CN204640697U - A kind of can the electrically-conductive backing plate of injection mo(u)lding LED support - Google Patents
A kind of can the electrically-conductive backing plate of injection mo(u)lding LED support Download PDFInfo
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- CN204640697U CN204640697U CN201520272997.6U CN201520272997U CN204640697U CN 204640697 U CN204640697 U CN 204640697U CN 201520272997 U CN201520272997 U CN 201520272997U CN 204640697 U CN204640697 U CN 204640697U
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- led support
- injection cavities
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Abstract
A kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, relate to LED technical field, it comprises metal substrate, metal substrate is provided with several glue injection cavities unit, each glue injection cavities unit comprises two glue injection cavities, each glue injection cavities comprises two the Lamp cup chambeies be interconnected and the glue oral area be located between two Lamp cup chambeies, each glue oral area can be embodied as the function of two LED supports injection moulding simultaneously, and each glue injection cavities unit comprises two glue oral areas, and two glue oral areas of same glue injection cavities unit are connected to same injecting glue runner, when LED support injecting glue is shaping, two glue oral areas can realize the injection mo(u)lding of four LED supports simultaneously, and then reduce the quantity of injection molding channel, and the distance that can effectively reduce between adjacent LED support, improve to make the closeness of LED support layout on metal substrate, thus improve the efficiency of LED injection mo(u)lding, reduce material consumption.
Description
Technical field
The utility model relates to LED technical field, be specifically related to a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support.
Background technology
In the manufacturing process of LED, in order to realize producing in enormous quantities, be generally adopt to be processed to form multiple LED support on a metal substrate, then carry out the operation such as die bond, some glue on LED support after, form multiple LED.
In the manufacturing process of LED support, be generally the structure first punching out positive and negative pad on metallic substrates, and then carry out injection moulding, make positive and negative pad to be connected to all, also keep mutually insulated simultaneously.And when carrying out injection moulding to metal substrate, because each LED support structure on substrate is all keep relatively independent, therefore when injection moulding, each LED support on metal substrate needs to be equipped with independently Jiao Kou, and each Jiao Kou must mate again an injecting glue runner.But, because in injection mold, injecting glue runner has certain volume, therefore must maintain a certain distance between mutual glue mouth, this also just causes LED support adjacent on metallic substrates must pull open larger distance, thus result in the LED support quantity minimizing that piece of metal substrate can be produced simultaneously, not only cause production efficiency low, and the final waste material of piece of metal substrate is more, produces waste of material serious.
Summary of the invention
The purpose of this utility model is for deficiency of the prior art, and provide a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, by improved products structure and layout to reduce the spacing of adjacent LED support, to improve the closeness of LED support layout on metal substrate, and then injection mo(u)lding efficiency.
The purpose of this utility model is achieved through the following technical solutions:
There is provided a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, comprise metal substrate, metal substrate is provided with glue injection cavities unit, the first longitudinal bond strip is provided with between the glue injection cavities unit that left and right is adjacent, the first lateral connection bar is provided with between neighbouring glue injection cavities unit, the second longitudinal bond strip that each glue injection cavities unit comprises two glue injection cavities and is located between two glue injection cavities, each glue injection cavities comprises two the Lamp cup chambeies be interconnected and the glue oral area be located between two Lamp cup chambeies, the second lateral connection bar is provided with between two Lamp cup chambeies of same glue injection cavities, described glue oral area is arranged at the second lateral connection bar between two Lamp cup chambeies of the glue injection cavities belonging to it, two described glue oral areas of same glue injection cavities unit are connected to same injecting glue runner.
Wherein, the width of described first longitudinal bond strip is greater than the width of the second longitudinal bond strip.
Wherein, the first through hole is offered between described Lamp cup chamber and described first longitudinal bond strip.
Wherein, the width of described first lateral connection bar is not less than the width of the second lateral connection bar.
Wherein, described second longitudinal bond strip offers the second through hole.
Wherein, described metal substrate is provided with locating hole, and described locating hole is just to described second longitudinal bond strip.
Wherein, glue injection cavities unit described in several is that matrix arrangement mode is arranged.
The beneficial effects of the utility model:
Of the present utility model can the electrically-conductive backing plate of injection mo(u)lding LED support, comprise metal substrate, metal substrate is provided with several glue injection cavities unit, each glue injection cavities unit comprises two glue injection cavities, each glue injection cavities comprises two the Lamp cup chambeies be interconnected and the glue oral area be located between two Lamp cup chambeies, each glue oral area can be embodied as the injection moulding simultaneously of two LED supports, and each glue injection cavities unit comprises two glue oral areas, two glue oral areas of same glue injection cavities unit connect same injecting glue runner, when LED support injecting glue is shaping, two glue oral areas can be embodied as the injection moulding simultaneously of four LED supports, and then reduce injection molding channel quantity, and the distance reduced between two adjacent LEDs support, and then the closeness of LED support layout on raising metal substrate, thus improve the efficiency of injection mo(u)lding, and minimizing material consumption.
Accompanying drawing explanation
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in accompanying drawing does not form any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 be of the present utility model a kind of can the structural representation of electrically-conductive backing plate of injection mo(u)lding LED support.
Include in Fig. 1:
1-metal substrate;
2-glue injection cavities unit;
3-first longitudinal bond strip, 31-first through hole;
4-first lateral connection bar;
5-glue injection cavities;
6-Lamp cup chamber;
7-glue oral area;
8-second longitudinal bond strip, 81-second through hole;
9-second lateral connection bar;
10-locating hole.
Detailed description of the invention
With the following Examples the utility model is further described.
Of the present utility model a kind of can injection mo(u)lding LED support electrically-conductive backing plate detailed description of the invention as shown in Figure 1, its structure comprises metal substrate 1, metal substrate 1 is provided with the glue injection cavities unit 2 that several are the arrangement of matrix arrangement mode, the first longitudinal bond strip 3 is provided with between the glue injection cavities unit 2 that left and right is adjacent, the first lateral connection bar 4 is provided with between neighbouring glue injection cavities unit 2, each glue injection cavities unit 2 comprises two glue injection cavities 5 and is located at the second longitudinal bond strip 8 between two glue injection cavities 5, each glue injection cavities 5 comprises two the Lamp cup chambeies 6 be interconnected and the glue oral area 7 be located between two Lamp cup chambeies 6, the second lateral connection bar 9 is left between two Lamp cup chambeies 6 of same glue injection cavities 5.Because each glue injection cavities unit 2 comprises two glue oral areas 7, and each glue oral area 7 is communicated with two Lamp cup chambeies 6, when LED support injection mo(u)lding, plastic melts carries out injecting glue by two glue oral areas 7 to simultaneously four Lamp cup chambeies 6, and two glue oral areas 7 of same glue injection cavities unit 2 are connected to same injecting glue runner, the quantity of injecting glue runner can be effectively reduced like this, and the distance between adjacent Lamp cup chamber 6 can effectively be reduced, improve to make the closeness of LED support layout on metal substrate 1, and then improve the efficiency of LED support injection mo(u)lding, reduce inventory charge.Described glue oral area 7 is arranged at the second lateral connection bar 9 between two Lamp cup chambeies 6 of the glue injection cavities 5 belonging to it, and when can ensure injecting glue, two Lamp cup chambeies 6 is evenly shaping, and then guarantees the evenly shaping of interior four the Lamp cup chambeies 6 of whole glue injection cavities unit 2.
Further, the width of the first longitudinal bond strip 3 is greater than the width of the second longitudinal bond strip 8, and that guarantees metal substrate 1 has certain structural strength.For improving the closeness that LED support is arranged at metal substrate 1 further, the quantity of LED support on increase metal substrate 1 large as far as possible, also guarantee that metal substrate 1 has certain structural strength simultaneously, the width of the first lateral connection bar 4 is not less than the width of the second lateral connection bar 9, in the present embodiment, the width of the first lateral connection bar 4 equals the width of the second lateral connection bar 9.
For ease of LED support is stripped down from metal substrate 1, offer the first through hole 31, second longitudinal bond strip 8 between Lamp cup chamber 6 and the first longitudinal bond strip 3 and offer the second through hole 81.
When processing Lamp cup chamber 6, for ease of the location of metal substrate 1, the edge of metal substrate 1 is provided with locating hole 10, and locating hole 10 is just to the center line of the second longitudinal bond strip 8.
Finally should be noted that; above embodiment is only in order to illustrate the technical solution of the utility model; but not the restriction to the utility model protection domain; although done to explain to the utility model with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical solution of the utility model or equivalent replacement, and not depart from essence and the scope of technical solutions of the utility model.
Claims (7)
1. one kind can the electrically-conductive backing plate of injection mo(u)lding LED support, comprise metal substrate, it is characterized in that: described metal substrate is provided with several glue injection cavities unit, the first longitudinal bond strip is left between the described glue injection cavities unit that left and right is adjacent, the first lateral connection bar is left between neighbouring glue injection cavities unit, each described glue injection cavities unit comprises two glue injection cavities, and leave the second longitudinal bond strip between two glue injection cavities of same described glue injection cavities unit, each described glue injection cavities comprises two the Lamp cup chambeies be interconnected and the glue oral area be located between two Lamp cup chambeies, and leave the second lateral connection bar between two Lamp cup chambeies of same described glue injection cavities, described glue oral area is arranged at described second lateral connection bar between two Lamp cup chambeies of the described glue injection cavities belonging to it, two described glue oral areas of same described glue injection cavities unit are connected to same injecting glue runner.
2. according to claim 1 a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, it is characterized in that: the width of described first longitudinal bond strip is greater than the width of the second longitudinal bond strip.
3. according to claim 1 a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, it is characterized in that: between described Lamp cup chamber and described first longitudinal bond strip, offer the first through hole.
4. according to claim 1 a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, it is characterized in that: the width of described first lateral connection bar is not less than the width of the second lateral connection bar.
5. according to claim 1 a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, it is characterized in that: described second longitudinal bond strip offers the second through hole.
6. according to claim 1 a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, it is characterized in that: described metal substrate is provided with locating hole, described locating hole is just to described second longitudinal bond strip.
7. according to claim 1 a kind of can the electrically-conductive backing plate of injection mo(u)lding LED support, it is characterized in that: glue injection cavities unit described in several is that matrix arrangement mode is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520272997.6U CN204640697U (en) | 2015-04-30 | 2015-04-30 | A kind of can the electrically-conductive backing plate of injection mo(u)lding LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520272997.6U CN204640697U (en) | 2015-04-30 | 2015-04-30 | A kind of can the electrically-conductive backing plate of injection mo(u)lding LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204640697U true CN204640697U (en) | 2015-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520272997.6U Active CN204640697U (en) | 2015-04-30 | 2015-04-30 | A kind of can the electrically-conductive backing plate of injection mo(u)lding LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204640697U (en) |
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2015
- 2015-04-30 CN CN201520272997.6U patent/CN204640697U/en active Active
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