CN205075285U - Formula discrete device and forming die cut straightly - Google Patents
Formula discrete device and forming die cut straightly Download PDFInfo
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- CN205075285U CN205075285U CN201520834635.1U CN201520834635U CN205075285U CN 205075285 U CN205075285 U CN 205075285U CN 201520834635 U CN201520834635 U CN 201520834635U CN 205075285 U CN205075285 U CN 205075285U
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- discrete device
- mould
- fin
- dao
- thimble
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a convenient follow -up installation and the difficult formula that the cut straightly discrete device who produces the short circuit and can satisfy the heat dissipation requirement again, including fin, ji dao, three pin, semiconductor chip side by side, be provided with the mounting hole on this fin, the pin connection of this fin, jidao and centre is as an organic whole, and this semiconductor chip welds in jidao's front, and the pin of this centre is connected with semiconductor chip's drain electrode, and two other pins are connected with semiconductor chip's source electrode and grid respectively through the lead wire, ji dao's front and both sides edge, whole fin expose by plastic -sealed body cladding, jidao's reverse side, and the neighbouring semiconductor chip's of three pin tip lies in the plastic -sealed body. In addition, this utility model still discloses the forming die and the manufacturing method that should cut straightly formula discrete device.
Description
Technical field
The utility model relates to a kind of direct insertion discrete device, and discloses the preparation method of this discrete device, and is used for making the special mould of this discrete device.
Background technology
Traditional direct insertion discrete device structure comprises fin, Ji Dao, three pin, semiconductor chips side by side, this fin is provided with installing hole, the pin of this fin, Ji Dao and centre connects as one, this semiconductor chip is welded in the front of Ji Dao, the pin of this centre is connected with the drain electrode of semiconductor chip, and two other pin is connected with the source electrode of semiconductor chip and grid respectively by lead-in wire, the plastic packaging of its discrete device has three kinds of forms at present, the complete plastic packaging in a kind of Shi Ji island, and fin is all exposed; A kind of complete plastic packaging in Shi Ji island and fin only has front and installing hole to be coated with plastic packaging material; And remain a kind of Shi Ji island and fin plastic packaging all completely.The discrete device of first two form is installed on pcb board, exposed fin easily with other component contact and produce short circuit, also very high to the position accuracy demand of assembling; And the discrete device of the third form, because fin and Ji Dao all wrap up, heat radiation does not reach requirement, and therefore, it is too high that the power of chip can not do.
And the mould of current this discrete device generally comprises the upper shaping mould and compacted under mould that cooperatively interact, and utilize thimble to compress discrete device framework, the chip on discrete device framework is easily made to produce stress build up, and, discrete device framework after distortion likely blocks air discharge duct, be produce pore in plastic-sealed body, affect the yield of quality.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of and facilitate subsequent installation and the direct insertion discrete device not easily producing that short circuit can meet again cooling requirements.
Second technical problem to be solved in the utility model is in addition: the mould providing a kind of direct insertion discrete device, this forming die structure is reasonable, vacuum extractor is utilized to be fitted in the Ji Dao back side of discrete device framework and the top in plastic packaging chamber, achieve the fixing of discrete device framework, the discrete device framework long-living stress build up because thimble compresses in forming process can be avoided, reduce the distortion of framework, improve the yield rate of discrete device.
For solving above-mentioned first technical problem, the technical solution of the utility model is: provide a kind of direct insertion discrete device, comprise fin, Ji Dao, three pins side by side, semiconductor chip, this fin is provided with installing hole, this fin, Ji Dao and middle pin connect as one, this semiconductor chip is welded in the front of Ji Dao, the pin of this centre is connected with the drain electrode of semiconductor chip, and two other pin is connected with the source electrode of semiconductor chip and grid respectively by lead-in wire, the front of described Ji Dao and both sides of the edge, whole fin is coated by plastic-sealed body, the reverse side of Ji Dao is exposed, the end of the contiguous semiconductor chip of three pins is positioned at plastic-sealed body.
As the preferred scheme of one, the opposite longitudinal side edge of described Ji Dao is that plastic-sealed body is coated.
As the preferred scheme of one, the front of described fin and the front flush of Ji Dao, the reverse side of fin is connected by an intermediate incline with the reverse side of Ji Dao, and this intermediate incline and the base island direct angle of reverse side are obtuse angle.
After have employed technique scheme, effect of the present utility model is: because the base island reverse side of this discrete device is exposed, and the front of described Ji Dao and both sides of the edge, whole fin are coated by plastic-sealed body, when so attaching it on pcb board, fin, due to through insulation processing, therefore can not cause short circuit phenomenon, in addition, Ji Dao is the carrying position as chip, and reverse side is exposed, greatly improves heat dispersion.
For solving above-mentioned second technical problem, the utility model provides a kind of mould for making direct insertion discrete device, and this mould comprises the upper shaping mould and compacted under mould that cooperatively interact:
Described upper shaping mould comprises upper plate, cope match-plate pattern, upper mould body and upper ejector pin mechanism, described cope match-plate pattern is fixed on upper plate by fixed bar, upper mould body is fixed on the lower surface of cope match-plate pattern, mould body is provided with model cavity for this, on this, ejector pin mechanism comprises the upper ejector retainner plate fluctuating and be arranged between cope match-plate pattern and upper plate, ejector retainner plate is fixed with thimble for this, on this, the lower end of thimble is run through described cope match-plate pattern with upper mould body and to be communicated with upper model cavity, on this, the position ejecting position and fin of thimble is suitable, this is provided with extension spring between ejector retainner plate and cope match-plate pattern,
Described compacted under mould comprises lower shoe, lower bolster, lower mould body and lower ejector pin mechanism, described lower bolster is fixed on lower shoe by fixed bar, lower mould body is fixed on the upper surface of lower bolster, this lower mould body is provided with counterdie die cavity, this lower ejector pin mechanism comprises the lower ejector retainner plate fluctuating and be arranged between lower bolster and lower shoe, this lower ejector retainner plate is fixed with some upper thimbles, the upper end of this lower thimble is run through described lower bolster with lower mould body and is communicated with counterdie die cavity, the position ejecting position and Ji Dao and fin of this lower thimble is suitable, stage clip is provided with between this lower ejector retainner plate and lower bolster, on this, model cavity and counterdie die cavity coordinate the plastic packaging chamber being configured for placing discrete device framework jointly, the general frame that this discrete device framework is connected into by brace by multiple discrete device unit, the reverse side of discrete device framework is positioned in plastic packaging chamber upward, this plastic packaging chamber is provided with injection channel and exhaust passage,
The push rod of ejector retainner plate on pushing tow when at matched moulds, this push rod is fixed on lower bolster; The upper end of this push rod when matched moulds on pushing tow ejector retainner plate make the lower end of thimble leave in membranous type chamber;
For the lower push rod of ejector retainner plate under the pushing tow when die sinking, this lower shoe is provided with the through hole facilitating lower push rod to run through, this lower push rod is installed on the lower power end of folding mould power set;
Vacuum extractor, the vacuum-pumping tube of this vacuum extractor is connected with cope match-plate pattern and the aspiration end of vacuum-pumping tube extends to upper model cavity is communicated with upper model cavity, the position of the aspiration end of this vacuum-pumping tube and the location matches of Ji Dao.
As the preferred scheme of one, described injection channel is arranged at the brace place of discrete device framework.
After have employed technique scheme, effect of the present utility model is: the discrete device in this mould is the top utilizing the negative pressure of vacuum extractor to carry out being adsorbed on plastic packaging chamber, guarantee that base island reverse side and the plastic packaging top of chamber of discrete device fit tightly, simultaneously, the upper thimble of this mould and the effect of lower thimble are not for compressing discrete device framework, but whole product after utilizing upper thimble and lower thimble to make plastic packaging and upper shaping mould and compacted under moulding/demoulding are used, therefore, discrete device framework can be reduced be squeezed and stress build up in injection moulding process, reduce deflection, avoid the blocking of exhaust passage, improve quality and the yield rate of product.
The utility model additionally provides a kind of preparation method of direct insertion discrete device, and it comprises the following steps:
A, one is provided to connect into overall discrete device framework by multiple discrete device unit by brace;
B, by chips welding on the Ji Dao of each discrete device unit of discrete device framework;
C, lead-in wire is welded in each discrete device unit chip with on corresponding pin;
D, be placed in the mould be heated between 165 DEG C-185 DEG C by the discrete device framework having welded chip and lead-in wire, the face down of discrete device framework is arranged;
E, matched moulds start to vacuumize, make the base island reverse side of discrete device framework and the upper surface of mould fit and last till that injection moulding terminates;
F, plastic packaging material to be injected in the plastic packaging chamber of mould by the mode of pressure injection, and 4 × 10
6pa-6 × 10
6240s-300s is kept under the Pressure Casting of pa;
G, closedown vacuum, discrete device framework is taken out in die sinking;
I, zinc-plated process is carried out to pin surface;
H, discrete device framework is carried out die-cut, form discrete discrete device.
As the preferred scheme of one, the vacuum vacuumized in described step e is 70-90Torr.
As the preferred scheme of one, in described step F, the injection port of plastic packaging material is near pin end.
As the preferred scheme of one, the flow channel that described injection hole is connected with plastic packaging chamber is in the brace region of discrete device framework.
After have employed technique scheme, effect of the present utility model is: this forming method can produce above-mentioned discrete device, while improving the radiating effect of discrete device, decreases short circuit phenomenon, facilitates the later stage to install.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the partial structurtes schematic diagram of the discrete device framework of the utility model embodiment;
Fig. 2 is the side view of discrete device framework;
Fig. 3 is the front view of discrete device;
Fig. 4 is the rearview of Fig. 3;
Fig. 5 is the left view of Fig. 3;
Fig. 6 is the structural representation of mould;
In accompanying drawing: 1. discrete device framework; 11. discrete device unit; 111. fin; 112. Ji Dao; 113. interim pins; 114. left tubing feet; Pin on the right side of in the of 115.; 116. plastic-sealed body; 117. lead-in wire; 118. semiconductor chip; 12. braces; 2. go up shaping mould; 21. upper plates; Ejector retainner plate on 22.; Thimble on 23.; 24. fixed bars; 25. cope match-plate patterns; Mould body on 26.; 27. upper reset springs; 28. vacuum-pumping tubes; 3. compacted under mould; 31. lower shoes; 32. lower bolsters; 33. times mould bodies; 34. times thimbles; 35. stage clips; 36. lower push rods; 37. push rods.
Detailed description of the invention
Below by specific embodiment, the utility model is described in further detail.
As Fig. 3, 4, shown in 5, a kind of direct insertion discrete device, comprise fin 111, base island 112, three pins side by side, semiconductor chip 118, this fin 111 is provided with installing hole, this fin 111, base island 112 and middle pin connect as one, this semiconductor chip 118 is welded in the front on base island 112, the pin of this centre is connected with the drain electrode of semiconductor chip 118, and two other pin is connected with the source electrode of semiconductor chip 118 and grid respectively by lead-in wire 117, wherein, describe with the orientation in Fig. 3 residing for discrete device, what be in left side is left tubing feet 114, what be in right side is right side pin one 15, what mediate is interim pins 113, interim pins 113 is connected with the drain electrode of semiconductor chip 118, left tubing feet 114 is connected with the grid of semiconductor chip 118, and right side pin one 15 is connected with the source electrode of semiconductor chip 118, the front on described base island 112 and both sides of the edge, whole fin 111 is coated by plastic-sealed body 116, the reverse side on base island 112 is exposed, the end of the contiguous semiconductor chip 118 of three pins is positioned at plastic-sealed body 116.And further, the opposite longitudinal side edge on described base island 112 is that plastic-sealed body 116 is coated.The front of described fin 111 and the front flush on base island 112, the reverse side of fin 111 is connected by an intermediate incline with the reverse side on base island 112, this intermediate incline and the base island 112 direct angle of reverse side are obtuse angle, this structure can facilitate fin 111 by plastic packaging material entirety parcel, makes the reverse side of the plastic-sealed body 116 of fin 111 concordant with the reverse side on base island 112.
Because base island 112 reverse side of this discrete device is exposed, and the front on described base island 112 and both sides of the edge, whole fin 111 are coated by plastic-sealed body 116, when so attaching it on pcb board, fin 111 is insulated by plastic-sealed body 116 and can not cause short circuit phenomenon, in addition, base island 112 is the carrying positions as chip, and reverse side is exposed, greatly improve heat dispersion, the cooling requirements of high power semiconductor chip 118 can be met like this.
As shown in Figure 6, the utility model additionally provides a kind of mould for making direct insertion discrete device in addition, and this mould comprises the upper shaping mould 2 and compacted under mould 3 that cooperatively interact:
Described upper shaping mould 2 comprises upper plate 21, cope match-plate pattern 25, upper mould body 26 and upper thimble 23 mechanism, described cope match-plate pattern 25 is fixed on upper plate 21 by fixed bar 24, upper mould body 26 is fixed on the lower surface of cope match-plate pattern 25, mould body 26 is provided with model cavity for this, on this, thimble 23 mechanism comprises upper thimble 23 plate 22 fluctuating and be arranged between cope match-plate pattern 25 and upper plate 21, thimble 23 plate 22 is fixed with thimble 23 for this, on this, the lower end of thimble 23 is run through described cope match-plate pattern 25 with upper mould body 26 and is communicated with upper model cavity, on this, the position ejecting position and fin 111 of thimble 23 is suitable, this is provided with extension spring between thimble 23 plate 22 and cope match-plate pattern 25, this extension spring is as upper reset spring 27, its effect is to provide the downward active force of thimble 23 plate 22 1, force lower thimble 34 plate pushing tow discrete device when die sinking, therefore, this extension spring also becomes stage clip 35, just this stage clip 35 needs to be arranged between thimble 23 plate 22 and upper plate 21,
Described compacted under mould 3 comprises lower shoe 31, lower bolster 32, lower mould body 33 and lower thimble 34 mechanism, described lower bolster 32 is fixed on lower shoe 31 by fixed bar 24, lower mould body 33 is fixed on the upper surface of lower bolster 32, this lower mould body 33 is provided with counterdie die cavity, this lower thimble 34 mechanism comprises lower thimble 34 plate fluctuating and be arranged between lower bolster 32 and lower shoe 31, this lower thimble 34 plate is fixed with some upper thimbles 23, the upper end of this lower thimble 34 is run through described lower bolster 32 with lower mould body 33 and is communicated with counterdie die cavity, the position ejecting position and base island 112 and fin 111 of this lower thimble 34 is suitable, stage clip 35 is provided with between this lower thimble 34 plate and lower bolster 32, in like manner, this stage clip 35 also can be changed into the extension spring be installed between lower thimble 34 plate and lower shoe 31.
On this, model cavity and counterdie die cavity coordinate the plastic packaging chamber being configured for placing discrete device framework 1 jointly, the general frame that this discrete device framework 1 is connected into by brace 12 by multiple discrete device unit 11, as shown in Figure 1, 2, this discrete device framework is stamp out several discrete device unit 11 on one sheet in fact, each discrete device unit 11 is connected by brace 12, unified injection moulding, the reverse side of discrete device framework 1 is positioned in plastic packaging chamber upward, and this plastic packaging chamber is provided with injection channel and exhaust passage; Generally preferred, described injection channel is arranged at brace 12 place of discrete device framework 1, even if form the exterior quality that injection moulding vestige also can not affect product at this position like this.
The push rod 37 of thimble 23 plate 22 on pushing tow when at matched moulds, this push rod 37 is fixed on lower bolster 32; The upper end of this push rod 37 when matched moulds on pushing tow thimble 23 plate 22 make the lower end of thimble 23 leave in membranous type chamber;
For the lower push rod 36 of thimble 34 plate under the pushing tow when die sinking, this lower shoe 31 is provided with the through hole facilitating lower push rod 36 to run through, and this lower push rod 36 is installed on the lower power end of folding mould power set;
Vacuum extractor, the vacuum-pumping tube 28 of this vacuum extractor is connected with cope match-plate pattern 25 and the aspiration end of vacuum-pumping tube 28 extends to upper model cavity is communicated with upper model cavity, the position of the aspiration end of this vacuum-pumping tube 28 and the location matches on base island 112.
Discrete device in this mould is the top utilizing the negative pressure of vacuum extractor to carry out being adsorbed on plastic packaging chamber, guarantee that base island 112 reverse side and the plastic packaging top of chamber of discrete device fit tightly, simultaneously, the upper thimble 23 of this mould and the effect of lower thimble 34 are not for compressing discrete device framework 1, but whole product after utilizing upper thimble 23 and lower thimble 34 to make plastic packaging and upper shaping mould 2 and compacted under mould 3 demoulding are used, when matched moulds time, on push rod 37 meeting pushing tow, thimble 23 plate 22 moves upward, thus force the lower end of thimble 23 to leave plastic packaging chamber, and simultaneously, lower thimble 34 plate makes the upper end of lower thimble 34 leave plastic packaging chamber under the action of the spring, therefore thimble 23 is gone up and lower thimble 34 can't affect injection moulding, and after injection moulding completes, lower shoe 31 is driven by power set and moves down, now, push rod 37 leaves thimble 23 plate 22, thus upper thimble 23 moves downward under the action of the spring, pushing tow discrete device makes itself and upper shaping mould 2 depart from, then, after lower shoe 31 moves to certain position, thimble 34 plate under lower push rod 36 meeting pushing tow, lower thimble 34 is moved upward, discrete device and compacted under mould 3 are departed from, thus convenient taking-up, this mould can reduce discrete device framework 1 and be squeezed and stress build up in injection moulding process, reduce deflection, avoid the blocking of exhaust passage, improve quality and the yield rate of product.
In addition, the utility model provides a kind of preparation method of direct insertion discrete device, and it comprises the following steps:
A, one is provided to connect into overall discrete device framework 1 by multiple discrete device unit 11 by brace 12;
B, by chips welding on the base island 112 of each discrete device unit 11 of discrete device framework 1;
C, lead-in wire 117 is welded in the chip of each discrete device unit 11 with on corresponding pin;
D, be placed in the mould be heated between 165 DEG C-185 DEG C by the discrete device framework 1 having welded chip and lead-in wire 117, the face down of discrete device framework 1 is arranged;
E, matched moulds start to vacuumize, make base island 112 reverse side of discrete device framework 1 and the upper surface of mould fit and last till that injection moulding terminates, this vacuum degree control vacuumized is at 70-90Torr;
F, plastic packaging material to be injected in the plastic packaging chamber of mould by the mode of pressure injection, and 4 × 10
6pa-6 × 10
6240s-300s is kept under the Pressure Casting of pa; The injection port of plastic packaging material is near pin end, and this 240s-300s comprises injection time and plastics cool times.
G, closedown vacuum, discrete device framework 1 is taken out in die sinking;
I, zinc-plated process is carried out to pin surface;
H, discrete device framework 1 is carried out die-cut, form discrete discrete device.The flow channel that described injection hole is connected with plastic packaging chamber is in brace 12 region of discrete device framework 1.
The above embodiment is only the description to preferred embodiment of the present utility model; not as the restriction to the utility model scope; on the basis not departing from the utility model design spirit; the various distortion make technical solutions of the utility model and transformation, all should fall in protection domain that claims of the present utility model determine.
Claims (5)
1. a direct insertion discrete device, comprise fin, Ji Dao, three pins side by side, semiconductor chip, this fin is provided with installing hole, it is characterized in that: this fin, Ji Dao and middle pin connect as one, this semiconductor chip is welded in the front of Ji Dao, the pin of this centre is connected with the drain electrode of semiconductor chip, and two other pin is connected with the source electrode of semiconductor chip and grid respectively by lead-in wire, the front of described Ji Dao and both sides of the edge, whole fin is coated by plastic-sealed body, the reverse side of Ji Dao is exposed, the end of the contiguous semiconductor chip of three pins is positioned at plastic-sealed body.
2. a kind of direct insertion discrete device as claimed in claim 1, is characterized in that: the opposite longitudinal side edge of described Ji Dao is that plastic-sealed body is coated.
3. a kind of direct insertion discrete device as claimed in claim 2, it is characterized in that: the front of described fin and the front flush of Ji Dao, the reverse side of fin is connected by an intermediate incline with the reverse side of Ji Dao, and this intermediate incline and the base island direct angle of reverse side are obtuse angle.
4., for making the mould as the direct insertion discrete device in claim 1, this mould comprises the upper shaping mould and compacted under mould that cooperatively interact, it is characterized in that:
Described upper shaping mould comprises upper plate, cope match-plate pattern, upper mould body and upper ejector pin mechanism, described cope match-plate pattern is fixed on upper plate by fixed bar, upper mould body is fixed on the lower surface of cope match-plate pattern, mould body is provided with model cavity for this, on this, ejector pin mechanism comprises the upper ejector retainner plate fluctuating and be arranged between cope match-plate pattern and upper plate, ejector retainner plate is fixed with thimble for this, on this, the lower end of thimble is run through described cope match-plate pattern with upper mould body and to be communicated with upper model cavity, on this, the position ejecting position and fin of thimble is suitable, this is provided with extension spring between ejector retainner plate and cope match-plate pattern,
Described compacted under mould comprises lower shoe, lower bolster, lower mould body and lower ejector pin mechanism, described lower bolster is fixed on lower shoe by fixed bar, lower mould body is fixed on the upper surface of lower bolster, this lower mould body is provided with counterdie die cavity, this lower ejector pin mechanism comprises the lower ejector retainner plate fluctuating and be arranged between lower bolster and lower shoe, this lower ejector retainner plate is fixed with some upper thimbles, the upper end of this lower thimble is run through described lower bolster with lower mould body and is communicated with counterdie die cavity, the position ejecting position and Ji Dao and fin of this lower thimble is suitable, stage clip is provided with between this lower ejector retainner plate and lower bolster, on this, model cavity and counterdie die cavity coordinate the plastic packaging chamber being configured for placing discrete device framework jointly, the general frame that this discrete device framework is connected into by brace by multiple discrete device unit, the reverse side of discrete device framework is positioned in plastic packaging chamber upward, this plastic packaging chamber is provided with injection channel and exhaust passage,
The push rod of ejector retainner plate on pushing tow when at matched moulds, this push rod is fixed on lower bolster; The upper end of this push rod when matched moulds on pushing tow ejector retainner plate make the lower end of thimble leave in membranous type chamber;
For the lower push rod of ejector retainner plate under the pushing tow when die sinking, this lower shoe is provided with the through hole facilitating lower push rod to run through, this lower push rod is installed on the lower power end of folding mould power set;
Vacuum extractor, the vacuum-pumping tube of this vacuum extractor is connected with cope match-plate pattern and the aspiration end of vacuum-pumping tube extends to upper model cavity is communicated with upper model cavity, the position of the aspiration end of this vacuum-pumping tube and the location matches of Ji Dao.
5. the mould of the direct insertion discrete device as shown in claim 4, is characterized in that: described injection channel is arranged at the brace place of discrete device framework.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520834635.1U CN205075285U (en) | 2015-10-26 | 2015-10-26 | Formula discrete device and forming die cut straightly |
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| CN201520834635.1U CN205075285U (en) | 2015-10-26 | 2015-10-26 | Formula discrete device and forming die cut straightly |
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| CN205075285U true CN205075285U (en) | 2016-03-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105252712A (en) * | 2015-10-26 | 2016-01-20 | 张家港凯思半导体有限公司 | Direct insertion type discrete device, manufacturing method and forming die |
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2015
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105252712A (en) * | 2015-10-26 | 2016-01-20 | 张家港凯思半导体有限公司 | Direct insertion type discrete device, manufacturing method and forming die |
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