CN204621791U - A kind of twin grinding dish of carry wafer holddown groove - Google Patents
A kind of twin grinding dish of carry wafer holddown groove Download PDFInfo
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- CN204621791U CN204621791U CN201520114124.2U CN201520114124U CN204621791U CN 204621791 U CN204621791 U CN 204621791U CN 201520114124 U CN201520114124 U CN 201520114124U CN 204621791 U CN204621791 U CN 204621791U
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- holddown groove
- wafer
- abrasive disk
- lower abrasive
- groove
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Abstract
The utility model discloses a kind of twin grinding dish of carry wafer holddown groove, comprising the top lap of split setting and lower abrasive disk, it is characterized in that: the abradant surface of described lower abrasive disk offers multiple holddown groove for placing described wafer.The mode fixing wafer with erratic star wheel of the utility model abandoning tradition, and adopt and directly on lower abrasive disk, offer holddown groove and fix wafer, so fixedly make between wafer and lower abrasive disk without relative motion, overcome the problem of the grinding inequality that existing wafer causes because of spinning motion, improve the yield of wafer grinding; Meanwhile, the structure of particular design makes the groove depth of holddown groove to regulate, and is suitable for the use of multi-thickness crystal, has simple to operate, that grinding efficiency is high advantage.
Description
Technical field
The utility model relates to and is a kind ofly arranged on twin grinding dish two-lap lapping machine mating use, particularly relates to a kind of twin grinding dish of carry wafer holddown groove.
Background technology
At present, two-lap lapping machine is the special machine of grinding semiconductor silicon chip, optical crystal chip contour smooth grinding workpiece, and upper and lower abrasive disk is its main working parts, directly dominates quality and the technical parameter of abrasive product.Top lap is arranged on the support of vertical lift, presses down mill setting and is that, on the pedestal that top lap is corresponding, wafer is placed on the erratic star wheel above lower abrasive disk, and during operation, lower abrasive disk abradant surface rotating close mill is down to by top lap.Existing upper-lower grinding disk for two-side lapping machine is made rightabout and is rotated, and wafer exists and is difficult to controlled rotation on the erratic star wheel between upper and lower abrasive disk, and easily cause wafer each position grinding uneven, formation wafer profile is bad; Meanwhile, existing two-lap lapping machine needs erratic star wheel to fix wafer, and the thickness of wafer is limited to the thickness of erratic star wheel, and erratic star wheel deformation easily causes wafer to deviate from.
Utility model content
It is more easy to operate that the technical problems to be solved in the utility model is to provide one, and efficiency is high and avoid producing the uneven twin grinding dish of grinding.
For solving the problem, the utility model adopts the twin grinding dish providing a kind of carry wafer holddown groove, comprising the top lap of split setting and lower abrasive disk, it is characterized in that: the abradant surface of described lower abrasive disk offers multiple holddown groove for placing described wafer.
In the utility model preferred embodiment, comprise the through slot that described holddown groove is through lower abrasive disk thickness direction further, the below of described lower abrasive disk is provided with the supporting disk that can be elevated, and in the card of described supporting disk, the position of corresponding described holddown groove is provided with the groove depth regulating block that can insert in holddown groove.
In the utility model preferred embodiment, comprise further described groove depth regulating block be described in one_to_one corresponding holddown groove arrange multiple.
In the utility model preferred embodiment, comprise multiple described holddown groove further and be square groove, it at least has two different sizes.
In the utility model preferred embodiment, the abradant surface comprising described top lap is further provided with the lapping liquid caulking groove of the arrangement in " well " font.
The beneficial effects of the utility model are: the mode fixing wafer with erratic star wheel of the utility model abandoning tradition, and adopt and directly on lower abrasive disk, offer holddown groove and fix wafer, so fixedly make between wafer and lower abrasive disk without relative motion, overcome the problem of the grinding inequality that existing wafer causes because of spinning motion, improve the yield of wafer grinding; Meanwhile, the structure of particular design makes the groove depth of holddown groove to regulate, and is suitable for the use of multi-thickness crystal, has simple to operate, that grinding efficiency is high advantage.
Accompanying drawing explanation
Fig. 1 is the structural representation of the lower abrasive disk of the utility model preferred embodiment;
Fig. 2 is the enlarged drawing of A point in the structural representation of the top lap of the utility model preferred embodiment and figure;
The sectional view of the twin grinding dish of Fig. 3 the utility model second embodiment.
In figure: 2, top lap, 4, lower abrasive disk, 6, holddown groove, 8, supporting disk, 10, groove depth regulating block, 12, lapping liquid caulking groove.
Detailed description of the invention
Below detailed description of the invention of the present utility model is described in further detail.
As Figure 1-3, the utility model provides a kind of and is arranged on twin grinding dish two-lap lapping machine mating use, comprise the top lap 2 of split setting and lower abrasive disk 4, top lap 2 is arranged on the support of vertical lift in use, pressing down mill 4 setting is on the pedestal that top lap 2 is corresponding, the abradant surface of described top lap 2 is provided with the lapping liquid caulking groove 12 of the arrangement in " well " font, the abradant surface of described lower abrasive disk 4 offers multiple holddown groove 6 for placing wafer, holddown groove 6 is the square groove of the structural design of corresponding wafer, it at least has two different sizes, the wafer of at least two kinds of different sizes can be placed, as the novel preferred embodiment of this practicality, the blind slot that holddown groove 6 is not through.In use, be placed in successively by wafer in holddown groove 6, the slow top lap 2 that falls makes it to close with lower abrasive disk 4 one side ground wafer and grinds, when being ground to pre-set dimension, delay and go up abrasive disk 2, stir wafer and unfocused surface is placed upward, continue grinding and eat preliminary dimension.By directly offering the holddown groove of fixed wafer in the grinding card of lower abrasive disk 4, to make between wafer and lower abrasive disk 4, without relative motion, to overcome the problem of the grinding inequality that existing wafer causes because of spinning motion, improving the yield of wafer grinding; Meanwhile, during grinding, the abrasive action of abrasive material to wafer concentrates on upper surface, and therefore efficiency is higher; On the other hand, abrasive disk of the present utility model is in use without the need to using erratic star wheel, and wafer grinding operation is more efficient and convenient.
As the second embodiment of the present utility model, described holddown groove 6 is the through slot of through lower abrasive disk 4 thickness direction, the below of lower abrasive disk 4 is provided with the supporting disk 8 that can be elevated, in the card of described supporting disk 8, the position of corresponding described holddown groove 6 is provided with the groove depth regulating block 10 that can insert in holddown groove 6, described groove depth regulating block 10 for holddown groove described in one_to_one corresponding 6 arrange multiple.Regulate groove depth regulating block 10 to insert the degree of depth in holddown groove 6 from below by lifting supporting disk 8, reach the object regulating holddown groove groove depth, the wafer grinding use of differing heights can be suitable for.
Above embodiment is only the utility model a kind of embodiment wherein, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (5)
1. a twin grinding dish for carry wafer holddown groove, comprising the top lap of split setting and lower abrasive disk, it is characterized in that: the abradant surface of described lower abrasive disk offers multiple holddown groove for placing described wafer.
2. the twin grinding dish of a kind of carry wafer holddown groove according to claim 1, it is characterized in that: described holddown groove is the through slot of through lower abrasive disk thickness direction, the below of described lower abrasive disk is provided with the supporting disk that can be elevated, and in the card of described supporting disk, the position of corresponding described holddown groove is provided with the groove depth regulating block that can insert in holddown groove.
3. the twin grinding dish of a kind of carry wafer holddown groove according to claim 2, is characterized in that: described groove depth regulating block is multiple for holddown groove setting described in one_to_one corresponding.
4. the twin grinding dish of a kind of carry wafer holddown groove according to claim 3, it is characterized in that: multiple described holddown groove is square groove, it at least has two different sizes.
5. the twin grinding dish of a kind of carry wafer holddown groove according to claim 1, is characterized in that: the abradant surface of described top lap is provided with the lapping liquid caulking groove of the arrangement in " well " font.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520114124.2U CN204621791U (en) | 2015-02-14 | 2015-02-14 | A kind of twin grinding dish of carry wafer holddown groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520114124.2U CN204621791U (en) | 2015-02-14 | 2015-02-14 | A kind of twin grinding dish of carry wafer holddown groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204621791U true CN204621791U (en) | 2015-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520114124.2U Active CN204621791U (en) | 2015-02-14 | 2015-02-14 | A kind of twin grinding dish of carry wafer holddown groove |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106002610A (en) * | 2016-07-05 | 2016-10-12 | 国营芜湖机械厂 | Ultrathin gasket grinding parallelism control device and grinding machining method thereof |
| CN109822450A (en) * | 2017-11-23 | 2019-05-31 | 北京创昱科技有限公司 | Single-sided polishing multi-wafer thickness compensation device and milling apparatus and grinding method |
-
2015
- 2015-02-14 CN CN201520114124.2U patent/CN204621791U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106002610A (en) * | 2016-07-05 | 2016-10-12 | 国营芜湖机械厂 | Ultrathin gasket grinding parallelism control device and grinding machining method thereof |
| CN106002610B (en) * | 2016-07-05 | 2019-05-10 | 国营芜湖机械厂 | A kind of super book gasket grinding depth of parallelism control device and its grinding method |
| CN109822450A (en) * | 2017-11-23 | 2019-05-31 | 北京创昱科技有限公司 | Single-sided polishing multi-wafer thickness compensation device and milling apparatus and grinding method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Cheng Xiaoguang Inventor before: Yang Xinhong |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171226 Address after: 224200 Wei Six Road No. 1, Dongtai Economic Development Zone, Yancheng City, Jiangsu Patentee after: Dongtai Dongfeng ho new Mstar Technology Ltd Address before: 224200 Wei Six Road No. 1, Dongtai Economic Development Zone, Yancheng City, Jiangsu Patentee before: JIANGSU GOODFEEL OPTO TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right |