CN204576536U - Fingerprint identification device, the touch-screen being provided with this device and terminal device - Google Patents
Fingerprint identification device, the touch-screen being provided with this device and terminal device Download PDFInfo
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- CN204576536U CN204576536U CN201520130503.0U CN201520130503U CN204576536U CN 204576536 U CN204576536 U CN 204576536U CN 201520130503 U CN201520130503 U CN 201520130503U CN 204576536 U CN204576536 U CN 204576536U
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Abstract
The utility model discloses a kind of fingerprint identification device, be provided with the touch-screen of this device and terminal device, comprise panel assembly and fingerprint identification module, panel assembly comprises Part I and Part II, and Part II comprises: substrate comprises the first end face and the second end face; Cover plate is arranged at the first end face side of substrate, comprises cover plate outer face and cover plate inner face; Fingerprint identification module comprises fingerprint sensor, to identify the fingerprint of user; Circuit substrate, circuit substrate one end connects fingerprint sensor, and the other end is walked around substrate edges and extended to the second end face.Above-mentioned fingerprint identification device, fingerprint sensor is located at Part II, even if Part I is damaged, also can not affects other element and normally work.Fingerprint sensor is located between substrate and cover plate, identifies the fingerprint of cover plate outer face, and the signal that fingerprint sensor produces is walked around substrate by circuit substrate passes.Therefore, without the need to perforate or fluting on cover plate and substrate, requirement of strength is reached.
Description
Technical field
The utility model relates to fingerprint recognition field, particularly relates to a kind of fingerprint identification device, is provided with the touch-screen of this device and terminal device.
Background technology
Along with the development of science and technology, the application of portable terminal in daily life is increasingly extensive, and function is also day by day powerful.But portable terminal is while having increasing function, also carry a lot of personal information.If these personal informations are revealed or usurped, can make troubles to user, cause immeasurable loss, therefore, portable terminal be arranged security structure and be very important.
Encrypt for modes such as employing passwords, user needs the password remembeing to preset, and the possibility that also there is password leakage or cracked.And the fingerprint of people is formed by nature-nurture acting in conjunction, its complexity not only can be provided for the enough of discriminating, also has uniqueness and unchangeability, and therefore fingerprint recognition becomes the cipher mode that some electronic equipments adopt.
But for the terminal device installing fingerprint identification device, fingerprint identification module needs to be installed on below cover plate.Cover plate, as the inputting interface of user, needs certain intensity, and therefore the thickness of cover plate is often greater than 300 microns.Although the increase of cover sheet thickness increases the intensity of cover plate, also can affect the recognition efficiency of fingerprint identification module to fingerprint simultaneously.
Existing electronic product is in order to realize fingerprint identification function and meet the thickness requirement of cover plate and substrate, usual employing is offered through hole or is offered the mode of groove, to expose the touch-control sensing region of fingerprint sensor or to reduce the distance of finger and fingerprint sensor, so that fingerprint sensor can carry out fingerprint detection accurately.Or, terminal device is comprised cover plate and substrate, but needs perforate or fluting on cover plate or substrate equally.
But, because cover plate and substrate generally adopt the materials such as glass to make, adopt said method, then destroy the one-piece construction of cover plate and substrate, cause cover plate or substrate easily to damage, reduce production efficiency, add production cost.
Utility model content
Based on this, be necessary to ensure the recognition efficiency of fingerprint module and the problem of intensity for screen panel, providing a kind of increases the recognition efficiency of fingerprint module and does not affect the fingerprint identification device of intensity, the touch-screen being provided with this device and terminal device simultaneously.
A kind of fingerprint identification device, comprise panel assembly and fingerprint identification module, described panel assembly comprises interconnective Part I and Part II, and described Part I is structure as a whole, and described Part II comprises:
Substrate, comprises the first end face and the second end face that are parallel to each other;
Cover plate, is arranged at the described first end face side of described substrate, comprises cover plate outer face and cover plate inner face;
Described fingerprint identification module comprises:
Fingerprint sensor, between described first end face and described cover plate inner face, described fingerprint sensor responds to one end of fingerprint near described first end face, to identify the fingerprint of user;
Circuit substrate, described circuit substrate one end connects described fingerprint sensor, and the other end is walked around described substrate edges and extended to described second end face.
Above-mentioned fingerprint identification device, panel assembly is divided into Part I and Part II.Fingerprint sensor is located at Part II, and therefore Part I can arrange thicker thickness, even if Part I is damaged, also can not affects other element and normally work.Fingerprint sensor is located between substrate and cover plate, identifies the fingerprint of cover plate outer face, and the signal that fingerprint sensor produces is walked around substrate by circuit substrate passes.Therefore this fingerprint identification device, without the need to perforate or fluting on cover plate and substrate, maintains the integrality of the structure of cover plate and substrate, and ensure that the integral thickness of this fingerprint identification device by the setting of substrate, reach requirement of strength.
Wherein in an embodiment, described fingerprint sensor directly contacts and fits in described cover plate inner face.
Wherein in an embodiment, described fingerprint identification device also comprises fingerprint recognition chip, and described fingerprint recognition chip is located at described second end face, and described circuit substrate walks around described substrate, is connected to described fingerprint recognition chip.
Wherein in an embodiment, described circuit substrate is flexible PCB.
Wherein in an embodiment, between described substrate and described cover plate, be provided with packed layer, to connect described substrate and described cover plate.
Wherein in an embodiment, described packed layer material is bonding agent, and described packed layer surrounds described fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
Wherein in an embodiment, establish ink layer between described cover plate and described fingerprint sensor, and described ink layer is at least one deck.
Wherein in an embodiment, being covered in described cover plate, to be provided with the color of the described ink layer of the position of described fingerprint sensor different from the color of the described ink layer be covered in other regions of described cover plate.
Wherein in an embodiment, between described cover plate and substrate, be provided with at least one deck ink layer.
Wherein in an embodiment, described cover plate materials is ultra-thin glass or wear-resistant thermoplastic polyester.
Wherein in an embodiment, described cover sheet thickness is less than or equal to 100 microns, and the thickness range of described Part II is 300 ~ 400 microns.
For sensing the touch-screen identifying fingerprint, comprise panel assembly, fingerprint identification module and touch-control sensing layer, described panel assembly comprises interconnective Part I and Part II, and described Part I is structure as a whole, and described Part II comprises:
Substrate, comprises the first end face and the second end face that are parallel to each other;
Cover plate, is arranged at the described first end face side of described cover plate, comprises cover plate outer face and cover plate inner face;
Described fingerprint identification module comprises:
Fingerprint sensor, between described first end face and described cover plate inner face, described fingerprint sensor responds to one end of fingerprint near described first end face, to identify the fingerprint of user;
Circuit substrate, described circuit substrate one end connects described fingerprint sensor, and the other end is walked around described substrate edges and extended to described second end face;
Wherein, described Part I is located at described Part II side, and described Part I comprises first surface and second surface, and described first surface and described cover plate outer face are positioned at same plane;
Described touch-control sensing layer is arranged at the second surface side of described Part I at least partly.
Wherein in an embodiment, described fingerprint identification device also comprises fingerprint recognition chip, and described fingerprint recognition chip is located at described second end face, and described circuit substrate walks around described substrate, is connected to described fingerprint recognition chip.
Wherein in an embodiment, described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in described cover plate outer face, to increase the susceptibility of described fingerprint sensor.
Wherein in an embodiment, described fingerprint sensor directly contacts and fits in described cover plate inner face.
Wherein in an embodiment, described circuit substrate is flexible PCB.
Wherein in an embodiment, between described substrate and described cover plate, be provided with packed layer, to connect described substrate and described cover plate.
Wherein in an embodiment, described packed layer material is bonding agent, and described packed layer surrounds described fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
Wherein in an embodiment, be provided with ink layer between described cover plate and described fingerprint sensor, described ink layer is at least one deck.
Wherein in an embodiment, being covered in described cover plate, to be provided with the color of the described ink layer of the position of described fingerprint sensor different from the color of the described ink layer be covered in other regions of described cover plate.
Wherein in an embodiment, be provided with ink layer between described cover plate and substrate, and described ink layer is at least one deck.
Wherein in an embodiment, described cover plate materials is ultra-thin glass or wear-resistant thermoplastic polyester.
Wherein in an embodiment, described cover sheet thickness is less than or equal to 100 microns, and the thickness range of described Part II is 300 ~ 400 microns.
A kind of terminal device for fingerprint recognition sensing, described terminal device is divided into viewing area and non-viewing area, described terminal device comprises panel assembly, fingerprint identification module and touch-control sensing layer, described panel assembly covers described viewing area and described non-viewing area, comprise the Part I being positioned at described viewing area at least partly and the Part II being positioned at described non-viewing area at least partly, described Part II comprises:
Substrate, comprises the first end face and the second end face that are parallel to each other;
Cover plate, is arranged at the described first end face side of described substrate, comprises cover plate outer face and cover plate inner face;
Described fingerprint identification module comprises:
Fingerprint sensor, between described first end face and described cover plate inner face, described fingerprint sensor responds to one end of fingerprint near described first end face, to identify the fingerprint of user;
Circuit substrate, described circuit substrate one end connects described fingerprint sensor, and the other end is walked around described substrate and arrived described second end face; Wherein, described Part II is located at described Part I side, and described Part II comprises first surface and second surface, and described first surface and described cover plate outer face are positioned at same plane;
Described touch-control sensing layer is arranged at the second surface side of described Part I at least partly.
Wherein in an embodiment, described fingerprint identification device also comprises fingerprint recognition chip, and described fingerprint recognition chip is located at described second end face, and described circuit substrate walks around described substrate, is connected to described fingerprint recognition chip.
Wherein in an embodiment, the described cover plate of described Part II extends to described Part I and forms integrative-structure with described Part I.
Wherein in an embodiment, described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in described cover plate outer face, to increase the susceptibility of described fingerprint sensor.
Wherein in an embodiment, described fingerprint sensor directly contacts and fits in described cover plate inner face.
Wherein in an embodiment, described circuit substrate is flexible PCB.
Wherein in an embodiment, between described substrate and described cover plate, be provided with packed layer, to connect described substrate and described cover plate.
Wherein in an embodiment, described packed layer material is bonding agent, and described packed layer surrounds described fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
Wherein in an embodiment, between described cover plate and described fingerprint sensor, be provided with the ink layer of at least one deck.
Wherein in an embodiment, being covered in described cover plate, to be provided with the color of the described ink layer of the position of described fingerprint sensor different from the color of the described ink layer be covered in other regions of described cover plate.
Wherein in an embodiment, between described cover plate and substrate, be provided with at least one deck ink layer.
Wherein in an embodiment, described cover plate materials is ultra-thin glass or wear-resistant thermoplastic polyester.
Wherein in an embodiment, described cover sheet thickness is less than or equal to 100 microns, and the thickness range of described Part II is 300 ~ 400 microns.
Accompanying drawing explanation
Fig. 1 is the structural representation of the touch-screen of an embodiment;
The Facad structure schematic diagram that Fig. 2 is the fingerprint identification device in the touch-screen shown in Fig. 1;
The structure schematic diagram that Fig. 3 is the fingerprint identification device in the touch-screen shown in Fig. 1;
Fig. 4 is for the fingerprint identification device shown in Fig. 2 is along the cut-open view of A-A ' profile line;
Fig. 5 is the cut-open view along A-A ' the profile line when fingerprint identification device shown in Fig. 2 of an embodiment is provided with ink layer;
Fig. 6 is the cut-open view along A-A ' the profile line when fingerprint identification device shown in Fig. 2 of another embodiment is provided with ink layer;
Fig. 7 is the cut-open view along A-A ' the profile line when fingerprint identification device shown in Fig. 2 of another embodiment is provided with ink layer;
Fig. 8 is the structural representation of the fingerprint identification device being provided with two fingerprint identification modules;
Fig. 9 is the schematic diagram of the terminal device of an embodiment.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present utility model more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in instructions of the present utility model herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
As shown in figs. 1 to 6, a kind of fingerprint identification device 100 in this preferred embodiment.In Fig. 1, this fingerprint identification device 100 and an extra module such as, with the use of, touch-control sensing layer 520.As shown in figs. 2 to 4, this fingerprint identification device 100 comprises panel assembly (figure does not mark) and fingerprint identification module 146.Panel assembly comprises interconnective Part I 120 and Part II 140.Part I 120 is structure as a whole.Part II 140 comprises substrate 142, cover plate 144 and fingerprint identification module 146.Fingerprint identification module 146 comprises fingerprint sensor 1462 and circuit substrate 1464.
Particularly, substrate 142 comprises the first end face 1422 and the second end face 1444 be parallel to each other.Cover plate 144 is arranged at the first end face 1422 side of substrate 142, comprises cover plate outer face 1442 and cover plate inner face 1444.
Fingerprint sensor 1462 is between the first end face 1422 and cover plate inner face 1444.Fingerprint sensor 1462 responds to one end of fingerprint near the first end face 1422, to identify the fingerprint of user.Circuit substrate 1464 one end connects fingerprint sensor 1462, and the other end is walked around substrate 142 and arrived the second end face 1424.
Above-mentioned fingerprint identification device 100, panel assembly is divided into Part I 120 and Part II 140.Fingerprint sensor 1462 is located at Part II 140, and therefore Part I 120 can arrange thicker thickness, to protect touch-screen 500, if Part I 120 is damaged, also can not affects touch-control sensing layer 520 and normally work.
Fingerprint sensor 1462 is located between substrate 142 and cover plate 144, identifies the fingerprint of cover plate outer face 1442, and the signal produced by fingerprint sensor 1462 is walked around substrate 142 by circuit substrate 1464 and passed.Therefore this fingerprint identification device 100, without the need to perforate or fluting on cover plate 144 and substrate 142, maintain the integrality of the structure of cover plate 144 and substrate 142, and ensure that the integral thickness of this fingerprint identification device 100 by the setting of substrate 142, reach requirement of strength.
Further, fingerprint sensor 1462 directly contacts and fits in cover plate inner face 1444.Cover plate 144 is ultra-thin materials, and when fingerprint identification device 100 is arranged on electronic equipment, cover plate 144 is exposed to outermost layer.So, user carries out touch control operation by cover plate 144.Further, cover plate outer face 1442 is positioned at fingerprint identification device 100 side outwardly, cover plate inner face 1444 towards the side of mobile phone, apparatus such as computer inside, namely closer to the side of electronic devices and components.
Because cover plate 144 is as the inputting interface of user, therefore often can accept the usage behavior such as touch and pressing of user, and in use come in contact with other objects and even collide with.Therefore, cover plate 144 needs reach certain thickness and ensure enough intensity.And at present, fingerprint sensor 1462 identifies that the coverage of fingerprint is less than 200 microns, and therefore the distance of the distance fingerprint sensor 1462 of cover plate 144 needs to be less than 200 microns, to ensure that fingerprint sensor 1462 can identify fingerprint.
Make the integral thickness of the cover plate 144 of electronic equipment and substrate 142 like this below 500 microns, make the cover plate 144 of electronic equipment can realize the demand of the rigid of inputting interface, electronic equipment thickness can not be increased again, fingerprint sensor 1462, not in borehole situation, is located at and solves technical matters of the present utility model between substrate 142 and cover plate 144 by such electronic equipment cover plate 144 cleverly.
In the present embodiment, the material of cover plate 144 is ultra-thin glass or wear-resistant thermoplastic polyester (Polyethylene terephthalate, and thickness is less than or equal to 100 microns PET), less than the distance 200 microns usually needed, therefore, fingerprint sensor 1462 in the present embodiment accurately can identify the fingerprint of cover plate outer face 1442, makes fingerprint recognition have higher accuracy, and without the need to offering through hole or groove and affect cover plate 144 intensity on cover plate 144.Improve production efficiency, and reduce production cost.
Further, wear-resistant thermoplastic surface of polyester is level and smooth and glossy, and resistance to creep, resistance to fatigue resistence, abrasion-resistant and good stability of the dimension, have stronger impact resistance, can extend the serviceable life of this fingerprint identification device 100.
And the material of substrate 142 is glass etc., can select according to actual needs.Make the thickness range of Part II 140 be 300 ~ 400 microns, so, the intensity of cover plate 144 can be increased, ensure that integrally-built thickness reaches requirement of strength, make this fingerprint identification device 100 have longer life-span and enough intensity.
Fingerprint identification device 100 also comprises fingerprint recognition chip 1466.This fingerprint recognition chip 1466 is located at the second end face 1424 side of substrate 142.Circuit substrate 1464 walks around substrate 142, is connected to this fingerprint recognition chip 1466.So, substrate 142 to hold circuit substrate 1464 without the need to fluting, ensure that the intensity of this fingerprint identification device 100, and decreases manufacturing procedure, save production cost.Further, outside circuit substrate 50 is exposed to, convenient maintenance.In the present embodiment, circuit substrate 1464 adopts flexible PCB.Flexible PCB is that the one made for base material with polyimide or mylar has height reliability, good flexible printed circuit.Have the advantages that distribution density is high, lightweight, thickness is thin, bending property is good.Circuit substrate 50 like this can walk around substrate easily, connects fingerprint sensor 1462 and fingerprint recognition chip 1466.
Particularly, fingerprint sensor 1462 comprises multiple fingerprint identification unit arranged in the matrix form.Fingerprint identification unit comprises induction electrode and drive electrode.Between induction electrode and drive electrode, there is detector gap, a basic capacitor can be formed.When finger presses cover plate outer face 1442, the specific inductive capacity due to fingerprint ridge is the several times of air, and capacitive coupling therefore between induction electrode from drive electrode can according to being that fingerprint ridge or fingerprint paddy are positioned at above detector gap and have different change.
So, fingerprint sensor 1462 can be judged, by the fingerprint ridge and the fingerprint paddy that are pressed in cover plate 144, to obtain fingerprint image, to carry out fingerprint collecting and identification.Be appreciated that the principle of work of fingerprint sensor 1462 is not limited thereto, different fingerprint sensors 1462 can be selected as required.
Packed layer 147 is provided with, with connection substrate 142 and cover plate 144 between substrate 142 and cover plate 144.The material of packed layer 147 is bonding agent, and packed layer 147 surrounds described fingerprint sensor 1462, with while connection substrate 142 with cover plate 144, and fixing fingerprint sensor 1462.
In the present embodiment, adhesive material is transparent optical cement (Optically Clear Adhesive, OCA) or ultraviolet hardening resin (Optically Clear Resin, OCR).
Transparent optical cement makes without base material by optics acryl glue, then at upper and lower bottom, more a kind of Double-face adhesive rubber alloy band without matrix material of one deck release film of respectively fitting.Clarity is high, and has high light transmittance (full light transmittance >99%), high adhesion force, high durable, water tolerance, high temperature resistant, uvioresistant, and long-time use can not produce yellow, stripping and rotten problem.
Ultraviolet hardening resin can suppress exterior light to shine the light scattering situation caused with backlight, there is the refractive index close with glass and transmittance, and the rate of expand to shrink of different substrate materials can be born, high/low temperature when substrate 142 is fitted with cover plate 144 can be kept out and change the problem produced.
Above-mentioned fingerprint identification device 100, by arranging cover plate 144 and substrate 142, fingerprint sensor 1462 is arranged between cover plate 144 and substrate 142, can reduce cover plate 144 thickness and without the need on cover plate 144 and substrate 142 slot, the fingerprint of fingerprint identification device 100 cover plate outer face 1442 more easy to identify can be made, ensure susceptibility and the accuracy of fingerprint recognition.Cover plate 144 is connected by packed layer 147 with substrate 142, ensures the intensity of cover plate 144 by substrate 142, extends the serviceable life of this fingerprint identification device 100, and not fragile.
As shown in Figure 5, the fingerprint identification device 200 of the second embodiment that the utility model provides, it is roughly the same with the first embodiment, comprises substrate 242, cover plate 244 and fingerprint identification module 246.Wherein, substrate 242 comprises the first end face 2422 and the second end face 2424 be parallel to each other.Cover plate 244 is arranged at the first end face 2422 side of substrate 242, comprises cover plate outer face 2442 and cover plate inner face 2444.
Fingerprint identification module 246 comprises fingerprint sensor 2462, circuit substrate 2464 and fingerprint recognition chip 2466.Fingerprint sensor 2462 is between the first end face 2424 and cover plate inner face 2444.Circuit substrate 2464 one end connects fingerprint sensor 2462, and the other end is walked around substrate 242 edge and arrived the second end face 2424, connects fingerprint recognition chip 2466.
Difference is, in the present embodiment, is provided with the ink layer 248 of at least one deck between cover plate 244 and fingerprint sensor 2462.Ink layer 248 covers on cover plate inner face 2444.Particularly, ink layer 248 can be white, black or other color, is printed on cover plate 244 by seal typography.
In the present embodiment, ink layer 248 be two-layer more than.So, the fingerprint sensor 2462 below cover plate 244 can be covered, make the color in this region consistent with other regions, form integral structure, aesthetic appeal.
In other embodiments, can not arrange ink layer 248 as required, the transparent shape of cover component 244 is arranged.When cover component 244 adopts non-transparent material to make, also ink layer 248 can be saved.
As shown in Figure 6, the fingerprint identification device 300 of the third embodiment that the utility model provides, it is roughly the same with above-described embodiment, comprises substrate 342, cover plate 344 and fingerprint identification module 346.Wherein, substrate 342 comprises the first end face 3422 and the second end face 3424 be parallel to each other.Cover plate 344 is arranged at the first end face 3422 side of substrate 342, comprises cover plate outer face 3442 and cover plate inner face 3444.
Fingerprint identification module 346 comprises fingerprint sensor 3462, circuit substrate 3464 and fingerprint recognition chip 3466.Fingerprint sensor 3462 is between the first end face 3424 and cover plate inner face 3444.Circuit substrate 3464 one end connects fingerprint sensor 3462, and the other end is walked around substrate 342 edge and arrived the second end face 3424, connects fingerprint recognition chip 3466.
Difference is, in the present embodiment, is positioned at the ink layer 348 in the region of fingerprint sensor 3462 induction range different from the color of the ink layer 348 in other regions.So, ink layer 348 can cover the electronic component under cover plate 344, has beautified outward appearance, meanwhile, makes user can distinguish the position at fingerprint sensor 3462 place fast according to the difference of color, improves speed and the accuracy of fingerprint recognition, user-friendly.
As shown in Figure 7, the fingerprint identification device 400 of the 4th kind of embodiment that the utility model provides, it is roughly the same with above-described embodiment, comprises substrate 442, cover plate 444 and fingerprint identification module 446.Wherein, substrate 442 comprises the first end face 4422 and the second end face 4424 be parallel to each other.Cover plate 444 is arranged at the first end face 4422 side of substrate 442, comprises cover plate outer face 4442 and cover plate inner face 4444.
Fingerprint identification module 446 comprises fingerprint sensor 4462, circuit substrate 4464 and fingerprint recognition chip 4466.Fingerprint sensor 4462 is between the first end face 4424 and cover plate inner face 4444.Circuit substrate 4464 one end connects fingerprint sensor 4462, and the other end is walked around substrate 442 edge and arrived the second end face 4424, connects fingerprint recognition chip 4466.
Difference is, in the present embodiment, ink layer 448 is located between cover plate 444 and substrate 442, to cover the electronic component under substrate 442, when cover plate 444 adopts transparent material, can demonstrate fingerprint sensor 4462 in cover plate outer face 4442.So that user positions, accurately identify the position of fingerprint sensor 4462.
As shown in Figure 8, the 5th embodiment of the present utility model provides a kind of fingerprint identification device 600.The structure of this fingerprint identification device 600 is roughly the same with fingerprint identification device 100, comprises panel assembly and fingerprint identification module 146.Panel assembly comprises Part I 120 and Part II 140.
Difference is, in the present embodiment, Part II 140 is positioned at the both sides (not shown) of Part I 120.The Part II 140 of Part I 140 both sides is respectively provided with fingerprint identification module 146, forms two fingerprint recognition regions.So, expand the regional extent of fingerprint recognition, facilitate the operation of user, can use in varied situations in zones of different and carry out fingerprint recognition.
As shown in Fig. 1 and Fig. 4, the utility model provides a kind of touch-screen 500, comprises panel assembly, fingerprint identification module 146 and touch-control sensing layer 520.Panel assembly comprises interconnective Part I 120 and Part II 140.
Part I 120 is structure as a whole.Part II 140 comprises substrate 142 and cover plate 144, and wherein, substrate 142 comprises the first end face 1422 and the second end face 1424 be parallel to each other.Cover plate 144 is arranged at the first end face 1422 side of substrate 142, comprises cover plate outer face 1442 and cover plate inner face 1444.
Fingerprint identification module 146 comprises fingerprint sensor 1462, circuit substrate 1464 and fingerprint recognition chip 1466.Fingerprint sensor 1462 is between the first end face 1422 and cover plate inner face 1444.Circuit substrate 1464 one end connects fingerprint sensor 1462, and the other end is walked around substrate 142 edge and arrived the second end face 1424, connects fingerprint recognition chip 1466.
Further, Part I 120 is positioned at Part II 140 side, and Part I 120 comprises first surface and second surface (scheming not mark), and first surface and cover plate outer face 1442 are positioned at same plane.In the present embodiment, first surface is the extension of cover plate outer face 1442, to make touch-screen 500 surface in integrated setting, has beautified outward appearance.
Control the second surface side that module 520 is arranged at Part I 120 at least partly.User touches the first surface of Part I 120, and touch-control sensing layer 520 can sense and realize touch control operation in the position that user touches.
Fingerprint identification device 100 also comprises semiconductive thin film (not shown), to strengthen the penetration capacity of fingerprint, increases the recognition efficiency of fingerprint.This semiconductive thin film is covered in cover plate outer face 1442.Semiconductive thin film is provided with spaced semiconductor striped.
Particularly, the material of semiconductive thin film comprises semi-conducting polymer, indium tin oxide and zinc tin oxide etc., by evaporating deposition technique, as the mode such as electron beam evaporation, magnetron sputtering is prepared from.Utilize semiconductor property, when not carrying out coupling charging to semiconductive thin film, the electric conductivity of semiconductive thin film is tending towards insulation.
Position transducer and radio-frequency signal generator (not shown) is also provided with between substrate 142 and cover plate 144.The detectable finger touch signal of position transducer, thus start radio-frequency signal generator.
When semiconductor film layer by the radio-frequency signal generator between substrate 142 and cover plate 144 apply radio frequency high tension charge time, the electric conductivity of semiconductive thin film is tending towards conductor, thus small current radio frequency signal can be inputted to finger by coupling charging, strengthen finger electric field line to the penetration of cover plate, increase the recognition efficiency of fingerprint sensor 1462.
On semiconductive thin film, the width of the spaced semiconductor striped of photoetching is roughly adapted to the width pointed, thus for pointing the region being provided for fingerprint recognition.
Be appreciated that in other embodiments, also can not arrange semiconductive thin film, fingerprint sensor 1462 directly identifies fingerprint by cover plate 144.
Touch-screen 500 also comprises protective seam (not shown).This protective seam is positioned at semiconductive thin film away from side, cover plate outer face 1442.In this preferred embodiment; protective seam is anti-fingerprint film; formed by spraying technology or thermal evaporation techniques; for a kind of silicon fluoride long-chain compound; it is a kind of material had compared with low surface tension; therefore there is waterproof, grease proofing function, and there is good crocking resistance, to protect semiconductive thin film.Be appreciated that the material of protective seam is not limited thereto, can arrange according to actual needs, also can not protective seam be set.
Above-mentioned touch-screen 500, the touch location distance fingerprint sensor 1462 of user's finger is the thickness of cover plate 144, due to close together, therefore ensure that the accuracy of fingerprint recognition.The substrate 142 that fingerprint sensor 1462 opposite side is arranged ensure that the thickness of this touch-screen 500, and fingerprint sensor logical 1462 walks around substrate 142 edge by circuit substrate 1464, connect fingerprint recognition chip 1466, cover plate 144 and substrate 142 are all without the need to offering through hole or groove, ensure that the integrality of structure, therefore this touch-screen 500 has certain intensity.
As shown in Fig. 1, Fig. 4 and Fig. 9, a kind of terminal device 700 that the utility model provides.Terminal device 700 is divided into viewing area 720 and non-viewing area 740.Terminal device 700 comprises panel assembly, fingerprint identification module 146 and touch-control sensing layer 520.Panel assembly covers viewing area 720 and non-viewing area 740, comprises the Part I 120 being positioned at viewing area 720 at least partly and the Part II 140 being positioned at non-viewing area 740 at least partly.
Part I 120 is integral type structure.Part II 140 comprises substrate 142 and cover plate 144.Substrate 142 comprises the first end face 1422 and the second end face 1424 be parallel to each other.Cover plate 144 is arranged at the first end face 1422 side of substrate 142, comprises cover plate outer face 1442 and cover plate inner face 1444.
Fingerprint identification module 146 comprises fingerprint sensor 1462, circuit substrate 1464 and fingerprint recognition chip 1466.
Fingerprint sensor 1462 is between the first end face 1422 and cover plate inner face 1444, and fingerprint sensor 1462 responds to one end of fingerprint near the first end face 1422, to identify the fingerprint of user.
Fingerprint sensor 1462 is between the first end face 1422 and cover plate inner face 1444.Circuit substrate 1464 one end connects fingerprint sensor 1462, and the other end is walked around substrate 142 edge and arrived the second end face 1424, connects fingerprint recognition chip 1466.
Further, Part I 120 is positioned at Part II 140 side, and Part I 120 comprises first surface and second surface (scheming not mark), and second surface and cover plate outer face 1442 are positioned at same plane.In the present embodiment, the cover plate 144 of Part II 120 extends to Part I 120 and forms integrative-structure with Part I 120.Be appreciated that the cover plate 144 of Part II 140 also can not be connected with Part I.
Touch-control sensing layer 520 is arranged at the second surface side of Part I 120 at least partly.User touches the first surface of Part I 120, and touch-control sensing layer 520 can sense and realize touch control operation in the position that user touches.
Above-mentioned terminal device 700, by pressing the fingerprint recognition region of cover clamp 144, namely identifies by fingerprint sensor 1462 pairs of user fingerprints, with the equipment of opening a terminal 700, avoids user profile to reveal from terminal device 700.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (36)
1. a fingerprint identification device, is characterized in that, comprises panel assembly and fingerprint identification module, and described panel assembly comprises interconnective Part I and Part II, and described Part I is structure as a whole, and described Part II comprises:
Substrate, comprises the first end face and the second end face that are parallel to each other;
Cover plate, is arranged at the described first end face side of described substrate, comprises cover plate outer face and cover plate inner face;
Described fingerprint identification module comprises:
Fingerprint sensor, between described first end face and described cover plate inner face, described fingerprint sensor responds to one end of fingerprint near described first end face, to identify the fingerprint of user;
Circuit substrate, described circuit substrate one end connects described fingerprint sensor, and the other end is walked around described substrate edges and extended to described second end face.
2. fingerprint identification device according to claim 1, is characterized in that, described fingerprint sensor directly contacts and fits in described cover plate inner face.
3. fingerprint identification device according to claim 1, it is characterized in that, described fingerprint identification device also comprises fingerprint recognition chip, and described fingerprint recognition chip is located at described second end face, described circuit substrate walks around described substrate, is connected to described fingerprint recognition chip.
4. fingerprint identification device according to claim 1, is characterized in that, described circuit substrate is flexible PCB.
5. fingerprint identification device according to claim 1, is characterized in that, is provided with packed layer between described substrate and described cover plate, to connect described substrate and described cover plate.
6. fingerprint identification device according to claim 5, is characterized in that, described packed layer material is bonding agent, and described packed layer surrounds described fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
7. fingerprint identification device according to claim 1, is characterized in that, establishes ink layer between described cover plate and described fingerprint sensor, and described ink layer is at least one deck.
8. fingerprint identification device according to claim 7, is characterized in that, being covered in described cover plate, to be provided with the color of the described ink layer of the position of described fingerprint sensor different from the color of the described ink layer be covered in other regions of described cover plate.
9. fingerprint identification device according to claim 1, is characterized in that, is provided with at least one deck ink layer between described cover plate and substrate.
10. fingerprint identification device according to claim 1, is characterized in that, described cover plate materials is ultra-thin glass or wear-resistant thermoplastic polyester.
11. fingerprint identification devices according to claim 1, is characterized in that, described cover sheet thickness is less than or equal to 100 microns, and the thickness range of described Part II is 300 ~ 400 microns.
12. 1 kinds for sensing the touch-screen of identification fingerprint, it is characterized in that, comprise panel assembly, fingerprint identification module and touch-control sensing layer, described panel assembly comprises interconnective Part I and Part II, described Part I is structure as a whole, and described Part II comprises:
Substrate, comprises the first end face and the second end face that are parallel to each other;
Cover plate, is arranged at the described first end face side of described cover plate, comprises cover plate outer face and cover plate inner face;
Described fingerprint identification module comprises:
Fingerprint sensor, between described first end face and described cover plate inner face, described fingerprint sensor responds to one end of fingerprint near described first end face, to identify the fingerprint of user;
Circuit substrate, described circuit substrate one end connects described fingerprint sensor, and the other end is walked around described substrate edges and extended to described second end face;
Wherein, described Part I is located at described Part II side, and described Part I comprises first surface and second surface, and described first surface and described cover plate outer face are positioned at same plane;
Described touch-control sensing layer is arranged at the second surface side of described Part I at least partly.
13. touch-screens according to claim 12, is characterized in that, described fingerprint identification device also comprises fingerprint recognition chip, and described fingerprint recognition chip is located at described second end face, and described circuit substrate walks around described substrate, are connected to described fingerprint recognition chip.
14. touch-screens according to claim 12, is characterized in that, described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in described cover plate outer face, to increase the susceptibility of described fingerprint sensor.
15. touch-screens according to claim 12, is characterized in that, described fingerprint sensor directly contacts and fits in described cover plate inner face.
16. touch-screens according to claim 12, is characterized in that, described circuit substrate is flexible PCB.
17. touch-screens according to claim 12, is characterized in that, are provided with packed layer between described substrate and described cover plate, to connect described substrate and described cover plate.
18. touch-screens according to claim 17, is characterized in that, described packed layer material is bonding agent, and described packed layer surrounds described fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
19. touch-screens according to claim 12, is characterized in that, are provided with ink layer between described cover plate and described fingerprint sensor, and described ink layer is at least one deck.
20. touch-screens according to claim 19, is characterized in that, being covered in described cover plate, to be provided with the color of the described ink layer of the position of described fingerprint sensor different from the color of the described ink layer be covered in other regions of described cover plate.
21. touch-screens according to claim 12, is characterized in that, are provided with ink layer between described cover plate and substrate, and described ink layer is at least one deck.
22. touch-screens according to claim 12, is characterized in that, described cover plate materials is ultra-thin glass or wear-resistant thermoplastic polyester.
23. touch-screens according to claim 12, is characterized in that, described cover sheet thickness is less than or equal to 100 microns, and the thickness range of described Part II is 300 ~ 400 microns.
24. 1 kinds of terminal devices for fingerprint recognition sensing, it is characterized in that, described terminal device is divided into viewing area and non-viewing area, described terminal device comprises panel assembly, fingerprint identification module and touch-control sensing layer, described panel assembly covers described viewing area and described non-viewing area, comprise the Part I being positioned at described viewing area at least partly and the Part II being positioned at described non-viewing area at least partly, described Part II comprises:
Substrate, comprises the first end face and the second end face that are parallel to each other;
Cover plate, is arranged at the described first end face side of described substrate, comprises cover plate outer face and cover plate inner face;
Described fingerprint identification module comprises:
Fingerprint sensor, between described first end face and described cover plate inner face, described fingerprint sensor responds to one end of fingerprint near described first end face, to identify the fingerprint of user;
Circuit substrate, described circuit substrate one end connects described fingerprint sensor, and the other end is walked around described substrate and arrived described second end face; Wherein, described Part II is located at described Part I side, and described Part II comprises first surface and second surface, and described first surface and described cover plate outer face are positioned at same plane;
Described touch-control sensing layer is arranged at the second surface side of described Part I at least partly.
25. terminal devices according to claim 24, it is characterized in that, described fingerprint identification device also comprises fingerprint recognition chip, and described fingerprint recognition chip is located at described second end face, described circuit substrate walks around described substrate, is connected to described fingerprint recognition chip.
26. terminal devices according to claim 24, is characterized in that, the described cover plate of described Part II extends to described Part I and forms integrative-structure with described Part I.
27. terminal devices according to claim 24, is characterized in that, described fingerprint identification device also comprises semiconductive thin film, and described semiconductive thin film is covered in described cover plate outer face, to increase the susceptibility of described fingerprint sensor.
28. terminal devices according to claim 24, is characterized in that, described fingerprint sensor directly contacts and fits in described cover plate inner face.
29. terminal devices according to claim 24, is characterized in that, described circuit substrate is flexible PCB.
30. terminal devices according to claim 24, is characterized in that, are provided with packed layer between described substrate and described cover plate, to connect described substrate and described cover plate.
31. terminal devices according to claim 30, is characterized in that, described packed layer material is bonding agent, and described packed layer surrounds described fingerprint sensor, and described adhesive material is transparent optical cement or ultraviolet hardening resin.
32. terminal devices according to claim 24, is characterized in that, are provided with the ink layer of at least one deck between described cover plate and described fingerprint sensor.
33. terminal devices according to claim 32, is characterized in that, being covered in described cover plate, to be provided with the color of the described ink layer of the position of described fingerprint sensor different from the color of the described ink layer be covered in other regions of described cover plate.
34. terminal devices according to claim 24, is characterized in that, are provided with at least one deck ink layer between described cover plate and substrate.
35. terminal devices according to claim 24, is characterized in that, described cover plate materials is ultra-thin glass or wear-resistant thermoplastic polyester.
36. terminal devices according to claim 24, is characterized in that, described cover sheet thickness is less than or equal to 100 microns, and the Part II scope of described substrate is 300 ~ 400 microns.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130503.0U CN204576536U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, the touch-screen being provided with this device and terminal device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520130503.0U CN204576536U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, the touch-screen being provided with this device and terminal device |
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| CN204576536U true CN204576536U (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520130503.0U Expired - Fee Related CN204576536U (en) | 2015-03-06 | 2015-03-06 | Fingerprint identification device, the touch-screen being provided with this device and terminal device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104700083A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, production method thereof, touch screen and terminal device |
| CN105205470A (en) * | 2015-09-29 | 2015-12-30 | 上海箩箕技术有限公司 | Fingerprint imaging module |
| CN106339125A (en) * | 2016-08-16 | 2017-01-18 | 广东欧珀移动通信有限公司 | Input component, terminal and manufacturing method |
| CN106897684A (en) * | 2017-02-16 | 2017-06-27 | 广东欧珀移动通信有限公司 | Fingerprint recognition component and terminal |
| CN107194303A (en) * | 2016-03-15 | 2017-09-22 | 上海箩箕技术有限公司 | Glass cover-plate and preparation method thereof, optical fingerprint sensor |
| CN107979669A (en) * | 2017-12-12 | 2018-05-01 | 江苏凯尔生物识别科技有限公司 | Touch-control fingerprint component for smart mobile phone |
| US10551951B2 (en) | 2016-08-16 | 2020-02-04 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Input assembly with fingerprint identification chip arranged between a touch panel and flexible circuit board |
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2015
- 2015-03-06 CN CN201520130503.0U patent/CN204576536U/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104700083A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, production method thereof, touch screen and terminal device |
| CN104700083B (en) * | 2015-03-06 | 2019-06-07 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device and its manufacturing method, touch screen, terminal device |
| CN105205470A (en) * | 2015-09-29 | 2015-12-30 | 上海箩箕技术有限公司 | Fingerprint imaging module |
| CN107194303A (en) * | 2016-03-15 | 2017-09-22 | 上海箩箕技术有限公司 | Glass cover-plate and preparation method thereof, optical fingerprint sensor |
| CN107194303B (en) * | 2016-03-15 | 2020-03-10 | 上海箩箕技术有限公司 | Glass cover plate, manufacturing method thereof and optical fingerprint sensor |
| CN106339125A (en) * | 2016-08-16 | 2017-01-18 | 广东欧珀移动通信有限公司 | Input component, terminal and manufacturing method |
| US10551951B2 (en) | 2016-08-16 | 2020-02-04 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Input assembly with fingerprint identification chip arranged between a touch panel and flexible circuit board |
| CN106897684A (en) * | 2017-02-16 | 2017-06-27 | 广东欧珀移动通信有限公司 | Fingerprint recognition component and terminal |
| WO2018149252A1 (en) * | 2017-02-16 | 2018-08-23 | 广东欧珀移动通信有限公司 | Fingerprint identification component and terminal |
| CN107979669A (en) * | 2017-12-12 | 2018-05-01 | 江苏凯尔生物识别科技有限公司 | Touch-control fingerprint component for smart mobile phone |
| CN107979669B (en) * | 2017-12-12 | 2023-10-03 | 江苏凯尔生物识别科技有限公司 | Touch fingerprint assembly for smart phone |
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