特环保科技有限公司 A kind of environment-friendly type energy-saving warming plate and its installation method
CN107100288B (en) * 2017-06-22 2018-11-20 厦门派探特环保科技有限公司 A kind of environment-friendly type energy-saving insulation board and its installation method

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151111

Termination date: 20190617