CN204727977U - A kind of electro-coppering device - Google Patents
A kind of electro-coppering device Download PDFInfo
- Publication number
- CN204727977U CN204727977U CN201520338232.8U CN201520338232U CN204727977U CN 204727977 U CN204727977 U CN 204727977U CN 201520338232 U CN201520338232 U CN 201520338232U CN 204727977 U CN204727977 U CN 204727977U
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- electro
- coppering
- copper
- bucket
- return line
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Abstract
The utility model discloses a kind of circuit board electroplating copper device, belongs to wiring board and manufactures field.Described electro-coppering device comprises electro-coppering cylinder, molten copper bucket, drain pipe and return line; Copper billet is provided with in described molten copper bucket; Described drain pipe is communicated with electro-coppering cylinder and molten copper bucket, and return line is communicated with electro-coppering cylinder and molten copper bucket, and the electroplate liquid in electro-coppering cylinder enters molten copper bucket by drain pipe, then enters electro-coppering cylinder through return line.This electro-coppering device is applicable to insoluble anode plating, can apply relatively inexpensive fine copper ball and replace the technique that existing copper plating bath adds cupric oxide, reduce cost of manufacture; Simple to operate and reduce artificial manipulation strength; In addition, in copper plating bath, content of copper ion is more stable, and copper electroplating layer quality is more excellent.
Description
Technical field
The utility model belongs to wiring board and manufactures field, particularly relates to a kind of circuit board electroplating copper device.
Background technology
The Technology of existing lining plate electro-coppering has soluble anode and insoluble anode two kinds, soluble anode directly fills copper ball as anode with titanium basket, electrolysis voltage due to titanium is high and cupric electrolysis voltage is low, in the electroplanting device of appropriate voltage, anode copper ball according to the size of electric current electrolyzing copper ion in proportion, to maintain content of copper ion in copper plating bath; Insoluble anode then using stainless steel or titanium net as anode, adds cupric oxide in electroplating process, to maintain content of copper ion in copper plating bath.In prior art, to there is anode distribution uneven for soluble anode, causes the problem of copper electroplating layer lack of homogeneity; Insoluble anode copper electroplating layer good uniformity, but cupric oxide need be added with the cupric ion of supplementary consumption, and cupric oxide is high relative to unit price, causes the problem that electroplating cost is high.
Summary of the invention
For the problems referred to above, the utility model provides a kind of employing to dissolve copper ball supplementation with copper ion and the circuit board electroplating copper device of the rear layers of copper good uniformity of plating, and concrete scheme is as follows:
A kind of electro-coppering device, comprises electro-coppering cylinder, molten copper bucket, drain pipe and return line; Copper billet is provided with in described molten copper bucket; Described drain pipe is communicated with electro-coppering cylinder and molten copper bucket, and return line is communicated with electro-coppering cylinder and molten copper bucket, and the electroplate liquid in electro-coppering cylinder enters molten copper bucket by drain pipe, then enters electro-coppering cylinder through return line.
Further, also comprise pipe connecting, described pipe connecting is communicated with drain pipe and return line, and pipe connecting is provided with the first control valve and first-class gauge.
Further, described drain pipe is provided with the second control valve and second gauge, flows through the copper plating bath flow of molten copper bucket for control and measurement.
Preferably, be provided with spreader plate in described molten copper bucket, molten copper bucket interior separation is become branch chamber and molten copper chamber by spreader plate, and spreader plate is provided with tap hole; Described drain pipe is communicated with electro-coppering cylinder and branch chamber, and described return line is communicated with molten copper chamber and electro-coppering cylinder.
Preferably, described molten copper chamber is round shape, and diameter is 200-250mm, and length is 500-600mm.
Further, described return line is provided with filtration pump, and filtration pump is positioned on the return line of connection electro-coppering cylinder and pipe connecting.
Further, the return line of described connection filtration pump and electro-coppering cylinder is provided with mixed liquid bucket.
Preferably, described copper billet is copper ball, and copper ball diameter is not more than 50mm.
Further, described electro-coppering cylinder is provided with netted anode electrode.
Further, described anode electrode is stainless (steel) wire or titanium net.
Electro-coppering device of the present utility model utilizes the sulfuric acid content that copper plating bath itself is higher, and copper plating bath flows through molten copper bucket, utilizes the molten copper of sulfuric acid, increases content of copper ion in copper plating bath, with the consumption of cupric ion in copper plating bath during supplementary plating.Wherein, in electroplate liquid, the concentration of sulfuric acid is 40-50ml/L; In copper plating bath, the concentration of copper sulfate need control at 180-220g/L, is preferably 200g/L; In electro-coppering cylinder, the circular flow of electroplate liquid is 500L/min.
Electro-coppering device of the present utility model utilizes control valve, under meter to regulate and flows through the copper plating bath flow of molten copper bucket, can control the compensation rate of cupric ion, thus effectively keeps the stable of copper plating bath content of copper ion in electro-coppering cylinder, and concrete grammar is:
When in copper plating bath in electro-coppering cylinder, copper ion concentration is less than 180g/L, the flow regulating the first control valve to flow through first-class gauge is 150L/min, and the second control valve control flow check is 350L/min through the flow of second gauge.
When in copper plating bath in electro-coppering cylinder, copper ion concentration is greater than 180g/L, when being less than 200g/L, the flow regulating the first control valve to flow through first-class gauge is 180L/min, and the second control valve control flow check is 320L/min through the flow of second gauge.
When in copper plating bath in electro-coppering cylinder, copper ion concentration is greater than 200g/L, when being less than 220g/L, the flow regulating the first control valve to flow through first-class gauge is 300L/min, and the second control valve control flow check is 200L/min through the flow of second gauge.
When in copper plating bath in electro-coppering cylinder, copper ion concentration is greater than 220g/L, the flow regulating the first control valve to flow through first-class gauge is 350L/min, and the second control valve control flow check is 150L/min through the flow of second gauge.
In addition, return line is arranged mixed liquid bucket, the electroplate liquid and the non-electroplate liquid flowing through molten copper bucket that make to flow through molten copper bucket fully mix, and filtration pump can filter electroplate liquid and provides circulation power and filter electroplate liquid.
This electro-coppering device is applicable to insoluble anode plating, can apply relatively inexpensive fine copper ball and replace the technique that existing copper plating bath adds cupric oxide, reduce cost of manufacture; Simple to operate and reduce artificial manipulation strength; In addition, in copper plating bath, content of copper ion is more stable, and copper electroplating layer quality is more excellent.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment electro-coppering device.
Fig. 2 is the sectional view of the molten copper bucket of the utility model embodiment electro-coppering device.
Embodiment
In order to more fully understand technology contents of the present utility model, below in conjunction with specific embodiment the technical solution of the utility model being introduced further and illustrating.
Embodiment
As shown in Figure 1, electro-coppering device comprises electro-coppering cylinder 1, molten copper bucket 2, mixed liquid bucket 3, return line 4, drain pipe 5, filtration pump 6, pipe connecting 7.
Electro-coppering cylinder 1 is provided with netted anode electrode 11, and anode electrode 11 is stainless (steel) wire or titanium net.
Drain pipe 5 is communicated with the bottom of electro-coppering cylinder 1 and the top of molten copper bucket 2.Return line 4 is communicated with the bottom of molten copper bucket 2 and the top of electro-coppering cylinder 1.On the return line 4 of filtration pump 6 between electro-coppering cylinder 1 and molten copper bucket 2, filtration pump 6 is for filtering electroplate liquid and providing circulation power.On the return line 4 of mixed liquid bucket 3 between electro-coppering cylinder 1 and filtration pump 6, for abundant mixed flow through the electroplate liquid of molten copper bucket and the non-electroplate liquid flowing through molten copper bucket.
Drain pipe 5 along liquid flow path direction being provided with successively the second control valve 51 and second gauge 52, for regulating the electroplate liquid flow flowing into molten copper bucket 2.Pipe connecting 7 one end connects drain pipe 5 He between electro-coppering cylinder 1 and the second control valve 51, and the other end connects the return line 5 between molten copper bucket 2 and filtration pump 6; Pipe connecting 7 along liquid flow path direction being provided with successively the first control valve 71 and first-class gauge 72, for regulating the electroplate liquid flow of the molten copper bucket 2 of non-inflow.
As shown in Figure 2, molten copper bucket 2 is round shape, and diameter is 200mm, and inside is provided with spreader plate 23, and inwall isometry position is provided with the back-up block 25 be fixed on inwall, and spreader plate 23 support is on back-up block 25.Molten copper bucket 2 interior separation is become the molten copper chamber 22 of the branch chamber 21 on top and bottom by spreader plate 23, and drain pipe 5 is communicated with branch chamber 21, and return line 4 is communicated with molten copper chamber 22.Spreader plate 23 is provided with tap hole 24, and tap hole 24 will be for entering the electroplate liquid uniform divided flows of branch chamber 21.
Molten copper chamber 22 is highly 500mm, and inside is provided with copper ball diameter being housed and being not more than 50mm.Supplement with diameter 50mm copper ball every day and add once, to the maximum capacity in molten copper chamber.In production process, in electroplate liquid, the concentration of sulfuric acid controls at 40-50ml/L; In copper plating bath, the concentration of copper sulfate need control at 180-220g/L, is preferably 200g/L; In electro-coppering cylinder, the circular flow of electroplate liquid is 500L/min.Detected the content of copper ion of copper plating bath in an electro-coppering cylinder every 1 hour, and regulate the copper plating bath flow flowing through drain pipe and pipe connecting according to content of copper ion, concrete control method is:
When in copper plating bath in electro-coppering cylinder, copper ion concentration is less than 180g/L, the flow regulating the first control valve to flow through first-class gauge is 150L/min, and the second control valve control flow check is 350L/min through the flow of second gauge.
When in copper plating bath in electro-coppering cylinder, copper ion concentration is greater than 180g/L, when being less than 200g/L, the flow regulating the first control valve to flow through first-class gauge is 180L/min, and the second control valve control flow check is 320L/min through the flow of second gauge.
When in copper plating bath in electro-coppering cylinder, copper ion concentration is greater than 200g/L, when being less than 220g/L, the flow regulating the first control valve to flow through first-class gauge is 300L/min, and the second control valve control flow check is 200L/min through the flow of second gauge.
When in copper plating bath in electro-coppering cylinder, copper ion concentration is greater than 220g/L, the flow regulating the first control valve to flow through first-class gauge is 350L/min, and the second control valve control flow check is 150L/min through the flow of second gauge.
The above only further illustrates technology contents of the present utility model with embodiment; so that reader is easier to understand; but do not represent embodiment of the present utility model and be only limitted to this, any technology done according to the utility model extends or recreation, all by protection of the present utility model.
Claims (10)
1. an electro-coppering device, is characterized in that, comprises electro-coppering cylinder, molten copper bucket, drain pipe and return line; Copper billet is provided with in described molten copper bucket; Described drain pipe is communicated with electro-coppering cylinder and molten copper bucket, and return line is communicated with electro-coppering cylinder and molten copper bucket, and the electroplate liquid in electro-coppering cylinder enters molten copper bucket by drain pipe, then enters electro-coppering cylinder through return line.
2. electro-coppering device according to claim 1, is characterized in that, be provided with the pipe connecting being communicated with drain pipe and return line between drain pipe and return line, pipe connecting is provided with the first control valve and first-class gauge.
3. electro-coppering device according to claim 2, is characterized in that, described drain pipe is provided with the second control valve and second gauge.
4. electro-coppering device according to claim 1, is characterized in that, is provided with spreader plate in described molten copper bucket, and molten copper bucket interior separation is become branch chamber and molten copper chamber by spreader plate, and spreader plate is provided with tap hole; Described drain pipe is communicated with electro-coppering cylinder and branch chamber, and described return line is communicated with molten copper chamber and electro-coppering cylinder.
5. electro-coppering device according to claim 4, is characterized in that, described molten copper chamber is round shape, and diameter is 200-250mm, and length is 500-600mm.
6. electro-coppering device according to claim 1, is characterized in that, described return line is provided with filtration pump, and filtration pump is positioned on the return line of connection electro-coppering cylinder and pipe connecting.
7. electro-coppering device according to claim 6, is characterized in that, the return line of described connection filtration pump and electro-coppering cylinder is provided with mixed liquid bucket.
8. electro-coppering device according to claim 1, is characterized in that, described copper billet is copper ball, and copper ball diameter is not more than 50mm.
9. electro-coppering device according to claim 1, is characterized in that, described electro-coppering cylinder is provided with netted anode electrode.
10. electro-coppering device according to claim 9, is characterized in that, described anode electrode is stainless (steel) wire or titanium net.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520338232.8U CN204727977U (en) | 2015-05-22 | 2015-05-22 | A kind of electro-coppering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520338232.8U CN204727977U (en) | 2015-05-22 | 2015-05-22 | A kind of electro-coppering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204727977U true CN204727977U (en) | 2015-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520338232.8U Withdrawn - After Issue CN204727977U (en) | 2015-05-22 | 2015-05-22 | A kind of electro-coppering device |
Country Status (1)
| Country | Link |
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| CN (1) | CN204727977U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104846422A (en) * | 2015-05-22 | 2015-08-19 | 深圳崇达多层线路板有限公司 | Electro-coppering device |
-
2015
- 2015-05-22 CN CN201520338232.8U patent/CN204727977U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104846422A (en) * | 2015-05-22 | 2015-08-19 | 深圳崇达多层线路板有限公司 | Electro-coppering device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20151028 Effective date of abandoning: 20170426 |