CN204536934U - Soldering tip control gear is used in semiconductor packages patch device - Google Patents
Soldering tip control gear is used in semiconductor packages patch device Download PDFInfo
- Publication number
- CN204536934U CN204536934U CN201520035352.0U CN201520035352U CN204536934U CN 204536934 U CN204536934 U CN 204536934U CN 201520035352 U CN201520035352 U CN 201520035352U CN 204536934 U CN204536934 U CN 204536934U
- Authority
- CN
- China
- Prior art keywords
- soldering tip
- semiconductor packages
- suction nozzle
- control gear
- patch device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Coating Apparatus (AREA)
Abstract
The utility model discloses in a kind of semiconductor packages patch device and use soldering tip control gear, comprise: support, the slide block be vertically slidably connected with described support, be fixed on the vertical suction nozzle pole on described slide block, the horizontal web joint that one end and described suction nozzle pole are fixing, is vertically fixed on described support, top is positioned at described web joint other end bottom surface, for driving the voice coil motor of web joint.The utility model semiconductor packages patch device soldering tip control gear, can control the pressure of suction nozzle pole.
Description
Technical field
The utility model relates in semiconductor packages patch device and uses soldering tip control gear.
Background technology
When making semiconductor devices, chip is needed to be put in fixing framework, by specific bonding way, make it fix, in order to more stable more at a high speed, chip is put into specific position, the soldering tip pressure inhaling sheet is very important, and its precision and stability is particularly important, and the height of this performance directly affects the performance of product.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor packages patch device soldering tip control gear, and it can control the pressure of suction nozzle pole.
For achieving the above object, the technical solution of the utility model is a kind of semiconductor packages patch device soldering tip control gear of design, comprising:
Support,
The slide block be vertically slidably connected with described support,
Be fixed on the vertical suction nozzle pole on described slide block,
The horizontal web joint that one end and described suction nozzle pole are fixed,
Vertically be fixed on described support, top is positioned at described web joint other end bottom surface, for driving the voice coil motor of web joint.
Preferably, described voice coil motor is furnished with the power supply driving its work.
Advantage of the present utility model and beneficial effect are: provide a kind of semiconductor packages patch device soldering tip control gear, it can control the pressure of suction nozzle pole.
By web joint, the power on voice coil motor is directly delivered to suction nozzle pole, its structure in the process of transmitting force without any loss, the precision of the raw power of voice coil loudspeaker voice coil electrogenesis machine is transferred directly to the precision of power on suction nozzle, the size of control can be carried out by the mode controlling voice coil loudspeaker voice coil electric current, its precision reaches 5g in high speed motions, and namely the precision of the pressure of suction nozzle can reach 5g.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
The technical scheme that the utility model is specifically implemented is:
As shown in Figure 1, a kind of semiconductor packages patch device soldering tip control gear, comprising:
Support 1,
The slide block 2 be vertically slidably connected with described support 1,
Be fixed on the vertical suction nozzle pole 3 on described slide block 2,
The horizontal web joint 4 that one end and described suction nozzle pole 3 are fixed,
Vertically be fixed on described support 1, top is positioned at described web joint 4 other end bottom surface, for driving the voice coil motor 5 of web joint 4.
Described voice coil motor 5 is furnished with the power supply (power supply does not illustrate in the drawings) driving its work.
By web joint, the power on voice coil motor 5 is directly delivered to suction nozzle pole 3, its structure in the process of transmitting force without any loss, the precision of the raw power of voice coil loudspeaker voice coil electrogenesis machine 5 is transferred directly to the precision of power on suction nozzle, the size of control can be carried out by the mode controlling voice coil loudspeaker voice coil 5 electric current, its precision reaches 5g in high speed motions, and namely the precision of the pressure of suction nozzle can reach 5g.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (2)
1. use soldering tip control gear in semiconductor packages patch device, it is characterized in that, comprising:
Support,
The slide block be vertically slidably connected with described support,
Be fixed on the vertical suction nozzle pole on described slide block,
The horizontal web joint that one end and described suction nozzle pole are fixed,
Vertically be fixed on described support, top is positioned at described web joint other end bottom surface, for driving the voice coil motor of web joint.
2. use soldering tip control gear in semiconductor packages patch device according to claim 1, it is characterized in that, described voice coil motor is furnished with the power supply driving its work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520035352.0U CN204536934U (en) | 2015-01-19 | 2015-01-19 | Soldering tip control gear is used in semiconductor packages patch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520035352.0U CN204536934U (en) | 2015-01-19 | 2015-01-19 | Soldering tip control gear is used in semiconductor packages patch device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204536934U true CN204536934U (en) | 2015-08-05 |
Family
ID=53750911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520035352.0U Expired - Fee Related CN204536934U (en) | 2015-01-19 | 2015-01-19 | Soldering tip control gear is used in semiconductor packages patch device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204536934U (en) |
-
2015
- 2015-01-19 CN CN201520035352.0U patent/CN204536934U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204536934U (en) | Soldering tip control gear is used in semiconductor packages patch device | |
| CN204178203U (en) | Semiconductor packages patch device soldering tip control gear | |
| CN204295724U (en) | A kind of shearing device of plastic products charge bar | |
| CN204093441U (en) | A kind of chemical reaction still | |
| CN204470489U (en) | A kind of handling materials device of coiling machine | |
| CN201997826U (en) | Semiautomatic welding device of capacitor | |
| CN206537448U (en) | A kind of easy-operating dovetail type base | |
| CN204583600U (en) | A kind of point gum machine | |
| CN202943806U (en) | Burr removing cutter of button type component | |
| CN203400834U (en) | Glue feeding device of glue mounting machine | |
| CN204130343U (en) | The simple and easy bag mechanism of paper of a kind of lead-in wire | |
| CN202543556U (en) | Interlock machine with adjustable processing speed | |
| CN204643154U (en) | Get cake depression generator | |
| CN204642233U (en) | A kind of automation line auxiliary material placement equipment | |
| CN204067205U (en) | A kind of Automatic rubber suction nozzle frock | |
| CN204583608U (en) | A kind of twin shaft point gum machine | |
| CN204294463U (en) | Paper extraction unit assisted by gluing machine | |
| CN204087038U (en) | A kind of controller | |
| CN103084103A (en) | Universal shaking table | |
| CN202696341U (en) | Motor wiring mechanism | |
| CN202816882U (en) | Die holder structure for semiconductor packaging | |
| CN203787365U (en) | Porcelain tube supply device of fuse-tube full-automatic assembling machine | |
| CN205058572U (en) | A elevating system for being directed at blowing machine carries out pay -off | |
| CN207861589U (en) | A kind of bobbin winder device | |
| CN203085494U (en) | A leading wire position-limiting device of the wire feeding system of a bonding machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 Termination date: 20160119 |
|
| EXPY | Termination of patent right or utility model |