CN204598338U - A kind of analog cellular heated by electrothermal film parts - Google Patents
A kind of analog cellular heated by electrothermal film parts Download PDFInfo
- Publication number
- CN204598338U CN204598338U CN201520305982.5U CN201520305982U CN204598338U CN 204598338 U CN204598338 U CN 204598338U CN 201520305982 U CN201520305982 U CN 201520305982U CN 204598338 U CN204598338 U CN 204598338U
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- China
- Prior art keywords
- electrothermal
- heated
- insulating material
- semiconductor membrane
- analog cellular
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- 230000001413 cellular effect Effects 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims abstract description 31
- 239000012528 membrane Substances 0.000 claims abstract description 30
- 239000011810 insulating material Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims description 14
- 229910052571 earthenware Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000003708 ampul Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000013081 microcrystal Substances 0.000 claims description 3
- 238000005485 electric heating Methods 0.000 abstract description 4
- 238000004134 energy conservation Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
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- Resistance Heating (AREA)
Abstract
The utility model discloses a kind of analog cellular heated by electrothermal film parts, there is component framework, the some groups of heating elements be serially connected are provided with in described component framework, the parts connecting plate of the side plate that described component framework is arranged by two pieces of subtends and two pieces of subtend settings forms, described heating element comprises insulating material connector, electrode and electrothermal semiconductor membrane component, often organizing in heating element, insulating material connector has laterally been arranged side by side two groups, described electrothermal semiconductor membrane component is vertically disposed side by side between two groups of insulating material connectors, in a vertical direction: between two electrothermal semiconductor membrane components, and all by described Electrode connection between electrothermal semiconductor membrane component and insulating material connector.Advantage of the present utility model: analog cellular heated by electrothermal film modular construction mechanical strength of the present utility model is high, be not easy to damage, and heat exchange is abundant, than traditional electric heating form energy-conservation more than 30%.
Description
Technical field
The utility model relates to a kind of heater element, is specifically related to a kind of analog cellular heated by electrothermal film parts.
Background technology
Electric heating element in the market, mainly adopt heating alloy, PTC as heater element, heating wire electric conversion efficiency is lower, and wire is dispelled the heat, and area of dissipation is little; PTC electric heating element electric conversion efficiency is higher, and radiating efficiency is not high, and high-temperature stability is inadequate.
And using earthenware as the electrothermal membrane heating element of carrier, there is far infrared radiation, useful to human body, can directly dispel the heat, electric conversion efficiency and radiating efficiency are all high, be such as disclose a kind of electric film element of pottery of honeycomb in the Chinese patent of 200620175260.3 at application number, by honeycomb ceramic plate, Electric radiant Heating Film, electrode forms, by Electric radiant Heating Film pyrolytic coating at the endoporus of honeycomb ceramic plate and honeycomb ceramic plate on the surface, the endoporus of honeycomb ceramic plate is through hole, the each opposite side of two opposite side of honeycomb ceramic plate or front and bottom surface is coated with silver slurry as electrode, after energising, honeycomb ceramic plate bore area generates heat.Advantage is, adopts electrothermal film technology, produces far infrared radiation useful to human body; Adopt electrothermal film technology, electric conversion efficiency is higher; Adopt honeycomb ceramic plate as heating carrier, directly dispel the heat, need not by other heat dissipation metals, radiating efficiency is higher; The electrode connection mode of electric film element of pottery of honeycomb is more reasonable, and the square resistance under alternating voltage 220V is little, and heating face is even, is easy to batch production, stable performance.But existing electric film element of pottery of honeycomb also have ignored a problem and is, square resistance is large, and insufficient strength is high, easily damages, and energy-conservation not.
Utility model content
The purpose of this utility model is to make up the deficiencies in the prior art, provides the analog cellular heated by electrothermal film parts that a kind of intensity is high and more energy-conservation.
In order to reach the purpose of this utility model, technical scheme is as follows:
A kind of analog cellular heated by electrothermal film parts, it is characterized in that, there is component framework, the some groups of heating elements be serially connected are provided with in described component framework, the parts connecting plate of the side plate that described component framework is arranged by two pieces of subtends and two pieces of subtend settings forms, described heating element comprises insulating material connector, electrode and electrothermal semiconductor membrane component, often organizing in heating element, insulating material connector has laterally been arranged side by side two groups, described electrothermal semiconductor membrane component is vertically disposed side by side between two groups of insulating material connectors, in a vertical direction: between two electrothermal semiconductor membrane components, and all by described Electrode connection between electrothermal semiconductor membrane component and insulating material connector.
Preferably, described side plate is aluminium section bar side plate.
Preferably, described insulating material connector is ceramic connecting piece.
Preferably, described electrode is copper electrode.
Preferably, between two groups of insulating material connectors, electrothermal semiconductor membrane component is provided with more than 2 rows.
Preferably, each the row's semiconductor thermoelectric film number of elements in vertical direction is 3 ~ 6.
Preferably, described electrothermal semiconductor membrane component is circular or polygonized structure.
Preferably, the base material of described electrothermal semiconductor membrane component can adopt any one in earthenware, ceramic wafer, crystallite pipe, micro-crystal plate, quartz ampoule, quartz plate, micanite pipe or micarex.More preferably, the base material of described electrothermal semiconductor membrane component adopts earthenware.
The beneficial effect that the utility model has:
Analog cellular heated by electrothermal film modular construction mechanical strength of the present utility model is high, is not easy to damage, and heat exchange is abundant, than traditional electric heating form energy-conservation more than 30%.
In addition, the structure member as a standard can realize power superposition and configuration easily in application.And the restriction not by any power supply standard in application, direct current, alternating current, 12V-380V all can be suitable for.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model analog cellular heated by electrothermal film parts.
Embodiment
Below in conjunction with embodiment, the utility model is further described, but protection range of the present utility model is not only confined to embodiment.
Shown in composition graphs 1, a kind of analog cellular heated by electrothermal film parts, there is component framework, in described component framework, be provided with the some groups of heating elements be serially connected.The parts connecting plate 2 of the side plate 1 that component framework is arranged by two pieces of subtends and two pieces of subtend settings forms, and component framework is quadrilateral structure, and side plate 1 and parts connecting plate 2 are respectively two opposite side of quadrangle.Side plate 1 horizontally set, parts connecting plate 2 is vertically arranged, and in the present embodiment, horizontal direction refers to the length direction of side plate 1, and vertical direction refers to the length direction of parts connecting plate 2, and horizontal direction is vertical with vertical direction.Heating element comprises insulating material connector 5, electrode 4 and electrothermal semiconductor membrane component 3, often organizing in heating element, insulating material connector 5 has laterally been arranged side by side two groups, described electrothermal semiconductor membrane component 3 is vertically disposed side by side between two groups of insulating material connectors 5, in a vertical direction: all connected by described electrode 4 between two electrothermal semiconductor membrane components 3 and between electrothermal semiconductor membrane component 3 and insulating material connector 5.In actual applications, when heating high power work as needed large area, heater block of the present utility model can be superposed.
In the present embodiment, side plate 1 is aluminium section bar side plate.Electrode 4 is copper electrode.
Insulating material connector 5 is ceramic connecting piece, quartzy connector or mica connector, and in the present embodiment, insulating material connector 5 is ceramic connecting piece.
Between two groups of insulating material connectors 5, electrothermal semiconductor membrane component 3 is provided with more than 2 rows, preferably 6 ~ 8 rows, and the present embodiment is 6 rows.Each row's electrothermal semiconductor membrane component 3 quantity in vertical direction is 3 ~ 6, and the present embodiment is 3.
Electrothermal semiconductor membrane component 3 is circular or polygonized structure, in the present embodiment, is eight-sided formation.What the base material of electrothermal semiconductor membrane component 3 adopted is high temperature resistant, high insulating material, can be any one in earthenware, ceramic wafer, crystallite pipe, micro-crystal plate, quartz ampoule, quartz plate, micanite pipe or micarex.In the present embodiment, what the base material of electrothermal semiconductor membrane component 3 adopted is earthenware.
Last it is noted that above embodiment only in order to illustrate the utility model and and technical scheme described by unrestricted the utility model, therefore, although this specification has been described in detail the utility model with reference to each above-mentioned embodiment, but, those of ordinary skill in the art is to be understood that, still can modify to the utility model or equivalent replacement, and all do not depart from technical scheme and the improvement thereof of spirit and scope of the present utility model, it all should be encompassed in right of the present utility model.
Claims (9)
1. analog cellular heated by electrothermal film parts, it is characterized in that, there is component framework, the some groups of heating elements be serially connected are provided with in described component framework, the parts connecting plate of the side plate that described component framework is arranged by two pieces of subtends and two pieces of subtend settings forms, described heating element comprises insulating material connector, electrode and electrothermal semiconductor membrane component, often organizing in heating element, insulating material connector has laterally been arranged side by side two groups, described electrothermal semiconductor membrane component is vertically disposed side by side between two groups of insulating material connectors, in a vertical direction: between two electrothermal semiconductor membrane components, and all by described Electrode connection between electrothermal semiconductor membrane component and insulating material connector.
2. analog cellular heated by electrothermal film parts according to claim 1, is characterized in that, described side plate is aluminium section bar side plate.
3. honeycomb heated by electrothermal film parts according to claim 2, is characterized in that, described insulating material connector is ceramic connecting piece.
4. analog cellular heated by electrothermal film parts according to claim 3, is characterized in that, described electrode is copper electrode.
5. analog cellular heated by electrothermal film parts according to claim 3, is characterized in that, between two groups of insulating material connectors, electrothermal semiconductor membrane component is provided with more than 2 rows.
6. analog cellular heated by electrothermal film parts according to claim 5, is characterized in that, each the row's semiconductor thermoelectric film number of elements in vertical direction is 3 ~ 6.
7. analog cellular heated by electrothermal film parts according to claim 1, is characterized in that, described electrothermal semiconductor membrane component is circular or polygonized structure.
8. analog cellular heated by electrothermal film parts according to claim 7, it is characterized in that, the base material of described electrothermal semiconductor membrane component can adopt in earthenware, ceramic wafer, crystallite pipe, micro-crystal plate, quartz ampoule, quartz plate, micanite pipe or micarex any one.
9. analog cellular heated by electrothermal film parts according to claim 8, is characterized in that, the base material of described electrothermal semiconductor membrane component adopts earthenware.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520305982.5U CN204598338U (en) | 2015-05-13 | 2015-05-13 | A kind of analog cellular heated by electrothermal film parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520305982.5U CN204598338U (en) | 2015-05-13 | 2015-05-13 | A kind of analog cellular heated by electrothermal film parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204598338U true CN204598338U (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520305982.5U Expired - Fee Related CN204598338U (en) | 2015-05-13 | 2015-05-13 | A kind of analog cellular heated by electrothermal film parts |
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| CN (1) | CN204598338U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108983026A (en) * | 2018-07-18 | 2018-12-11 | 王伟 | Electric heating ground film emulates leakage current verifying attachment and the method for inspection |
| CN109974295A (en) * | 2019-04-18 | 2019-07-05 | 江西克莱威纳米碳材料有限公司 | A kind of air heat exchanger and its preparation method and application |
-
2015
- 2015-05-13 CN CN201520305982.5U patent/CN204598338U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108983026A (en) * | 2018-07-18 | 2018-12-11 | 王伟 | Electric heating ground film emulates leakage current verifying attachment and the method for inspection |
| CN109974295A (en) * | 2019-04-18 | 2019-07-05 | 江西克莱威纳米碳材料有限公司 | A kind of air heat exchanger and its preparation method and application |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 |