CN204576538U - Fingerprint identification device, the touch-screen being provided with this device and terminal device - Google Patents
Fingerprint identification device, the touch-screen being provided with this device and terminal device Download PDFInfo
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- CN204576538U CN204576538U CN201520130990.0U CN201520130990U CN204576538U CN 204576538 U CN204576538 U CN 204576538U CN 201520130990 U CN201520130990 U CN 201520130990U CN 204576538 U CN204576538 U CN 204576538U
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Abstract
The utility model discloses a kind of fingerprint identification device, be provided with the touch-screen of this device and terminal device, comprising: cover plate, comprise first surface and second surface, first surface offers identification slot, for location fingerprint identified region; Fingerprint identification module, comprises fingerprint sensor, and fingerprint sensor responds to one end of fingerprint near described second surface, for responding to the fingerprint being positioned at described first surface.Above-mentioned fingerprint identification device, the identification slot that first surface is offered is corresponding with the fingerprint sensor being installed on second surface, to reduce the distance of fingerprint identification module and first surface.During by fingerprint identification module identification fingerprint, avoid the susceptibility of the thickness effect fingerprint sensor due to cover plate, and positioned by identification slot, improve the accuracy of fingerprint identification module identification.Further, identification slot offers the region in the corresponding fingerprint identification module of first surface, and the thickness of other position of cover plate is constant, ensure that the intensity of cover plate.
Description
Technical field
The utility model relates to fingerprint recognition field, particularly relates to a kind of fingerprint identification device, is provided with the touch-screen of this device and terminal device.
Background technology
Along with the development of science and technology, the application of portable terminal in daily life is increasingly extensive, and function is also day by day powerful.But portable terminal is while having increasing function, also carry a lot of personal information.If these personal informations are revealed or usurped, can make troubles to user, cause immeasurable loss, therefore, portable terminal be arranged security structure and be very important.
But encrypt for modes such as employing passwords, user needs the password remembeing to preset, and the possibility that also there is password leakage or cracked.And the fingerprint of people is formed by nature-nurture acting in conjunction, its complexity not only can be provided for the enough of discriminating, also has uniqueness and unchangeability, and therefore fingerprint recognition becomes the cipher mode that some electronic equipments adopt.
For the terminal device installing fingerprint identification device, fingerprint identification module needs to be installed on below cover plate.Cover plate, as the inputting interface of user, needs certain intensity, and therefore the thickness of cover plate is often greater than 300 microns.Although the increase of cover sheet thickness increases the intensity of cover plate, also can affect the recognition efficiency of fingerprint identification module to fingerprint simultaneously.
Existing electronic product, in order to realize fingerprint identification function and meet the thickness requirement of cover plate, is typically employed in the mode that lid surface opens hole, to expose the touch-control sensing region of fingerprint sensor, so that fingerprint sensor can carry out fingerprint detection.And adopt the method for perforate, then cannot ensure cover plate intensity, cause cover plate in use easily to damage.
And if the mode that employing is slotted inside cover plate arranges fingerprint sensor, then user is difficult to the position finding fingerprint sensor, reduces the efficiency of fingerprint recognition, if adopt transparent panel, then make the structure of fingerprint sensor be presented on lid surface, affect the panel of electronic product.
Utility model content
Based on this, be necessary to ensure the identification accuracy of fingerprint identification module and the problem of intensity for screen panel, providing a kind of increases the identification accuracy of fingerprint identification module and does not affect the fingerprint identification device of intensity and be provided with the terminal device of this fingerprint identification device simultaneously.
A kind of fingerprint identification device, comprising:
Cover plate, comprises first surface and second surface, and described first surface offers identification slot, for location fingerprint identified region;
Fingerprint identification module, comprises fingerprint sensor, and described fingerprint sensor responds to one end of fingerprint near described second surface, for responding to the fingerprint being positioned at described first surface;
Wherein, described fingerprint sensor is fixed at the described second surface side of described cover plate, and corresponding with described identification slot, is positioned in than the position of other region of described second surface closer to fingerprint to make described fingerprint sensor.
Wherein in an embodiment, the integral thickness of described cover plate is 300 ~ 400 microns, and the thickness being provided with the described cover plate of described identification slot is less than 150 microns.
Wherein in an embodiment, described identification slot comprises spigot surface and surface of contact, and the relatively described first surface of described surface of contact caves inward, and described spigot surface connects described first surface and described surface of contact, and around described surface of contact.
Wherein in an embodiment, described spigot surface tilts extended relative to described surface of contact, reduces gradually from described first surface to make the cross-sectional area diameter of described identification slot to described surface of contact direction.
Wherein in an embodiment, area matched near described second surface of described spigot surface area and described fingerprint sensor.
Wherein in an embodiment, described second surface covers at least one deck ink layer, and described ink layer is between described cover plate and described fingerprint identification module.
Wherein in an embodiment, described fingerprint identification module also comprises fingerprint recognition chip, and described fingerprint recognition chip is electrically connected with described fingerprint sensor, to process the finger print information that described fingerprint sensor obtains.
Wherein in an embodiment, described fingerprint identification module also comprises circuit substrate, and described fingerprint sensor is connected by described circuit substrate with described fingerprint recognition chip.
Wherein in an embodiment, described second surface offers the blind hole district that cave inward corresponding with described identification slot, and described blind hole district is located in one end that described fingerprint sensor responds to described identification slot place fingerprint.
Wherein in an embodiment, described blind hole district comprises dip plane and stationary plane, and the relatively described second surface of described stationary plane caves inward, and described dip plane connects described second surface and described stationary plane, and around described stationary plane.
Wherein in an embodiment, described dip plane tilts extended from described second surface towards described stationary plane direction, reduces gradually from described second surface to make the cross-sectional diameter in described blind hole district to described stationary plane direction.
Wherein in an embodiment, the part or all of of described cover plate is made by transparent material, or part is made by non-transparent material.
Wherein in an embodiment, described transparent material adopt in glass, sapphire, transparent resin, polycarbonate any one, described non-transparent material is stupalith.
For a touch-screen for fingerprint recognition sensing, comprising:
Cover plate, comprises first surface and second surface, and described first surface offers identification slot, for location fingerprint identified region;
Fingerprint identification module, comprises fingerprint sensor, and described fingerprint sensor responds to one end of fingerprint near described second surface, for responding to the fingerprint being positioned at described first surface; And
Touch-control sensing layer, is arranged at the described second surface side of described cover plate;
Wherein, described fingerprint knows the described second surface side that sensor is fixed at described cover plate, and corresponding with described identification slot, is positioned in than the position of other region of described second surface closer to fingerprint to make described fingerprint sensor.
Wherein in an embodiment, described fingerprint sensor comprise be configured to be capacitively coupled to fingerprint crestal line to sense one group of capacity cell of fingerprint.
Wherein in an embodiment, described identification slot comprises surface of contact, and described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in the described surface of contact of described identification slot.
Wherein in an embodiment, described semiconductive thin film is provided with spaced semiconductor striped.
Wherein in an embodiment, described fingerprint identification device also comprises protective seam, and described protective seam is positioned at described semiconductive thin film away from described first surface side.
Wherein in an embodiment, described protective seam is anti-fingerprint film, to protect described semiconductive thin film.
Wherein in an embodiment, the integral thickness of described cover plate is 300 ~ 400 microns, and the thickness being provided with the described cover plate of described identification slot is less than 150 microns.
Wherein in an embodiment, described identification slot comprises spigot surface and described surface of contact, and the relatively described first surface of described surface of contact caves inward, and described spigot surface connects described first surface and described surface of contact, and around described surface of contact.
Wherein in an embodiment, described spigot surface tilts extended relative to described surface of contact, reduces gradually from described first surface to make the cross-sectional area diameter of described identification slot to described surface of contact direction.
Wherein in an embodiment, described spigot surface area and described fingerprint identification module area matched.
Wherein in an embodiment, described second surface covers at least one deck ink layer, and described ink layer is between described cover plate and described fingerprint identification module.
Wherein in an embodiment, described fingerprint identification module also comprises fingerprint recognition chip, and described fingerprint recognition chip is electrically connected with described fingerprint sensor, to process the finger print information that described fingerprint sensor obtains.
Wherein in an embodiment, described fingerprint identification module also comprises circuit substrate, and described fingerprint sensor is connected by described circuit substrate with described fingerprint recognition chip.
Wherein in an embodiment, described fingerprint sensor is positioned in than described fingerprint recognition chip and the described circuit substrate position closer to described identification slot.
Wherein in an embodiment, described second surface offers the blind hole district that cave inward corresponding with described identification slot, and described blind hole district is located in one end that described fingerprint identification module responds to described identification slot place fingerprint.
Wherein in an embodiment, described blind hole district comprise dip plane with and stationary plane, the relatively described second surface of described stationary plane caves inward, and described dip plane connects described second surface and described stationary plane, and around described stationary plane.
Wherein in an embodiment, described dip plane tilts extended from described second surface towards described stationary plane direction, reduces gradually from described second surface to make the cross-sectional diameter in described blind hole district to described stationary plane direction.
Wherein in an embodiment, the part or all of of described cover plate is made by transparent material, or part is made by non-transparent material.
Wherein in an embodiment, described transparent material adopt in glass, sapphire, transparent resin, polycarbonate any one, described non-transparent material is stupalith.
For a terminal device for fingerprint recognition sensing, comprise viewing area and non-viewing area, described terminal device also comprises:
Be arranged at the touch-control sensing layer of described viewing area at least partly;
Be arranged at the fingerprint identification device of described non-viewing area at least partly;
Described fingerprint identification device comprises:
Cover plate, comprises first surface and second surface, the identification slot that described first surface is offered, for location fingerprint identified region;
Fingerprint identification module, comprises fingerprint sensor, and described fingerprint sensor responds to one end of fingerprint near described second surface, for responding to the described fingerprint being positioned at described first surface;
Wherein, described fingerprint sensor is fixed at the described second surface side of described cover plate, and it is corresponding with described identification slot, to make described fingerprint sensor be positioned in than the position of other region of described second surface closer to finger, described touch-control sensing layer is arranged at the described second surface side of described cover plate.
Wherein in an embodiment, described identification slot comprises surface of contact, and described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in the described surface of contact of described identification slot.
Wherein in an embodiment, described fingerprint identification device also comprises protective seam, and described protective seam is positioned at described semiconductive thin film away from described first surface side, to protect described semiconductive thin film.
Wherein in an embodiment, the integral thickness of described cover plate is 300 ~ 400 microns, and the thickness being provided with the described cover plate of described identification slot is less than 150 microns.
Wherein in an embodiment, described identification slot comprises spigot surface and described surface of contact, and the relatively described first surface of described surface of contact caves inward, and described spigot surface connects described first surface and described surface of contact, and around described surface of contact.
Wherein in an embodiment, described second surface covers at least one deck ink layer, and described ink layer is between described cover plate and described fingerprint identification module.
Wherein in an embodiment, described fingerprint identification module also comprises fingerprint recognition chip, and described fingerprint recognition chip is electrically connected with described fingerprint sensor, to process the finger print information that described fingerprint sensor obtains.
Wherein in an embodiment, described fingerprint identification module also comprises circuit substrate, and described fingerprint sensor is connected by described circuit substrate with described fingerprint recognition chip.
Wherein in an embodiment, described second surface offers the blind hole district that cave inward corresponding with described identification slot, and described blind hole district is located in one end that described fingerprint identification module responds to described identification slot place fingerprint.
Wherein in an embodiment, the part or all of of described cover plate is made by transparent material, or part is made by non-transparent material.
Wherein in an embodiment, described transparent material adopt in glass, sapphire, transparent resin, polycarbonate any one, described non-transparent material is stupalith.
Above-mentioned fingerprint identification device, the identification slot that first surface is offered is corresponding with the fingerprint sensor being installed on second surface, to reduce the distance of fingerprint identification module and first surface.During by fingerprint identification module identification fingerprint, avoid the susceptibility of the thickness effect fingerprint sensor due to cover plate, and positioned by identification slot, improve the accuracy of fingerprint identification module identification.Further, identification slot offers the region in the corresponding fingerprint identification module of first surface, and the thickness of other position of cover plate is constant, ensure that the intensity of cover plate.
Accompanying drawing explanation
Fig. 1 is the structural representation in the front of the fingerprint identification device of an embodiment;
Fig. 2 is the structural representation of the reverse side of the fingerprint identification device shown in Fig. 1;
Fig. 3 is the structural representation of the fingerprint identification device of an embodiment;
Fig. 4 is the partial enlarged drawing of the fingerprint identification device shown in Fig. 3;
Fig. 5 is the structural representation of the section of the partial enlarged drawing shown in Fig. 4;
Fig. 6 is the structural representation of the section of the partial enlarged drawing shown in Fig. 4 of another embodiment;
Fig. 7 is the structural representation of the touch-screen of an embodiment;
Fig. 8 is the structural representation of the touch-screen of another embodiment;
Fig. 9 is the structural representation of the terminal device of an embodiment.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present utility model more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in instructions of the present utility model herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
As shown in Figure 1, Figure 2, shown in Fig. 4 and Fig. 5, a kind of fingerprint identification device 100 in this preferred embodiment, comprises cover plate 120 and fingerprint identification module 140.
Cover plate 120 comprises the first surface 122 and second surface 124 that are parallel to each other.First surface 122 offers identification slot 126, for location fingerprint identified region.
Fingerprint identification module 140 comprises fingerprint sensor 142.Fingerprint sensor 142 responds to one end of fingerprint near second surface 122, for responding to the fingerprint being positioned at first surface 122.
Wherein, fingerprint sensor 142 is fixed at second surface 124 side of cover plate 120, and corresponding with identification slot 126, is positioned in other region than second surface 124 closer to the position of fingerprint to make fingerprint sensor 142.
Above-mentioned fingerprint identification device 100, the identification slot 126 that first surface 122 is offered is corresponding with the fingerprint sensor 142 being installed on second surface 124, to reduce the distance of fingerprint identification module 140 and first surface 122.When identifying fingerprint by fingerprint identification module 140, avoid the susceptibility of the thickness effect fingerprint sensor 142 due to cover plate 120, and positioned by identification slot 126, improve the accuracy that fingerprint identification module 140 identifies.Further, identification slot 126 offers the region in the corresponding fingerprint identification module 140 of first surface 122, and the thickness of other position of cover plate 120 is constant, ensure that the intensity of cover plate 120.
When fingerprint identification device 100 is installed on the terminal device such as mobile phone, computer 200, cover plate 120 is positioned at outermost layer, play the effect of protection terminal device inner member, and user is by touching cover plate 120, can complete the various operations to terminal device 200.Further, first surface 122 is positioned at fingerprint identification device 100 side outwardly, second surface 124 towards the side of the terminal device such as mobile phone, computer 200 inside, namely closer to the side of electronic devices and components.
Cover plate 120 is made by transparent and/or non-transparent material, particularly, can adopt any one material manufacture in tempered glass, tempered glass, polycarbonate, sapphire, pottery.Preferably, high-strength material can be selected to make, be positioned at the various elements of second surface 124 side with available protecting.Such as, mole hardness number of sapphire material is 9, is only second to mole hardness number of diamond, and therefore the second surface 124 of cover plate 120 can not be scratched by sandstone.
Because cover component 120 is as the inputting interface of user, therefore often can accept the usage behavior such as touch and pressing of user, and in use come in contact with other objects and even collide with.Therefore, cover component 120 needs to reach certain intensity.Cover component 120 integral thickness is 300 ~ 400 microns, can ensure the intensity of cover component 120.
The thickness that cover plate 120 offers the region of identification slot 126 is less than 150 microns, to ensure that fingerprint sensor 142 can identify fingerprint.
Identification slot 126 on cover plate 120 is formed by techniques such as cutting or etchings.
Particularly, identification slot 126 comprises surface of contact 1222 and spigot surface 1224.Surface of contact 1222 relatively first surface 122 caves inward, spigot surface 1224 connects first surface 122 and surface of contact 1222, and around surface of contact 1222, and tilt extended relative to surface of contact 1222, reduce gradually to surface of contact 1222 direction from first surface 122 to make the cross-sectional area diameter of identification slot 126.So, identification slot 126 and first surface 122 seamlessly transit, and make this identification slot 126 not fragile.
Area matched near second surface 124 of the area of spigot surface 1224 and fingerprint sensor 142, particularly, the area of spigot surface 224 is slightly larger than described fingerprint identification module 140 area.So, user accurately locates by the position of identification slot 126 pairs of fingerprint identification modules 140, and make fingerprint aim at identified region, fingerprint identification module 140 responds to finger print information, ensures speed and the accuracy of fingerprint recognition.
Fingerprint identification module 140 comprises fingerprint sensor 142, fingerprint recognition chip 144 and circuit substrate 146.Fingerprint sensor 142 is electrically connected with fingerprint recognition chip 144.Fingerprint sensor 142 comprise be configured to be capacitively coupled to fingerprint crestal line to sense one group of capacity cell of fingerprint.
Particularly, fingerprint sensor 142 comprises multiple fingerprint identification unit arranged in the matrix form.Fingerprint identification unit can comprise induction electrode and drive electrode.Between induction electrode and drive electrode, there is detector gap, a basic capacitor can be formed.When the identification slot 126 of finger presses cover plate 120, the specific inductive capacity due to fingerprint ridge is the several times of air, and the capacitive coupling therefore between induction electrode from drive electrode can be positioned at above detector gap according to fingerprint ridge or fingerprint paddy different change.So, judge, by the fingerprint ridge and the fingerprint paddy that are pressed in identification slot 126, to obtain fingerprint image, to carry out fingerprint collecting and identification.
Be appreciated that the principle of work of fingerprint sensor 142 is not limited thereto, optical profile type can be adopted to pass fingerprint sensor, pressure resistance type fingerprint sensor and RF-type fingerprint sensor, select different types as required.
Further, fingerprint sensor 142 is electrically connected by circuit substrate 146 with fingerprint recognition chip 144.Particularly, fingerprint sensor 142 is electrically connected with circuit substrate 146 by lead-in wire, and circuit substrate 146 is electrically connected with fingerprint recognition chip 144.In the present embodiment, fingerprint recognition chip 144 is installed on circuit substrate 146 by conducting resinl, makes it be electrically connected with circuit substrate 146.Be appreciated that, fingerprint sensor 142 and circuit substrate 146, electric connection mode between circuit substrate 146 and fingerprint recognition chip 144 are not limited thereto, as long as fingerprint sensor 142 is electrically connected with fingerprint recognition chip 144, with the finger print data making fingerprint recognition chip 144 receive and process fingerprint sensor 142 collection.
In the present embodiment, circuit substrate 146 adopts flexible PCB.Flexible PCB is that the one made for base material with polyimide or mylar has height reliability, good flexible printed circuit.Have the advantages that distribution density is high, lightweight, thickness is thin, bending property is good.Flexible PCB is applied in fingerprint identification module 140, can reduce the size of fingerprint identification module 140, and has lighter weight, has longer serviceable life.
Fingerprint identification device 100 also comprises at least one deck ink layer 160.Ink layer 160 covers second surface 124 horizontal-extending.This ink layer 160 is between cover plate 120 and fingerprint identification module 140.Particularly, ink layer 160 can be white, black or other color, is printed on cover plate 120 by seal typography.
In the present embodiment, ink layer 160 be two-layer more than.So, can cover fingerprint identification module 140, make fingerprint identification module 140 can not be exposed to cover plate 120 opposite side, do not affect the integration of cover plate 120, thus outward appearance is more attractive in appearance.The identification slot 126 that is located through in fingerprint recognition region realizes, and makes cover plate 120 have higher physical strength.
In other embodiments, can not arrange ink layer 160 as required, the transparent shape of cover plate 120 is arranged.When cover plate 120 adopts non-transparent material to make, also ink layer 160 can be saved.
Above-mentioned fingerprint identification device 100, fingerprint identification module 140 is arranged at second surface 124, and the region that first surface 122 is corresponding with fingerprint identification module 140 is provided with identification slot 126.Finger presses identification slot 126, namely gathers finger print information by fingerprint identification module 140.Because identification slot 126 caves inward, because this reducing cover plate 120 thickness in fingerprint identification area territory, ensure that the sensitivity of fingerprint identification module 140, and the thickness in other regions is constant, the intensity of cover plate 120 can not be affected.The setting of identification slot 126 also can play the effect of quick position, makes fingerprint aim at fingerprint identification module 140 exactly, increases the accuracy of fingerprint recognition.Also be provided with ink layer 160 between cover plate 120 and fingerprint identification module 140, can bridging effect be played, make fingerprint identification module 140 can not be exposed to cover plate 120 opposite side end face, ensure the integraty of cover plate 120 and attractive in appearance.
As shown in Figure 1 and Figure 6, a kind of fingerprint identification device 200 that the second embodiment of the present utility model provides, the structure of this fingerprint identification device 200 is roughly the same with above-mentioned fingerprint identification device 100, comprises cover plate 220 and fingerprint module (not shown).
Cover plate 220, comprise first surface 222 and second surface 224, first surface 222 offers the identification slot 226 caved inward.
Fingerprint identification module comprises fingerprint sensor 242, fingerprint recognition chip and circuit substrate.This fingerprint identification module is arranged on the second surface 224 of cover plate 220 position corresponding with identification slot 226.
The difference of the present embodiment is, in the present embodiment, second surface 224 offers the blind hole district 228 corresponding with identification slot 226, and blind hole district 228 is located in one end that fingerprint sensor 242 responds to identification slot 226 place fingerprint.
Blind hole district 228 comprises dip plane and and stationary plane (scheming not mark).Stationary plane opposite second surface 224 caves inward, and dip plane connects second surface 224 and stationary plane, and around stationary plane.Dip plane tilts extended from second surface 224 towards stationary plane direction, reduce gradually from second surface 224 to make the cross-sectional diameter in blind hole district 28 to stationary plane direction.
So, can position the installation site of fingerprint sensor 242, to make it accurately aim at identification slot 226, improve installation effectiveness.Further, the distance between fingerprint and fingerprint sensor 242 can be reduced further, improve fingerprint recognition efficiency further.
As shown in Figure 3, the 3rd embodiment of the present utility model provides a kind of fingerprint identification device 300.The structure of this fingerprint identification device 300 is roughly the same with fingerprint identification device 100, comprises cover plate 120 and fingerprint identification module 140.
Difference is, in the present embodiment, the quantity of fingerprint identification module 140 is two, be arranged at cover plate 120 two ends respectively, form two fingerprint recognition regions, expand the regional extent of fingerprint recognition, facilitate the operation of user, can use in varied situations in the zones of different of cover plate 120 and carry out fingerprint recognition.
As shown in Fig. 1 and Fig. 7, the utility model provides a kind of touch-screen 400, comprises fingerprint identification device 100, also comprises touch-control sensing layer 420.
Fingerprint identification device 100 comprises cover plate 120 and fingerprint identification module 140.
Cover plate 120 comprises first surface 122 and second surface 124, and first surface 122 offers the identification slot 126 caved inward.
Fingerprint identification module 140 comprises fingerprint sensor 142, fingerprint recognition chip 144 and circuit substrate 146, and one end that fingerprint sensor 142 responds to fingerprint is installed on second surface 124, for responding to the fingerprint of first surface 122.
Touch-control sensing layer 420 is arranged at second surface 124 side of cover plate 120.User touches the first surface 122 of cover plate 120, and touch-control sensing layer 380 can sense and realize touch control operation in the position that user touches.
In the present embodiment, fingerprint identification device 100 also comprises semiconductive thin film (not shown), to improve the susceptibility of cover plate 120, improves the recognition efficiency of fingerprint identification module 140 pairs of fingerprints.This semiconductive thin film is covered in the surface of contact 1264 of identification slot 126.Semiconductive thin film is provided with spaced semiconductor striped.
Particularly, the material of semiconductive thin film comprises semi-conducting polymer, indium tin oxide and zinc tin oxide etc., by evaporating deposition technique, as the mode such as electron beam evaporation, magnetron sputtering is prepared from.Utilize semiconductor property, when not carrying out coupling charging to semiconductive thin film, the electric conductivity of semiconductive thin film is tending towards insulation.
Fingerprint identification module 140 also comprises position transducer and radio-frequency signal generator (not shown).The detectable finger touch signal of position transducer, thus start radio-frequency signal generator.
When semiconductor film layer is applied radio frequency high tension charging by the radio-frequency signal generator in fingerprint identification module 140, the electric conductivity of semiconductive thin film is tending towards conductor, thus small current radio frequency signal can be inputted to finger by coupling charging, strengthen finger electric field line to the penetration of cover plate 120, increase the recognition efficiency of fingerprint identification module.
On semiconductive thin film, the width of the spaced semiconductor striped of photoetching is roughly adapted to the width pointed, thus for pointing the region being provided for fingerprint recognition.
Fingerprint identification device 100 also comprises protective seam (not shown).This protective seam is positioned at semiconductive thin film away from surface of contact 1264 side.In this preferred embodiment; protective seam is anti-fingerprint film; formed by spraying technology or thermal evaporation techniques; for a kind of silicon fluoride long-chain compound; it is a kind of material had compared with low surface tension; therefore there is waterproof, grease proofing function, and there is good crocking resistance, to protect semiconductive thin film.
Above-mentioned touch-screen 400, the close together of the touch location distance fingerprint sensor 142 of user's finger, and cave inward and energy quick position, ensure that the accuracy of fingerprint recognition.And maintain complete structure for the cover plate 120 touched, the cover plate of through hole is offered in contrast, has good intensity, not fragile, extends the serviceable life of this touch-screen 400.
As shown in Figures 7 and 8, of the present utility modelly still another embodiment provides a kind of touch-screen 500.The structure of touch-screen 500 is roughly the same with the structure of touch-screen 400.This touch-screen 500 comprises fingerprint identification device 200, also comprises touch-control sensing layer 420.
Fingerprint identification device 200 comprises cover plate 220 and fingerprint identification module (not shown).
Cover plate 220 comprises first surface 222 and second surface 224, and first surface 222 offers the identification slot 226 caved inward.
Fingerprint identification module comprises fingerprint sensor 242, fingerprint recognition chip and connects the circuit substrate of fingerprint sensor 242 and fingerprint recognition chip, and one end that fingerprint sensor 242 responds to fingerprint is installed on second surface 124, for responding to the fingerprint of first surface 222.
Difference is, in the present embodiment, second surface 224 offers the blind hole district 228 corresponding with identification slot 226, and blind hole district 228 is located in one end that fingerprint sensor 242 responds to identification slot 226 place fingerprint.
Blind hole district 228 comprises dip plane and and stationary plane (scheming not mark).Stationary plane opposite second surface 224 caves inward, and dip plane connects second surface 224 and stationary plane, and around stationary plane.Dip plane tilts extended from second surface 224 towards stationary plane direction, reduce gradually from second surface 224 to make the cross-sectional diameter in blind hole district 28 to stationary plane direction.
So, the distance between fingerprint and fingerprint sensor 242 can be reduced further, improve fingerprint recognition efficiency further.
As shown in Fig. 1, Fig. 7 and Fig. 9, a kind of terminal device 600 that the utility model provides, comprise viewing area 620 and non-viewing area 640, also comprise the touch-control sensing layer 420 being arranged at viewing area 620 at least partly and the fingerprint identification device 100 being arranged at non-viewing area 640 at least partly.Fingerprint identification device 100 comprises cover plate 120 and fingerprint identification module 140.
Wherein, cover plate 120 covers viewing area 620 and non-viewing area 640, and comprise first surface 122 and second surface 124, first surface 122 offers the identification slot 126 caved inward.
Fingerprint identification module 140 comprises fingerprint sensor 142, fingerprint identification device 144 and connects the circuit substrate 146 of fingerprint sensor 142 and fingerprint identification device 144.One end that fingerprint sensor 142 responds to fingerprint is installed on second surface 124, for responding to the fingerprint being positioned at first surface 122.
Touch-control sensing layer 420 is arranged at second surface 122 side of cover plate 120, and fits in second surface 124.Touch-control sensing layer 420 makes user carry out operation control by viewing area 620 to this terminal device 600.
So, by pressing the identification slot 126 of terminal device 600, namely fingerprint recognition is carried out by fingerprint identification module 140.
Be appreciated that in other embodiments, viewing area 620 can arrange different cover plates 120 from not visible region 640, to meet different requirements.
Above-mentioned terminal device 600 is integrated with fingerprint identification module 140, can carry out fingerprint recognition to user.Be applied to the portable terminal devices such as mobile phone, password is set by fingerprint, avoid loss and the leakage of personal information.The cover plate offering identification slot can make user accurately locate, and user relies on sense of touch accurately can navigate to the region of fingerprint recognition, and reduces the distance of fingerprint to fingerprint identification module, ensure that the accurate rapidly of fingerprint recognition.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (39)
1. a fingerprint identification device, is characterized in that, comprising:
Cover plate, comprises first surface and second surface, and described first surface offers identification slot, for location fingerprint identified region;
Fingerprint identification module, comprises fingerprint sensor, and described fingerprint sensor responds to one end of fingerprint near described second surface, for responding to the fingerprint being positioned at described first surface;
Wherein, described fingerprint sensor is fixed at the described second surface side of described cover plate, and corresponding with described identification slot, is positioned in than the position of other region of described second surface closer to fingerprint to make described fingerprint sensor.
2. fingerprint identification device according to claim 1, is characterized in that, the integral thickness of described cover plate is 300 ~ 400 microns, and the thickness being provided with the described cover plate of described identification slot is less than 150 microns.
3. fingerprint identification device according to claim 1, it is characterized in that, described identification slot comprises spigot surface and surface of contact, and the relatively described first surface of described surface of contact caves inward, described spigot surface connects described first surface and described surface of contact, and around described surface of contact.
4. fingerprint identification device according to claim 3, is characterized in that, described spigot surface tilts extended relative to described surface of contact, reduces gradually from described first surface to make the cross-sectional area diameter of described identification slot to described surface of contact direction.
5. fingerprint identification device according to claim 3, is characterized in that, area matched near described second surface of described spigot surface area and described fingerprint sensor.
6. fingerprint identification device according to claim 1, is characterized in that, described second surface covers at least one deck ink layer, and described ink layer is between described cover plate and described fingerprint identification module.
7. fingerprint identification device according to claim 1, is characterized in that, described fingerprint identification module also comprises fingerprint recognition chip, and described fingerprint recognition chip is electrically connected with described fingerprint sensor, to process the finger print information that described fingerprint sensor obtains.
8. fingerprint identification device according to claim 7, is characterized in that, described fingerprint identification module also comprises circuit substrate, and described fingerprint sensor is connected by described circuit substrate with described fingerprint recognition chip.
9. fingerprint identification device according to claim 1, is characterized in that, described second surface offers the blind hole district that cave inward corresponding with described identification slot, and described blind hole district is located in one end that described fingerprint sensor responds to described identification slot place fingerprint.
10. fingerprint identification device according to claim 9, it is characterized in that, described blind hole district comprises dip plane and stationary plane, and the relatively described second surface of described stationary plane caves inward, described dip plane connects described second surface and described stationary plane, and around described stationary plane.
11. fingerprint identification devices according to claim 10, it is characterized in that, described dip plane tilts extended from described second surface towards described stationary plane direction, reduces gradually from described second surface to make the cross-sectional diameter in described blind hole district to described stationary plane direction.
12. fingerprint identification devices according to claim 1, is characterized in that, the part or all of of described cover plate is made by transparent material, or part is made by non-transparent material.
13. fingerprint identification devices according to claim 12, is characterized in that, described transparent material adopt in glass, sapphire, transparent resin, polycarbonate any one, described non-transparent material is stupalith.
14. 1 kinds, for the touch-screen of fingerprint recognition sensing, is characterized in that, comprising:
Cover plate, comprises first surface and second surface, and described first surface offers identification slot, for location fingerprint identified region;
Fingerprint identification module, comprises fingerprint sensor, and described fingerprint sensor responds to one end of fingerprint near described second surface, for responding to the fingerprint being positioned at described first surface; And
Touch-control sensing layer, is arranged at the described second surface side of described cover plate;
Wherein, described fingerprint knows the described second surface side that sensor is fixed at described cover plate, and corresponding with described identification slot, is positioned in than the position of other region of described second surface closer to fingerprint to make described fingerprint sensor.
15. touch-screens according to claim 14, it is characterized in that, described identification slot comprises surface of contact, described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in the described surface of contact of described identification slot.
16. touch-screens according to claim 15, is characterized in that, described fingerprint identification device also comprises protective seam, and described protective seam is positioned at described semiconductive thin film away from described first surface side, to protect described semiconductive thin film.
17. touch-screens according to claim 14, is characterized in that, the integral thickness of described cover plate is 300 ~ 400 microns, and the thickness being provided with the described cover plate of described identification slot is less than 150 microns.
18. touch-screens according to claim 15, it is characterized in that, described identification slot comprises spigot surface and described surface of contact, and the relatively described first surface of described surface of contact caves inward, described spigot surface connects described first surface and described surface of contact, and around described surface of contact.
19. touch-screens according to claim 18, is characterized in that, described spigot surface tilts extended relative to described surface of contact, reduces gradually from described first surface to make the cross-sectional area diameter of described identification slot to described surface of contact direction.
20. touch-screens according to claim 18, is characterized in that, described spigot surface area and described fingerprint identification module area matched.
21. touch-screens according to claim 14, is characterized in that, described second surface covers at least one deck ink layer, and described ink layer is between described cover plate and described fingerprint identification module.
22. touch-screens according to claim 14, is characterized in that, described fingerprint identification module also comprises fingerprint recognition chip, and described fingerprint recognition chip is electrically connected with described fingerprint sensor, to process the finger print information that described fingerprint sensor obtains.
23. touch-screens according to claim 22, is characterized in that, described fingerprint identification module also comprises circuit substrate, and described fingerprint sensor is connected by described circuit substrate with described fingerprint recognition chip.
24. touch-screens according to claim 14, is characterized in that, described second surface offers the blind hole district that cave inward corresponding with described identification slot, and described blind hole district is located in one end that described fingerprint identification module responds to described identification slot place fingerprint.
25. touch-screens according to claim 24, it is characterized in that, described blind hole district comprise dip plane with and stationary plane, the relatively described second surface of described stationary plane caves inward, described dip plane connects described second surface and described stationary plane, and around described stationary plane.
26. touch-screens according to claim 14, is characterized in that, the part or all of of described cover plate is made by transparent material, or part is made by non-transparent material.
27. touch-screens according to claim 26, is characterized in that, described transparent material adopt in glass, sapphire, transparent resin, polycarbonate any one, described non-transparent material is stupalith.
28. 1 kinds of terminal devices for fingerprint recognition sensing, it is characterized in that, comprise viewing area and non-viewing area, described terminal device also comprises:
Be arranged at the touch-control sensing layer of described viewing area at least partly;
Be arranged at the fingerprint identification device of described non-viewing area at least partly;
Described fingerprint identification device comprises:
Cover plate, comprises first surface and second surface, the identification slot that described first surface is offered, for location fingerprint identified region;
Fingerprint identification module, comprises fingerprint sensor, and described fingerprint sensor responds to one end of fingerprint near described second surface, for responding to the described fingerprint being positioned at described first surface;
Wherein, described fingerprint sensor is fixed at the described second surface side of described cover plate, and it is corresponding with described identification slot, to make described fingerprint sensor be positioned in than the position of other region of described second surface closer to finger, described touch-control sensing layer is arranged at the described second surface side of described cover plate.
29. terminal devices according to claim 28, it is characterized in that, described identification slot comprises surface of contact, described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in the described surface of contact of described identification slot.
30. terminal devices according to claim 29, is characterized in that, described fingerprint identification device also comprises protective seam, and described protective seam is positioned at described semiconductive thin film away from described first surface side, to protect described semiconductive thin film.
31. terminal devices according to claim 28, is characterized in that, the integral thickness of described cover plate is 300 ~ 400 microns, and the thickness being provided with the described cover plate of described identification slot is less than 150 microns.
32. terminal devices according to claim 29, it is characterized in that, described identification slot comprises spigot surface and described surface of contact, and the relatively described first surface of described surface of contact caves inward, described spigot surface connects described first surface and described surface of contact, and around described surface of contact.
33. terminal devices according to claim 28, is characterized in that, described second surface covers at least one deck ink layer, and described ink layer is between described cover plate and described fingerprint identification module.
34. terminal devices according to claim 28, is characterized in that, described fingerprint identification module also comprises fingerprint recognition chip, and described fingerprint recognition chip is electrically connected with described fingerprint sensor, to process the finger print information that described fingerprint sensor obtains.
35. terminal devices according to claim 34, is characterized in that, described fingerprint identification module also comprises circuit substrate, and described fingerprint sensor is connected by described circuit substrate with described fingerprint recognition chip.
36. terminal devices according to claim 28, is characterized in that, described second surface offers the blind hole district that cave inward corresponding with described identification slot, and described blind hole district is located in one end that described fingerprint identification module responds to described identification slot place fingerprint.
37. terminal devices according to claim 36, it is characterized in that, described blind hole district comprise dip plane with and stationary plane, the relatively described second surface of described stationary plane caves inward, described dip plane connects described second surface and described stationary plane, and around described stationary plane.
38. terminal devices according to claim 28, is characterized in that, the part or all of of described cover plate is made by transparent material, or part is made by non-transparent material.
39., according to terminal device according to claim 38, is characterized in that, described transparent material adopt in glass, sapphire, transparent resin, polycarbonate any one, described non-transparent material is stupalith.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130990.0U CN204576538U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, the touch-screen being provided with this device and terminal device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130990.0U CN204576538U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, the touch-screen being provided with this device and terminal device |
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| CN204576538U true CN204576538U (en) | 2015-08-19 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104700081A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen with same and terminal device |
| WO2017032092A1 (en) * | 2015-08-21 | 2017-03-02 | 广东欧珀移动通信有限公司 | Fingerprint sensor module and terminal |
| CN110436766A (en) * | 2019-08-28 | 2019-11-12 | 捷庭有限公司 | The glass protecting label and its manufacturing method of gradual blind hole |
-
2015
- 2015-03-06 CN CN201520130990.0U patent/CN204576538U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104700081A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen with same and terminal device |
| WO2017032092A1 (en) * | 2015-08-21 | 2017-03-02 | 广东欧珀移动通信有限公司 | Fingerprint sensor module and terminal |
| CN110436766A (en) * | 2019-08-28 | 2019-11-12 | 捷庭有限公司 | The glass protecting label and its manufacturing method of gradual blind hole |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Shenzhen OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330029 Nanchang Avenue, Nanchang high tech Zone, Nanchang, Jiangxi 1189 Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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