CN204598470U - PCB electroplating process complete equipment - Google Patents
PCB electroplating process complete equipment Download PDFInfo
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- CN204598470U CN204598470U CN201520234489.9U CN201520234489U CN204598470U CN 204598470 U CN204598470 U CN 204598470U CN 201520234489 U CN201520234489 U CN 201520234489U CN 204598470 U CN204598470 U CN 204598470U
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- pcb
- complete equipment
- electroplating process
- process complete
- washing mechanism
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Abstract
The utility model provides a kind of PCB electroplating process complete equipment, described PCB electroplating process complete equipment is provided with nog plate system, level except colloid system and horizontal Direct Electroplating system, and described level is removed colloid system and is from left to right sequentially provided with bulk mechanism, only water washing mechanism, de-smear mechanism, reclaims water washing mechanism and average mechanism; Described horizontal Direct Electroplating system is from left to right sequentially provided with whole aperture apparatus, oxidation unit, catalytic unit, PCB panel turnover device, No. two catalytic units and a clear water cleaning device.Owing to being optimized in multiple operations of plate process, structure of the present utility model is simple, plate treatment effeciency and plate Disposal quality all improve a lot.
Description
Technical field
The invention belongs to pcb board processing technique field, specifically, relate to a kind of complete equipment shortening PCB electroplating process.
Background technology
Traditionally, the processing method making outer-layer circuit comprises the following steps: plate is electroplated: make each sandwich circuit conducting and connection; Nog plate: greasy dirt and the alligatoring copper surface of removing copper surface, strengthen the adhesion of dry grinding and copper face; Pad pasting: under pressurization, heating condition, makes dry film firmly be combined in cleaning, alligatoring copper-clad plate; Exposure: dry film photoresist, after UV illumination is penetrated, cross-linking polymerization occurs, not being developed liquid by the sclerosis of illumination part film forming affected; Development: by the certain density Na of the part without ultraviolet radiation on dry film
2cO
3solubilize; Through ultraviolet radiation, the part of polymerization reaction take place retains; Figure electricity: use the principles of chemistry that hole copper and face copper are plated to MI requirement; Move back film: by the dry film effect of strong base solution with the light that exposed to the sun, decorporated by the film on figure, the remaining copper coin having figure; Etching: the unexposed layers of copper having revealed copper part is etched away; Move back tin: by the effect of tin stripper solution, the tin on figure is decorporated, the remaining copper coin having figure.
Chinese patent CN 104023480 A discloses a kind of processing method shortening PCB electroplating process, mainly comprise panel plating, nog plate, pad pasting, exposure, development, etching and move back film step, adopt this special technological process of panel plating, directly etched to the unexposed layers of copper having revealed copper part by acid etching manufacture craft, thus minimizing figure is electric and move back the large step of tin two, shorten the electroplating process of pcb board, further for enterprise provides cost savings.
But this device structure is too complicated, cause production of low quality, process velocity is slow too.
Utility model content
In order to solve above-mentioned the deficiencies in the prior art part, the purpose of this utility model is to provide that a kind of structure is simple, plate treatment effeciency and all higher PCB electroplating process complete equipment of Disposal quality, to overcome defect of the prior art.
To achieve these goals, the utility model provides a kind of PCB electroplating process complete equipment, described PCB electroplating process complete equipment is provided with nog plate system, level except colloid system and horizontal Direct Electroplating system, wherein, described level is from left to right sequentially provided with bulk mechanism, only water washing mechanism, de-smear mechanism, reclaims water washing mechanism and average mechanism except colloid system; Described horizontal Direct Electroplating system is from left to right sequentially provided with whole aperture apparatus, oxidation unit, catalytic unit, PCB panel turnover device, No. two catalytic units and a clear water cleaning device.
As further illustrating PCB electroplating process complete equipment described in the utility model, preferably, described nog plate system is high-pressure washing mechanism.
As further illustrating PCB electroplating process complete equipment described in the utility model, preferably, described only water washing mechanism is spray washing mechanism.
As can be seen here, the structure of the PCB electroplating process complete equipment that the utility model provides is simple, and owing to being optimized in multiple operations of plate process, plate treatment effeciency and plate Disposal quality all improve a lot.
Accompanying drawing explanation
Fig. 1 is the structural representation of PCB electroplating process complete equipment of the present utility model.
Description of reference numerals is as follows:
Nog plate system 1, level are except colloid system 2, bulk mechanism 21, only water washing mechanism 22, de-smear mechanism 23, recovery water washing mechanism 24, average mechanism 25, horizontal Direct Electroplating system 3, whole aperture apparatus 31, oxidation unit 32, catalytic unit 33, No. two catalytic units 34, clear water cleaning device 35, PCB panel turnover devices 36.
Embodiment
Structure of the present utility model, feature and other objects is understood further in order to enable auditor, preferred embodiment appended by now combining is accompanied by accompanying drawing and is described in detail as follows, embodiment illustrated by this accompanying drawing is only for illustration of the technical solution of the utility model, and non-limiting the utility model.
First, please refer to Fig. 1, Fig. 1 is the structural representation of PCB electroplating process complete equipment of the present utility model.The PCB electroplating process complete equipment that the utility model provides is provided with nog plate system 1, level except colloid system 2 and horizontal Direct Electroplating system 3.
For nog plate system 1, it is high-pressure washing mechanism, thus make nog plate efficiency and nog plate quality higher.
For level except colloid system 2, as shown in Figure 1, level is removed colloid system 2 and is from left to right sequentially provided with bulk mechanism 21, only water washing mechanism 22, de-smear mechanism 23, reclaims water washing mechanism 24 and average mechanism 25, and only water washing mechanism 22 is spray washing mechanism, not only can save liquid medicine, can also Disposal quality be improved simultaneously.
For horizontal Direct Electroplating system 3, as shown in Figure 1, horizontal Direct Electroplating system 3 is from left to right sequentially provided with whole aperture apparatus 31, oxidation unit 32, catalytic unit 33, PCB panel turnover device 36, No. two catalytic units 34 and clear water cleaning device 35.Thus, utilize PCB panel turnover device 36 effectively can improve the quality of catalytic process steps, prevent Kong Wutong, the residual copper phenomenon in hole.In addition, PCB panel turnover device 36 turns PCB, achieves the transfer of circuit board between reactive tank, also improves the effect of catalytic reaction, avoids Kong Wutong, empty residual copper phenomenon.
In the utility model, bulk mechanism 21, only water washing mechanism 22, de-smear mechanism 23, recovery water washing mechanism 24, average mechanism 25, whole aperture apparatus 31, oxidation unit 32, catalytic unit 33, No. two catalytic units 34, clear water cleaning device 35 and PCB panel turnover devices 36 are all conventional chemical reaction grooves.
As can be seen here, the structure of the PCB electroplating process complete equipment that the utility model provides is simple, and owing to being optimized in multiple operations of plate process, plate treatment effeciency and plate Disposal quality all improve a lot.
It is to be understood that, above-mentioned utility model content and embodiment be intended to prove the utility model the practical application of technical scheme is provided, should not be construed as the restriction to the utility model protection range.Those skilled in the art in spirit of the present utility model and principle, when doing various amendment, equivalent replace or improve.Protection range of the present utility model is as the criterion with appended claims.
Claims (3)
1. a PCB electroplating process complete equipment, described PCB electroplating process complete equipment is provided with nog plate system (1), level except colloid system (2) and horizontal Direct Electroplating system (3), it is characterized in that,
Level is removed colloid system (2) and is from left to right sequentially provided with bulk mechanism (21), only water washing mechanism (22), de-smear mechanism (23), reclaims water washing mechanism (24) and average mechanism (25);
Horizontal Direct Electroplating system (3) is from left to right sequentially provided with whole aperture apparatus (31), oxidation unit (32), catalytic unit (33), PCB panel turnover device (36), No. two catalytic units (34) and a clear water cleaning device (35).
2. PCB electroplating process complete equipment as claimed in claim 1, it is characterized in that, nog plate system (1) is high-pressure washing mechanism.
3. PCB electroplating process complete equipment as claimed in claim 1, is characterized in that, only water washing mechanism (22) is spray washing mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520234489.9U CN204598470U (en) | 2015-04-17 | 2015-04-17 | PCB electroplating process complete equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520234489.9U CN204598470U (en) | 2015-04-17 | 2015-04-17 | PCB electroplating process complete equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204598470U true CN204598470U (en) | 2015-08-26 |
Family
ID=53934573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520234489.9U Active CN204598470U (en) | 2015-04-17 | 2015-04-17 | PCB electroplating process complete equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204598470U (en) |
-
2015
- 2015-04-17 CN CN201520234489.9U patent/CN204598470U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Three road 523528 in Guangdong province Dongguan City Qiaotou Shuikou stone village run No. 1 building C Patentee after: Dongguan Teng Ming Intelligent Equipment Co., Ltd. Address before: Three road 523528 in Guangdong province Dongguan City Qiaotou Shuikou stone village run No. 1 building C Patentee before: Dongguan City Teng Ming Electronics Equipment Co., Ltd |