CN204537800U - The SMD inductance of high stability EMI - Google Patents
The SMD inductance of high stability EMI Download PDFInfo
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- CN204537800U CN204537800U CN201520175042.9U CN201520175042U CN204537800U CN 204537800 U CN204537800 U CN 204537800U CN 201520175042 U CN201520175042 U CN 201520175042U CN 204537800 U CN204537800 U CN 204537800U
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- coil windings
- pedestal
- emi
- gold plated
- solder joint
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Abstract
This application discloses the SMD inductance of a kind of high stability EMI, by providing the pedestal of ceramic material, and adopting in the two opposite sides of base of ceramic craft of gilding to form the first gold plated pads and the second gold plated pads, effectively ensureing the stability of pedestal and pad, longer service life, performance is better; Be directly welded in by two free ends of coil windings in the first gold plated pads and the second gold plated pads, accurate positioning is easy, effectively avoids dry joint rosin joint; Employing gluing process forms two free ends stretching out described magnetic cover and the first solder joint thereof and the second solder joint that seal and cover described coil windings on pedestal; available protecting solder joint and the wire forming described coil windings are not damaged, and guarantee the stability that the application's inductance component uses and fail safe further.
Description
Technical field
The application relates to technical field of electronic devices, particularly relates to the SMD inductance of a kind of high stability EMI.
Background technology
Pedestal many employings plastic material of the SMD inductance of existing high stability EMI is made, and its pad then adopts the zinc-plated terminal of copper.During making, first coiling on magnetic core, then carry out scolding tin, finally by solder joint point glue on the zinc-plated terminal of copper wire two free end being entangled in pedestal.Plastic cement pedestal is easily out of shape under the environment of the high heat of high temperature, and the pad that the zinc-plated terminal of copper is formed easily is oxidized in long-term use procedure and under the environment of humidity; And wire two free end is wound on the pad of the zinc-plated terminal formation of copper by employing manually, not only accurately cannot locates and easily come loose, causing dry joint rosin joint; Meanwhile, wire is in atmosphere exposed, in assembling process, is easily scraped off broken skin and causes short circuit.
Summary of the invention
The application is intended to one of solve the problems of the technologies described above at least to a certain extent.
The application provides the SMD inductance of a kind of high stability EMI, comprises pedestal, the magnetic core be fixed on described pedestal, the coil windings be set around on described magnetic core, and covers at the outside and magnetic cover be fixed on described pedestal of described magnetic core; Described pedestal adopts ceramic material to make, and the outside of the two opposite sides of described pedestal adopts craft of gilding to be formed with the first gold plated pads and the second gold plated pads that are not connected.
Further, first free end of described coil windings stretch out described magnetic cover and directly with the welding mutually towards described magnetic core side and be formed with the first solder joint of described first gold plated pads, the second free end of described coil windings stretches out described magnetic cover and direct welding mutually towards described magnetic core side and being formed with the second solder joint with described second gold plated pads.
Further, described pedestal is put glue and be formed with sealing covering the first free end of described coil windings and the first colloid of the first solder joint, and sealing covers the second free end of described coil windings and the second colloid of the second solder joint.
Further, the axial cross section of described magnetic core is the I shape of middle part indent.
Further, described magnetic core is manganese core matter.
Further, described coil windings adopts flat copper wire or circular copper wire winding to form.
The beneficial effect of the application is:
By providing the pedestal of ceramic material, and adopt craft of gilding to form the first gold plated pads and the second gold plated pads in the two opposite sides of base of ceramic, effectively ensure the stability of pedestal and pad, longer service life, performance is better; Be directly welded in by two free ends of coil windings in the first gold plated pads and the second gold plated pads, accurate positioning is easy, effectively avoids dry joint rosin joint; Employing gluing process forms two free ends stretching out described magnetic cover and the first solder joint thereof and the second solder joint that seal and cover described coil windings on pedestal; available protecting solder joint and the wire forming described coil windings are not damaged, and guarantee the stability that the application's inductance component uses and fail safe further.
Accompanying drawing explanation
Fig. 1 is the front view that the SMD inductance of the application high stability EMI does not put glue.
Fig. 2 is the decomposition texture schematic diagram that the SMD inductance of the application high stability EMI does not put glue.
Fig. 3 is the left view after the application high stability EMI SMD inductance point glue.
Fig. 4 is the perspective view after the application high stability EMI SMD inductance point glue.
Embodiment
Be described below in detail the embodiment of the application, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the application, and the restriction to the application can not be interpreted as.
In the description of the application, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the application and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore the restriction to the application can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In the description of the application, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature immediately below second feature and tiltedly below, or only represent that fisrt feature level height is lower than second feature.
By reference to the accompanying drawings the application is described in further detail below by embodiment.
Please refer to Fig. 1 ~ Fig. 4, present embodiments provide the SMD inductance of a kind of high stability EMI, comprise pedestal 10, magnetic core 20, coil windings 30 and magnetic cover 40.
Described coil windings 30 is made up of the wire be set around on described magnetic core 20, described magnetic core 20 is fixed on described pedestal 10, described magnetic cover 40 covers at the outside of described magnetic core 20 and is fixed on described pedestal 10, described coil windings 30 to be fixed on described pedestal 10 and to be defined in described magnetic cover 40.As shown in Figure 2, in the present embodiment, the axial cross section of described magnetic core 20 is the I shape of middle part indent, and described coil windings 30 is set around the indent position of described magnetic core 20.Described magnetic core 20 is preferably set to manganese core matter.Described coil windings 30 preferably adopts flat copper wire or circular copper wire winding to form.
Described pedestal 10 adopts ceramic material to make, and the outside of the two opposite sides of described pedestal 10 adopts craft of gilding to be formed with the first gold plated pads 11 and the second gold plated pads 12 be not connected.
First free end 31 of described coil windings 30 stretches out described magnetic cover 40 and directly welds mutually with the side towards described magnetic core 20 of described first gold plated pads 11 and be formed with the first solder joint, and the second free end 32 of described coil windings 30 stretches out described magnetic cover 40 and directly welds mutually with the side towards described magnetic core 20 of described second gold plated pads 12 and be formed with the second solder joint.As shown in Figure 1 and Figure 2, first free end 31 of described coil windings 30 and the second free end 32 stretch out the length of described magnetic cover 40, with described first free end 31 and the second free end 32 can preferably with the side firm welded towards described magnetic core 20 of described first gold plated pads 11 and the second gold plated pads 12 for benchmark.
Please refer to Fig. 3, Fig. 4, described pedestal 10 is put glue and be formed with sealing covering the first free end 31 of described coil windings 30 and the first colloid 51 of the first solder joint, and sealing covers the second free end 32 of described coil windings 30 and the second colloid 52 of the second solder joint, to be covered first free end 31 stretching out described magnetic cover 40 of described coil windings 30 by described first colloid 51 and the sealing of the second colloid 52, first free end 31 and the first solder joint thereof and the second solder joint, avoid the first free end 31 of described coil windings 30, outside first free end 31 and the first solder joint thereof and the second solder joint are exposed to, scratch is caused to damage or oxidation.
The SMD inductance of described high stability EMI manufacturing the application mainly comprises following step:
By design size and the requirement making pedestal mould of described pedestal 10;
Ceramic material is positioned in the mold cavity of described pedestal mould, adopts 1000 ~ 1400 degree of high temperature sinterings to form the matrix (preferably adopting 1200 degree of high temperature) of described pedestal 10;
The outside plating gold of craft of gilding in the matrix two opposite sides of described pedestal 10 is adopted to form the first gold plated pads 11 and the second gold plated pads 12 be not connected;
Wire is set around on described magnetic core 20 and forms described coil windings 30;
The described coil windings 30 wound is welded on described magnetic core 20;
Two free ends of described coil windings 30 are welded on respectively in described first gold plated pads 11 and the second gold plated pads 12;
Described magnetic cover 40 is covered on the magnetic core 20 welded;
Two free ends of the described coil windings 30 appeared outside described magnetic cover 40 and corresponding solder joint place point glue.
When concrete operations, laser automatic spot-welding device is preferably adopted to complete corresponding weld job.
The SMD inductance of described high stability EMI of the application forms described pedestal 10 by adopting ceramic material to fire, and adopt craft of gilding to form described first gold plated pads 11 and the second gold plated pads 12 in the two opposite sides of described pedestal 10, the stability of the described pedestal 10 of effective guarantee and pad, longer service life, performance is better; Two free ends of described coil windings 30 are directly welded in described first gold plated pads 11 and the second gold plated pads 12, more easily accurately locate, can effectively avoid dry joint rosin joint; Employing gluing process forms two free ends and the first solder joint thereof and the second solder joint that seal and cover described coil windings 30 on described pedestal 10; available protecting solder joint and the wire forming described coil windings 30 are not damaged, and guarantee the stability that the SMD inductance of the described high stability EMI of the application uses and fail safe further.
In the description of this specification, at least one embodiment that specific features, structure, material or feature that the description of reference term " execution mode ", " some execution modes ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained in the application or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above content is the further description done the application in conjunction with concrete execution mode, can not assert that the concrete enforcement of the application is confined to these explanations.For the application person of an ordinary skill in the technical field, under the prerequisite not departing from the application's design, some simple deduction or replace can also be made.
Claims (6)
1. the SMD inductance of high stability EMI, is characterized in that, comprises pedestal, the magnetic core be fixed on described pedestal, the coil windings be set around on described magnetic core, and covers at the outside and magnetic cover be fixed on described pedestal of described magnetic core; Described pedestal adopts ceramic material to make, and the outside of the two opposite sides of described pedestal adopts craft of gilding to be formed with the first gold plated pads and the second gold plated pads that are not connected.
2. the SMD inductance of high stability EMI as claimed in claim 1, it is characterized in that, first free end of described coil windings stretch out described magnetic cover and directly with the welding mutually towards described magnetic core side and be formed with the first solder joint of described first gold plated pads, the second free end of described coil windings stretches out described magnetic cover and direct welding mutually towards described magnetic core side and being formed with the second solder joint with described second gold plated pads.
3. the SMD inductance of high stability EMI as claimed in claim 2, it is characterized in that, described pedestal is put glue and be formed with sealing covering the first free end of described coil windings and the first colloid of the first solder joint, and sealing covers the second free end of described coil windings and the second colloid of the second solder joint.
4. the SMD inductance of high stability EMI as claimed any one in claims 1 to 3, it is characterized in that, the axial cross section of described magnetic core is the I shape of middle part indent.
5. the SMD inductance of high stability EMI as claimed any one in claims 1 to 3, it is characterized in that, described magnetic core is manganese core matter.
6. the SMD inductance of high stability EMI as claimed any one in claims 1 to 3, is characterized in that, described coil windings adopts flat copper wire or circular copper wire winding to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520175042.9U CN204537800U (en) | 2015-03-26 | 2015-03-26 | The SMD inductance of high stability EMI |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520175042.9U CN204537800U (en) | 2015-03-26 | 2015-03-26 | The SMD inductance of high stability EMI |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204537800U true CN204537800U (en) | 2015-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520175042.9U Expired - Fee Related CN204537800U (en) | 2015-03-26 | 2015-03-26 | The SMD inductance of high stability EMI |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204537800U (en) |
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2015
- 2015-03-26 CN CN201520175042.9U patent/CN204537800U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 Termination date: 20200326 |