CN204736573U - 一种眼镜片薄膜的激光隐形打标设备 - Google Patents

一种眼镜片薄膜的激光隐形打标设备 Download PDF

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CN204736573U
CN204736573U CN201520151810.7U CN201520151810U CN204736573U CN 204736573 U CN204736573 U CN 204736573U CN 201520151810 U CN201520151810 U CN 201520151810U CN 204736573 U CN204736573 U CN 204736573U
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lens
mirror
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冯广智
郭岁延
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Shenzhen Aohua Laser Technology Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00865Applying coatings; tinting; colouring
    • B29D11/00923Applying coatings; tinting; colouring on lens surfaces for colouring or tinting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

本实用新型公开了一种眼镜片薄膜的激光隐形打标设备,包括激光器、光束整形装置、振镜和f-θ镜;激光器发出的激光经光束整形装置整形后,经振镜后入射到f-θ镜上,f-θ镜出射的激光聚焦到眼镜片的薄膜上;所述的激光器是波段范围为200-400nm、激光脉冲宽度在100-1000ps范围内,平均功率小于100mW的紫外激光器。本实用新型采用紫外小功率的激光器,因为能量小,且亚纳秒紫外激光是冷加工,薄膜材料直接气化或等离子化,不会熔化而产生黑化现象,同时能保证不过分烧蚀或者烧蚀不足的现象发生,打标质量优良。

Description

一种眼镜片薄膜的激光隐形打标设备
[技术领域]
本实用新型涉及激光加工设备,尤其涉及一种眼镜片薄膜的激光隐形打标设备。
[背景技术]
现代人阅读书籍,使用电脑、电视、手机等显示设备的频率越来越高,相当高比例的人是近视眼,不得不在生活中长时间佩戴眼镜。另外,人们对于装饰等需求佩戴眼镜的需求也很大。然而,消费者在购买眼镜时,很难查看出眼镜片的出产厂家和型号,部分商家甚至以次充好,以普通厂家的廉价眼镜片充当大牌眼镜片厂出产的高档眼镜片。如此就需要在眼镜片上刻上能够用肉眼看到的特殊标记,以使消费者区别不同眼镜片厂的不同产品,达到防伪鉴别的目的。然而眼镜片作为视觉观察的窗口必须保证高透过性,不能遮挡光线。使用者在佩戴眼镜时又不能够看到镜片上的标记。如此就需要使用者只能在特定的方向、特定的角度查看眼镜片上的标记,而在佩戴眼镜时看不到这个特殊标记,称之为隐形标记。在眼镜片上加工隐形标记,称之为激光隐形打标技术。
眼镜片薄膜厚度通常在1μm以下,普通的激光打标机会造成眼镜片薄膜的大面积烧蚀,并且损坏眼镜片的数值或玻璃基质。
[发明内容]
本实用新型要解决的技术问题是提供一种打标质量好,不会损坏镜片和薄膜的眼镜片薄膜的激光隐形打标设备。
为了解决上述技术问题,本实用新型采用的技术方案是,一种眼镜片薄膜的激光隐形打标设备,包括激光器、光束整形装置、振镜和f-θ镜;激光器发出的激光经光束整形装置整形后,经振镜后入射到f-θ镜上,f-θ镜出射的激光聚焦到眼镜片的薄膜上;所述的激光器是波段范围为200-400nm、激光脉冲宽度在100-1000ps范围内,平均功率小于100mW的紫外激光器。
以上所述的眼镜片薄膜的激光隐形打标设备,所述光束整形装置是将激光器的光束扩束到小于或等于振镜入光孔尺寸的光束整形装置,振镜入光孔处光斑为6-14μm。
以上所述的眼镜片薄膜的激光隐形打标设备,f-θ镜的焦距为80-180mm,其聚焦光斑小于50μm。
本实用新型激光隐形打标设备采用紫外小功率的激光器,因为能量小,且亚纳秒紫外激光是冷加工,薄膜材料直接气化或等离子化,不会熔化而产生黑化现象,同时能保证不过分烧蚀或者烧蚀不足的现象发生,打标质量优良。
[附图说明]
下面结合附图和具体实施方式对本实用新型作进一步详细的说明。
图1是本实用新型实施例眼镜片薄膜的激光隐形打标设备的结构示意图。
[具体实施方式]
如图1所示,本实用新型实施例眼镜片薄膜的激光隐形打标设备包含激光器1、光束整形装置2、振镜3和f-θ镜4。
激光器1发出的激光经光束整形装置2整形后,经振镜3后入射到f-θ镜4上,f-θ镜4出射的激光聚焦到眼镜片5的薄膜上。
其中,激光器1是波段范围为200-400nm、激光脉冲宽度在100-1000ps范围内,平均功率小于100mW的紫外激光器。
光束整形装置2是将激光器的光束扩束到小于或等于振镜入光孔尺寸的光束整形装置,振镜入光孔处光斑为6-14μm。
f-θ镜4的焦距为80-180mm,其聚焦光斑小于50μm。
激光器发出中心波长<400nm的紫外激光,可以使用的典型激光波长为355nm和266nm的激光;该激光是脉冲宽度小于1ns的皮秒的激光,考虑到激光器的成本,典型的脉宽为100-1000ps的皮秒激光;紫外激光相比于可见和红外光,光子能量较大,能够直接打断某些非金属材料的化学键产生等离子效应;可见和红外激光用于工业加工通常是利用其热效应,将材料熔化或部分气化而去除材料,而紫外激光经常能够将材料直接气化或等离子化以去除材料,紫外激光就是所说的冷光源,相比于可见和红外激光热效应较小,能够获得更好的加工边缘,不容易使材料碳化发黑。脉冲宽度是影响激光热效应的又一因素,由于激光的热传导存在一定的弛豫时间,激光在皮秒的脉宽时间内大部分被材料吸收起到去除材料的作用,而来不及被传导扩散,从而也能减少激光的热效应。
眼镜片5的基底材料通常为玻璃或树脂,膜层很薄,厚度最大的抗磨损膜也只有3-5μm,增透膜通常小于1μm。因此过高的激光能量容易在去除膜层材料的同时,损伤到眼镜片的基底材料。在做眼镜片的隐形标记时,通常激光能量不超过100mW。
光束整形装置是将激光束扩束到指定的光斑大小,根据所采用激光器的出射光斑选用不同扩束倍数的扩束镜。如需求进入到振镜的光斑大小约为10mm,而激光器的出射光斑约为2.5mm,则需选择4倍的扩束镜;
振镜通过两个镜片对扩束后的激光束进行扫描,经过f-θ镜片聚焦,使聚焦光点能够被聚焦到眼镜片不同的位置的膜层上。如采用100mm焦距的聚焦镜,光点可以聚焦到约20μm。
通过振镜对聚焦光束的扫描,选择性去除眼镜片上膜层材料,实现刻写指定图形的标记。
因为眼镜片基底材料对可见光的透过性很高(>95%),而佩戴眼镜时,眼镜片膜上的透明图形离眼睛很近,并不能在视网膜上成像,所以无法看到眼镜片上的打标图形。而当在一定距离外以一定角度范围查看眼镜片时,激光打标图形处因为去除了膜层材料,其表面反射率高于未打标的镜片处。光线在眼镜片表面发生反射,反射率的不同使打标图形能够被看到。
本实用新型实施例采用紫外小功率的激光器,因为能量小且亚纳秒紫外激光是冷加工,薄膜材料直接气化或等离子化,不会熔化而产生黑化现象,同时能保证不过分烧蚀或者烧蚀不足的现象发生。

Claims (3)

1.一种眼镜片薄膜的激光隐形打标设备,包括激光器,其特征在于,包括光束整形装置、振镜和f-θ镜;激光器发出的激光经光束整形装置整形后,经振镜后入射到f-θ镜上,f-θ镜出射的激光聚焦到眼镜片的薄膜上;所述的激光器是波段范围为200-400nm、激光脉冲宽度在100-1000ps范围内,平均功率小于100mW的紫外激光器。
2.根据权利要求1所述的眼镜片薄膜的激光隐形打标设备,其特征在于,所述光束整形装置是将激光器的光束扩束到小于或等于振镜入光孔尺寸的光束整形装置,振镜入光孔处光斑为6-14μm。
3.根据权利要求2所述的眼镜片薄膜的激光隐形打标设备,其特征在于,f-θ镜的焦距为80-180mm,其聚焦光斑小于50μm。
CN201520151810.7U 2015-03-17 2015-03-17 一种眼镜片薄膜的激光隐形打标设备 Expired - Fee Related CN204736573U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114309967A (zh) * 2022-01-11 2022-04-12 大族激光科技产业集团股份有限公司 激光加工方法和设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114309967A (zh) * 2022-01-11 2022-04-12 大族激光科技产业集团股份有限公司 激光加工方法和设备

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