CN204741010U - Positioner of wafer processing - Google Patents
Positioner of wafer processing Download PDFInfo
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- CN204741010U CN204741010U CN201520394450.3U CN201520394450U CN204741010U CN 204741010 U CN204741010 U CN 204741010U CN 201520394450 U CN201520394450 U CN 201520394450U CN 204741010 U CN204741010 U CN 204741010U
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Abstract
The utility model provides a positioner of wafer processing which characterized in that contains: the vision module, it is adjacent in the wafer seat of this vision module, and the absorption module, locate the top of wafer seat. The utility model provides a wafer seat is given to an at least vacuum suction, and makes and adsorb at least one of module and inhale the hole and have suction to adsorb the wafer in the top of adsorbing the module, one goes up the top image of vision to bit cell capture wafer to produce top information, once the vision captures the bottom image of wafer to the bit cell to produce bottom information, a vision operation module is given with bottom information transfer to top information, and this vision operation module produces the locating information according to top information and bottom information. The utility model discloses utilize vacuum suction to be fixed in the absorption module with the wafer to simplify location structure. And the locating information of utilizing image information to produce improves the accurate nature of location, is favorable to subsequent processing processing procedure.
Description
Technical field
The utility model relates to wafer processing techniques field, is specifically related to the positioner of a kind of wafer processing.
Background technology
Existing electronic product is just towards future development that is frivolous or size reduction, and the size of the chip causing electronic product to use is more and more less, and accurate machining arrives the position for processing also to make wafer more require when processing and fabricating.
The locate mode of common wafer Working position has two kinds, and one is pressing type, and another is clip type.Wherein, pressing type is after wafer is moved into wafer support seat, by the edge of a press unit compacting wafer, is positioned wafer support seat to make wafer; Clip type utilizes jaw to fix wafer, to carry out wafer processing.
As mentioned above, the apparatus structure of existing pressing type or clip type is comparatively complicated, so the real demand having improvement of existing location structure.
Summary of the invention
The positioner that the utility model provides a kind of wafer to process, ensures the precise positioning of wafer while its object is to solve prior art location structure complexity.
For achieving the above object, the technical solution adopted in the utility model is:
A positioner for wafer processing, includes:
One vision module;
One wafer block, is arranged adjacent to described vision module; And
One adsorption module, is located at the top of described wafer block.
Related content in technique scheme is explained as follows:
1, in such scheme, described vision module has visual-alignment unit on, and on this, visual-alignment unit is positioned at the top of described wafer block.
2, in such scheme, described vision module also has visual-alignment unit, and this lower visual-alignment unit is positioned at the below of described wafer block.
3, in such scheme, described upper visual-alignment unit is synchronous start with described lower visual-alignment unit, or respective independent start.
4, in such scheme, also have a vision algorithm module, this vision algorithm module signal connects described vision module.
5, in such scheme, described wafer block has at least one air flue, and this air flue couples a negative-pressure vacuum source; Described adsorption module has at least one sucker, and this sucker communicates described air flue.
6, in such scheme, described adsorption module is a ring bodies or matrix arrangement, and described adsorption module is that rubber, plastic-steel, aluminium matter or metal material are made.
Operation principle of the present utility model and advantage as follows:
The utility model utilizes a pull of vacuum, so that wafer is fixed on adsorption module, simplifies location structure whereby.In addition, the image that in utilization, visual-alignment unit and lower visual-alignment unit capture, and by the locating information that image information produces, to improve the accuracy of location, be conducive to follow-up procedure for processing.
Accompanying drawing explanation
Accompanying drawing 1 is the schematic perspective view of the utility model embodiment positioner;
Accompanying drawing 2 is the structural representation of the utility model embodiment positioner;
Accompanying drawing 3 is the schematic perspective view one of the utility model embodiment adsorption module, wafer block and wafer;
Accompanying drawing 4 is the schematic perspective view two of the utility model embodiment adsorption module, wafer block and wafer;
Accompanying drawing 5 is the partial cutaway schematic of the utility model embodiment adsorption module, wafer block and wafer;
Accompanying drawing 6 is the part section enlarged diagram of the utility model embodiment adsorption module, wafer block and wafer;
Accompanying drawing 7 is the part section enlarged diagram of the utility model embodiment adsorption module and wafer.
In above accompanying drawing: 10, upper visual-alignment unit; 11, lower visual-alignment unit; 12, wafer block; 120, air flue; 13, adsorption module; 130, sucker; 14, vision computing module; 20, wafer.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment: please coordinate with reference to figure 1 with shown in Fig. 2, the positioner that a kind of wafer of the utility model adds, it includes a vision module, wafer block 12, adsorption module 13 and a vision computing module 14.
Described vision module to have on one visual-alignment unit 10 and once visual-alignment unit 11.Described lower visual-alignment unit 11 is positioned at the below of visual-alignment unit 10.Described upper visual-alignment unit 10 and lower visual-alignment unit 11 are one photosensitive to coupling assembly (Charge-coupled Device, CCD), and described upper visual-alignment unit 10 can synchronous or respective independent start with lower visual-alignment unit 11.
Described wafer block 12 is between upper visual-alignment unit 10 and lower visual-alignment unit 11.Refer to shown in Fig. 5 and Fig. 6, described wafer block 12 has at least one air flue 120.Described air flue 120 couples a negative-pressure vacuum source.
Please coordinate with reference to shown in figure 3, Fig. 6 and Fig. 7, described adsorption module 13 is located at the top of wafer block 12, and described adsorption module 13 is a ring bodies or matrix arrangement.Described adsorption module 13 has at least one sucker 130, this sucker 130 phase airway 120.Described adsorption module 13 can be that rubber, plastic-steel, aluminium matter or metal material are made.
Described vision computing module 14 connects described upper visual-alignment unit 10 and described lower visual-alignment unit 11 by signal.
Please coordinate with reference to shown in figure 3 ~ 7, a wafer 20 is positioned over the top of a wafer block 12.
At least one negative-pressure vacuum source provides at least one pull of vacuum to the air flue 120 of wafer block 12, and makes sucker 130 have a suction, wafer 20 to be adsorbed in the top of adsorption module 13.
Upper visual-alignment unit 10 capture the top image of wafer 20 that adsorbs by adsorption module 13, and produce a top information.Lower visual-alignment unit 11 capture the bottom image of wafer 20 that adsorbs by adsorption module 13, and produce a bottom information.Described upper visual-alignment unit 10 synchronously can carry out image capture, or independently carry out image capture separately with described lower visual-alignment unit 11.
Described top information and described bottom information send vision computing module 14 to, and this vision computing module 14, according to described top information and described bottom information, produces a locating information.Described locating information is preferably wafer 20 Working position, described locating information can use by follow-up procedure for processing.
Comprehensively above-mentioned, the positioner of wafer processing of the present utility model, it utilizes a pull of vacuum, so that wafer 20 is fixed on adsorption module 13, in recycling, visual-alignment unit 10 and lower visual-alignment unit 11 capture the image of wafer 20, described vision computing module 14 according to captured image information, to produce a locating information, this locating information can use by follow-up procedure for processing.
In sum, the utility model compared to existing technologies, can realize the object simplifying location structure, and can reach the effect of precise positioning.
Above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection range of the present utility model.
Claims (7)
1. a positioner for wafer processing, is characterized in that: include:
One vision module;
One wafer block, is arranged adjacent to described vision module; And
One adsorption module, is located at the top of described wafer block.
2. positioner according to claim 1, is characterized in that: described vision module has visual-alignment unit on, and on this, visual-alignment unit is positioned at the top of described wafer block.
3. positioner according to claim 2, is characterized in that: described vision module also has visual-alignment unit, and this lower visual-alignment unit is positioned at the below of described wafer block.
4. positioner according to claim 3, is characterized in that: described upper visual-alignment unit is synchronous start with described lower visual-alignment unit, or respective independent start.
5. positioner according to claim 1, is characterized in that: also have a vision algorithm module, and this vision algorithm module signal connects described vision module.
6. positioner according to claim 1, is characterized in that: described wafer block has at least one air flue, and this air flue couples a negative-pressure vacuum source; Described adsorption module has at least one sucker, and this sucker communicates described air flue.
7. positioner according to claim 1, is characterized in that: described adsorption module is a ring bodies or matrix arrangement, and described adsorption module is that rubber, plastic-steel, aluminium matter or metal material are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520394450.3U CN204741010U (en) | 2015-06-10 | 2015-06-10 | Positioner of wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520394450.3U CN204741010U (en) | 2015-06-10 | 2015-06-10 | Positioner of wafer processing |
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| Publication Number | Publication Date |
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| CN204741010U true CN204741010U (en) | 2015-11-04 |
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| CN201520394450.3U Active CN204741010U (en) | 2015-06-10 | 2015-06-10 | Positioner of wafer processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900574A (en) * | 2015-06-10 | 2015-09-09 | 苏州均华精密机械有限公司 | Positioning device for wafer processing and positioning method thereof |
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2015
- 2015-06-10 CN CN201520394450.3U patent/CN204741010U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900574A (en) * | 2015-06-10 | 2015-09-09 | 苏州均华精密机械有限公司 | Positioning device for wafer processing and positioning method thereof |
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