CN204660333U - A kind of PCBA packaging uses antistatic foam envelope - Google Patents
A kind of PCBA packaging uses antistatic foam envelope Download PDFInfo
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- CN204660333U CN204660333U CN201520151924.1U CN201520151924U CN204660333U CN 204660333 U CN204660333 U CN 204660333U CN 201520151924 U CN201520151924 U CN 201520151924U CN 204660333 U CN204660333 U CN 204660333U
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- pcba
- foam
- packaging
- envelope
- envelope body
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Abstract
The utility model discloses a kind of PCBA packaging antistatic foam envelope, the rectangular flat shape envelope body made with IXPE foam, this envelope body comprises upper and lower bottom surface, described envelope body while be provided with shedding motion, other three limits of described envelope body are closing structure, described closing structure is flanging glued construction or upset Folding structure, described flanging glued construction is press on another bottom surface by the edge of upper bottom surface or bottom surface by edging machine, the bonding impression of a bottom surface formation wherein.The shedding motion that the utility model is arranged, can make PCBA etc. need the electronics of electrostatic prevention to carry out quickly and easily packing and sealing; Flanging glued construction, only a bottom surface forms bonding impression wherein, has enough binding powers, not easily tear between guarantee two bottom surfaces, and whole envelope body tailored appearance.
Description
Technical field
The utility model relates to the technical field of PCBA electrostatic prevention packaging bag, is specifically related to a kind of PCBA packaging antistatic foam envelope.
Background technology
21 century, all trades and professions are all in electronization, and electronic product development rapidly.Structure and the performance of electronic product and spare and accessory parts thereof are more and more accurate.In its manufacture, transport, use, circulation process, be easily subject to the infringement of extraneous static and electromagnetic wave etc., make the reduction of electronic devices and components precision, signal parameter drift, shortening life-span or make product failure completely.Electrostatic discharge ESD (English full name: Electro-Static discharge, Chinese: Electro-static Driven Comb) and electromagnetic interference EMI is on the impact of high-accuracy electronic product, sensitive electron components and parts, high-accuracy circuit card etc. more and more seriously, becomes current ubiquitous a kind of dangerous.
PCBA is in transportation, due to friction, clash into, the impact in external electrical field and magnetic field, easy generation electrostatic, electrostatic precipitation can affect the performance of product, and accumulation of static electricity can produce electric discharge under suitable conditions, cause product and equipment failure or component wear, great economic loss may be caused, so in order to prevent electrostatic to the interference of product and equipment.
Further, common antistatic shielding packaging bag not puncture-resistant, the scuffing puncture etc. of packaging product to shielding material easily allows anti-static shielding lose efficacy, and product is exposed in electrostatic and electromagnetic wave environment.When common antistatic shielding packaging bag packs circuit card finished product or other electronic products, due to the aperture position of packaging bag or the problem of openings of sizes, pack difficulty or packaging bag is caused to be broken, and, due to the aperture position of packaging bag and the mode of opening, carry out the complexity packed by directly causing circuit card.
Utility model content
In order to solve the problem, a kind of PCBA packaging antistatic foam envelope circuit card or electronic product etc. being carried out to easily quick pack disclosed in the utility model, the flanging glued construction of this foam envelope makes foam envelope not only durable but also attractive in appearance.
The technical scheme that the utility model is adopted for achieving the above object is:
A kind of PCBA packaging uses antistatic foam envelope, the rectangular flat shape envelope body made with IXPE foam, this envelope body comprises upper and lower bottom surface, described envelope body while be provided with shedding motion, other three limits of described envelope body are closing structure, described closing structure is flanging glued construction or upset Folding structure, and described flanging glued construction is press on another bottom surface by the edge of upper bottom surface or bottom surface by edging machine, the bonding impression of a bottom surface formation wherein.
Further, described shedding motion is arranged on long limit or the minor face of rectangular flat shape envelope body.
Further, described shedding motion is provided with Self-enclosing hermetically-sealed construction, and this Self-enclosing hermetically-sealed construction is zip mode seal;
Or described shedding motion is provided with ligulate closing structure, this ligulate closing structure is be integrated with upper bottom surface or bottom surface, and outwardly directed tongue piece.
Further, the junction of described tongue piece and upper bottom surface or bottom surface is provided with tongue piece overturn structure, and this tongue piece overturn structure is be positioned at the tongue piece that bottom surface outer surface edge and tongue piece junction arrange to overturn impression.
Further, described upset Folding structure is amount to the upset folding line of formation at one piece of overall IXPE foam by upset.
The thickness of a wherein bottom surface of described envelope body is 0.2 ~ 2mm.Preferably, the thickness of a wherein bottom surface of described envelope body is 0.8 ~ 1.2mm.
The expansion ratio of described IXPE foam is 5 times ~ 35 times.Preferably, the expansion ratio of described IXPE foam is 15 times ~ 20 times.
Further, filled conductive carbon black or conducting polymer in described IXPE foam, formed respectively black or the IXPE foam of colour.
The utility model has the advantage of: the shedding motion that the utility model is arranged, PCBA etc. can be made to need the electronics of electrostatic prevention to carry out quickly and easily packing and sealing; Flanging glued construction, only a bottom surface forms bonding impression wherein, between guarantee two bottom surfaces, there is enough binding powers, not easily tear, and whole envelope body tailored appearance, the IXPE foam of being filled by conducting polymer again and the envelope body with different colours made, can replace traditional packing box.
The ligulate closing structure of shedding motion, facilitating PCBA pack, envelope, protection product, meanwhile, good looking appearance is generous; The Self-enclosing hermetically-sealed construction of shedding motion can be good at sealing envelope body.
Below in conjunction with accompanying drawing and detailed description of the invention, the utility model is further illustrated.
Accompanying drawing explanation
The integral structure schematic diagram of Fig. 1 to be the utility model shedding motion be ligulate closing structure;
Fig. 2 is the sectional structure schematic diagram of Fig. 1;
Fig. 3 is the utility model open mode sectional structure schematic diagram;
The structural representation of Fig. 4 to be the utility model shedding motion be Self-enclosing hermetically-sealed construction.
In figure: 1. envelope body, 11. upper bottom surfaces, 12. bottom surfaces, 2. shedding motion, 21. ligulate closing structures, 22. tongue pieces, 23. tongue piece upset impressions, 24. Self-enclosing hermetically-sealed constructions, 3. closing structure, 31. flanging glued constructions, 32. bonding impressions, 33. upset Folding structures.
Detailed description of the invention
Embodiment 1, see Fig. 1 ~ Fig. 3, the PCBA packaging antistatic foam envelope that the present embodiment provides, the rectangular flat shape envelope body 1 made with IXPE foam, this envelope body 1 comprises, bottom surface 12, described envelope body 1 while be provided with shedding motion 2, described shedding motion 2 is arranged on the position, long limit of rectangular flat shape envelope body 1, other three limits of described envelope body 1 are closing structure 3, described closing structure 3 is flanging glued construction 31 or upset Folding structure 33, described flanging glued construction 31 is press on another bottom surface by the edge of upper bottom surface 11 or bottom surface 12 by edging machine, the bonding impression 32 that formed due to the melting of IXPE foam of a bottom surface wherein.Described upset Folding structure 33 is amount to the upset folding line of formation at one piece of overall IXPE foam by upset.The shedding motion 2 that the present embodiment is arranged, can make PCBA etc. need the electronics of electrostatic prevention to carry out quickly and easily packing and sealing; Flanging glued construction 31, only a bottom surface forms bonding impression 32 wherein, between guarantee two bottom surfaces, there is enough binding powers, not easily tear, and whole envelope body 1 tailored appearance, the IXPE foam of being filled by conducting polymer again and the envelope body 1 with different colours made, can replace traditional packing box.
Described shedding motion 2 is provided with ligulate closing structure 321, this ligulate closing structure 321 is be integrated with upper bottom surface 11 or bottom surface 12, and outwardly directed tongue piece 22, described tongue piece 22 is provided with tongue piece 22 overturn structure with the junction of upper bottom surface 11 or bottom surface 12, this tongue piece 22 overturn structure is be positioned at the tongue piece that bottom surface 12 outer surface edge and tongue piece 22 junction arrange to overturn impression 23, this tongue piece upset impression 23 is positioned at bottom surface 12 outer surface edge place, tongue piece upset impression 23 carries out pressing by edging machine, after tongue piece upset impression 23 is formed, after tongue piece 22 is opened, tongue piece 22 can under the antagonistic force of the metamorphosis of this upset impression, automatically the opening of closed envelope.The ligulate closing structure 321 of shedding motion 2, facilitating PCBA pack, envelope, protection product, meanwhile, good looking appearance is generous; The Self-enclosing hermetically-sealed construction 24 of shedding motion 2 can be good at sealing envelope body 1.
The thickness of a wherein bottom surface of described envelope body 1 is 0.2 ~ 2mm.
The expansion ratio of described IXPE foam is 5 times ~ 35 times.Expansion ratio is multiplied by density and equals 950, calculate, when the expansion ratio of IXPE foam is 5 times, the density of IXPE foam is 190 kilograms of every sq ms, when the expansion ratio of IXPE foam is 35 times, the density of IXPE foam is kilogram every sq m 27.1 kilograms of every sq ms.
Filled conductive carbon black in described IXPE foam, forms the IXPE foam of black.
Embodiment 2, see Fig. 4, the PCBA packaging antistatic foam envelope structure that the present embodiment provides is basic identical with embodiment 1, and its difference is, described shedding motion 2 is provided with Self-enclosing hermetically-sealed construction 24, and this Self-enclosing hermetically-sealed construction 24 is zip mode seal;
The expansion ratio of described IXPE foam is 15 times ~ 20 times.When the expansion ratio of IXPE foam is 15 times, the density of IXPE foam is 63.3 kilograms of every sq ms, and when the expansion ratio of IXPE foam is 35 times, the density of IXPE foam is kilogram every sq m 47.5 kilograms of every sq ms.
The thickness of a wherein bottom surface of described envelope body 1 is 0.8 ~ 1.2mm.
Embodiment 3, the PCBA packaging antistatic foam envelope structure that the present embodiment provides is basic identical with embodiment 1, and its difference is, described shedding motion 2 is arranged on the minor face of rectangular flat shape envelope body 1.Filled conductive Polymer in described IXPE foam, forms colored IXPE foam.
In above-described embodiment, radiant crosslinked polyethylene expanded material (Irradiation CrosslinkedPolyethylene Foam, being called for short IXPE) main raw material(s) is Low Density Polyethylene (LDPE), adopt radiation modification and freely continuous foamed technology production, product has uniform hole-closing structure, smooth epidermis, excellent rebound resilience, higher mechanical strength, excellent heat insulation, waterproof, resistance to ag(e)ing and chemical resistance.The post-forming process such as compound, bonding, cutting can be carried out, after suitably improving formula, its flame resistance, electric conductivity can be given.IXPE surface electrical resistance and volume resistance are 10
3-9Ω, permanent conduction/electrostatic prevention, smooth surface, environmental protection, easy post-forming process.
After adding carbon black mixing post-foaming, produce foaming body at ixpe and eva in normal scope, performance is substantially similar, and ixpe anyway surface has skinning, and eva is because be that moulded from foam skinning is substantially imperfect and abscess fine and smooth.On material property, eva more wear-resisting but shaping need that glue is bonding cannot melting self-adhesion, ixpe processing can heat bonding without the need to glue more environmental protection.
The utility model is not limited to above-mentioned embodiment, adopt or approximate construction identical with the utility model above-described embodiment or device, and other obtaining is for PCBA packaging antistatic foam envelope, all within protection domain of the present utility model.
Claims (10)
1. a PCBA packaging uses antistatic foam envelope, it is characterized in that: the rectangular flat shape envelope body made with IXPE foam, this envelope body comprises upper and lower bottom surface, described envelope body while be provided with shedding motion, other three limits of described envelope body are closing structure, described closing structure is flanging glued construction or upset Folding structure, described flanging glued construction is press on another bottom surface by the edge of upper bottom surface or bottom surface by edging machine, the bonding impression of a bottom surface formation wherein.
2. PCBA packaging antistatic foam envelope according to claim 1, is characterized in that, described shedding motion is arranged on long limit or the minor face of rectangular flat shape envelope body.
3. PCBA packaging antistatic foam envelope according to claim 2, it is characterized in that, described shedding motion is provided with Self-enclosing hermetically-sealed construction, and this Self-enclosing hermetically-sealed construction is zip mode seal;
Or described shedding motion is provided with ligulate closing structure, this ligulate closing structure is be integrated with upper bottom surface or bottom surface, and outwardly directed tongue piece.
4. PCBA packaging antistatic foam envelope according to claim 3, it is characterized in that, the junction of described tongue piece and upper bottom surface or bottom surface is provided with tongue piece overturn structure, and this tongue piece overturn structure is be positioned at the tongue piece that bottom surface outer surface edge and tongue piece junction arrange to overturn impression.
5. PCBA packaging antistatic foam envelope according to claim 1, is characterized in that, described upset Folding structure is amount to the upset folding line of formation at one piece of overall IXPE foam by upset.
6. PCBA packaging antistatic foam envelope according to claim 1, is characterized in that, the thickness of a wherein bottom surface of described envelope body is 0.2 ~ 2mm.
7. PCBA packaging antistatic foam envelope according to claim 6, is characterized in that, the thickness of a wherein bottom surface of described envelope body is 0.8 ~ 1.2mm.
8. PCBA packaging antistatic foam envelope according to claim 1, is characterized in that, the expansion ratio of described IXPE foam is 5 times ~ 35 times.
9. PCBA packaging antistatic foam envelope according to claim 1, is characterized in that, the expansion ratio of described IXPE foam is 15 times ~ 20 times.
10. PCBA packaging antistatic foam envelope according to claim 1, is characterized in that, filled conductive carbon black or conducting polymer in described IXPE foam, formed respectively black or the IXPE foam of colour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520151924.1U CN204660333U (en) | 2015-03-17 | 2015-03-17 | A kind of PCBA packaging uses antistatic foam envelope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520151924.1U CN204660333U (en) | 2015-03-17 | 2015-03-17 | A kind of PCBA packaging uses antistatic foam envelope |
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| Publication Number | Publication Date |
|---|---|
| CN204660333U true CN204660333U (en) | 2015-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520151924.1U Expired - Fee Related CN204660333U (en) | 2015-03-17 | 2015-03-17 | A kind of PCBA packaging uses antistatic foam envelope |
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| CN (1) | CN204660333U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106697588A (en) * | 2016-12-02 | 2017-05-24 | 郑州云海信息技术有限公司 | Foam clamping groove for packaging PCBA board and manufacturing and use methods of foam clamping groove |
| CN107244157A (en) * | 2017-07-16 | 2017-10-13 | 长沙修恒信息科技有限公司 | A kind of waterproof bag with fold-type mechanism |
| CN108438487A (en) * | 2018-04-04 | 2018-08-24 | 深圳市鸿利包装制品有限公司 | A kind of self-sealing packing bag and packing method for automatic packaging |
-
2015
- 2015-03-17 CN CN201520151924.1U patent/CN204660333U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106697588A (en) * | 2016-12-02 | 2017-05-24 | 郑州云海信息技术有限公司 | Foam clamping groove for packaging PCBA board and manufacturing and use methods of foam clamping groove |
| CN107244157A (en) * | 2017-07-16 | 2017-10-13 | 长沙修恒信息科技有限公司 | A kind of waterproof bag with fold-type mechanism |
| CN108438487A (en) * | 2018-04-04 | 2018-08-24 | 深圳市鸿利包装制品有限公司 | A kind of self-sealing packing bag and packing method for automatic packaging |
| CN108438487B (en) * | 2018-04-04 | 2024-04-05 | 深圳市鸿利包装制品有限公司 | Self-sealing type packaging bag for automatic packaging and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wu Wen Inventor before: Yuan Yiwen |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171016 Address after: 247100, 25 building, electronic information industry park, Chizhou economic and Technological Development Zone, Anhui Patentee after: Anhui Addie New Material Co. Ltd. Address before: 518106 Guangdong province Shenzhen Guangming New District Office of Gongming village community chariot old village building 801 B02 Patentee before: SHENZHEN SIMAPEI TECHNOLOGY CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20200317 |