CN107100288B - A kind of environment-friendly type energy-saving insulation board and its installation method - Google Patents
A kind of environment-friendly type energy-saving insulation board and its installation method Download PDFInfo
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- CN107100288B CN107100288B CN201710479349.1A CN201710479349A CN107100288B CN 107100288 B CN107100288 B CN 107100288B CN 201710479349 A CN201710479349 A CN 201710479349A CN 107100288 B CN107100288 B CN 107100288B
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- 238000009413 insulation Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000009434 installation Methods 0.000 title claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 83
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 229920000297 Rayon Polymers 0.000 claims abstract description 10
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 22
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 12
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 10
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 10
- 238000005253 cladding Methods 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 238000005187 foaming Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 14
- 239000011810 insulating material Substances 0.000 abstract description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 45
- 229910002092 carbon dioxide Inorganic materials 0.000 description 23
- 229960004424 carbon dioxide Drugs 0.000 description 22
- 239000001569 carbon dioxide Substances 0.000 description 21
- 239000007789 gas Substances 0.000 description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 10
- 238000004321 preservation Methods 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 229920001083 polybutene Polymers 0.000 description 5
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101000856236 Clostridium acetobutylicum (strain ATCC 824 / DSM 792 / JCM 1419 / LMG 5710 / VKM B-1787) Butyrate-acetoacetate CoA-transferase subunit B Proteins 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B2001/742—Use of special materials; Materials having special structures or shape
Abstract
It includes insulating layer and parent plate that the present invention, which provides a kind of environment-friendly type energy-saving insulation board and its installation method, environment-friendly type energy-saving insulation board,;Wherein, the insulating layer includes outer panel, thermal insulation layer and spongy layer;The two sides of the thermal insulation layer are Nian Jie with the outer panel and the spongy layer respectively;The spongy layer is Nian Jie by filling viscous viscose with described matrix plate.Make insulating layer after coating parent plate by filling viscous middle A, B glue of viscous viscose, can between insulating layer and parent plate filling arbon dioxide gas, greatly reduce the thermal coefficient of insulating layer, improve heat insulation effect, reduce the use of thermal insulation layer, the overall weight for alleviating thermal insulator has great practicability in field of heat insulating materials.
Description
Technical field
The present invention relates to pipe ventilated technical field, in particular to a kind of environment-friendly type energy-saving insulation board and its installation method.
Background technique
Thermal insulation material all play the role of in more and more fields it is highly important, by temperature preservation not only can be to avoid temperature
Degree is not distributed to other spaces and is damaged to the article of other not heatproofs, is more meaned to save mass energy, be avoided
The loss of the energy has extremely important influence in environmental protection.
Wherein, insulation board is commonly used as thermal insulation material, and in existing thermal insulation material, phenolic board can reach preferable heat preservation
Effect, however general phenolic board reaches 50kg/m3~80kg/m3, this will greatly increase the overall weight of thermal insulator, make installing
In the process, extremely inconvenient, it is also higher to thermal insulator load-bearing requirements itself, it will also cause some potential safety problems.
A kind of vacuum heat-insulating plate exists in the prior art, production method is cavity to be arranged in plate, then be evacuated
Processing forms evacuated panel.Although and this method preparation vacuum heat-insulating plate heat insulation effect it is very good, high production cost,
And manufactured vacuum board status is often fixed, the shape size in later period is difficult to carry out cutting change, there is pole in actual use
Big inconvenience.
Summary of the invention
A kind of environment-friendly type energy-saving insulation board is provided to solve above-mentioned the deficiencies in the prior art and disadvantage, the present invention,
Including insulating layer and parent plate;Wherein,
The insulating layer includes outer panel, thermal insulation layer and spongy layer;The two sides of the thermal insulation layer respectively with the outer panel
It is bonded with the spongy layer;The spongy layer is Nian Jie by filling viscous viscose with described matrix plate;
The viscous viscose of filling includes A glue and B glue, and the A glue is coated on the spongy layer, and the B glue is coated in institute
It states in matrix plate surface;Wherein, each component weight of the A glue is:
The each component weight of the B glue is:
Further, in the A glue, the concentration of dilute hydrochloric acid is 0.1mol/L~4mol/L.
Further, the thermal insulation layer is foamable phenolic plate, and thermal coefficient is 0.018w/mk~0.04w/mk.
Further, the spongy layer with a thickness of 1cm~6cm.
Further, described matrix plate outer surface is provided with concave architecture, described matrix plate outer surface far from edge 2cm~
It is flat surface in the range of 20cm.
The installation method of a kind of as above any environment-friendly type energy-saving insulation board, which is characterized in that be bonded insulating layer
It is in the method and step of parent plate:
A, A glue is uniformly coated on the surface of spongy layer, hangs 40~60min;
B, after hanging, A glue is uniformly coated on the surface of spongy layer, hangs 5~15min, repeats the step 1~2 time;
C, B glue is coated in the surface region of parent plate, wherein edge region is not coated by B glue, hangs 5~15min;
D, it repeats step C 1~2 time;
E, insulating layer is fitted in matrix plate surface, when fitting, is at the uniform velocity pressure bonded to another side from one side of parent plate, directly
To the complete insulation layer cladding of parent plate;
F, coat insulating layer after, parent plate superficial layer away from the range of 2cm~20cm at every flanging, i.e., uncoated B
The position of glue applies pressure to insulating layer, and keeps pressure 20min~60min;Insulating layer is bonded on parent plate.
Further, in step C, parent plate surface region coat B glue after, uniformly spray sodium bicarbonate powder in
At the coating area of B glue, 5~15min is hung.
A kind of environment-friendly type energy-saving insulation board and its installation method provided by the invention, by filling viscous middle A, B glue of viscous viscose
And the cooperation of other structures, make insulating layer after coating parent plate, titanium dioxide can be filled between insulating layer and parent plate
Carbon gas greatly reduces the thermal coefficient of insulating layer, improves heat insulation effect, reduces the use of thermal insulation layer, alleviates guarantor
The overall weight of warm body has suitable for all types of thermal insulators, such as utilidor, heat-preserving wall in field of heat insulating materials
Great practicability.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of environment-friendly type energy-saving insulation board provided by the invention;
Fig. 2 is the structural representation perspective view of insulating layer in Fig. 1;
Fig. 3 is the structural representation perspective view of parent plate in Fig. 1;
Fig. 4 is the preferred embodiment structural schematic diagram of Fig. 1.
Appended drawing reference:
10 insulating layer, 20 parent plate, 11 outer panel
12 thermal insulation layer, 13 spongy layer, 21 concave architecture
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Fig. 1 is a kind of structural schematic diagram of environment-friendly type energy-saving insulation board provided by the invention, as shown in Figure 1, including heat preservation
10 (as shown in Figure 2) of layer and parent plate 20 (as shown in Figure 3);Wherein,
As illustrated in fig. 1 and 2, the insulating layer 10 includes outer panel 11, thermal insulation layer 12 and spongy layer 13;The thermal insulation layer 12
Two sides it is Nian Jie with the outer panel 11 and the spongy layer 13 respectively;The spongy layer 13 passes through filling with described matrix plate 20
Viscous viscose bonding;Wherein, described matrix plate 20 is the superficial layer of thermal insulator.
The viscous viscose of filling includes A glue and B glue, and the A glue is coated on the spongy layer 13, and the B glue is coated in
On 20 surface of described matrix plate;Wherein, each component weight of the A glue is:
The each component weight of the B glue is:
Specifically, when insulating layer coats parent plate, when the sodium bicarbonate powder in dilute hydrochloric acid and B glue in A glue contacts,
Following reaction occurs:
HCl+NaHCO3→H2O+CO2↑+NaCl
It meanwhile if being when preparing in the thermal insulator (such as utilidor) of material as hot environment, to send out at this time with parent plate
Raw following reaction:
2NaHCO3→H2O+CO2↑+Na2CO3
Both this reaction generates carbon dioxide gas, and carbon dioxide gas is led as the main greenhouse gas in atmosphere
Hot coefficient is only 0.015w/mk (thermal coefficient of general air is 0.028~0.039w/mk), is had very excellent
Thermal insulation property;Since the titania powder in B glue has water imbibition, the water for generating the reaction is removed, and is reacted to life
Carry out more abundant at the direction of carbon dioxide.
The carbon dioxide gas of generation is filled between insulating layer and parent plate.Since A glue is coated on sponge in insulating layer
In layer, and polybutene rubber has good air-tightness in A glue, and polybutene rubber plugs the stomata of sponge surface, makes
Carbon dioxide will not enter inside sponge, and sponge has good morphotropism, therefore, as shown in Figure 1, generating carbon dioxide
Position formed air bag, once being formed after air bag, remaining at generate carbon dioxide will concentrate and be filled in air bag, sponge have
Some morphotropism can be such that insulating layer deforms and damage to avoid increased internal pressure after generation carbon dioxide gas.
In addition, ethyl orthosilicate has good heat resistance, it is coated in matrix plate surface as the ingredient in B glue, energy
Enough make when being passed through high-temperature gas in thermal insulator, guarantees good switching performance between insulating layer and parent plate;Methyl silicon resin
It is dissolved in organic solvent, insulating layer and parent plate can be made to be firmly combined as high-adhesive-strength, binder resistant to high temperature;A glue
As main bonding agent self-crosslinking reaction can occur for the acrylate neutralized in B glue, play good bonding effect.
The environment-friendly type energy-saving insulation board provided through the invention, insulating layer after coating parent plate, can in insulating layer and
Carbon dioxide gas is generated between parent plate, and is filled in therebetween, is greatly reduced the thermal coefficient of insulating layer, is improved
Heat insulation effect reduces the use of thermal insulation layer, alleviates the overall weight of thermal insulator, suitable for all types of thermal insulators, such as protects
Warm pipeline, heat-preserving wall etc. can cut environment-friendly type energy-saving insulation board according to the difference of the shape of thermal insulator, use
Scene is flexible;In addition, also have the function of certain fireproof using the environment-friendly type energy-saving insulation board, once fire incident, ring occurs
The carbon dioxide of guarantor's type energy-saving heat preserving intralamellar part release also has certain effect to the control of the intensity of a fire.Environment-friendly type section provided by the invention
Energy insulation board has great practicability and substantive distinguishing features outstanding and marked improvement in field of heat insulating materials.
Preferably, in the A glue, the concentration of dilute hydrochloric acid is 0.1mol/L~4mol/L.
Specifically, the preferable range of concentration of hydrochloric acid is 1.3mol/L~2.8mol/L, and the concentration of hydrochloric acid used is excessively high to base
Body plate has certain corrosiveness, and the amount of carbon dioxide generated is excessive, will destroy the cementability between insulating layer and parent plate;If
Concentration of hydrochloric acid is too low, then can not generate enough carbon dioxide gas, is unable to reach the effect of expected heat preservation.This concentration model
The optimum concentration range obtained by many experiments and test is enclosed, making for insulation board provided by the invention can be effectively applicable to
With.
Preferably, the thermal insulation layer 12 is foamable phenolic plate, thermal coefficient is 0.018w/mk~0.04w/mk.
Specifically, the thermal coefficient of foamable phenolic plate is lower, and good heat preservation can be played to thermal insulator as insulating layer
Effect.However, the density of foamable phenolic plate is 50Kg/m3~80Kg/m3, therefore the thickness of foamable phenolic plate is blocked up, will cause to protect
The preponderance of warm body;If thickness is too thin, heat insulation be will also decrease.In the present invention, the foamable phenolic plate thickness used is only
Carbon dioxide gas for 1cm~5cm, connecting inner is kept the temperature, and the use of foamable phenolic plate can not only be reduced, and is reduced and is protected
The weight of warm body, while heat insulation effect can be greatly improved.
Preferably, the spongy layer 13 with a thickness of 1cm~6cm.
Specifically, the use of spongy layer 13 and its with certain thickness be it is highly important, the deformability of sponge with
And the thickness having can provide certain space storage capacity for the carbon dioxide generated, and avoid heat insulation layer structure because generating two
Carbonoxide makes internal pressure increase and be destroyed.
Preferably, as shown in figure 3,20 outer surface of described matrix plate is provided with concave architecture 21,20 appearance of described matrix plate
It is flat surface in the range of identity distance edge 2cm~20cm, according to the difference of the specific heat preservation shape using parent plate preparation,
When thermal insulator is the planar structures such as wall, 20 outer surface of parent plate is far from being flat surface in the range of edge 2cm~20cm;When
When thermal insulator is pipeline (such as square tube) structure for having rib, 20 outer surface of parent plate is away from being smooth in the range of seamed edge 2cm~20cm
Surface;When thermal insulator is circular pipe structure, in the range of 20 outer surface of parent plate is away from side 2cm~20cm where rounded bottom surface
For flat surface.
The concave architecture 21 that 20 outer surface of parent plate is provided with can provide certain appearance when carbon dioxide gas is excessive
Receive space, as shown in figure 4, the opposite intermediate region of 20 outer surface of parent plate is arranged in concave architecture 21, can allow carbon dioxide more
Add being located in this region for concentration, and 20 outer surface of parent plate is conducive to far from being flat surface in the range of edge 2cm~20cm
It fills viscous viscose insulating layer 10 and parent plate 20 are firmly combined.
The installation method of a kind of as above any environment-friendly type energy-saving insulation board, wherein insulating layer is bonded in matrix
The method and step of plate is:
A, A glue is uniformly coated on the surface of spongy layer, hangs 40~60min;
B, after hanging, A glue is uniformly coated on the surface of spongy layer, hangs 5~15min, repeats the step 1~2 time;
C, B glue is coated in the surface region of parent plate, wherein edge region is not coated by B glue, hangs 5~15min;
D, it repeats step C 1~2 time;
E, insulating layer is fitted in matrix plate surface, when fitting, is at the uniform velocity pressure bonded to another side from one side of parent plate, directly
To the complete insulation layer cladding of parent plate;
F, coat insulating layer after, parent plate superficial layer away from the range of 2cm~20cm at every flanging, i.e., uncoated B
The position of glue applies pressure to insulating layer, and keeps pressure 20min~60min;Insulating layer is bonded on parent plate.
Specifically, in step A, A glue is first coated, one layer of densification can be formed on the surface of sponge after hanging 40~60min
Film, can prevent carbon dioxide gas from entering inside sponge, to influence heat insulation effect.
In step C, the only region coating B glue within the scope of superficial layer of parent plate is away from edge 2cm~20cm,
The B glue and A glue allowed in this region is bonded and is reacted generation carbon dioxide, and the position of uncoated B glue, which will only pass through A glue, to be kept the temperature
Layer and parent plate are combined.This coating method both can guarantee the more concentration of carbon dioxide filling, facilitate heat insulation effect,
And it can guarantee the fastness that insulating layer is connected with parent plate.
Preferably, in step C, parent plate superficial layer away from the region coating B glue within the scope of the 2cm~20cm of edge
Afterwards, uniformly sprinkling sodium bicarbonate powder hangs 5~15min at the coating area of B glue.
Since the sodium bicarbonate in B glue is blended in B glue, the sodium bicarbonate that can effectively generate carbon dioxide was possible to
It is few, therefore can spray a certain amount of sodium bicarbonate powder after coating B glue at the coating area of B glue, can guarantee carbon dioxide
Amount meet heat insulation effect.
The present invention provides following embodiment:
Embodiment one,
By 1.0 parts of dilute hydrochloric acid, 15 parts of acrylate, 10 parts of polybutene rubber, 5.0 parts of methyl silicon resin, organic solvent
1.1 parts, it is mixed and made into A glue;1.0 parts of sodium bicarbonate powder, 11 parts of ethyl orthosilicate, 12 parts of acrylate, titania powder
3.0 parts, it is mixed and made into B glue;
A glue is uniformly coated in the sponge layer surface of insulating layer, hangs 50min;It is uniformly applied on the surface of spongy layer again
A glue is covered, 10min is hung, repeats the step 1 time;B is coated far from the central area within the scope of the 5cm of edge in the surface of parent plate
Glue, edge region are not coated by B glue, hang 8min;It repeats previous step 2 times;Insulating layer is fitted in matrix plate surface, is pasted
When conjunction, another side is pressure bonded at the uniform velocity with side from parent plate, the air of script is squeezed out, until the complete insulation layer packet of parent plate
It covers;Pressure is applied to insulating layer in the surface of parent plate, that is, uncoated B glue position, and keeps pressure 50min;Completing will heat preservation
After layer is bonded in the installation on parent plate, as embodiment one.
Embodiment two,
By 2.3 parts of dilute hydrochloric acid, 18 parts of acrylate, 16 parts of polybutene rubber, 7.0 parts of methyl silicon resin, organic solvent
1.5 parts, it is mixed and made into A glue;1.6 parts of sodium bicarbonate powder, 13 parts of ethyl orthosilicate, 15 parts of acrylate, titania powder
3.8 parts, it is mixed and made into B glue;
A glue is uniformly coated in the sponge layer surface of insulating layer, hangs 48min;It is uniformly applied on the surface of spongy layer again
A glue is covered, 12min is hung, repeats the step 1 time;B is coated far from the central area within the scope of the 6cm of edge in the surface of parent plate
Glue, edge region are not coated by B glue, hang 10min;It repeats previous step 2 times;Insulating layer is fitted in matrix plate surface,
When fitting, another side is pressure bonded at the uniform velocity with side from parent plate, the air of script is squeezed out, until the complete insulation layer of parent plate
Cladding;Pressure is applied to insulating layer in the surface of parent plate, that is, uncoated B glue position, and keeps pressure 55min;It completes to protect
After warm layer is bonded in the installation on parent plate, as embodiment two.
Embodiment three,
By 3.0 parts of dilute hydrochloric acid, 24 parts of acrylate, 20 parts of polybutene rubber, 11 parts of methyl silicon resin, organic solvent
2.0 parts, it is mixed and made into A glue;2.0 parts of sodium bicarbonate powder, 15 parts of ethyl orthosilicate, 18 parts of acrylate, titania powder
4.7 parts, it is mixed and made into B glue;
A glue is uniformly coated in the sponge layer surface of insulating layer, hangs 50min;It is uniformly applied on the surface of spongy layer again
A glue is covered, 12min is hung, repeats the step 2 time;It is coated in the surface of parent plate far from the central area in the range of the 5cm of edge
B glue, edge region are not coated by B glue, hang 10min;It repeats previous step 2 times;Insulating layer is fitted in matrix plate surface,
When fitting, another side is pressure bonded at the uniform velocity with side from parent plate, the air of script is squeezed out, until the complete insulation layer of parent plate
Cladding;Pressure is applied to insulating layer in the surface of parent plate, that is, uncoated B glue position, and keeps pressure 50min;It completes to protect
After warm layer is bonded in the installation on parent plate, as embodiment three.
The environment-friendly type energy-saving insulation board of the embodiment preparation provided through the invention can be applied in utilidor, heat preservation
The fields such as wall, are compared with the prior art, and greatly reduce the thermal coefficient of insulating layer, improve heat insulation effect, reduce every
The use of heat, alleviates the overall weight of thermal insulator, has great practicability and substantive spy outstanding in field of thermal insulation
Point and marked improvement.
Although more herein used such as insulating layer, parent plate, outer panel, thermal insulation layer, spongy layer, concave architecture
It does not exclude the possibility of using other terms.It is of the invention the use of these items is only for being more convenient to describe and explain
Essence;Being construed as any additional limitation is disagreed with spirit of that invention.
Finally it should be noted that:The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, those skilled in the art should understand that:Its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement;And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (7)
1. a kind of environment-friendly type energy-saving insulation board, it is characterised in that:Including insulating layer (10) and parent plate (20);Wherein,
The insulating layer (10) includes outer panel (11), thermal insulation layer (12) and spongy layer (13);The two sides of the thermal insulation layer (12)
It is Nian Jie with the outer panel (11) and the spongy layer (13) respectively;The spongy layer (13) is with described matrix plate (20) by filling out
Fill viscous viscose bonding;
The viscous viscose of filling includes A glue and B glue, and the A glue is coated on the spongy layer (13), and the B glue is coated in institute
It states on parent plate (20) surface;Wherein, each component weight of the A glue is:
The each component weight of the B glue is:
2. a kind of environment-friendly type energy-saving insulation board according to claim 1, it is characterised in that:In the A glue, dilute hydrochloric acid it is dense
Degree is 0.1mol/L~4mol/L.
3. a kind of environment-friendly type energy-saving insulation board according to claim 1, it is characterised in that:The thermal insulation layer (12) is foaming
Phenolic board, thermal coefficient are 0.018w/mk~0.04w/mk.
4. a kind of environment-friendly type energy-saving insulation board according to claim 1, it is characterised in that:The thickness of the spongy layer (13)
For 1cm~6cm.
5. a kind of environment-friendly type energy-saving insulation board according to claim 1, it is characterised in that:Described matrix plate (20) outer surface
Be provided with concave architecture (21), described matrix plate (20) outer surface far from the range of edge 2cm~20cm be flat surface.
6. a kind of installation method of environment-friendly type energy-saving insulation board as claimed in any one of claims 1 to 5, which is characterized in that will
The method and step that insulating layer is bonded in parent plate is:
A, A glue is uniformly coated on the surface of spongy layer, hangs 40~60min;
B, after hanging, A glue is uniformly coated on the surface of spongy layer, hangs 5~15min, repeats the step 1~2 time;
C, B glue is coated in the surface region of parent plate, wherein edge region is not coated by B glue, hangs 5~15min;
D, it repeats step C 1~2 time;
E, insulating layer is fitted in matrix plate surface, when fitting, is at the uniform velocity pressure bonded to another side from one side of parent plate, until base
The complete insulation layer cladding of body plate;
F, after coating insulating layer, parent plate superficial layer away from the range of 2cm~20cm at every flanging, i.e., uncoated B glue
Position applies pressure to insulating layer, and keeps pressure 20min~60min;Insulating layer is bonded on parent plate.
7. the installation method of environment-friendly type energy-saving insulation board according to claim 6, it is characterised in that:In step C, in base
After the surface region coating B glue of body plate, sodium bicarbonate powder is uniformly sprayed at the coating area of B glue, hangs 5~15min.
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CN201811327183.2A CN109208769B (en) | 2017-06-22 | 2017-06-22 | Heat-preservation filling adhesive and using method thereof |
CN201710479349.1A CN107100288B (en) | 2017-06-22 | 2017-06-22 | A kind of environment-friendly type energy-saving insulation board and its installation method |
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DE202011050486U1 (en) * | 2011-06-19 | 2011-10-13 | Viktor Schatz | insulating element |
GB2507325A (en) * | 2012-10-26 | 2014-04-30 | Euroform Products Ltd | Composite insulation including gas filled pockets |
CN104563312A (en) * | 2013-10-24 | 2015-04-29 | 开县人人有余科技有限公司 | Insulation board filled with carbon dioxide |
CN204174769U (en) * | 2014-11-06 | 2015-02-25 | 常州市乾翔新材料科技有限公司 | A kind of Novel fireproof phenolic aldehyde composite board |
CN204753859U (en) * | 2015-06-17 | 2015-11-11 | 天津市壹泓天亿科技发展有限公司 | Novel polyphenyl board of dampproofing resistance to compression |
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CN109208769A (en) | 2019-01-15 |
CN109208769B (en) | 2020-04-17 |
CN107100288A (en) | 2017-08-29 |
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Effective date of registration: 20191227 Address after: 215539 Changsheng Industrial Park, Zhitang Town, Changshu City, Suzhou City, Jiangsu Province Patentee after: Suzhou Hanyan New Material Co., Ltd Address before: Unit A13, 10th floor, 389 Tongji South Road, Jimei District, Xiamen City, Fujian Province Patentee before: Xiamen send special environmental protection technology Co., Ltd. |