CN204178203U - Semiconductor packages patch device soldering tip control gear - Google Patents
Semiconductor packages patch device soldering tip control gear Download PDFInfo
- Publication number
- CN204178203U CN204178203U CN201420564460.2U CN201420564460U CN204178203U CN 204178203 U CN204178203 U CN 204178203U CN 201420564460 U CN201420564460 U CN 201420564460U CN 204178203 U CN204178203 U CN 204178203U
- Authority
- CN
- China
- Prior art keywords
- soldering tip
- semiconductor packages
- control gear
- suction nozzle
- patch device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Coating Apparatus (AREA)
Abstract
The utility model discloses a kind of semiconductor packages patch device soldering tip control gear, comprise: support, the slide block be vertically slidably connected with described support, be fixed on the vertical suction nozzle pole on described slide block, the horizontal web joint that one end and described suction nozzle pole are fixing, is vertically fixed on described support, top is positioned at described web joint other end bottom surface, for driving the voice coil motor of web joint.The utility model semiconductor packages patch device soldering tip control gear, can control the pressure of suction nozzle pole.
Description
Technical field
The utility model relates to semiconductor packages patch device soldering tip control gear.
Background technology
When making semiconductor devices, chip is needed to be put in fixing framework, by specific bonding way, make it fix, in order to more stable more at a high speed, chip is put into specific position, the soldering tip pressure inhaling sheet is very important, and its precision and stability is particularly important, and the height of this performance directly affects the performance of product.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor packages patch device soldering tip control gear, and it can control the pressure of suction nozzle pole.
For achieving the above object, the technical solution of the utility model is a kind of semiconductor packages patch device soldering tip control gear of design, comprising:
Support,
The slide block be vertically slidably connected with described support,
Be fixed on the vertical suction nozzle pole on described slide block,
The horizontal web joint that one end and described suction nozzle pole are fixed,
Vertically be fixed on described support, top is positioned at described web joint other end bottom surface, for driving the voice coil motor of web joint.
Preferably, described voice coil motor is furnished with the power supply driving its work.
Advantage of the present utility model and beneficial effect are: provide a kind of semiconductor packages patch device soldering tip control gear, it can control the pressure of suction nozzle pole.
By web joint, the power on voice coil motor is directly delivered to suction nozzle pole, its structure in the process of transmitting force without any loss, the precision of the raw power of voice coil loudspeaker voice coil electrogenesis machine is transferred directly to the precision of power on suction nozzle, the size of control can be carried out by the mode controlling voice coil loudspeaker voice coil electric current, its precision reaches 5g in high speed motions, and namely the precision of the pressure of suction nozzle can reach 5g.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
The technical scheme that the utility model is specifically implemented is:
As shown in Figure 1, a kind of semiconductor packages patch device soldering tip control gear, comprising:
Support 1,
The slide block 2 be vertically slidably connected with described support 1,
Be fixed on the vertical suction nozzle pole 3 on described slide block 2,
The horizontal web joint 4 that one end and described suction nozzle pole 3 are fixed,
Vertically be fixed on described support 1, top is positioned at described web joint 4 other end bottom surface, for driving the voice coil motor 5 of web joint 4.
Described voice coil motor 5 is furnished with the power supply (power supply does not illustrate in the drawings) driving its work.
By web joint, the power on voice coil motor 5 is directly delivered to suction nozzle pole 3, its structure in the process of transmitting force without any loss, the precision of the raw power of voice coil loudspeaker voice coil electrogenesis machine 5 is transferred directly to the precision of power on suction nozzle, the size of control can be carried out by the mode controlling voice coil loudspeaker voice coil 5 electric current, its precision reaches 5g in high speed motions, and namely the precision of the pressure of suction nozzle can reach 5g.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (2)
1. semiconductor packages patch device soldering tip control gear, is characterized in that, comprising:
Support,
The slide block be vertically slidably connected with described support,
Be fixed on the vertical suction nozzle pole on described slide block,
The horizontal web joint that one end and described suction nozzle pole are fixed,
Vertically be fixed on described support, top is positioned at described web joint other end bottom surface, for driving the voice coil motor of web joint.
2. semiconductor packages patch device soldering tip control gear according to claim 1, is characterized in that, described voice coil motor is furnished with the power supply driving its work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420564460.2U CN204178203U (en) | 2014-09-26 | 2014-09-26 | Semiconductor packages patch device soldering tip control gear |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420564460.2U CN204178203U (en) | 2014-09-26 | 2014-09-26 | Semiconductor packages patch device soldering tip control gear |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204178203U true CN204178203U (en) | 2015-02-25 |
Family
ID=52567000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420564460.2U Expired - Fee Related CN204178203U (en) | 2014-09-26 | 2014-09-26 | Semiconductor packages patch device soldering tip control gear |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204178203U (en) |
-
2014
- 2014-09-26 CN CN201420564460.2U patent/CN204178203U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204178203U (en) | Semiconductor packages patch device soldering tip control gear | |
| CN204536934U (en) | Soldering tip control gear is used in semiconductor packages patch device | |
| CN204093441U (en) | A kind of chemical reaction still | |
| CN204470489U (en) | A kind of handling materials device of coiling machine | |
| CN202943806U (en) | Burr removing cutter of button type component | |
| CN203400834U (en) | Glue feeding device of glue mounting machine | |
| CN204583600U (en) | A kind of point gum machine | |
| CN204130343U (en) | The simple and easy bag mechanism of paper of a kind of lead-in wire | |
| CN204642233U (en) | A kind of automation line auxiliary material placement equipment | |
| CN204643154U (en) | Get cake depression generator | |
| CN204298235U (en) | Low temperature glass bonding machine | |
| CN203212621U (en) | Automatic tinning device for magnetic ring framework | |
| CN205185164U (en) | A cooling device for waterproofing membrane becomes to produce | |
| CN202543556U (en) | Interlock machine with adjustable processing speed | |
| CN204067205U (en) | A kind of Automatic rubber suction nozzle frock | |
| CN204294463U (en) | Paper extraction unit assisted by gluing machine | |
| CN203266889U (en) | Ceramic blank trimming structure | |
| CN204087038U (en) | A kind of controller | |
| CN103084103A (en) | Universal shaking table | |
| CN203787365U (en) | Porcelain tube supply device of fuse-tube full-automatic assembling machine | |
| CN202783950U (en) | Accurate tea packaging machine | |
| CN202816882U (en) | Die holder structure for semiconductor packaging | |
| CN205058572U (en) | A elevating system for being directed at blowing machine carries out pay -off | |
| CN203085494U (en) | A leading wire position-limiting device of the wire feeding system of a bonding machine | |
| CN204030776U (en) | A kind of dust cleaning apparatus electric machine support |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150225 Termination date: 20160926 |