CN204622355U - A kind of novel sapphire wafer system of processing - Google Patents
A kind of novel sapphire wafer system of processing Download PDFInfo
- Publication number
- CN204622355U CN204622355U CN201520120684.9U CN201520120684U CN204622355U CN 204622355 U CN204622355 U CN 204622355U CN 201520120684 U CN201520120684 U CN 201520120684U CN 204622355 U CN204622355 U CN 204622355U
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- wafer
- sapphire wafer
- screen
- processing
- silk
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Abstract
The utility model discloses a kind of novel sapphire wafer system of processing, comprise the screen printing device (2) that can carry out silk-screen to monoblock sapphire wafer, it is characterized in that, after described screen printing device (2), be also provided with cutter sweep (4), burnishing device (6), cleaning device (8) successively.In the utility model, the mode of cutting after adopting first silk-screen, reduces process implementing difficulty, improves production efficiency and qualification rate.
Description
Technical field
The utility model relates to a kind of novel sapphire wafer system of processing.
Background technology
Existing Sapphire mobile phone camera protection cover and fingerprint recognition protection screen all adopt double side polished wafers through the technique of laser cutting or machine cuts then silk-screen, plated film, the deficiency that existing technique mainly exists: mobile phone camera over cap, fingerprint recognition protection screen all have drawn from sapphire double side polished wafers, its size is less, silk-screen once can only print a slice or several, is difficult to form large-scale production;
Utility model content
The technical problems to be solved in the utility model is to provide a kind of can to produce in enormous quantities.
For solving the problem, the utility model provides a kind of novel sapphire wafer system of processing, comprises the screen printing device that can carry out silk-screen to monoblock sapphire wafer, it is characterized in that, be also provided with successively after described screen printing device:
-cutter sweep, described sapphire wafer can be cut into some pieces of wafer splits of goal standard by it;
-burnishing device, can carry out polishing to the two-sided of described wafer split;
-cleaning device, can carry out cleaning treatment to the described wafer split after polishing.
As further improvement of the utility model, being provided with between described screen printing device and described cutter sweep can to the one side of described sapphire wafer or the two-sided coating apparatus carrying out plated film.
As further improvement of the utility model, described cleaning device is ultrasonic cleaning equipment.
As further improvement of the utility model, after described cleaning device, be also provided with the packing device can packed each described wafer split.
The beneficial effects of the utility model are,
(1) in the utility model, the mode of cutting after adopting first silk-screen, reduce process implementing difficulty, because no matter manually silk-screen or machine silk-screen, carrying out silk screen printing process to whole wafer, to implement difficulty low more than carrying out enforcement to little wafer, is mainly manifested in the ink overflow of Waffer edge, prints the enforcement difficulty of the aspect such as inclined;
(2) enhance productivity, silk-screen is carried out to whole face and wants the split of comparison wafer to carry out silk-screen efficiency one by one to want fast 10-15 doubly
(3) improving yield, can quality control factors be reduced by carrying out silk-screen to whole wafer, improve finished product yield and reduce product control difficulty.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Wherein: 2-screen printing device; 4-cutter sweep; 6-burnishing device; 8-cleaning device; 10-packing device.
Detailed description of the invention
Below detailed description of the invention of the present utility model is described in further detail.
As shown in Figure 1, the utility model comprises the screen printing device 2 that can carry out silk-screen to monoblock sapphire wafer, it is characterized in that, is also provided with successively after described screen printing device 2:
-cutter sweep 4, described sapphire wafer can be cut into some pieces of wafer splits of goal standard by it;
-burnishing device 6, can carry out polishing to the two-sided of described wafer split;
-cleaning device 8, can carry out cleaning treatment to the described wafer split after polishing.
As further improvement of the utility model, being provided with between described screen printing device 2 and described cutter sweep 4 can to the one side of described sapphire wafer or the two-sided coating apparatus carrying out plated film.
As further improvement of the utility model, described cleaning device 8 is ultrasonic cleaning equipment 8.
As further improvement of the utility model, after described cleaning device 8, be also provided with the packing device can packed each described wafer split.
Concrete principle of the present utility model is as follows:
1. simulate the higher sapphire wafer double side polished wafers size of rate of drawing materials through CAD;
2. make supporting silk-screen wafer according to the double side polished wafers size of selected sapphire wafer and place tool and according to needing the graphic making film of silk-screen and shining web plate processed;
3. tinctorial pattern configures ink and carries out silk-screen by screen printing device 2 to whole surface sapphire wafer according to demand;
4. the sapphire wafer plating single or double anti-reflection film that pair silk-screen is good;
5., by cutter sweep 4, the sapphire wafer after silk-screen is laser-cut into some wafer splits;
6, by burnishing device 6, carry out polishing to the two-sided of wafer split
7. Ultrasonic Cleaning is carried out in the wafer split after pair cutting;
8. the finished product wafer after pair cleaning is packed.
Of the present utility modelly to be a little,
(3) in the utility model, the mode of cutting after adopting first silk-screen, reduce process implementing difficulty, because no matter manually silk-screen or machine silk-screen, carrying out silk screen printing process to whole wafer, to implement difficulty low more than carrying out enforcement to little wafer, is mainly manifested in the ink overflow of Waffer edge, prints the enforcement difficulty of the aspect such as inclined;
(4) enhance productivity, silk-screen is carried out to whole face and wants the split of comparison wafer to carry out silk-screen efficiency one by one to want fast 10-15 doubly
(3) improving yield, can quality control factors be reduced by carrying out silk-screen to whole wafer, improve finished product yield and reduce product control difficulty.
Above embodiment is only the utility model a kind of embodiment wherein, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (4)
1. a novel sapphire wafer system of processing, comprises the screen printing device (2) that can carry out silk-screen to monoblock sapphire wafer, it is characterized in that, is also provided with successively after described screen printing device (2):
-cutter sweep (4), described sapphire wafer can be cut into some pieces of wafer splits of goal standard by it;
-burnishing device (6), can carry out polishing to the two-sided of described wafer split;
-cleaning device (8), can carry out cleaning treatment to the described wafer split after polishing.
2. the novel sapphire wafer system of processing of one according to claim 1, it is characterized in that, being provided with between described screen printing device (2) and described cutter sweep (4) can to the one side of described sapphire wafer or the two-sided coating apparatus carrying out plated film.
3. the novel sapphire wafer system of processing of one according to claim 2, is characterized in that, described cleaning device (8) is ultrasonic cleaning equipment.
4. the novel sapphire wafer system of processing of one according to claim 3, is characterized in that, is also provided with the packing device (10) can packed each described wafer split after described cleaning device (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520120684.9U CN204622355U (en) | 2015-02-14 | 2015-02-14 | A kind of novel sapphire wafer system of processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520120684.9U CN204622355U (en) | 2015-02-14 | 2015-02-14 | A kind of novel sapphire wafer system of processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204622355U true CN204622355U (en) | 2015-09-09 |
Family
ID=54041414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520120684.9U Expired - Fee Related CN204622355U (en) | 2015-02-14 | 2015-02-14 | A kind of novel sapphire wafer system of processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204622355U (en) |
-
2015
- 2015-02-14 CN CN201520120684.9U patent/CN204622355U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 Termination date: 20200214 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |