CN204695190U - A kind of three-dimensional heat radiation computer housing - Google Patents
A kind of three-dimensional heat radiation computer housing Download PDFInfo
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- CN204695190U CN204695190U CN201520392603.0U CN201520392603U CN204695190U CN 204695190 U CN204695190 U CN 204695190U CN 201520392603 U CN201520392603 U CN 201520392603U CN 204695190 U CN204695190 U CN 204695190U
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- installation position
- hard disk
- power supply
- heat radiation
- air vent
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- 230000005855 radiation Effects 0.000 title claims abstract description 30
- 238000009434 installation Methods 0.000 claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 239000003570 air Substances 0.000 description 32
- 238000005516 engineering process Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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Abstract
The utility model discloses a kind of three-dimensional heat radiation computer housing, comprise the motherboard, upper plate, header board, base plate and the rear plate that form casing, power pack is provided with in cabinet, power pack includes power supply installation position and hard disk installation position, power pack is positioned at the bottom of cabinet, it is fixed on base plate, is provided with the power supply heat sinking lid of band air vent above power supply installation position, is provided with the Hard disk heat radiation lid of band air vent above hard disk installation position; Upper plate, header board, base plate and rear plate are equipped with air vent, base plate, power supply heat sinking lid, Hard disk heat radiation lid, header board, form air convection channel by air vent between upper plate and rear plate.The utility model breaches traditional design philosophy, originally the hardware such as power supply, hard disk being installed on header board place is transferred to bottom, what that header board is almost become is empty, at upper plate, header board and rear plate, air vent is set, heat dissipation channel is increased greatly, power supply and hard disk are provided with special heat dissipation channel and fan, drastically increase radiating effect.
Description
Technical field
The utility model relates to computer product technical field, is specifically related to a kind of computer housing of perfect heat-dissipating.
Background technology
The heat dissipation problem of computer housing and wire rod arrangement problem are puzzlement computer row two hang-ups in the industry always.About heat dissipation problem, prior art is mainly by installing radiator fan to CPU, power supply, certainly sometimes also can provided with fan for high performance video cards, then air vent is offered at the side plate of cabinet and rear plate, by fan, cool ambient air is sucked from air vent, cabinet inside hot-air is discharged from air vent.This mode has certain radiating effect, but not desirable, especially for some high-performance CPU and video card, its main cause is exactly that structural design and heat dissipation channel design are unreasonable, and power supply, the hardware master that hard disk equal-volume is large, thermal value is large install concentratedly on header board, cause header board almost blocked, make air and outside air in cabinet can not play effective convection effects, heat concentrates on cabinet inside for a long time, computer performance may be caused to decline, even cause electronic component to damage.In addition, hard disk does not arrange independently heating radiator usually yet, and Long-Time Service can reduce serviceable life and the data reading speed of hard disk.
Utility model content
The technical problems to be solved in the utility model be to provide a kind of design more rationally, the three-dimensional heat radiation computer housing of good heat dissipation effect.
For solving the problems of the technologies described above, the utility model adopts following technical scheme: a kind of three-dimensional heat radiation computer housing, comprise casing, casing entirety is square structure, be motherboard in the side of cabinet, be upper plate above, be header board above, bottom is base plate, be rear plate below, in header board inside upper part, CD-ROM drive support is installed, it is characterized in that: in cabinet, be provided with power pack, power pack includes power supply installation position and hard disk installation position, power pack is positioned at the bottom of cabinet, it is fixed on base plate, the corresponding power supply heat sinking lid being provided with band air vent above power supply installation position, the corresponding Hard disk heat radiation lid being provided with band air vent above hard disk installation position, described upper plate is provided with air vent, and described header board is provided with air vent, and described base plate is provided with air vent, and described rear plate is provided with air vent, base plate, power supply heat sinking lid, Hard disk heat radiation lid, header board, forms air convection channel by air vent between upper plate and rear plate.
Further, on upper plate, be provided with blower tray, blower tray is reserved with the installation position for installing 24CM water-cooled row or 2*12CM fan.
Further, described header board be reserved with position can the installation position for installing 2*12CM fan or 2*12CM fan of up-down adjustment.
Further, described rear plate be reserved with position can up-down adjustment for installing 12CM water-cooled row or the installation position of 1*12CM fan.
Further, described power supply heat sinking lid is reserved with the installation position for installing 1*12CM fan; Described Hard disk heat radiation covers the installation position be reserved with for installing 1*12CM fan; Power supply heat sinking lid and Hard disk heat radiation lid are structure as a whole.
Can form many convection channel in cabinet, under the effect of fan, cold air sucks with header board bottom cabinet, discharges extraneous from the air vent of upper plate and rear plate.The air that bottom sucks gives power supply and Hard disk heat radiation respectively, and the air sucked above is then mainly for CPU and mainboard heat radiation, and special heat dissipation channel or fan for different hardware design, can reach better radiating effect thus.
The utility model structure is simple, design is more reasonable, breach traditional design philosophy, originally the hardware such as power supply, hard disk being installed on header board place is transferred to bottom, what that header board is almost become is empty, and design numerous air vents at upper plate, header board and rear plate, heat dissipation channel is increased greatly, and power supply and hard disk design have special heat dissipation channel and fan, drastically increase radiating effect.
Accompanying drawing explanation
Fig. 1 is the utility model one-piece construction figure;
Fig. 2 is the utility model right view.
In figure, 1 is upper plate, and 2 is header board, and 3 is base plate, and 4 is rear plate, and 5 is motherboard, and 6 is power pack, and 7 is blower tray, and 8 is power supply installation position, and 9 is Hard disk heat radiation lid, and 10 is power supply heat sinking lid, and 11 is air vent, and 12 is hard disk installation position.
Embodiment
Below in conjunction with the accompanying drawing in the utility model instructions, clear, complete description is carried out to the technical scheme of the utility model embodiment.
Only reason for convenience, in instructions once, employ specific direction term, such as " on ", D score, "front", "rear" etc., for object of reference with the accompanying drawing of correspondence, can not think restriction of the present utility model, when the definition of accompanying drawing face changes, the direction definition of these words performance should be interpreted as corresponding different directions face.
In the present embodiment, see figures.1.and.2, described three-dimensional heat radiation computer housing, comprises casing, and casing entirety is square structure, be motherboard 5 in the side of cabinet, be upper plate 1 above, before be header board 2, bottom is base plate 3, be rear plate 4 below, in header board 2 inside upper part, CD-ROM drive support be installed; Power pack 6 is provided with in cabinet, power pack 6 includes power supply installation position 8 and hard disk installation position 12, power pack 6 is positioned at the bottom of cabinet, it is fixed on base plate 3, the corresponding power supply heat sinking lid 10 being provided with band air vent above power supply installation position 8, the corresponding Hard disk heat radiation lid 9 being provided with band air vent above hard disk installation position 12; Described upper plate 1 is provided with air vent, described header board 2 is provided with air vent, described base plate 3 is provided with air vent, and described rear plate 4 is provided with air vent, base plate 3, power supply heat sinking lid 10, Hard disk heat radiation lid 9, header board 2, forms air convection channel by air vent between upper plate 1 and rear plate 4.
On upper plate 1, be provided with blower tray 7, blower tray 7 is reserved with the installation position for installing 24CM water-cooled row or 2*12CM fan.
Described header board 2 is reserved with the installation position for installing 2*12CM fan or 2*12CM fan, and position of fan can up-down adjustment.
Described rear plate 4 is reserved with the installation position for installing 12CM water-cooled row or 1*12CM fan, and position of fan can up-down adjustment.
Described power supply heat sinking lid 10 is reserved with the installation position for installing 1*12CM fan; Described Hard disk heat radiation lid 9 is reserved with the installation position for installing 1*12CM fan; Power supply heat sinking lid 10 and Hard disk heat radiation lid 9 are structure as a whole.
Can form many convection channel in cabinet, under the effect of fan, cold air sucks with header board 2 bottom cabinet, discharges extraneous from the air vent of upper plate 1 and rear plate 4.The air that bottom sucks gives power supply and Hard disk heat radiation respectively, and the air sucked above is then mainly for CPU and mainboard heat radiation, and special heat dissipation channel or fan for different hardware design, can reach better radiating effect thus.
Below the utility model is described in detail, the above, be only the preferred embodiment of the utility model, when not limiting the utility model practical range, namely allly do impartial change according to the application's scope and modify, all should still belong in the utility model covering scope.
Claims (5)
1. a three-dimensional heat radiation computer housing, comprise casing, casing entirety is square structure, be motherboard in the side of cabinet, be upper plate above, be header board above, bottom is base plate, be rear plate below, in header board inside upper part, CD-ROM drive support is installed, it is characterized in that: in cabinet, be provided with power pack, power pack includes power supply installation position and hard disk installation position, power pack is positioned at the bottom of cabinet, it is fixed on base plate, the corresponding power supply heat sinking lid being provided with band air vent above power supply installation position, the corresponding Hard disk heat radiation lid being provided with band air vent above hard disk installation position, described upper plate is provided with air vent, and described header board is provided with air vent, and described base plate is provided with air vent, and described rear plate is provided with air vent, base plate, power supply heat sinking lid, Hard disk heat radiation lid, header board, forms air convection channel by air vent between upper plate and rear plate.
2. three-dimensional heat radiation computer housing according to claim 1, is characterized in that: on upper plate, be provided with blower tray, and blower tray is reserved with the installation position for installing 24CM water-cooled row or 2*12CM fan.
3. three-dimensional according to claim 1 heat radiation computer housing, is characterized in that: described header board is reserved with position can the installation position for installing 2*12CM fan or 2*12CM fan of up-down adjustment.
4. three-dimensional according to claim 1 heat radiation computer housing, is characterized in that: described rear plate is reserved with position can the installation position for installing 12CM water-cooled row or 1*12CM fan of up-down adjustment.
5. three-dimensional heat radiation computer housing according to claim 1, is characterized in that: described power supply heat sinking lid is reserved with the installation position for installing 1*12CM fan; Described Hard disk heat radiation covers the installation position be reserved with for installing 1*12CM fan; Power supply heat sinking lid and Hard disk heat radiation lid are structure as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520392603.0U CN204695190U (en) | 2015-06-08 | 2015-06-08 | A kind of three-dimensional heat radiation computer housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520392603.0U CN204695190U (en) | 2015-06-08 | 2015-06-08 | A kind of three-dimensional heat radiation computer housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204695190U true CN204695190U (en) | 2015-10-07 |
Family
ID=54235459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520392603.0U Active CN204695190U (en) | 2015-06-08 | 2015-06-08 | A kind of three-dimensional heat radiation computer housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204695190U (en) |
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2015
- 2015-06-08 CN CN201520392603.0U patent/CN204695190U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171221 Address after: 510800 Chuang Yi Street, 28, high tech Industrial Park, Conghua Economic Development Zone, Guangzhou, Guangdong Patentee after: Guangzhou pan Chi computer equipment Co., Ltd. Address before: 246000 Longtan two group 363, Baisha village, Baisha village, Wangjiang County, Anqing City, Anhui Patentee before: Wang Yufeng |
|
| TR01 | Transfer of patent right |