CN204585589U - A kind of semiconductor chip cutting processing fixture - Google Patents
A kind of semiconductor chip cutting processing fixture Download PDFInfo
- Publication number
- CN204585589U CN204585589U CN201520210855.7U CN201520210855U CN204585589U CN 204585589 U CN204585589 U CN 204585589U CN 201520210855 U CN201520210855 U CN 201520210855U CN 204585589 U CN204585589 U CN 204585589U
- Authority
- CN
- China
- Prior art keywords
- substrate
- fixing plate
- annular fixing
- projection
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The utility model relates to a kind of semiconductor chip cutting processing fixture, it is located on substrate, comprise the projection be fixed on substrate, the mode that described substrate is fastened by bolts is provided with an annular fixing plate, described annular fixing plate parcel projection is arranged, the top madial wall of described annular fixing plate being positioned at projection is provided with annular recess, described projection is provided with one for the sticky cutting substrate establishing semiconductor chip, the lower end of described cutting substrate is provided with a boss, described boss coordinates to realize clamping with annular recess, the opposite side described substrate being positioned at annular fixing plate is provided with ring-type grip block, described ring-type grip block is provided with the second annular recess coordinated with boss.
Description
Technical field
The utility model relates to a kind of semiconductor chip cutting processing fixture.
Background technology
The raw material of existing semiconductor thermoelectric material to be cut is mostly column, if but want to use processing first just can use through the rectangular particle of fine cut again through cutting into disk, and existing to semiconductor thermoelectric chip material carry out retrofit be all adopt scroll saw move back and forth realize cutting, and rectangular particles is all often the length and width of several millimeters, cannot utilize and be mechanically clamped processing, therefore disk must be bonded on a substrate and cut, after cutting, glue can soften through heating, is convenient to taking off of semiconductor chip.But this cutting mode often all can destroy substrate, make substrate need often to change, and the mode changed comparatively bother, and causes operating efficiency lower.
Utility model content
Therefore, for above-mentioned problem, the utility model proposes a kind of structure simple, can quick-replaceable substrate, semiconductor chip cutting processing fixture that operating efficiency is high.
For achieving the above object, the utility model have employed following technical scheme: a kind of semiconductor chip cutting processing fixture, it is located on substrate, comprise the projection be fixed on substrate, the mode that described substrate is fastened by bolts is provided with an annular fixing plate, described annular fixing plate parcel projection is arranged, the top madial wall of described annular fixing plate being positioned at projection is provided with annular recess, described projection is provided with one for the sticky cutting substrate establishing semiconductor chip, the lower end of described cutting substrate is provided with a boss, described boss coordinates to realize clamping with annular recess, the opposite side described substrate being positioned at annular fixing plate is provided with ring-type grip block, described ring-type grip block is provided with the second annular recess coordinated with boss.
Further, described ring-type grip block and the hinged setting of annular fixing plate, described annular fixing plate is provided with a fixture block, and described ring-type grip block is provided with a hasp, and described ring-type grip block realizes closely being connected by hasp and the cooperation of fixture block with annular fixing plate.
By adopting preceding solution, the beneficial effects of the utility model are: compared with passing through the sticky mode being located at substrate with existing semiconductor chip, this semiconductor chip cutting processing fixture, by arranging a boss, boss arranges cutting substrate, and utilizes annular fixing plate and ring-type grip block to be fixed cutting substrate, thus quick despatch, the replacement of cutting substrate can be realized, thus can increase work efficiency significantly, and the precision of cutting can be ensured; Further, ring-type grip block realizes being fastened by the mode that hasp is connected with annular fixing plate, can realize handling more quickly.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the sectional view at A-A place in Fig. 1.
Detailed description of the invention
Now with detailed description of the invention, the utility model is further illustrated by reference to the accompanying drawings.
With reference to figure 1, the present embodiment provides a kind of semiconductor chip cutting processing fixture, it is located on substrate 1, comprise the projection 2 be fixed on substrate 1, the mode that described substrate 1 is fastened by bolts is provided with an annular fixing plate 3, described annular fixing plate 3 wraps up projection 2 and arranges, the top madial wall of described annular fixing plate 3 being positioned at projection 2 is provided with annular recess 31, described projection 2 is provided with one for the sticky cutting substrate 4 establishing semiconductor chip, the lower end of described cutting substrate 4 is provided with a boss 41, described boss 41 coordinates to realize clamping with annular recess 31, the opposite side described substrate 1 being positioned at annular fixing plate 3 is provided with ring-type grip block 5, described ring-type grip block 5 is provided with the second annular recess 51 coordinated with boss 41.Described ring-type grip block 5 and the hinged setting of annular fixing plate 3, described annular fixing plate 3 is provided with a fixture block 32, described ring-type grip block 5 is provided with a hasp 52, and described ring-type grip block 5 realizes closely being connected with the cooperation of fixture block 32 by hasp 52 with annular fixing plate 3.
Compared with passing through the sticky mode being located at substrate with existing semiconductor chip, this semiconductor chip cutting processing fixture, by arranging a boss, boss arranges cutting substrate, and utilize annular fixing plate and ring-type grip block to be fixed cutting substrate, thus quick despatch, the replacement of cutting substrate can be realized, thus can increase work efficiency significantly, and the precision of cutting can be ensured; Further, ring-type grip block realizes being fastened by the mode that hasp is connected with annular fixing plate, can realize handling more quickly.
Although specifically show in conjunction with preferred embodiment and describe the utility model; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection domain of the present utility model.
Claims (2)
1. a semiconductor chip cutting processing fixture, it is located on substrate, it is characterized in that: comprise the projection be fixed on substrate, the mode that described substrate is fastened by bolts is provided with an annular fixing plate, described annular fixing plate parcel projection is arranged, the top madial wall of described annular fixing plate being positioned at projection is provided with annular recess, described projection is provided with one for the sticky cutting substrate establishing semiconductor chip, the lower end of described cutting substrate is provided with a boss, described boss coordinates to realize clamping with annular recess, the opposite side described substrate being positioned at annular fixing plate is provided with ring-type grip block, described ring-type grip block is provided with the second annular recess coordinated with boss.
2. a kind of semiconductor chip cutting processing fixture according to claim 1, it is characterized in that: described ring-type grip block and the hinged setting of annular fixing plate, described annular fixing plate is provided with a fixture block, described ring-type grip block is provided with a hasp, and described ring-type grip block realizes closely being connected by hasp and the cooperation of fixture block with annular fixing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520210855.7U CN204585589U (en) | 2015-04-09 | 2015-04-09 | A kind of semiconductor chip cutting processing fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520210855.7U CN204585589U (en) | 2015-04-09 | 2015-04-09 | A kind of semiconductor chip cutting processing fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204585589U true CN204585589U (en) | 2015-08-26 |
Family
ID=53921783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520210855.7U Expired - Fee Related CN204585589U (en) | 2015-04-09 | 2015-04-09 | A kind of semiconductor chip cutting processing fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204585589U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111426554A (en) * | 2020-03-23 | 2020-07-17 | 天津大学 | Semiconductor chip high temperature shear test anchor clamps |
-
2015
- 2015-04-09 CN CN201520210855.7U patent/CN204585589U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111426554A (en) * | 2020-03-23 | 2020-07-17 | 天津大学 | Semiconductor chip high temperature shear test anchor clamps |
| CN111426554B (en) * | 2020-03-23 | 2021-10-08 | 天津大学 | Semiconductor chip high temperature shear test anchor clamps |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 361000 Fujian province Xiamen torch hi tech Zone (Xiangan) Industrial Zone Xiang Ming Road No. 28 building 5F Frestech Patentee after: P&N TECHNOLOGY (XIAMEN) CO.,LTD. Address before: 361000 Fujian province Xiamen torch hi tech Zone (Xiangan) Industrial Zone Xiang Ming Road No. 28 building 5F Frestech Patentee before: PENGNAN ELECTRONIC TECHNOLOGY (XIAMEN) Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |