CN204585991U - Magnetron sputtering flexible copper-clad substrate and prepare its magnetic control sputtering device - Google Patents
Magnetron sputtering flexible copper-clad substrate and prepare its magnetic control sputtering device Download PDFInfo
- Publication number
- CN204585991U CN204585991U CN201520219748.0U CN201520219748U CN204585991U CN 204585991 U CN204585991 U CN 204585991U CN 201520219748 U CN201520219748 U CN 201520219748U CN 204585991 U CN204585991 U CN 204585991U
- Authority
- CN
- China
- Prior art keywords
- magnetron sputtering
- copper
- coating
- magnetic control
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of magnetron sputtering flexible copper-clad substrate, comprise flexible parent metal, flexible parent metal is coated with titanium oxide coating by reaction magnetocontrol sputtering in the poisoned mode, titanium oxide coating is coated with copper coating by magnetron sputtering technique.The invention also discloses a kind of magnetic control sputtering device for the preparation of above-mentioned magnetron sputtering flexible copper-clad substrate, comprise unreeling structure, rolling-up mechanism and at least two magnetic control targets.First magnetron sputtering flexible copper-clad substrate of the present utility model plates titanium oxide coating, such as TiO by reaction magnetocontrol sputtering technique in the poisoned mode on flexible parent metal
2coating, by magnetron sputtering TiO
2plasma bombardment, improves the surface property of flexible parent metal, only needs very thin TiO
2coating, just make adhesiving effect be improved significantly, the adhesion between copper coating and base material is improved greatly, wherein, increase plating TiO
2after coating, copper coating adhesion strength can reach more than 9N/cm.
Description
Technical field
The utility model relates to magnetron sputtering plating field, and be specifically related to a kind of magnetron sputtering flexible copper-clad substrate, the utility model also relates to the magnetic control sputtering device for the preparation of this magnetron sputtering flexible copper-clad substrate.
Background technology
At some flexible parent metals, such as, on PET (polyethylene terephthalate, PETG) base material, magnetron sputtering copper coating, can as the application such as electromagnetic shielding film, conducting film.If directly sputter copper coating on the flexible parent metals such as PET, there is the problems such as adhesion difference, copper coating easily come off.
Utility model content
The copper coating existed in the technical problem prior art that the utility model solves and poor, the caducous problem of flexible parent metal adhesion, and then a kind of magnetron sputtering flexible copper-clad substrate that can improve adhesion between copper coating and flexible parent metal is provided, the utility model is also provided for the magnetic control sputtering device preparing this magnetron sputtering flexible copper-clad substrate.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is as follows:
A kind of magnetron sputtering flexible copper-clad substrate, comprises flexible parent metal, described flexible parent metal is coated with titanium oxide coating by the reaction magnetocontrol sputtering under poison mode, described titanium oxide coating is coated with copper coating by magnetron sputtering technique.
Preferably, described titanium oxide coating is TiO
2coating.
Preferably, the thickness of described titanium oxide coating is not more than 1nm.
Preferably, described copper coating is coated with copper electroplating layer by electroplating technology.
Preferably, described flexible parent metal is PET base material.
The present invention also provides a kind of magnetic control sputtering device for the preparation of described magnetron sputtering flexible copper-clad substrate, comprise unreeling structure and rolling-up mechanism, two magnetic control targets are at least set gradually between described unreeling structure and described rolling-up mechanism, wherein close on most a described magnetic control target of described unreeling structure for the magnetic control target for titanium oxide coating described in magnetron sputtering, all the other all described magnetic control targets are the magnetic control target for copper coating described in magnetron sputtering.
Preferably, the number of described magnetic control target is 6.
The beneficial effects of the utility model are as follows:
First magnetron sputtering flexible copper-clad substrate of the present utility model plates titanium oxide coating, such as TiO by reaction magnetocontrol sputtering technique in the poisoned mode on flexible parent metal
2coating, by magnetron sputtering TiO
2plasma bombardment, improves the surface property of flexible parent metal, only needs very thin TiO
2coating, just make adhesiving effect be improved significantly, the adhesion between copper coating and base material is improved greatly, wherein, increase plating TiO
2after coating, copper coating adhesion strength can reach more than 9N/cm.
Accompanying drawing explanation
Fig. 1 is the structural representation of an embodiment of magnetron sputtering flexible copper-clad substrate of the present utility model;
Fig. 2 is the structural representation of the magnetic control sputtering device for the preparation of magnetron sputtering flexible copper-clad substrate of the present utility model;
In figure:
1 flexible parent metal, 2 titanium oxide coating, 3 copper coatings, 4 copper electroplating layers, 5 unreeling structures, 6 rolling-up mechanisms, 7 magnetic control targets.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the technical solution of the utility model and beneficial effect are described further.
See accompanying drawing 1, magnetron sputtering flexible copper-clad substrate of the present utility model, comprise flexible parent metal 1, flexible parent metal 1 is coated with titanium oxide coating 2 by reaction magnetocontrol sputtering in the poisoned mode, titanium oxide coating 2 is coated with copper coating 3 by magnetron sputtering technique.
Wherein, titanium oxide coating 2 can be TiO
2coating, flexible parent metal 1 can be PET base material.
Magnetron sputtering flexible copper-clad substrate of the present utility model is first reaction magnetocontrol sputtering TiO in the poisoned mode on the flexible parent metals such as PET
2, and then the copper that magnetron sputtering needs.Reaction magnetocontrol sputtering TiO
2time plasma bombard the flexible parent metals such as PET to a certain extent, improve the surface property of the flexible parent metals such as PET.The TiO sputtering very thin thickness is only needed under structure of the present utility model
2, at below 1nm, almost can be able to ignore.
Magnetron sputtering flexible copper-clad substrate of the present utility model can also be coated with copper electroplating layer 4 by electroplating technology as required on copper coating 3.
Under structure of the present utility model, reaction magnetocontrol sputtering TiO on flexible parent metal
2after, need to be coated with subsequent copper coating online at once, otherwise impact strengthens adhesion effect, for this reason, the utility model provides the magnetic control sputtering device for the preparation of above-mentioned magnetron sputtering flexible copper-clad substrate, see accompanying drawing 2, comprise unreeling structure 5 and rolling-up mechanism 6, two magnetic control targets 7 are at least set gradually between unreeling structure 5 and rolling-up mechanism 6, the magnetic control target 7 wherein closing on most unreeling structure 1 is the magnetic control target for magnetron sputtering titanium oxide coating 2, and all the other all magnetic control targets 7 are the magnetic control target for magnetron sputtering copper coating 3.
Wherein, the number of magnetic control target 7 can set as required, and the number of magnetic control target 7 can be 6 as shown in the figure, and PET passes through each magnetic control target successively, uses a magnetic control target 7 reaction magnetocontrol sputtering TiO of the most contiguous unreeling structure 1
2bombardment PET, thus strengthen the adhesion of follow-up magnetic control target film plating layer and PET.
Obviously, those skilled in the art can carry out various change and modification to the utility model and not depart from spirit and scope of the present utility model.If these amendments and modification belong within the scope of the utility model claim and equivalent technologies thereof, then the utility model is also intended to comprise these change and modification.
Claims (7)
1. a magnetron sputtering flexible copper-clad substrate, comprise flexible parent metal (1), it is characterized in that: on described flexible parent metal (1), be coated with titanium oxide coating (2) by the reaction magnetocontrol sputtering under poison mode, described titanium oxide coating (2) is coated with copper coating (3) by magnetron sputtering technique.
2. magnetron sputtering flexible copper-clad substrate as claimed in claim 1, is characterized in that: described titanium oxide coating (2) is TiO
2coating.
3. magnetron sputtering flexible copper-clad substrate as claimed in claim 2, is characterized in that: the thickness of described titanium oxide coating (2) is not more than 1nm.
4. magnetron sputtering flexible copper-clad substrate as claimed in claim 3, is characterized in that: on described copper coating (3), be coated with copper electroplating layer (4) by electroplating technology.
5. magnetron sputtering flexible copper-clad substrate according to any one of Claims 1-4, is characterized in that: described flexible parent metal (1) is PET base material.
6. the magnetic control sputtering device for the preparation of magnetron sputtering flexible copper-clad substrate according to any one of claim 1 to 5, comprise unreeling structure (5) and rolling-up mechanism (6), it is characterized in that: between described unreeling structure (5) and described rolling-up mechanism (6), at least set gradually two magnetic control targets (7), wherein close on most a described magnetic control target (7) of described unreeling structure (1) for the magnetic control target for titanium oxide coating (2) described in magnetron sputtering, all the other all described magnetic control targets (7) are the magnetic control target for copper coating described in magnetron sputtering (3).
7. magnetic control sputtering device as claimed in claim 6, is characterized in that: the number of described magnetic control target (7) is 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520219748.0U CN204585991U (en) | 2015-04-13 | 2015-04-13 | Magnetron sputtering flexible copper-clad substrate and prepare its magnetic control sputtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520219748.0U CN204585991U (en) | 2015-04-13 | 2015-04-13 | Magnetron sputtering flexible copper-clad substrate and prepare its magnetic control sputtering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204585991U true CN204585991U (en) | 2015-08-26 |
Family
ID=53922183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520219748.0U Active CN204585991U (en) | 2015-04-13 | 2015-04-13 | Magnetron sputtering flexible copper-clad substrate and prepare its magnetic control sputtering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204585991U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111556678A (en) * | 2020-04-21 | 2020-08-18 | 江西沃格光电股份有限公司深圳分公司 | Composite board, preparation method thereof, shell and electronic equipment |
| CN111613385A (en) * | 2020-04-16 | 2020-09-01 | 信维通信（江苏）有限公司 | PTFE copper-clad plate for 5G high-frequency communication and manufacturing method thereof |
-
2015
- 2015-04-13 CN CN201520219748.0U patent/CN204585991U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111613385A (en) * | 2020-04-16 | 2020-09-01 | 信维通信（江苏）有限公司 | PTFE copper-clad plate for 5G high-frequency communication and manufacturing method thereof |
| CN111613385B (en) * | 2020-04-16 | 2022-01-18 | 信维通信（江苏）有限公司 | PTFE copper-clad plate for 5G high-frequency communication and manufacturing method thereof |
| CN111556678A (en) * | 2020-04-21 | 2020-08-18 | 江西沃格光电股份有限公司深圳分公司 | Composite board, preparation method thereof, shell and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6964401B2 (en) | Transparent conductive film | |
| US20140159285A1 (en) | Composition for laser direct structuring and laser direct structuring method using same | |
| CN204659076U (en) | A kind of flexible substrates copper plating film structure | |
| CN105291674A (en) | Electronic product shell and surface treatment method thereof | |
| US20140113089A1 (en) | Electronic device housing and method for manufacturing same | |
| CN204585991U (en) | Magnetron sputtering flexible copper-clad substrate and prepare its magnetic control sputtering device | |
| TWI676697B (en) | Reactive sputtering method and method for producing laminated film | |
| KR102308278B1 (en) | Pvd coatings embedded in coats of paint | |
| JP2016089266A (en) | Radio wave transmission type multilayer optical coating | |
| CN208562506U (en) | A kind of target | |
| US20160085326A1 (en) | Conductive laminate, touch panel and electronic device using the conductive laminate, and method for making the conductive laminate | |
| CN104264112B (en) | A kind of Matte film vacuum optical coating method | |
| CN101781750B (en) | Method for nonconductive metallization of plastic surface and plastic piece manufactured thereby | |
| CN106471158A (en) | The laminated coating of base material | |
| CN104962861A (en) | Alloy composite material and preparation method thereof | |
| CN106716316A (en) | Conductive substrate, layered conductive substrate, method for producing conductive substrate, and method for producing layered conductive substrate | |
| CN203976900U (en) | A kind of target material structure of sputter coating | |
| CN103489505A (en) | ITO (Indium Tin Oxide) conducting film for touch screen and preparation method thereof | |
| CN102465254A (en) | Electromagnetic shielding processing method for surface of plastic and product prepared by using electromagnetic shielding processing method | |
| CN110997185B (en) | Equipment cover, electronic equipment and method for coating equipment cover | |
| KR102274080B1 (en) | Method for manufacturing touch screen substrate | |
| CN102808151B (en) | Coating method for insulated metal film | |
| CN209259941U (en) | A kind of low-e glass of high-permeability | |
| CN104264115B (en) | A kind of method of coating surface antistatic | |
| CN103614695B (en) | A kind of anaerobic no-bias is coated with the method for sapphire PVD film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |