WO2017041483A1 - Low-inductance large-power inductor - Google Patents
Low-inductance large-power inductor Download PDFInfo
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- WO2017041483A1 WO2017041483A1 PCT/CN2016/077855 CN2016077855W WO2017041483A1 WO 2017041483 A1 WO2017041483 A1 WO 2017041483A1 CN 2016077855 W CN2016077855 W CN 2016077855W WO 2017041483 A1 WO2017041483 A1 WO 2017041483A1
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- low
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- power inductor
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 claims description 3
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 claims description 3
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/04—Leading of conductors or axles through casings, e.g. for tap-changing arrangements
Definitions
- the utility model relates to the technical field of inductance, in particular to a low-sensitivity high-power inductor.
- the low-sensitivity high-power inductors on the market are generally divided into two types, one is a pin type, and the body wire is used as a pin to maximize product power, but the following disadvantages exist, and a manual plug-in must be used when using, which requires a lot of labor. It is impossible to automate the work; the other is SMD (Surface Mounted Devices), the same workmanship, adding the material, forming SMD after welding, and realizing SMT (Surface Mount Technology) automatically when used. Patch, but the following shortcomings, the product body and the pin have solder joints, which may result in an open circuit and insufficient contact surface, can not effectively maximize the power, and the body lead-out conductor must be cut due to the welding of the material, resulting in waste.
- SMD Surface Mounted Devices
- a low-inductance high-power inductor which is directly formed into a wire lead through a body lead and is formed into an SMD product, and has the advantages of convenient use and good performance. , low cost and other advantages.
- the body wire needs to be formed into a wire lead by a flattening operation, and the flattening operation deforms the body wire to produce a flat patch surface by pressing, which not only damages the conductor body structure, but also causes the wire deformation to cause partial breakage or even generation. Open the circuit to reduce product reliability and thus affect performance.
- the side surface becomes irregular and needs to be trimmed, thereby causing waste on the material, and at the same time, processes such as flattening, trimming, and manual tinning are generated, which increases the labor cost.
- the purpose of the utility model is to provide a low-sensitivity high-power inductor, which does not need to be flattened, and may have Effectively save processing costs and improve product performance.
- the utility model is realized as follows:
- a low-inductance high-power inductor comprising a magnetic shell and a magnetic rod and a wire embedded in the magnetic shell, the wire being wound around the magnetic bar to form a coil structure, and the wire The two ends of the magnetic shell respectively lead directly to the wire pins.
- the magnetic shell is a cover structure having an open end, and corresponding sides of the open end of the magnetic shell are respectively provided with a lead wire slot to respectively lead out the lead pins.
- the magnetic bar is a columnar nickel-zinc ferrite or a columnar manganese-zinc ferrite.
- the wire is a copper wire.
- the utility model has the beneficial effects that the low-sensitivity high-power inductor provided by the utility model directly leads out the magnetic shell through the two ends of the coil wire of the coil, and directly forms a wire lead to form an SMD product, and does not need to be flattened, so that The SMD patch function can be realized without changing the shape of the conductor, which not only improves the performance of the product, but also maximizes the use of the material and reduces the waste of resources, thereby effectively saving processing costs and costs.
- the low-inductance high-power inductor can directly save the labor cost by using the SMT machine, and the product pin is directly formed at both ends of the coil wire, so that there is no joint in the middle, which can effectively make the product Maximize power and improve product performance.
- FIG. 1 is a schematic view showing the structure of a bottom surface of a preferred embodiment of a low-sensitivity high-power inductor of the present invention.
- FIG. 2 is a side view showing a partial structure of the low-inductance high-power inductor shown in FIG. 1.
- FIG. 3 is a schematic view showing the structure of the bottom surface of the magnetic shell of the low-inductance high-power inductor shown in FIG. 1.
- the embodiment provides a low-inductance high-power inductor 1.
- the low-inductance high-power inductor 1 includes a magnetic shell 11 and a magnetic rod 12 and a wire 13 built in the magnetic shell 11, the wire 13 is wound around the magnetic bar 12 to form a coil structure, and the wire 13 The two ends of the magnetic shell 11 are respectively led out to become the lead pins 131.
- the magnetic shell 11 is a cover structure having an open end.
- the corresponding two sides of the open end of the magnetic shell 11 are respectively provided with a lead wire slot 111 for respectively extracting the Wire pin 131.
- the magnetic bar 12 is a columnar nickel zinc ferrite or a columnar manganese zinc ferrite.
- the wire 13 is a copper wire.
- the low-sensitivity high-power inductor provided in this embodiment is directly formed as a wire lead through the two ends of the coil wire of the coil, and forms an SMD product, which does not need to be flattened, so that the SMD sticker can be realized without changing the shape of the conductor.
- the film function not only improves the performance of the product, but also maximizes the use of materials and reduces the waste of resources, thereby effectively saving processing costs and costs.
- the low-inductance high-power inductor can directly save the labor cost by using the SMT machine direct machine patch operation, and because of the product introduction
- the foot is directly formed at both ends of the coil wire, so there is no joint in the middle, which can effectively maximize the power of the product and improve the performance of the product.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A low-inductance large-power inductor (1). The low-inductance large-power inductor (1) comprises a magnetic housing (11), and a magnetic bar (12) and a lead (13) provided inside the magnetic housing (11). The lead (13) winds the magnetic bar (12) to form a coil structure, and two ends of the lead (13) are led out of the magnetic housing (11) separately and directly become lead pins (131). The low-inductance large-power inductor (1) does not need a flattening operation, the processing cost can be effectively reduced, and the product performance can be improved.
Description
本实用新型涉及电感技术领域,尤其涉及一种低感大功率电感。The utility model relates to the technical field of inductance, in particular to a low-sensitivity high-power inductor.
目前市场上的低感大功率电感一般分为二种,一种为插针式,使用本体导线做引脚实现产品功率最大化,但存在以下缺点,使用时必须进行人工插件,耗费大量人工,无法进行自动化作业;另一种为SMD(Surface Mounted Devices,贴片)式,前做工一样,增加料片,焊接后成型为SMD,使用时能实现SMT(Surface Mount Technology,表面贴装技术)自动贴片,但存在以下缺点,产品本体与引脚有焊接点,从而可能产生开路及接触面不够,无法有效发挥最大功率,且因焊接料片而须将本体引出导体裁切,形成浪费。At present, the low-sensitivity high-power inductors on the market are generally divided into two types, one is a pin type, and the body wire is used as a pin to maximize product power, but the following disadvantages exist, and a manual plug-in must be used when using, which requires a lot of labor. It is impossible to automate the work; the other is SMD (Surface Mounted Devices), the same workmanship, adding the material, forming SMD after welding, and realizing SMT (Surface Mount Technology) automatically when used. Patch, but the following shortcomings, the product body and the pin have solder joints, which may result in an open circuit and insufficient contact surface, can not effectively maximize the power, and the body lead-out conductor must be cut due to the welding of the material, resulting in waste.
因而,在公开号为CN 204537823U的实用新型专利中公开了一种低感大功率电感,其通过本体导线引出磁壳外直接成形为导线引脚,进而形成SMD类产品,具有使用方便、性能好、成本低等优点。然而,其本体导线需通过打扁作业来成形为导线引脚,而打扁作业通过挤压使本体导线形变产生扁平贴片面,不仅有损导体本体结构,而且导线形变容易引起部分断裂,甚至产生开路,降低产品可靠性,从而影响性能。另外,其形变后侧面变得不规则而需切边整形,因而产生材料上的浪废,同时产生打扁、切边、人工上锡等工序,增加大量工时费用。Therefore, in the utility model patent published as CN 204537823U, a low-inductance high-power inductor is disclosed, which is directly formed into a wire lead through a body lead and is formed into an SMD product, and has the advantages of convenient use and good performance. , low cost and other advantages. However, the body wire needs to be formed into a wire lead by a flattening operation, and the flattening operation deforms the body wire to produce a flat patch surface by pressing, which not only damages the conductor body structure, but also causes the wire deformation to cause partial breakage or even generation. Open the circuit to reduce product reliability and thus affect performance. In addition, after the deformation, the side surface becomes irregular and needs to be trimmed, thereby causing waste on the material, and at the same time, processes such as flattening, trimming, and manual tinning are generated, which increases the labor cost.
实用新型内容Utility model content
本实用新型的目的在于提供了一种低感大功率电感,无需打扁作业,可有
效节约加工成本、提高产品性能。The purpose of the utility model is to provide a low-sensitivity high-power inductor, which does not need to be flattened, and may have
Effectively save processing costs and improve product performance.
本实用新型是这样实现的:The utility model is realized as follows:
一种低感大功率电感,所述低感大功率电感包括磁壳以及内置于所述磁壳中的磁棒和导线,所述导线缠绕所述磁棒设置以形成线圈结构,且所述导线的两端分别引出所述磁壳外直接成为导线引脚。A low-inductance high-power inductor comprising a magnetic shell and a magnetic rod and a wire embedded in the magnetic shell, the wire being wound around the magnetic bar to form a coil structure, and the wire The two ends of the magnetic shell respectively lead directly to the wire pins.
作为上述低感大功率电感的改进,所述磁壳为一端开口的罩体结构,所述磁壳的开口端的对应两侧分别设有一引脚导线槽,以分别引出所述导线引脚。As a modification of the low-inductance high-power inductor, the magnetic shell is a cover structure having an open end, and corresponding sides of the open end of the magnetic shell are respectively provided with a lead wire slot to respectively lead out the lead pins.
作为上述低感大功率电感的改进,所述磁棒为柱状镍锌铁氧体或柱状锰锌铁氧体。As an improvement of the low-inductance high-power inductor described above, the magnetic bar is a columnar nickel-zinc ferrite or a columnar manganese-zinc ferrite.
作为上述低感大功率电感的改进,所述导线为铜线。As an improvement of the low-inductance high-power inductor described above, the wire is a copper wire.
本实用新型的有益效果是:本实用新型提供的低感大功率电感,其通过本身线圈导线的两端引出磁壳外直接成为导线引脚,形成SMD类产品,无需打扁作业,使之在不改变导体形状下实现SMD贴片功能,不仅提高了产品的性能,而且达到了材料使用最大化,降低了资源浪废,从而有效节约加工成本及费用。还有,本低感大功率电感可通过使用SMT机直接机器贴片作业,进而有效节约人工成本,而且由于产品引脚为线圈导线两端直接成形产生,故中间无接合口,能有效使产品的功率最大化、提高产品性能。The utility model has the beneficial effects that the low-sensitivity high-power inductor provided by the utility model directly leads out the magnetic shell through the two ends of the coil wire of the coil, and directly forms a wire lead to form an SMD product, and does not need to be flattened, so that The SMD patch function can be realized without changing the shape of the conductor, which not only improves the performance of the product, but also maximizes the use of the material and reduces the waste of resources, thereby effectively saving processing costs and costs. In addition, the low-inductance high-power inductor can directly save the labor cost by using the SMT machine, and the product pin is directly formed at both ends of the coil wire, so that there is no joint in the middle, which can effectively make the product Maximize power and improve product performance.
为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description It is only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to these drawings without any creative work.
图1为本实用新型低感大功率电感一种较佳实施例的底面结构示意图。1 is a schematic view showing the structure of a bottom surface of a preferred embodiment of a low-sensitivity high-power inductor of the present invention.
图2为图1所示低感大功率电感的局部结构侧面示意图。2 is a side view showing a partial structure of the low-inductance high-power inductor shown in FIG. 1.
图3为图1所示低感大功率电感的磁壳的底面结构示意图。3 is a schematic view showing the structure of the bottom surface of the magnetic shell of the low-inductance high-power inductor shown in FIG. 1.
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. example. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
如图1及图2所示,本实施例提供一种低感大功率电感1。所述低感大功率电感1包括磁壳11以及内置于所述磁壳11中的磁棒12和导线13,所述导线13缠绕所述磁棒12设置以形成线圈结构,且所述导线13的两端分别引出所述磁壳11外直接成为导线引脚131。As shown in FIG. 1 and FIG. 2, the embodiment provides a low-inductance high-power inductor 1. The low-inductance high-power inductor 1 includes a magnetic shell 11 and a magnetic rod 12 and a wire 13 built in the magnetic shell 11, the wire 13 is wound around the magnetic bar 12 to form a coil structure, and the wire 13 The two ends of the magnetic shell 11 are respectively led out to become the lead pins 131.
具体地,如图1及图3所示,所述磁壳11为一端开口的罩体结构,所述磁壳11的开口端的对应两侧分别设有一引脚导线槽111,以分别引出所述导线引脚131。优选地,如图2所示,所述磁棒12为柱状镍锌铁氧体或柱状锰锌铁氧体。所述导线13为铜线。Specifically, as shown in FIG. 1 and FIG. 3, the magnetic shell 11 is a cover structure having an open end. The corresponding two sides of the open end of the magnetic shell 11 are respectively provided with a lead wire slot 111 for respectively extracting the Wire pin 131. Preferably, as shown in FIG. 2, the magnetic bar 12 is a columnar nickel zinc ferrite or a columnar manganese zinc ferrite. The wire 13 is a copper wire.
本实施例提供的低感大功率电感,其通过本身线圈导线的两端引出磁壳外直接成为导线引脚,形成SMD类产品,无需打扁作业,使之在不改变导体形状下实现SMD贴片功能,不仅提高了产品的性能,而且达到了材料使用最大化,降低了资源浪废,从而有效节约加工成本及费用。还有,本低感大功率电感可通过使用SMT机直接机器贴片作业,进而有效节约人工成本,而且由于产品引
脚为线圈导线两端直接成形产生,故中间无接合口,能有效使产品的功率最大化、提高产品性能。The low-sensitivity high-power inductor provided in this embodiment is directly formed as a wire lead through the two ends of the coil wire of the coil, and forms an SMD product, which does not need to be flattened, so that the SMD sticker can be realized without changing the shape of the conductor. The film function not only improves the performance of the product, but also maximizes the use of materials and reduces the waste of resources, thereby effectively saving processing costs and costs. In addition, the low-inductance high-power inductor can directly save the labor cost by using the SMT machine direct machine patch operation, and because of the product introduction
The foot is directly formed at both ends of the coil wire, so there is no joint in the middle, which can effectively maximize the power of the product and improve the performance of the product.
以上所述仅为本实用新型的较佳实施例而已,并不用以限制本实用新型,凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., which are included in the spirit and principles of the present invention, should be included in Within the scope of protection of the present invention.
Claims (4)
- 一种低感大功率电感,其特征在于,所述低感大功率电感包括磁壳以及内置于所述磁壳中的磁棒和导线,所述导线缠绕所述磁棒设置以形成线圈结构,且所述导线的两端分别引出所述磁壳外直接成为导线引脚。A low-inductance high-power inductor, characterized in that the low-inductance high-power inductor comprises a magnetic shell and a magnetic rod and a wire built in the magnetic shell, and the wire is wound around the magnetic rod to form a coil structure, And the two ends of the wire are respectively led out of the magnetic shell to directly become a wire lead.
- 如权利要求1所述的低感大功率电感,其特征在于,所述磁壳为一端开口的罩体结构,所述磁壳的开口端的对应两侧分别设有一引脚导线槽,以分别引出所述导线引脚。The low-inductance high-power inductor according to claim 1, wherein the magnetic shell is a cover structure having an open end, and the corresponding two sides of the open end of the magnetic shell are respectively provided with a lead wire slot for respectively leading out The wire lead.
- 如权利要求1所述的低感大功率电感,其特征在于,所述磁棒为柱状镍锌铁氧体或柱状锰锌铁氧体。The low-inductance high-power inductor according to claim 1, wherein the magnetic bar is a columnar nickel zinc ferrite or a columnar manganese zinc ferrite.
- 如权利要求1所述的低感大功率电感,其特征在于,所述导线为铜线。 The low inductance high power inductor of claim 1 wherein said wire is a copper wire.
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CN201520704945.1 | 2015-09-11 | ||
CN201520704945.1U CN204926956U (en) | 2015-09-11 | 2015-09-11 | Low sense high power inductors |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203950632U (en) * | 2014-06-26 | 2014-11-19 | 长兴盛强电子器材有限公司 | A kind of power-type inductance |
CN204537823U (en) * | 2015-04-08 | 2015-08-05 | 惠州市鑫感佳电子科技有限公司 | The high-power inductance of low sense |
CN204926956U (en) * | 2015-09-11 | 2015-12-30 | 惠州市鑫感佳电子科技有限公司 | Low sense high power inductors |
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2015
- 2015-09-11 CN CN201520704945.1U patent/CN204926956U/en not_active Expired - Fee Related
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2016
- 2016-03-30 WO PCT/CN2016/077855 patent/WO2017041483A1/en active Application Filing
- 2016-04-13 TW TW105205116U patent/TWM529254U/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203950632U (en) * | 2014-06-26 | 2014-11-19 | 长兴盛强电子器材有限公司 | A kind of power-type inductance |
CN204537823U (en) * | 2015-04-08 | 2015-08-05 | 惠州市鑫感佳电子科技有限公司 | The high-power inductance of low sense |
CN204926956U (en) * | 2015-09-11 | 2015-12-30 | 惠州市鑫感佳电子科技有限公司 | Low sense high power inductors |
Also Published As
Publication number | Publication date |
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CN204926956U (en) | 2015-12-30 |
TWM529254U (en) | 2016-09-21 |
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