CN204644488U - Multi-layer flexible printed circuit board copper plating device - Google Patents
Multi-layer flexible printed circuit board copper plating device Download PDFInfo
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- CN204644488U CN204644488U CN201520252548.5U CN201520252548U CN204644488U CN 204644488 U CN204644488 U CN 204644488U CN 201520252548 U CN201520252548 U CN 201520252548U CN 204644488 U CN204644488 U CN 204644488U
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- hanger
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Abstract
The utility model relates to a kind of multi-layer flexible printed circuit board copper plating device, comprise hinge-type thin-plate electroplating hanger and plating cylinder, the hanger comprised for filling extension thin plate described in hinge-type thin-plate electroplating hanger, described hanger is a closed framework, the side of described framework is provided with multiple handle clamp, the inner side of handle clamp is provided with conductive electric wire, and described framework side is also provided with masked cathode plate; The top of described framework is provided with transverse distance governor lever; Described plating cylinder both sides are evenly placed with anodic phosphorous copper balls; Described hinge-type thin-plate electroplating hanger annular array is arranged in plating cylinder.The utility model specification anodic phosphorous copper balls uses, plate cylinder both sides anode quantity and arrangement is closely fastidious, effectively improves panel plating homogeneity; The improvement of pusher annular coppered wire, makes copper ball consumption greatly reduce, production cost is declined to a great extent.The special tectonic of ring plate wire makes occupation area of equipment significantly reduce, and the consumption of water is reduced greatly.
Description
Technical field
The utility model relates to multi-layer flexible printed circuit board field, especially a kind of multi-layer flexible printed circuit board copper plating device.
Background technology
Electro-coppering refers to again by the mode that direct current is electroplated on the basis of PTH or black holes/shadow, in hole and copper coin surface plate the copper of one deck specific thickness again, to ensure the performance requriements of product.Need first product to be manually sandwiched on Electropolating hangers, be hung on again after fixing on cathode rod and lock laggard row electroplating activity.Need arrange in pairs or groups during operation and wave and air-blowing, with improving product grout and homogeneity.
Traditional electrical copper-plating technique when operation, adopt be stainless steel encapsulate folder point type hanger or all steel contained side formula hanger product is clipped laggard enter copper electroplating groove carry out electroplating activity; Because traditional technology limit, must have during operation perpendicular to product or with the swing in the angled direction of product to promote grout effect.Another in order to promote homogeneity and electroplating effect, collocation air-blowing operation must be had.
Because having swing and the dual function of air-blowing, hanger once product cannot be completely fixed, product just very easily wrinkle, therefore the plating of book plate becomes a large difficult point of traditional electrical copper facing operation; Separately along with the development trend of " short, little, light, the book, fast, economize " of electronic product, the copper-plated low TP value of traditional electrical (thickness ratio that Throwing power is institute's plated hole copper and face copper), makes copper facing cost high.Separately for reaching hole copper thickness requirement and thicker face copper that synchronous electric plates and the poor homogeneity of traditional electrical copper facing, become a large obstacle of restriction fine-line development.
Utility model content
The technical problems to be solved in the utility model is: provide a kind of multi-layer flexible printed circuit board copper plating device.
The utility model solves the technical scheme that its technical problem adopts: a kind of multi-layer flexible printed circuit board copper plating device, comprise hinge-type thin-plate electroplating hanger and plating cylinder, the hanger comprised for filling extension thin plate described in hinge-type thin-plate electroplating hanger, described hanger is a closed framework, the side of described framework is provided with multiple handle clamp, the inner side of handle clamp is provided with conductive electric wire, and described framework side is also provided with masked cathode plate; The top of described framework is provided with transverse distance governor lever; Described plating cylinder both sides are evenly placed with anodic phosphorous copper balls; Described hinge-type thin-plate electroplating hanger annular array is arranged in plating cylinder.
Further, hanger framework described in the utility model is stainless steel framework.
Further say, plating cylinder described in the utility model is provided with nozzle thin plate being carried out to medicine liquid spray.
The beneficial effects of the utility model are, solve the defect existed in background technology, transform electroplating evenness is poor, for homogeneity, each homogeneity of ingredients of electroplating acid copper liquid of electric current, improve the measures such as liquid medicine stirring system, swing system, specification anodic phosphorous copper balls uses, plate cylinder both sides anode quantity and arrangement is closely fastidious, effectively improves panel plating homogeneity; The improvement of pusher annular coppered wire, the book plate that push type annular coppered wire after the collocation of hinge-type book plate Electropolating hangers improves is produced, surface finish is good, without falling to press from both sides wrinkle phenomenon, product is not yielding, and homogeneity is fine, and TP value is higher, copper ball consumption reduces greatly, and production cost is declined to a great extent.The special tectonic of ring plate wire makes occupation area of equipment significantly reduce, and the consumption of water is reduced greatly.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the structural representation of the utility model hanger;
In figure: 1, transverse distance governor lever; 2, cover plate; 3, handle clamp; 4, conductive electric wire; 5, masked cathode plate;
Embodiment
With preferred embodiment, the utility model is described in further detail by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
Comprising for filling the hanger hanging thin plate as shown in Figure 1, described hanger is a closed framework, and the side of described framework is provided with multiple handle clamp 3, and the inner side of handle clamp is provided with conductive electric wire 4, and described framework side is also provided with masked cathode plate 5.The top of described framework is provided with transverse distance governor lever 1.Traditional electrical copper facing frock used is stainless steel encapsulate folder point type hanger or stainless steel flange hanger, is all product to be put into 4 screws that then corresponding folder point or contained side place lock correspondence respectively during these two kinds of hanger clamping plate.But this two kinds of hangers and production line thereof, because of self-characteristic, when producing book plate once hanger slightly unfairness or personnel's screw do not lock, product will be there is and come off or the phenomenon of product arrisdefect wrinkle from hanger.Therefore wrinkle condemnation factor is higher in production book plate process.Such as: test point is about 1-1.5cm from edges of boards, each test point distance 3.5cm.Thick by face copper thickness tester copper test.With 250*325mm 1OZ copper coin for test benchmark plate, before and after copper facing, every piece of copper coin one side measures 63 points, and two sides is totally 126 points, to calculate extreme difference value and electroplating evenness (cov).Because the copper-plated equipment of traditional electrical and frock clamp limit, electroplating evenness poor effect, homogeneity is about about 80%-85%; And grout ability is comparatively general, TP value generally maintains about 0.8 ~ 1, if namely hole copper thickness need reach 15um, then the copper that product surface plates also can reach about 15um.
Plating cylinder both sides are evenly placed with anodic phosphorous copper balls; Described hinge-type thin-plate electroplating hanger annular array is arranged in plating cylinder.
Hinge-type hanger adopts PVC+316 stainless steel to make, and has Portable durable, the advantage that upper and lower plates efficiency is high.And collocation masked cathode plate makes electroplating evenness increase.Have embedded rubber cushion in this hinge-type hanger cover plate, have certain projecting height, thus hanger cover plate 2-in-1 upper after, Copper Foil can be pushed down and can not come off by this rubber cushion tightly, and conductive clip point corresponding to both sides can ensure the electroconductibility that product is good.And in the limited block established, can ensure that every piece of product clamping plate degree of depth is consistent, prevents clamping plate from crossing and takes an advanced study into scrapping of product.
Upper and lower and the limited block snap by one side of product during upper plate, close handle clamp, and then carry out the same operation of the other side, and three pieces of products operate successively from the bottom up.After product clips, be linked into negative electrode and fly on target, locking conduction screw.This clamping plate mode operating efficiency is high, and without the need to the turn of the screw during clamping plate, the product that only handle clamp need be closed can clamp completely.Upper and lower plates efficiency at least improves 200%.
Adopt pusher annularly plating copper cash, upper and lower plates operates at same place simultaneously.And this kind of equipment is the ring structure of plate of being back to back, under the prerequisite of same production capacity, more traditional gantry line that takes up room has had very large saving.Water consumption has very large saving compared with gantry line; This kind of equipment takes the alr mode that jet flow technique instead of air-blowing.Namely by nozzle, product is carried out to the sprinkling of fresh liquor on the both sides of product correspondence position.Improve grout ability makes TP value significantly improve.And by having installed cylindrical anode masking shield additional at portion, the homogeneity of product has been had and further promotes.
Use the book plate that the pusher annular coppered wire of hinge-type book plate Electropolating hangers collocation is produced, surface finish is good, and without falling to press from both sides wrinkle phenomenon, product is not yielding.And homogeneity is fine, TP value is higher.The product that this kind of mode is produced, uniformity coefficient at least can reach more than 92%.TP value at least can reach more than 2.0.When even hole copper thickness is plated to 20um, copper foil surface face copper at most only on plate 10um, this characteristic can make production cost decline to a great extent.
Therefore the special tectonic of ring plate wire makes occupation area of equipment significantly reduce, and the consumption of water is reduced greatly.Special rack design, makes upper and lower plates become convenient and swift, ultrahigh in efficiency, and when same production capacity, planer-type automation line or Manual line at least need outfit 4 people, and ring plate wire collocation book plate hanger has two employees to be enough to meet production.Special hanger and plating mode design, book plate tortuosity is significantly reduced, and good homogeneity makes the making of follow-up fine-line become more convenient; High TP value makes again under same copper facing thickness requirement, and copper ball consumption reduces greatly, and production cost is declined to a great extent.Special rack design, (Electropolating hangers needs every daily nitric acid to carry out nitre extension to the copper that hanger plates to make hanger daily maintenance maintenance cost at least reduce about 300%-400%, and the Electropolating hangers conductive clip point area that the utility model uses is little, therefore consumption nitric acid amount is less).The generation of sewage also significantly reduces simultaneously.
The just embodiment of the present utility model described in above specification sheets, various illustrating is not construed as limiting flesh and blood of the present utility model, person of an ordinary skill in the technical field after having read specification sheets can to before described embodiment make an amendment or be out of shape, and do not deviate from essence and the scope of utility model.
Claims (3)
1. a multi-layer flexible printed circuit board copper plating device, comprise hinge-type thin-plate electroplating hanger and plating cylinder, it is characterized in that: the hanger comprised for filling extension thin plate described in hinge-type thin-plate electroplating hanger, described hanger is a closed framework, the side of described framework is provided with multiple handle clamp, the inner side of handle clamp is provided with conductive electric wire, and described framework side is also provided with masked cathode plate; The top of described framework is provided with transverse distance governor lever; Described plating cylinder both sides are evenly placed with anodic phosphorous copper balls; Described hinge-type thin-plate electroplating hanger annular array is arranged in plating cylinder.
2. multi-layer flexible printed circuit board copper plating device as claimed in claim 1, is characterized in that: described hanger framework is stainless steel framework.
3. multi-layer flexible printed circuit board copper plating device as claimed in claim 1, is characterized in that: described plating cylinder is provided with nozzle thin plate being carried out to medicine liquid spray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520252548.5U CN204644488U (en) | 2015-04-23 | 2015-04-23 | Multi-layer flexible printed circuit board copper plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520252548.5U CN204644488U (en) | 2015-04-23 | 2015-04-23 | Multi-layer flexible printed circuit board copper plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204644488U true CN204644488U (en) | 2015-09-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520252548.5U Expired - Fee Related CN204644488U (en) | 2015-04-23 | 2015-04-23 | Multi-layer flexible printed circuit board copper plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204644488U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110952128A (en) * | 2019-11-01 | 2020-04-03 | 江苏中科瑞尔汽车科技有限公司 | Shielding electroplating method and hanger structure |
-
2015
- 2015-04-23 CN CN201520252548.5U patent/CN204644488U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110952128A (en) * | 2019-11-01 | 2020-04-03 | 江苏中科瑞尔汽车科技有限公司 | Shielding electroplating method and hanger structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Henglin Town, Wujin District of Jiangsu province Changzhou 213000 Tong Tau Street, No. 4 Patentee after: Jiangsu Xiehe electronic Limited by Share Ltd Address before: Henglin town Wujin District Cui Bridge Street 213103 Jiangsu province Changzhou City Patentee before: Changzhou Xiehe Circuit Board Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150916 Termination date: 20210423 |