CN104047045A - Circulating dissolved copper solution preparation device and method for calendered copper-foil copper plating process - Google Patents
Circulating dissolved copper solution preparation device and method for calendered copper-foil copper plating process Download PDFInfo
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Abstract
The invention discloses a circulating dissolved copper solution preparation device and method for a calendered copper-foil copper plating process. The device comprises a dissolved copper tower, a dissolved copper circulating tank, a transfer pump, a circulating tank, a circulating pump, a copper plating tank, a spray pipe, a spray pump, a measuring pump and a first pipeline, wherein the spray pipe is arranged on the upper part in the dissolved copper tower and provided with a plurality of spray heads; one end of the spray pump extends to the inside of the dissolved copper circulating tank through a pipeline, and the other end is connected with the spray pipe through a pipeline; the measuring pump is connected with the transfer pump in parallel; and the first pipeline is connected with the copper plating tank and circulating tank, and provided with a fourth valve. The device and method are simple and novel, have the characteristics of energy saving, high efficiency and the like, and thus, have favorable popularization and application values.
Description
Technical field
The present invention relates to a kind of molten copper liquid making of circulation device and method for rolled copper foil copper facing operation.
Background technology
Calendering surface treatment copper foil has good tensile strength, good unit elongation and surperficial low profile degree, and the excellent good physical behavior such as metal compaction and low-resistivity.The advantage that these are unique, makes to roll surface treatment copper foil and holds big lead over conventionally in electron production field widely used electrolytic surface for many years and process Copper Foil.Can find out, calendering surface treatment copper foil is processed Copper Foil than electrolytic surface and is had more powerful quality-advantage and larger development space.The theoretical investigation of rolled copper foil process for treating surface and production are domestic important new industries of in recent years rising.This respect, China, on the basis of developing voluntarily, developing, has obtained many achievements.Also introduced new research and production technology and a relevant device with Advanced Idea simultaneously abroad.But, at present, roll production technology and the equipment of surface treatment copper foil both at home and abroad, also generally there is the general character of some shortcomings, especially exist complex process tediously long, the fluctuated and cost of quality, energy consumption are high, processing unit need to improve etc. problem.At present, the solution that these problems have not also had.
The molten copper liquid making of the circulation mode of traditional rolled copper foil copper facing operation is mainly to adopt systemic circulation liquid making technology pattern (seeing accompanying drawing 1).The molten copper liquid making of systemic circulation technology pattern is that the circulation liquid making of molten copper system is series circulation with whole solution recycle system.It is " leading directly to " circulation liquid making technology pattern of the molten copper liquid making in circulation limit, a kind of limit.The advantage of this technology pattern is that processing unit is simple, and molten copper is fast, easy to operate.Shortcoming is that the process of its molten copper that circulates must be continuous when circulation liquid making (instant copper process), and in other words, as long as molten copper process is carried out in systemic circulation, the process of molten copper will be carried out simultaneously.During this will cause producing, when whole copper plating solution does not need to increase copper content, the molten copper process that circulates is still being carried out.This is the control to production and technique to this phenomenon, is totally unfavorable.Thus, the molten copper speed control of the technology pattern of this circulation liquid making is very difficult.Particularly, for some the low copper solutions in surface treatment, this circulation liquid making technique, is easy to make the copper content of solution in the molten copper process of continual systemic circulation, exceeds the upper limit of processing parameter, and the controllability of processing condition is reduced.
Summary of the invention
Technical assignment of the present invention is for above-mentioned deficiency of the prior art, a kind of molten copper liquid making of circulation device and method for rolled copper foil copper facing operation is provided, and it has the circulate feature of molten copper technology of original, novel, practical and rolled copper foil surface aftertreatment efficiently.
To achieve these goals, the technical scheme proposing according to the present invention is as follows:
A kind of molten copper liquid making of circulation device for rolled copper foil copper facing operation, comprise the molten copper tower, molten copper circulation groove, transferpump, circulation groove, recycle pump and the copper plating groove that are connected successively, described molten Tong Ta upper end has inlet mouth and fluid inlet, lower end has liquid outlet, described fluid inlet enters by the first valve to be communicated with described copper plating groove, described liquid outlet is communicated with described molten copper circulation groove, also comprise: shower, described shower is arranged on the top in described molten copper tower, and described shower is provided with some spray headers; Liquid spraying pump, one end of described Liquid spraying pump is deep into the inside of described molten copper circulation groove by pipeline, and the other end is connected with described shower by pipeline; Volume pump, described volume pump and described transferpump are connected in parallel, and before and after described transferpump, both sides are equipped with the second valve, and the both sides, front and back of described volume pump are equipped with the 3rd valve; The first pipeline, described the first pipeline connects described copper plating groove and circulation groove, and on the first pipeline, is provided with the 4th valve.
Preferably, the lower end of described molten copper tower is doline.
Preferably, the upper end of described molten copper tower is also provided with into Tong Kou.
Preferably, described circulation groove is provided with sulfuric acid import and purified water inlet.
Preferably, the pipeline between described Liquid spraying pump and molten copper tower is connected with the second pipeline, and described the second pipeline is connected with described molten copper circulation groove, and described the second pipeline is provided with the 5th valve.
Preferably, the pipeline between described transferpump and circulation groove is connected with the 3rd pipeline, and described San Ke road is connected with described molten copper circulation groove, and described the 3rd pipeline is provided with the 6th valve.
Preferably, also comprise liquid-feeding pump, described in send the import of defeated pump to connect described circulation groove, outlet connect described molten copper circulation groove.
The present invention also provides a kind of molten copper liquid making of circulation method for rolled copper foil copper facing operation, and step is:
(1), when time production liquid making originally, the second valve opening of transferpump and front and back, by the 3rd valve closes of the volume pump in parallel with it and front and back; Meanwhile, by the first valve opening, the second valve closes; Like this, molten copper solutions and the whole solution recycle system of the liquid making that makes to circulate form large series circulation, are adding the molten copper that self circulates of molten copper tower and molten copper circulation groove, the molten copper speed of greatly accelerating to circulate, brought into play above-mentioned processing unit simple, molten copper is fast, and few advantage consumes energy.
(2) in the time of normal production, the second valve closes of transferpump and front and back, the 3rd valve opening of the volume pump in parallel with it and front and back; Meanwhile, by the first valve closes, the second valve opening; According to the concentration of the copper in circulation groove by volume pump to supplementation with copper ion in circulation groove.Like this, molten copper circulation liquid making solution and whole solution recycle system series circulation are cut off, form closed cycle liquid making partial circulating, then by volume pump with progressively to the whole recycle system add, the form of supplementation with copper ion, to whole solution system supplementation with copper ion, make the object that its technology controlling and process is stable.
Molten copper pattern above can be selected to be arbitrarily used alternatingly under different control requires.Meanwhile, also can be under the cooperation of online densitometer, carry out conversion automatically and strength of solution and automatically control.Because the automatic control section of concentration does not belong to this patent, scope is discussed, is repeated no more herein.Described online densitometer can be arranged in circulation groove.
The transformation connection of this pipeline of the present invention and circulation liquid making technique, according to current data, be that the molten copper circulation technology of a domestic and international electrolysis and surface treatment production is still untapped, is characteristic novelty circulation liquid making technology pattern.Its beneficial effect is:
(1) in the time that copper plating solution system need to increase copper ion concentration (as first fluting and urgent need supplementation with copper ion time), the molten copper that can circulate fast, is supplemented rapidly system copper content;
(2) in the time that copper facing process is normally carried out, can be with the molten copper that circulates of mode stably, i.e. the solution circulated mode of the molten copper sheathing systemic circulation of partial circulating liquid making supplementation with copper ion, ensures that processing parameter is stable;
(3) can adopt flexibly above two kinds of modes of being used alternatingly of the molten copper pattern of circulation, to adapt to and to meet the instant needs in production.
And then, targetedly for rolled copper foil copper facing operation, in the production process of rolled copper foil and electrolytic copper foil surface processing, possesses great operability: in the time driving or need to supplement cupric ion fast, adopt the former the molten copper liquid making pattern that circulates, make solution cupric reach in time technic index.When normal production, can adopt the molten copper liquid making of the latter's single loop pattern, carry out balancing processing technical parameter in the mode of stable supplementation with copper ion.Like this, can aspect molten copper speed and stability, carry out suitable selection.Meanwhile, owing to can reasonably adopting the molten copper of intermittent type, make the copper content of solution system more stable, also can obtain the effect of control, energy efficient simultaneously.
Adopt above operation steps, just can in producing aspect molten copper speed and stability, carry out suitable selection, the advantage of two kinds of molten copper modes of performance, obtains at a high speed, efficient good molten copper liquid making effect.
Additional aspect of the present invention and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Brief description of the drawings
Fig. 1 is the molten copper liquid making of the circulation device for rolled copper foil copper facing operation in prior art;
Fig. 2 is the molten copper liquid making of the circulation device for rolled copper foil copper facing operation in the present invention.
Wherein, molten copper tower 1; Molten copper circulation groove 2; Liquid spraying pump 3; Transferpump 4; Volume pump 5; Circulation groove 6; Recycle pump 7; Copper plating groove 8; Liquid-feeding pump 9; The first pipeline 10; The second pipeline 11; The 3rd pipeline 12; The first valve 13; The second valve 14; The 3rd valve 15; The 4th valve 16; The 5th valve 17; The 6th valve 18.
Embodiment
Below by the embodiments of the invention of describing with reference to embodiment, embodiment is only for explaining the present invention, and can not be interpreted as limitation of the present invention.
For adapting to rolled copper foil surface-treated copper-plating technique needs, one for existing traditional molten copper pattern is improved, as shown in Figure 2, for the molten copper liquid making of a circulation device for rolled copper foil copper facing operation, comprise molten copper tower 1, molten copper circulation groove 2, Liquid spraying pump 3, transferpump 4, volume pump 5, circulation groove 6, recycle pump 7, copper plating groove 8 and liquid-feeding pump 9.
The upper end of described molten copper tower 1 has inlet mouth and fluid inlet, and lower end has liquid outlet.Top in molten copper tower 1 is provided with shower, and shower is provided with some spray headers.The upper end of molten copper tower 1 is also provided with into Tong Kou.The lower end liquid outlet of molten copper tower 1 is doline, the upper end of molten copper tower 1 interior liquid outlet is provided with sieve plate, the middle part of sieve plate is provided with some reticulated cell, and middle part be positioned at doline liquid outlet outlet directly over, middle part diameter is extremely consistent mutually with flare opening size, the outside of sieve plate is dull and stereotyped, and copper liquid can not flow down.Like this, when copper liquid is through flare opening Rapid Flow lower time, between sieve plate and outlet, form negative pressure, drive the air of sieve plate top to flow out downwards, thereby can participate in more fully molten copper reaction by air.
The import of described Liquid spraying pump 3 is connected with the pipeline below being deep into the inner liquid level of molten copper circulation groove 2, and outlet connects shower by pipeline.This pipeline also connects one end of the second pipeline 11, and the other end of the second pipeline 11 is connected with molten copper circulation groove 2, and the second pipeline 11 is provided with the 5th valve 17.
The rear and front end of described transferpump 4 is equipped with the second valve 14, and another pipeline being deep into below the inner liquid level of molten copper circulation groove 2 of the import of transferpump 4 connects, and outlet connects circulation groove 6 by pipeline.Pipeline between outlet and circulation groove 6 is also connected with one end of the 3rd pipeline 12, and the other end of the 3rd pipeline 12 connects molten copper circulation groove 2, the three pipelines 12 and is provided with the 6th valve 18.
Described volume pump 5 is connected in parallel with transferpump 4 and the second valve 14, and the both sides, front and back of transferpump 4 are equipped with the 3rd valve 15.The specification of volume pump 5 can be: output flow: 0~1000L/Hr, lift: 20m.
Described circulation groove 6 is provided with sulfuric acid import and purified water inlet, and circulation groove 6 inside are provided with densitometer, can detect in real time the concentration of copper in the interior copper liquid of circulation groove 6.
The import of described recycle pump 7 is connected to below the interior liquid level of circulation groove 6 by pipeline, and outlet connects described copper plating groove 8 by pipeline.
Described copper plating groove 8 passes through the fluid inlet of the molten copper tower 1 of pipeline connection by machine row plating tank overflow mode, pipeline between copper plating groove 8 and fluid inlet is provided with the first valve 13, this pipeline also connects one end of the first pipeline 10, and the other end of the first pipeline 10 connects circulation groove 6.The first pipeline 10 is provided with the 4th valve 16.
The import of described liquid-feeding pump 9 connects circulation groove 6 by pipeline, and outlet connects molten copper circulation groove 2 by pipeline.
The embodiment of the present invention also provides a kind of molten copper liquid making of circulation method for rolled copper foil copper facing operation, and step is:
(1), when time production liquid making originally, the second valve 14 of transferpump 4 and front and back is opened, and the 3rd valve 15 of the volume pump in parallel with it 5 and front and back is closed; , the first valve 13 is opened, the second valve 14 is closed meanwhile; Like this, molten copper solutions and the whole solution recycle system of the liquid making that makes to circulate form large series circulation, are adding the molten copper that self circulates of molten copper tower 1 and molten copper circulation groove 2, the molten copper speed of greatly accelerating to circulate, brought into play above-mentioned processing unit simple, molten copper is fast, and few advantage consumes energy.
(2) in the time of normal production, the second valve 14 of transferpump 4 and front and back is closed, and the 3rd valve 15 of the volume pump 5 in parallel with it and front and back is opened; , the first valve 13 is closed, the second valve 14 is opened meanwhile; According to the concentration of the copper in circulation groove 6 by volume pump 5 to supplementation with copper ion in circulation groove 6.Like this, molten copper circulation liquid making solution and whole solution recycle system series circulation are cut off, form closed cycle liquid making partial circulating, then by volume pump 5 with progressively to the whole recycle system add, the form of supplementation with copper ion, to whole solution system supplementation with copper ion, make the object that its technology controlling and process is stable.
Copper plating solution is as follows with reference to technological standards:
(1) solidify copper facing
Copper facing: Cu:30~80g/L; H2S04:60~160g/L;
Molten copper: Cu:50~150g/L; H2S04:60~160g/L;
(2) alligatoring copper facing
Copper facing: Cu:10~30g/L; H2S04:50~150g/L;
Molten copper: Cu:30~120g/L; H2S04:50~150g/L;
(3) melanism copper facing
Melanism copper facing: Cu:2.0~20g/L; H2S04:20~80g/L;
The molten copper of melanism: Cu:10~40g/L; H2S04:20~80g/L.
In technological process of the present invention, when in the situation of the just start of rolled copper foil surface treating machine row or urgent need supplementation with copper ion, adopt the molten copper pattern of molten copper tower systemic circulation, make solution copper content reach rapidly process goal value.Enter after normal production, adopt the molten copper pattern of molten copper tower partial circulating, adopt the mode of systemic circulation cover partial circulating, make copper plating solution system maintain the needs of normal supplementation with copper ion.Such novelty, flexible copper pattern, the input of required increase is very little.
Can find out, adopt novel, the molten copper pattern that circulates flexibly, can take into account the advantage of different molten copper circulation patterns, in the time driving or need to supplement cupric ion fast, the feed liquor of molten copper tower is entered by the overflow of machine row plating tank, now for adopting systemic circulation molten copper liquid making pattern, self molten copper of adding that molten copper tower and molten copper circulation groove coordinate, makes whole solution system cupric reach in time, rapidly technic index.When normal production, can adopt the molten copper liquid making of systemic circulation cover partial circulating pattern, now, the feed liquor of molten copper tower is the molten copper liquid making of interval type of self molten copper circulation.Therefore, alternately adopt two kinds of molten copper pattern flexibly, can aspect molten copper speed and stability, carry out suitable selection.Meanwhile, in producing at ordinary times, can reasonably adopt the molten copper of intermittent type, not only make the copper content of solution system more stable, also can obtain the effect of control, energy efficient simultaneously.
The technology and equipment feature of patent of the present invention compared with the existing technology, has following outstanding beneficial effect:
1) owing to having adopted the molten copper liquid making of novel circulation pattern, can adopt the large flow circulation of systemic circulation copper copper liquid making mode, in (fluting) start or need rapidly when make-up solution copper content, to have saved the setup time of fluting (start) and the time of adjusting process condition.As: the molten copper of circulation liquid making of first start, typically to solidify molten copper for example, adopt the large flow circulation of systemic circulation copper copper liquid making mode, molten copper speed can reach 15kg/Hr, and the normal consumption copper per hour of producing of surface treatment copper foil is:
1.186g/A/Hr (electrochemical equivalent) × 4500A (maximum value) × 1 hour (time) × 95% (current efficiency)=5230.26g=5.23kg be: the normal consumption copper speed of producing is: 5.23kg/Hr.
As can be seen here, adopt systemic circulation large flow circulation copper copper liquid making mode, the molten copper 15kg of energy per hour, is much higher than the consumption copper speed of production, and its molten copper ability has very large surplus.The molten copper mode of circulation of the large flow of this systemic circulation, for the molten copper of first fluting and fast supplementary cupric ion, is very practical.
2) in the time of normal production, switch by conversion valve and relevant electrical equipment, adopt the molten copper pattern of interval type partial circulating, the molten copper liquid making of more continuous systemic circulation pattern has reduced energy consumption in large quantities.And its main advantage is, the supplementary cupric ion of this pattern is not directly, but indirectly toward the pattern of supplementation with copper ion, has reduced the anxiety that exceed standard of copper ion concentration because increasing rapidly.
3) adopt above novel, the molten copper liquid making pattern that circulates flexibly:
(1) can save first fluting setup time
(2) while normally production, can utilize the recycle pump of interval type use volume pump and low discharge, replace the recycle pump of large flow, save to a certain extent energy consumption.
(3) owing to having adopted above-mentioned circulation liquid making pattern, indirectly approximately improved production efficiency 3%, economic benefit is obvious.
In sum, patent of the present invention is because having the various features such as simple, novel, energy-conservation, efficient, thereby has good application value.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: in the situation that not departing from principle of the present invention and aim, can carry out multiple variation, amendment, replacement and modification to these embodiment, scope of the present invention is limited by claim and equivalent thereof.
Claims (8)
1. the molten copper liquid making of the circulation device for rolled copper foil copper facing operation, comprise the molten copper tower, molten copper circulation groove, transferpump, circulation groove, recycle pump and the copper plating groove that are connected successively, described molten Tong Ta upper end has inlet mouth and fluid inlet, lower end has liquid outlet, described fluid inlet enters by the first valve to be communicated with described copper plating groove, described liquid outlet is communicated with described molten copper circulation groove, it is characterized in that, also comprises:
Shower, described shower is arranged on the top in described molten copper tower, and described shower is provided with some spray headers;
Liquid spraying pump, one end of described Liquid spraying pump is deep into the inside of described molten copper circulation groove by pipeline, and the other end is connected with described shower by pipeline;
Volume pump, described volume pump and described transferpump are connected in parallel, and before and after described transferpump, both sides are equipped with the second valve, and the both sides, front and back of described volume pump are equipped with the 3rd valve;
The first pipeline, described the first pipeline connects described copper plating groove and circulation groove, and on the first pipeline, is provided with the 4th valve.
2. the molten copper liquid making of the circulation device for rolled copper foil copper facing operation according to claim 1, is characterized in that, the lower end of described molten copper tower is doline.
3. the molten copper liquid making of the circulation device for rolled copper foil copper facing operation according to claim 1, is characterized in that, the upper end of described molten copper tower is also provided with into Tong Kou.
4. the molten copper liquid making of the circulation device for rolled copper foil copper facing operation according to claim 1, is characterized in that, described circulation groove is provided with sulfuric acid import and purified water inlet.
5. the molten copper liquid making of the circulation device for rolled copper foil copper facing operation according to claim 1, it is characterized in that, pipeline between described Liquid spraying pump and molten copper tower is connected with the second pipeline, and described the second pipeline is connected with described molten copper circulation groove, and described the second pipeline is provided with the 5th valve.
6. the molten copper liquid making of the circulation device for rolled copper foil copper facing operation according to claim 1, it is characterized in that, pipeline between described transferpump and circulation groove is connected with the 3rd pipeline, and described San Ke road is connected with described molten copper circulation groove, and described the 3rd pipeline is provided with the 6th valve.
7. the molten copper liquid making of the circulation device for rolled copper foil copper facing operation according to claim 1, is characterized in that, also comprises liquid-feeding pump, described in send the import of defeated pump to connect described circulation groove, outlet connect described molten copper circulation groove.
8. for the molten copper liquid making of a circulation method for rolled copper foil copper facing operation, it is characterized in that, step is:
(1), when time production liquid making originally, the second valve opening of transferpump and front and back, by the 3rd valve closes of the volume pump in parallel with it and front and back; Meanwhile, by the first valve opening, the second valve closes;
(2) in the time of normal production, the second valve closes of transferpump and front and back, the 3rd valve opening of the volume pump in parallel with it and front and back; Meanwhile, by the first valve closes, the second valve opening; According to the concentration of the copper in circulation groove by volume pump to supplementation with copper ion in circulation groove.
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
CN1103903A (en) * | 1993-05-28 | 1995-06-21 | 古尔德电子有限公司 | Electrodeposited copper foil and process for makin gasame using electrolyte solutions having controlled additions of chloride ions and organic additives |
CN1264757A (en) * | 2000-01-26 | 2000-08-30 | 魏明星 | Equipment and method for dissolving copper in step of producing raw liquid with electrolytic copper foil |
CN1380915A (en) * | 2000-05-18 | 2002-11-20 | 三井金属鉱业株式会社 | Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in electrolysis apparatus |
CN1405365A (en) * | 2002-10-29 | 2003-03-26 | 广东梅县梅雁电解铜箔有限公司 | Method for producing soluble copper in the production of electrolytic copper foil |
CN201543388U (en) * | 2009-10-28 | 2010-08-11 | 合肥铜冠国轩铜材有限公司 | Spray-type rapid high-efficiency copper dissolving system |
CN202028344U (en) * | 2011-04-21 | 2011-11-09 | 佛冈建滔实业有限公司 | Copper dissolving tank device |
CN102465323A (en) * | 2010-11-05 | 2012-05-23 | 柯国平 | Novel method for dissolving copper during production of electrolytic copper foil |
CN102531029A (en) * | 2010-12-30 | 2012-07-04 | 东莞华威铜箔科技有限公司 | Method for melting copper at low temperature and copper melting device |
CN102776552A (en) * | 2012-08-02 | 2012-11-14 | 梅县金象铜箔有限公司 | Automatic control technology of black oxidation copper foil in supplying copper ions and equipment used thereby |
-
2014
- 2014-06-30 CN CN201410300112.9A patent/CN104047045B/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
CN1103903A (en) * | 1993-05-28 | 1995-06-21 | 古尔德电子有限公司 | Electrodeposited copper foil and process for makin gasame using electrolyte solutions having controlled additions of chloride ions and organic additives |
CN1264757A (en) * | 2000-01-26 | 2000-08-30 | 魏明星 | Equipment and method for dissolving copper in step of producing raw liquid with electrolytic copper foil |
CN1200145C (en) * | 2000-01-26 | 2005-05-04 | 魏明星 | Equipment and method for dissolving copper in step of producing raw liquid with electrolytic copper foil |
CN1380915A (en) * | 2000-05-18 | 2002-11-20 | 三井金属鉱业株式会社 | Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in electrolysis apparatus |
CN1405365A (en) * | 2002-10-29 | 2003-03-26 | 广东梅县梅雁电解铜箔有限公司 | Method for producing soluble copper in the production of electrolytic copper foil |
CN201543388U (en) * | 2009-10-28 | 2010-08-11 | 合肥铜冠国轩铜材有限公司 | Spray-type rapid high-efficiency copper dissolving system |
CN102465323A (en) * | 2010-11-05 | 2012-05-23 | 柯国平 | Novel method for dissolving copper during production of electrolytic copper foil |
CN102531029A (en) * | 2010-12-30 | 2012-07-04 | 东莞华威铜箔科技有限公司 | Method for melting copper at low temperature and copper melting device |
CN202028344U (en) * | 2011-04-21 | 2011-11-09 | 佛冈建滔实业有限公司 | Copper dissolving tank device |
CN102776552A (en) * | 2012-08-02 | 2012-11-14 | 梅县金象铜箔有限公司 | Automatic control technology of black oxidation copper foil in supplying copper ions and equipment used thereby |
Cited By (8)
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CN107287650A (en) * | 2017-08-14 | 2017-10-24 | 江东电子材料有限公司 | A kind of electrolyte automatic regulating system and adjusting method |
CN109371430A (en) * | 2018-10-17 | 2019-02-22 | 单春艳 | A kind of energy-saving and environment-friendly copper foil process units |
CN110241444A (en) * | 2019-07-10 | 2019-09-17 | 江东电子材料有限公司 | A kind of the copper ion concentration control system and its method of electrolytic copper foil technique |
CN110846692A (en) * | 2019-11-06 | 2020-02-28 | 安徽铜冠铜箔有限公司 | Copper dissolving device |
CN110846692B (en) * | 2019-11-06 | 2024-04-19 | 安徽铜冠铜箔集团股份有限公司 | Copper dissolving device |
CN112501653A (en) * | 2020-11-26 | 2021-03-16 | 万宝矿产有限公司 | Electrodeposition waste copper dissolving device and copper dissolving method |
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