CN204518245U

CN204518245U - A kind of components and parts

Info

Publication number: CN204518245U
Application number: CN201420707222.2U
Authority: CN
Inventors: 周垠群; 蔡锦波; 骆建辉; 高桂丽
Original assignee: SHENZHEN BENCENT ELECTRONICS CO Ltd
Current assignee: Shenzhen Penang Electronics Co.,Ltd.
Priority date: 2014-11-23
Filing date: 2014-11-23
Publication date: 2015-07-29
Anticipated expiration: 2024-11-23

Abstract

The utility model provides a kind of components and parts, comprise device body and flat board that profile is column, flat board is positioned at the side of the outer surface of device body, the dull and stereotyped outer surface being connected to device body by the parallel relative side surface of itself and device body outer surface, device body is contained in dull and stereotyped outer rim scope in the first area that the outer rim of the upright projection of a side surface of flat board surrounds, the flat board made by the insulating material arranged can meet the insulation property of device body electrode and equipment metal shell, and the first area that the region that surrounds of the outer rim of the flat board outer rim that is greater than or equal to device body surrounds, then just can increase the minimum creep distance of electrode to equipment metal shell without the need to increasing electric clearance, save the device space, for carrying out surge protection module miniaturization and integratedly provide solution.

Description

A kind of components and parts

Technical field

The utility model relates to the safe-discharge technical field of components and parts, is specifically related to a kind of components and parts.

Background technology

Potential difference is there is between other conductors in the exposed conductive part of components and parts and residing environment, mutually be affected for avoiding two conductive components with potential difference be in same environment, need design safety distance between two conductive components with potential difference, the safe distance of electric field mainly comprises electric clearance (space length) and creepage distance (creepage distance).Wherein, electric clearance refers to the beeline measured along air on two adjacent conductors or a conductor and adjacent motor casing surface, creepage distance refer to there is potential difference two conductive components between along the beeline on insulating material surface.On electrically, making restriction to minimum creep distance, is to prevent between two electric conductors, and creepage phenomenon appears in the pollutant that may be occurred by insulating material surface.To the requirement of minimum creep distance, relevant with the voltage between two conductive components, to let out trace index relevant with insulating material resistance to, with electrical equipment residing for the class of pollution of environment relevant.

Prior art meets the requirement of minimum creep distance by increasing electric clearance, particularly to anti-high-tension lightning surge equipment, require that electric clearance increases along with the increase of surge grade, the thickness of the device applying these components and parts is increased, occupies more space.

Utility model content

The utility model provides a kind of components and parts, and solving existing components and parts is meet electrical safety arcing distance to increase the bulky problem that electric clearance causes the device of these components and parts of application.

First aspect, the embodiment of the present application provides a kind of components and parts, comprise the device body that profile is column, described device body comprises at least two electrodes be arranged in order, be tightly connected between two often adjacent electrodes in described at least two electrodes insulated tube, chamber is formed to make the insulated tube between two often adjacent electrodes and described two often adjacent electrodes, it is characterized in that, described components and parts also comprise flat board, described flat board is positioned at the side of the outer surface of described device body, described flat board by its near described device body and be connected to the outer surface of described device body with the parallel relative side surface of described device body outer surface, described device body is contained in the outer rim scope of described flat board in the first area that the outer rim of the upright projection of a described side surface of described flat board surrounds, described flat board is the flat board that insulating material is made.

Based on the application's first aspect, in the first optional execution mode, the outer rim that described components and parts also comprise described flat board or the bead that tilt extend to form vertical towards described device body.

Based on the first optional execution mode of the application's first aspect, in the optional execution mode of the second, described first area is contained in the outer rim scope of described flat board, comprising:

The first area that described device body surrounds in the outer rim of the upright projection of described dull and stereotyped place plane is completely overlapping with the outer rim scope of described flat board.

Based on the first optional execution mode of the application's first aspect, in the third optional execution mode, described device body is contained in the outer rim scope of described flat board in the first area that the outer rim of the upright projection of described dull and stereotyped place plane surrounds, and comprising:

Described device body is really contained in the outer rim scope of described flat board in the first area that the outer rim of the upright projection of described dull and stereotyped place plane surrounds.

Based on the application's first aspect or the first is to arbitrary optional execution mode in the third, in the 4th kind of optional execution mode, described flat board by its near described device body and be connected to the outer surface of described device body with the parallel relative side surface of described device body outer surface, comprising:

Described flat board by its near described device body and bonding with the parallel relative side surface of described device body outer surface or be connected to the outer surface of described device body by the pad solder that a described side surface of described flat board is arranged.

Based on the 4th kind of optional execution mode of the application's first aspect, in the 5th kind of optional execution mode, the shape of described flat board is any one in rectangle, ellipse, circle, square or regular shape.

Based on the 5th kind of optional execution mode of the application's first aspect, in the 6th kind of optional execution mode, described flat board is the flat board that resin material or plastic material are made, and the thickness of described flat board is less than or equal to 1.5mm.

Based on the 6th kind of optional execution mode of the application's first aspect, in the 7th kind of optional execution mode, described flat board is the flat board that heat resistant resin material or heat resistant plastics material or high temperature resistant plastic material are made.

Based on the 5th kind of optional execution mode of the application's first aspect, in the 8th kind of optional execution mode, described flat board is the flat board of ceramic material or print circuit plates making, the thickness of described flat board is greater than or equal to 0.4mm, and the thickness of described flat board is less than or equal to 2mm.

Based on the first optional execution mode of the application's first aspect, in the 9th kind of optional execution mode, the shape of described flat board is rectangle, the close described device body of described flat board and be the length of described flat board and the plane at wide place with the parallel relative described side surface of described device body outer surface, the axial length of described device body is less than or equal to the length of described flat board, and the radical length of described device body is less than or equal to the width of described flat board.

Based on the 9th kind of optional execution mode of the application's first aspect, in the tenth kind of optional execution mode, described electrode is copper electrode or oxygen-free copper electrode or iron nickel electrode;

Or described electrode is the electrode of any one material in electronickelling on copper electrode or oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, gold.

Based on the first aspect of the application or the first is to optional execution mode or the 9th kind or the tenth kind of optional execution mode arbitrarily in the third, in the 11 kind of optional execution mode, in described chamber, be sealed with gas.

Based on the 11 kind of optional execution mode of the first aspect of the application, in the 12 kind of optional execution mode, described gas is at least one gas in argon gas, helium, neon, hydrogen, nitrogen.

Based on the first aspect of the application or the first is to optional execution mode or the 9th kind or the tenth kind of optional execution mode arbitrarily in the third, in the 13 kind of optional execution mode, in described chamber, be packaged with the electrical combination module be combined to form with at least one components and parts of described two adjacent electrode electrical interconnects or at least two component circuit.

Based on the first aspect of the application or the first is to optional execution mode or the 9th kind or the tenth kind of optional execution mode arbitrarily in the third, in the 14 kind of optional execution mode, gas is sealed with in described chamber, described insulated tube is rectangle porcelain tube or square porcelain tube or circular porcelain tube or oval porcelain tube, and the shape of described electrode is square-shaped electrode or circular electrode;

Described device body comprises at least two electrodes be arranged in order, and comprising:

Described device body comprises 2 electrodes be arranged in order or 3 electrodes be arranged in order or 6 electrodes be arranged in order.

The utility model provides a kind of components and parts, comprise the device body that profile is column, described device body comprises at least two electrodes be arranged in order, be tightly connected between two often adjacent electrodes in described at least two electrodes insulated tube, forms chamber to make the insulated tube between two often adjacent electrodes and described two often adjacent electrodes.And the components and parts that the application provides also comprise flat board, described flat board is positioned at the side of the outer surface of described device body, described flat board is connected to the outer surface of described device body near described device body with the parallel relative side surface of described device body outer surface by it, described device body is contained in the outer rim scope of described flat board in the first area that the outer rim of the upright projection of a described side surface of described flat board surrounds, the flat board made by the described insulating material arranged can meet the insulation property between electrode and another energized conductor, and the first area that the region that surrounds of the outer rim of the described flat board outer rim that is greater than or equal to device body surrounds, then just can increase minimum creep distance between electrode to another energized conductor without the need to increasing electric clearance, decrease the thickness of the device of these components and parts of application, save more space.In addition, these components and parts, by dull and stereotyped insulation property and the larger performance of minimum creep distance, reduce the probability that creepage surface all pollutes, make these components and parts be more applicable for the high environment of pollution level.

Accompanying drawing explanation

In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.

The structure chart of the components and parts that Fig. 1 a provides for the application first embodiment;

The upward view of components and parts of Fig. 1 b for providing based on the application first embodiment shown in Fig. 1 a;

The cutaway view of components and parts of Fig. 1 c for providing based on the application first embodiment shown in Fig. 1 a;

The structure chart of the components and parts that Fig. 2 a provides for the application second embodiment;

The upward view of components and parts of Fig. 2 b for providing based on the application second embodiment shown in Fig. 2 a;

The cutaway view of components and parts of Fig. 2 c for providing based on the application second embodiment shown in Fig. 2 a;

The structure chart of the components and parts that Fig. 3 a provides for the application the 3rd embodiment;

The upward view of components and parts of Fig. 3 b for providing based on the application the 3rd embodiment shown in Fig. 3 a;

The cutaway view of components and parts of Fig. 3 c for providing based on the application the 3rd embodiment shown in Fig. 3 a;

The structure chart of the components and parts that Fig. 4 a provides for the application the 4th embodiment;

The upward view of components and parts of Fig. 4 b for providing based on the application the 4th embodiment shown in Fig. 4 a;

The cutaway view of components and parts of Fig. 4 c for providing based on the application the 4th embodiment shown in Fig. 4 a;

The structure chart of the components and parts that Fig. 5 a provides for the application the 5th embodiment;

The upward view of components and parts of Fig. 5 b for providing based on the application the 5th embodiment shown in Fig. 5 a;

The upward view of the components and parts that Fig. 5 c provides for another embodiment of the application;

The structure chart of the components and parts that Fig. 6 a provides for the application the 6th embodiment;

The upward view of components and parts of Fig. 6 b for providing based on the application the 6th embodiment shown in Fig. 6 a;

The cutaway view of components and parts of Fig. 6 c for providing based on the application the 6th embodiment shown in Fig. 6 a;

The structure chart of the components and parts that Fig. 7 a provides for the application the 7th embodiment;

The upward view of components and parts of Fig. 7 b for providing based on the application the 7th embodiment shown in Fig. 7 a;

The upward view of the components and parts that Fig. 7 c provides for another embodiment of the application;

The structure chart of the components and parts that Fig. 8 a provides for the application the 8th embodiment;

The cutaway view of components and parts of Fig. 8 b for providing based on the application the 8th embodiment shown in Fig. 8 a.

Embodiment

Below in conjunction with the accompanying drawing in the embodiment of the present application, be clearly and completely described the technical scheme in the embodiment of the present application, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Below by specific embodiment, be described in detail respectively.

The components and parts that the embodiment of the present application provides, comprise the device body that profile is column, device body comprises at least two electrodes be arranged in order, be tightly connected between two often adjacent electrodes at least two electrodes insulated tube, forms chamber to make the insulated tube between two often adjacent electrodes and two often adjacent electrodes.And the components and parts that the application provides also comprise flat board, flat board is positioned at the side of the outer surface of device body, dull and stereotyped by its near device body and be connected to the outer surface of device body with the parallel relative side surface of device body outer surface, device body flat board close device body and be contained in dull and stereotyped outer rim scope with the first area that the outer rim of the upright projection of the parallel relative side surface of device body outer surface surrounds, the flat board made by the insulating material arranged can meet the insulation property between electrode and another energized conductor, and the first area that the region that surrounds of the outer rim of the flat board outer rim that is greater than or equal to device body surrounds, then just can increase minimum creep distance between electrode to another energized conductor without the need to increasing electric clearance, decrease the thickness of the device of these components and parts of application, save more space.In addition, these components and parts, by dull and stereotyped insulation property and the larger performance of minimum creep distance, reduce the probability that creepage surface all pollutes, make these components and parts be more applicable for the high environment of pollution level.

In the components and parts that the embodiment of the present application provides, the electrode that device body comprises can be 2 or 3 or 6 or more, and the shape of electrode can be square (square or rectangle or band chamfering square) or electrode that is circular or other regular shapes, and electrode can be the electrode of any one material in copper electrode or oxygen-free copper electrode or iron nickel electrode or electronickelling on copper electrode or oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, gold.During specific implementation, the number of electrode is selected, shape selects and Material selec-tion is determined according to the application scenarios of components and parts, not by the restriction of each embodiment in the application.

In the components and parts that the embodiment of the present application provides, the insulated tube that device body comprises can be earthenware or glass tube, and the shape of insulated tube can be rectangle porcelain tube or square porcelain tube or circular porcelain tube or oval porcelain tube, during specific implementation, the Material selec-tion of insulated tube and the shape of insulated tube are selected by the restriction of each embodiment in the application.

In the components and parts that the embodiment of the present application provides, flat board can be the flat board that pottery or resin or plastic material or printed circuit board are made, dull and stereotyped shape can be any one in rectangle, ellipse, circle, square or regular shape, and during specific implementation, the Material selec-tion of insulated tube and the shape of insulated tube are selected by the restriction of each embodiment in the application.When the thickness of flat board is determined, the flat board that resin material or plastic material are made is harder than the flat board of ceramic material, be not easy broken or damaged, therefore under similar stiffness condition, the flat board using resin material or plastic material to be made is thinner than the flat board of ceramic material, decrease the thickness of components and parts, and then the space that components and parts take can be reduced; And the flat board using resin material or plastic material to be made is thinner than the flat board of ceramic material can increase electric clearance, and then add safe distance, improve the safe distance of components and parts reliability.

In the components and parts that the embodiment of the present application provides, a dull and stereotyped side surface can by the gluing outer surface being connected to device body, or a side of flat board can arrange pad, a then dull and stereotyped side can by pad solder to the outer surface of device body, and during specific implementation, device body and dull and stereotyped connected mode select the restriction not being subject to each embodiment in the application.

As the optional execution mode of one, the dull and stereotyped flat board be made for heat resistant resin material or heat resistant plastics material or high temperature resistant plastic material.

As the optional execution mode of one, the dull and stereotyped flat board being the heat resistant plastices such as bakelite material, phenolic resins, nylon, polyphenylene sulfide, Teflon, organic siliconresin, fiberglass reinforced type nylon, fiberglass reinforced polyphenylene sulfide, epoxy resin, glass fiber reinforced epoxy resin, fiberglass reinforcing polyester and being made.

As the optional execution mode of one, dull and stereotyped outer rim is vertical or tilt to extend to form bead towards device body.Wherein, the distance that bead extends is less than or equal to the radial distance of device body, and when namely realizing, flat board can be replaced by a lid.And bead and flat board can be formed in one device or be combined to form device, lip material and plate material are all insulating material, can be identical or different insulating material.

Present embodiment can increase the minimum creep distance between electrode to another energized conductor further by the lid that dull and stereotyped and bead are formed, increase the safe distance between components and parts to another energized conductor, improve the safe distance of components and parts reliability, and creepage surface can be reduced by the probability all polluted, make these components and parts be more applicable for the high environment of pollution level.

As the optional execution mode of one, first area is contained in dull and stereotyped outer rim scope, comprising:

Device body is completely overlapping with dull and stereotyped outer rim scope in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds.

As the optional execution mode of one, device body is contained in dull and stereotyped outer rim scope in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds, comprising:

Device body is really contained in dull and stereotyped outer rim scope in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds.

In the embodiment of the present application, when flat board is ceramic material, thickness can be 0.4mm or 0.5mm or 0.7mm or 0.8mm or 1.1mm or 1.5mm or 2mm, can be the arbitrary numerical value between 0.4mm to 2mm during specific implementation, when the thickness of earthenware slab is less than 0.4mm, earthenware slab is easily broken.The thickness of the flat board that resin or plastic material make can be less than 0.4mm, thinner than earthenware slab, can increase electric clearance with promote the safe distance of components and parts performance, make these components and parts be more applicable for the high environment of pollution level; Or reduce the thickness of the device of these components and parts of application, and then save more space.

In the embodiment of the present application, flat board be resin material or plastic material time, dull and stereotyped thickness is less than or equal to 1.5mm, can be 0.8mm or 0.5mm or 0.4mm or 0.6mm or 0.3mm or 0.2mm.During specific implementation, dull and stereotyped thickness is selected not by the restriction of the present embodiment.As the optional execution mode of one, the dull and stereotyped flat board be made for transparent or translucent or opaque resin material.

As the optional execution mode of one, dull and stereotyped shape is rectangle, dull and stereotyped close a device body and side surface relative with device body outer surface is the length of flat board and the plane at wide place, the axial length of device body is less than or equal to dull and stereotyped length, and the radical length of device body is less than or equal to dull and stereotyped width.

As the optional execution mode of one, in chamber, be sealed with gas.Insulated tube between described two often adjacent electrodes and described two often adjacent electrodes forms the chamber of at least one inert gas included in argon gas, helium, neon, hydrogen, nitrogen, and the gas namely sealed can be at least one gas in argon gas, helium, neon, hydrogen, nitrogen.

As the optional execution mode of one, in chamber, be packaged with the electrical combination module be combined to form with at least one components and parts of adjacent two electrode electrical interconnects or at least two component circuit.

Exemplify the part representative embodiment of the application below by concrete diagram, the protection range of concrete the application is as the criterion with claims.Refer to Fig. 1 a, Fig. 1 b and Fig. 1 c, the structure chart of the components and parts that Fig. 1 a provides for the application first embodiment, the upward view of components and parts of Fig. 1 b for providing based on the application first embodiment shown in Fig. 1 a, the cutaway view of components and parts of Fig. 1 c for providing based on the application first embodiment shown in Fig. 1 a.As shown in Figure 1a, the components and parts that the present embodiment provides, comprise device body 110 and dull and stereotyped 120, device body 110 comprises the porcelain tube 113 be tightly connected by solder between two electrodes (electrode 111 and electrode 112) and two electrodes.In the present embodiment, dull and stereotyped 120 is square plate, be positioned at the side of the outer surface of device body 110, dull and stereotyped 120 are connected to the outer surface of device body 110 near device body 110 with the parallel relative side surface of device body 110 outer surface by it.And in the present embodiment, as shown in Figure 1 b, device body 110 is contained in dull and stereotyped outer rim scope S1 in the first area (outer rim scope S2) that the outer rim of the upright projection of a side surface of flat board 120 surrounds.As illustrated in figure 1 c, electrode 111 and being tightly connected formation chamber 114 by solder between electrode 112 and porcelain tube 113.Can find out in Fig. 1 a that flat board 120 is positioned at the upside of the outer surface of device body 110, and close the device body 110 of dull and stereotyped 120 and a side surface relative with device body 110 outer surface are the lower surface of dull and stereotyped 120, flat board 120 is connected to the outer surface of device body 110 by its lower surface relative with device body 110 outer surface.Can find out in Fig. 1 b that the outer rim scope S1 of dull and stereotyped 120 contains the outer rim scope S2 of device body 110 in the upright projection of flat board 120.Particularly, in the present embodiment, device body 110 shown in Fig. 1 b is really contained in the outer rim scope S1 of dull and stereotyped 120 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 120 place planes surrounds, namely device body 110 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 120 place planes surrounds in the outer rim scope S1 of dull and stereotyped 120, but completely not overlapping with the outer rim scope S1 of dull and stereotyped 120.In other embodiments, device body can be completely overlapping with the outer rim scope of flat board in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds.

In the present embodiment, the flat board 120 made by the insulating material arranged can meet the insulation property between electrode and another energized conductor, and the first area (outer rim scope S2) that the region (outer rim scope S1) that surrounds of the outer rim of dull and stereotyped 120 outer rim that is greater than or equal to device body 110 surrounds, then just can increase minimum creep distance between electrode to another energized conductor without the need to increasing electric clearance, decrease the thickness of the device of these components and parts of application, save more space.In addition, these components and parts, by the insulation property of dull and stereotyped 120 and the larger performance of minimum creep distance, reduce the probability that creepage surface all pollutes, make these components and parts be more applicable for the high environment of pollution level.

In the present embodiment, the shape of electrode 111 and electrode 112 is the square-shaped electrode of band chamfering, electrode 111 and electrode 112 are oxygen-free copper electrode, and the insulated tube (porcelain tube 113) be tightly connected between adjacent electrode is square porcelain tube, and the flat board 120 that dull and stereotyped 120 are formed for resin material making.In other embodiments, electrode can be square or rectangle or be with the square of chamfering) or electrode that is circular or other regular shapes, electrode can be iron nickel electrode or copper electrode or be electronickelling on oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, the electrode of any one material in gold, the insulated tube be tightly connected between adjacent electrode can be square or circular or oval glass tube or porcelain tube, and flat board can be the flat board that pottery or resin or plastic material or printed circuit board are made, and the shape of flat board can be rectangle, oval, circular, any one in square or regular shape.

In the present embodiment, one side surface of dull and stereotyped 120 can by the gluing outer surface being connected to device body 110 in succession, in other embodiments, a dull and stereotyped side can arrange pad, then a dull and stereotyped side can by pad solder to the outer surface of device body.In the present embodiment, the thickness of dull and stereotyped 120 is 0.45mm, and dull and stereotyped 120 is flat boards 120 that transparent resin material is made, in other embodiments, dull and stereotyped thickness is less than or equal to 1mm, can be 0.8mm or 0.5mm or 0.4mm or 0.6mm or 0.3mm or 0.2mm, and flat board can be transparent or the flat board that is made of semi-transparent resin material or opaque resin material.

As the optional execution mode of one, in other embodiments, the dull and stereotyped flat board be made for heat resistant resin material or heat resistant plastics material or high temperature resistant plastic material.

As the optional execution mode of one, in other embodiments, the dull and stereotyped flat board being the heat resistant plastices such as bakelite material, phenolic resins, nylon, polyphenylene sulfide, Teflon, organic siliconresin, fiberglass reinforced type nylon, fiberglass reinforced polyphenylene sulfide, epoxy resin, glass fiber reinforced epoxy resin, fiberglass reinforcing polyester and being made.

In the present embodiment, as shown in Figure 1 b, the shape of dull and stereotyped 120 is square, a side surface relative with device body 110 outer surface of dull and stereotyped 120 is the dull and stereotyped length of 120 and the plane at wide (length of square plate is equal with wide) place, the axial length of device body 110 is less than the length of flat board 120 and the width that the radical length of device body 110 is less than dull and stereotyped 120.As the optional execution mode of one, in other embodiments, the axial length of device body is less than dull and stereotyped length, and the radical length of device body equals dull and stereotyped width.In addition, as the optional execution mode of another kind, in other embodiments, the axial length of device body can equal dull and stereotyped length, and the radical length of device body can be less than or equal to dull and stereotyped width.

In the present embodiment, as illustrated in figure 1 c, electrode 111 and electrode 112 are boss electrode, and namely the central area of the outer surface of electrode 111 and electrode 112 is recessed to form boss 111a towards porcelain tube 113.Wherein, the surface of boss 111a is provided with the grid 111b of regular shape, and grid 111b surface can apply the electronic emission materials such as electronic powder.

As the optional execution mode of one, in chamber 114, be sealed with gas.The gas type wherein sealed can be at least one gas in argon gas, helium, neon, hydrogen, nitrogen.

As the optional execution mode of one, in chamber 114, be packaged with the electrical combination module be combined to form with at least one components and parts of adjacent two electrodes (electrode 111 and electrode 112) electrical interconnects or at least two component circuit.

As the optional execution mode of one, refer to Fig. 2 a, Fig. 2 b and Fig. 2 c, the structure chart of the components and parts that Fig. 2 a provides for the application second embodiment, the upward view of components and parts of Fig. 2 b for providing based on the application second embodiment shown in Fig. 2 a, the cutaway view of components and parts of Fig. 2 c for providing based on the application second embodiment shown in Fig. 2 a.As shown in Figure 2 a, the components and parts that the present embodiment provides are the components and parts improvement structurally provided based on the application first embodiment shown in Fig. 1 a.In the present embodiment, the outer rim of dull and stereotyped 120 vertically extends to form bead 210 towards device body 110, and as shown in Figure 2 b, the axial length of device body 110 is less than the length of flat board 120, and the width that the radical length of device body 110 is less than dull and stereotyped 120, namely the outer rim scope S1 of dull and stereotyped 120 contains the outer rim scope S2 of device body 110 in the upright projection of flat board 120.As shown in Figure 2 c, wherein, the distance that bead 210 extends is less than or equal to the radial distance of device body 110, and namely dull and stereotyped 120 form a lid with bead 210, cover buckle is to device body 110.And electrode 111 and electrode 112 are boss electrode, and namely the central area of the outer surface of electrode 111 and electrode 112 is recessed to form boss 111a towards porcelain tube 113.Wherein, the surface of boss 111a is provided with the grid 111b of regular shape, and grid 111b surface can apply the electronic emission materials such as electronic powder.In order to reduce the space that flat board 120 length in the axial direction takies with the axis of saving components and parts, the length of the flat board 120 that the present embodiment provides is less than the length of the flat board 120 that the first embodiment provides, relative to the components and parts that the application first embodiment provides, present embodiment not only reduces by lid that is dull and stereotyped and bead formation the space that components and parts take, the minimum creep distance between electrode to another energized conductor can also be increased further, to increase the safe distance between components and parts to another energized conductor, improve the safe distance of components and parts reliability, and creepage surface can be reduced by the probability all polluted, these components and parts are made to be more applicable for the high environment of pollution level.

In other embodiments, device body can be completely overlapping with the outer rim scope of flat board or be a bit larger tham dull and stereotyped outer rim scope in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds, and dull and stereotyped outer rim can extend to form bead towards device body inclination.Bead and flat board can be formed in one device or be combined to form device, and lip material and plate material are all insulating material, can be identical or different insulating material.

Refer to Fig. 3 a, Fig. 3 b and Fig. 3 c, the structure chart of the components and parts that Fig. 3 a provides for the application the 3rd embodiment, the upward view of components and parts of Fig. 3 b for providing based on the application the 3rd embodiment shown in Fig. 3 a, the cutaway view of components and parts of Fig. 3 c for providing based on the application the 3rd embodiment shown in Fig. 3 a.As shown in Figure 3 a, the components and parts that the present embodiment provides comprise device body 310 and dull and stereotyped 320, and device body 310 comprises the porcelain tube 314 and porcelain tube 315 that are tightly connected by solder between two electrodes often adjacent in three electrodes (electrode 311, electrode 312 and electrode 313) and three electrodes.In the present embodiment, dull and stereotyped 320 is rectangle thin plate, be positioned at the side of the outer surface of device body 310, flat board 320 is by close device body 310 and it is connected to the outer surface of device body 310 with the parallel relative side surface of device body 310 outer surface.And in the present embodiment, device body 310 is contained in the outer rim scope S1 of dull and stereotyped 320 in the first area (outer rim scope S2) that the outer rim of the upright projection of a side surface of flat board 320 surrounds.As shown in Figure 3 c, electrode 311 and being tightly connected formation chamber 316 by solder between electrode 312 and porcelain tube 314, electrode 312 and being tightly connected formation chamber 317 by solder between electrode 313 and porcelain tube 315.Can find out in Fig. 3 a that flat board 320 is positioned at the upside of the outer surface of device body 310, and a side surface relative with device body 310 outer surface of dull and stereotyped 320 is the lower surface of dull and stereotyped 320, flat board 320 is connected to the outer surface of device body 310 by its lower surface relative with device body 310 outer surface.As shown in Figure 3 b, can find out in Fig. 3 b that the outer rim scope S1 of dull and stereotyped 320 contains the outer rim scope S2 of device body 310 in the upright projection of flat board 320.In the present embodiment, device body 310 shown in Fig. 3 b is really contained in dull and stereotyped outer rim scope S1 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 320 place planes surrounds, namely device body 310 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 320 place planes surrounds in the outer rim scope S1 of dull and stereotyped 320, but completely not overlapping with the outer rim scope S1 of dull and stereotyped 320.In other embodiments, device body can be completely overlapping with the outer rim scope of flat board in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds.

In the present embodiment, the shape of electrode 311, electrode 312 and electrode 313 is the square-shaped electrode of band chamfering, electrode 311, electrode 312 and electrode 313 is iron nickel electrode, the porcelain tube 314 be tightly connected between adjacent electrode and porcelain tube 315 are circular porcelain tube, and dull and stereotyped 320 is that resin material or plastic cement make the flat board 320 formed.In other embodiments, electrode can be square or rectangle or be with the square of chamfering) or electrode that is circular or other regular shapes, electrode can be iron nickel electrode or copper electrode or be iron plating on oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, the electrode of any one material in gold, the insulated tube be tightly connected between adjacent electrode can be square or circular or oval glass tube or porcelain tube, and flat board can be the flat board that pottery or resin or plastic material or printed circuit board are made, and the shape of flat board can be rectangle, oval, circular, any one in square or regular shape.

In the present embodiment, one side surface of dull and stereotyped 320 can by the gluing outer surface being connected to device body 310 in succession, in other embodiments, a dull and stereotyped side can arrange pad, then a side of dull and stereotyped 320 can by pad solder to the outer surface of device body.In the present embodiment, the thickness of dull and stereotyped 320 is 0.55mm, and dull and stereotyped 320 is flat boards 320 that transparent resin material is made, in other embodiments, dull and stereotyped thickness is less than or equal to 1.5mm, can be 0.8mm or 0.5mm or 0.4mm or 0.65mm or 0.3mm or 0.2mm, and flat board can be transparent or the flat board that is made of semi-transparent resin material or opaque resin material.

In the present embodiment, as shown in Figure 3 b, the shape of dull and stereotyped 320 is rectangle, a side surface relative with device body 310 outer surface of dull and stereotyped 320 is the dull and stereotyped length of 320 and the plane at wide place, the axial length of device body 310 is less than the length of flat board 320 and the width that the radical length of device body 310 equals dull and stereotyped 320.As the optional execution mode of one, in other embodiments, the axial length of device body is less than dull and stereotyped length, and the radical length of device body is less than dull and stereotyped width.In addition, as the optional execution mode of another kind, in other embodiments, the axial length of device body can equal dull and stereotyped length, and the radical length of device body can be less than or equal to dull and stereotyped width.

As the optional execution mode of one, in chamber, be sealed with gas.The gas type wherein sealed can be at least one gas in argon gas, helium, neon, hydrogen, nitrogen.

In the present embodiment, as shown in Figure 3 c, electrode 311, electrode 312 and electrode 313 is boss electrode, wherein, the central area of the outer surface of electrode 311 is recessed to form boss 311a 314 towards porcelain tube 314, the central area porcelain tube 315 of the outer surface of similar electrode 313 is recessed to form boss 311a, and on the two sides be connected with porcelain tube of electrode 312, the central area of each side extends to form boss 312a towards the porcelain tube 314 be connected with this side and porcelain tube 315.Wherein, the surface of boss 311a is provided with the grid 311b of regular shape, and grid 311b surface can apply the electronic emission materials such as electronic powder.In the present embodiment, the thickness of electrode 312 is greater than the thickness of electrode 311 and electrode 313, and in other embodiments, the thickness of electrode 312 can be less than or equal to the thickness of electrode 311 and electrode 313, and specific implementation is not by the restriction of the present embodiment.

As the optional execution mode of one, refer to Fig. 4 a and Fig. 4 b and Fig. 4 c, the structure chart of the components and parts that Fig. 4 a provides for the application the 4th embodiment, the upward view of components and parts of Fig. 4 b for providing based on the application the 4th embodiment shown in Fig. 4 a, the cutaway view of components and parts of Fig. 4 c for providing based on the application the 4th embodiment shown in Fig. 4 a.As shown in fig. 4 a, the components and parts that the present embodiment provides are the components and parts improvement structurally provided based on the application the 3rd embodiment shown in Fig. 3 a.In the present embodiment, the outer rim of dull and stereotyped 320 vertically extends to form bead 410 towards device body 310, and as shown in Figure 4 b, the axial length of device body 310 is less than the length of flat board 320, and the width that the radical length of device body 310 is less than dull and stereotyped 320, namely the outer rim scope S1 of dull and stereotyped 320 contains the outer rim scope S2 of device body 310 in the upright projection of flat board 320.As illustrated in fig. 4 c, wherein, the distance that bead 410 extends is less than or equal to the radial distance of device body 310, and namely dull and stereotyped 320 form a lid with bead 410, cover buckle is to device body 310.In order to reduce the space that flat board 320 length in the axial direction takies with the axis of saving components and parts, the length of the flat board 320 that the present embodiment provides is less than the length of the flat board 320 that the 3rd embodiment provides, relative to the components and parts that the application the 3rd embodiment provides, present embodiment not only reduces by lid that is dull and stereotyped and bead formation the space that components and parts take, the minimum creep distance between electrode to another energized conductor can also be increased further, to increase the safe distance between components and parts to another energized conductor, improve the safe distance of components and parts reliability, and creepage surface can be reduced by the probability all polluted, these components and parts are made to be more applicable for the high environment of pollution level.

As illustrated in fig. 4 c, electrode 311, electrode 312 and electrode 313 is boss electrode, wherein, the central area of the outer surface of electrode 311, electrode 313 is recessed to form boss 311a towards porcelain tube, and on the two sides be connected with porcelain tube of electrode 312, the central area of each side extends to form a boss 312a towards the porcelain tube be connected with this side.Wherein, the surface of boss 311a is provided with the grid 311b of regular shape, and grid 311b surface can apply the electronic emission materials such as electronic powder.In the present embodiment, the thickness of electrode 312 is greater than the thickness of electrode 311 and electrode 313, and in other embodiments, the thickness of electrode 312 can be less than or equal to the thickness of electrode 311 and electrode 313, and specific implementation is not by the restriction of the present embodiment.

Refer to the structure chart of the components and parts that Fig. 5 a and Fig. 5 b, Fig. 5 a provides for the application the 5th embodiment, the upward view of components and parts of Fig. 5 b for providing based on the application the 5th embodiment shown in Fig. 5 a.As shown in Figure 5 a, the components and parts that the present embodiment provides comprise device body 510 and dull and stereotyped 530, and device body 510 comprises the porcelain tube 517, porcelain tube 518, porcelain tube 519, porcelain tube 520 and the porcelain tube 521 that are tightly connected by solder between two electrodes often adjacent in six electrodes (electrode 511, electrode 512, electrode 513, electrode 514, electrode 515 and electrode 516) and six electrodes.Wherein, electrode 511 and being tightly connected by solder between electrode 512 and porcelain tube 517, electrode 512 and being tightly connected by solder between electrode 513 and porcelain tube 518, electrode 513 and being tightly connected by solder between electrode 514 and porcelain tube 519, electrode 514 and being tightly connected by solder between electrode 515 and porcelain tube 520, electrode 515 and being tightly connected by solder between electrode 516 and porcelain tube 521.In the present embodiment, dull and stereotyped 530 is rectangle thin plate, be positioned at the side of the outer surface of device body 510, dull and stereotyped 530 are connected to the outer surface of device body 510 near device body 510 with the parallel relative side surface of device body 510 outer surface by it.And in the present embodiment, device body 510 is contained in the outer rim scope S1 of dull and stereotyped 530 in the first area (outer rim scope S2) that the outer rim of the upright projection of a side surface of flat board 530 surrounds.Can find out in Fig. 5 a that flat board 530 is positioned at the upside of the outer surface of device body 510, and a side surface relative with device body 510 outer surface of dull and stereotyped 530 is the lower surface of dull and stereotyped 530, flat board 530 is connected to the outer surface of device body 510 by its lower surface relative with device body 510 outer surface.As shown in Figure 5 b, can find out in Fig. 5 b that the outer rim scope S1 of dull and stereotyped 530 contains the outer rim scope S2 of device body 510 in the upright projection of flat board 530.In the present embodiment, device body 510 shown in Fig. 5 b is really contained in the outer rim scope S1 of dull and stereotyped 530 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 530 place planes surrounds, namely device body 510 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 530 place planes surrounds in the outer rim scope S1 of dull and stereotyped 530, but completely not overlapping with the outer rim scope S1 of dull and stereotyped 530.In other embodiments, device body can be completely overlapping with the outer rim scope of flat board in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds.

In the present embodiment, the flat board 530 made by the insulating material arranged can meet the insulation property between electrode and another energized conductor, and the first area (outer rim scope S2) that the region (outer rim scope S1) that surrounds of the outer rim of dull and stereotyped 530 outer rim that is greater than or equal to device body 510 surrounds, then just can increase minimum creep distance between electrode to another energized conductor without the need to increasing electric clearance, decrease the thickness of the device of these components and parts of application, save more space.In addition, these components and parts, by the insulation property of dull and stereotyped 530 and the larger performance of minimum creep distance, reduce the probability that creepage surface all pollutes, make these components and parts be more applicable for the high environment of pollution level.

In the present embodiment, the shape of electrode 511, electrode 512, electrode 513, electrode 514, electrode 515 and electrode 516 is the square-shaped electrode of band chamfering, and be iron nickel electrode, the porcelain tube 517 be tightly connected between adjacent electrode, porcelain tube 518, porcelain tube 519, porcelain tube 520 and porcelain tube 521 is circular porcelain tube, and dull and stereotyped 530 is that resin material or plastic cement make the flat board 530 formed.In other embodiments, electrode can be the electrode of square or other regular shapes of square or rectangle or circle or band chamfering, electrode can be iron nickel electrode or copper electrode or be electronickelling on oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, the electrode of any one material in gold, the insulated tube be tightly connected between adjacent electrode can be square or circular or oval glass tube or porcelain tube, and flat board can be the flat board that pottery or resin or plastic material or printed circuit board are made, and the shape of flat board can be rectangle, oval, circular, any one in square or regular shape.

In the present embodiment, one side surface of dull and stereotyped 530 can by the gluing outer surface being connected to device body 510 in succession, in other embodiments, a dull and stereotyped side can arrange pad, then a dull and stereotyped side can by pad solder to the outer surface of device body.In the present embodiment, the thickness of dull and stereotyped 530 is 0.35mm, and dull and stereotyped 530 is flat boards 530 that transparent resin material is made, in other embodiments, dull and stereotyped thickness is less than or equal to 1.5mm, can be 0.8mm or 0.5mm or 0.4mm or 0.65mm or 0.3mm or 0.2mm, and flat board can be transparent or the flat board that is made of semi-transparent resin material or opaque resin material.

In the present embodiment, as shown in Figure 5 b, the shape of dull and stereotyped 530 is rectangle, a side surface relative with device body 510 outer surface of dull and stereotyped 530 is the dull and stereotyped length of 530 and the plane at wide place, the axial length of device body 510 is less than the length of flat board 530 and the width that the radical length of device body 510 equals dull and stereotyped 530.Refer to Fig. 5 c, the upward view of the components and parts that Fig. 5 c provides for another embodiment of the application for Fig. 5 c, as shown in Figure 5 c, as the optional execution mode of one, the axial length of device body 510 is less than the length of flat board 530 and the width that the radical length of device body 510 is less than dull and stereotyped 530.In addition, as the optional execution mode of another kind, in other embodiments, the axial length of device body can equal dull and stereotyped length, and the radical length of device body can be less than or equal to dull and stereotyped width.

In the present embodiment, the central area of the outer surface of electrode 511 and electrode 516 is recessed to form boss towards connected porcelain tube; At electrode 512, electrode 513, electrode 514, electrode 515 with on the two sides be connected with porcelain tube of electrode 516, the central area of each side extends to form a boss towards the porcelain tube be connected with this side, the structure of concrete electrode 512, electrode 513, electrode 514, electrode 515 and electrode 516 can the structure of the electrode 312 shown in reference diagram 3c, with electrode 312 unlike variable thickness sample.Wherein, the surface of boss is provided with the grid of regular shape, and surface mesh can apply the electronic emission materials such as electronic powder.As the optional execution mode of one, in chamber, be packaged with the electrical combination module be combined to form with at least one components and parts of adjacent two electrode electrical interconnects or at least two component circuit.

As the optional execution mode of one, refer to Fig. 6 a, Fig. 6 b and Fig. 6 c, the structure chart of the components and parts that Fig. 6 a provides for the application the 6th embodiment, the upward view of components and parts of Fig. 6 b for providing based on the application the 6th embodiment shown in Fig. 6 a, the cutaway view of components and parts of Fig. 6 c for providing based on the application the 6th embodiment shown in Fig. 6 a.As shown in Figure 6 a, the components and parts that the present embodiment provides are the components and parts improvement structurally provided based on the application the 5th embodiment shown in Fig. 5 a.In the present embodiment, the outer rim of dull and stereotyped 530 vertically extends to form bead 610 towards device body 510, and as shown in Figure 6 b, the axial length of device body 510 is less than the length of flat board 530, and the width that the radical length of device body 510 is less than dull and stereotyped 530, namely the outer rim scope S1 of dull and stereotyped 530 contains the outer rim scope S2 of device body 510 in the upright projection of flat board 530.As fig. 6 c, the distance that bead 610 extends is less than or equal to the radial distance of device body 510, and namely dull and stereotyped 530 form a lid with bead 610, cover buckle is to device body 510.In order to reduce the space that dull and stereotyped length in the axial direction takies with the axis of saving components and parts, the length of the flat board that the present embodiment provides is less than the length of the flat board that the 5th embodiment provides, relative to the components and parts that the application the 5th embodiment provides, present embodiment not only reduces by lid that is dull and stereotyped and bead formation the space that components and parts take, the minimum creep distance between electrode to another energized conductor can also be increased further, to increase the safe distance between components and parts to another energized conductor, improve the safe distance of components and parts reliability, and creepage surface can be reduced by the probability all polluted, these components and parts are made to be more applicable for the high environment of pollution level.In other embodiments, device body can be completely overlapping with the outer rim scope of flat board or be a bit larger tham dull and stereotyped outer rim scope in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds, and dull and stereotyped outer rim can extend to form bead towards device body inclination.Bead and flat board can be formed in one device or be combined to form device, and lip material and plate material are all insulating material, can be identical or different insulating material.

As fig. 6 c, in the present embodiment, the central area of the outer surface of electrode 511 and electrode 516 is recessed to form boss 511a towards connected porcelain tube; At electrode 512, electrode 513, electrode 514, electrode 515 with on the two sides be connected with porcelain tube of electrode 516, the central area of each side extends to form a boss 512a towards the porcelain tube be connected with this side, the structure of concrete electrode 512, electrode 513, electrode 514, electrode 515 and electrode 516 can the structure of the electrode 312 shown in reference diagram 3c, with electrode 312 unlike variable thickness sample.Wherein, the surface of boss 511a is provided with the grid 511b of regular shape, and the surface of boss 512a is provided with the grid 512b of regular shape, and the surface of grid 511b and grid 512b can apply the electronic emission materials such as electronic powder.

Refer to the structure chart of the components and parts that Fig. 7 a and Fig. 7 b, Fig. 7 a provides for the application the 7th embodiment, the upward view of components and parts of Fig. 7 b for providing based on the application the 7th embodiment shown in Fig. 7 a.As shown in Figure 7a, the components and parts that the present embodiment provides comprise device body 710 and dull and stereotyped 730, and device body 710 comprises the porcelain tube 717, porcelain tube 718, porcelain tube 719, porcelain tube 720 and the porcelain tube 721 that are tightly connected by solder between two electrodes often adjacent in six electrodes (electrode 711, electrode 712, electrode 713, electrode 714, electrode 715 and electrode 716) and six electrodes.Wherein, electrode 711 and being tightly connected by solder between electrode 712 and porcelain tube 717, electrode 712 and being tightly connected by solder between electrode 713 and porcelain tube 718, electrode 713 and being tightly connected by solder between electrode 714 and porcelain tube 719, electrode 714 and being tightly connected by solder between electrode 715 and porcelain tube 720, electrode 715 and being tightly connected by solder between electrode 716 and porcelain tube 721.In the present embodiment, dull and stereotyped 730 is rectangle thin plate, is positioned at the side of the outer surface of device body 710, and flat board 730 is connected to the outer surface of device body 710 by the parallel relative side surface of itself and device body 710 outer surface.And in the present embodiment, device body 710 is contained in the outer rim scope S1 of dull and stereotyped 730 in the first area (outer rim scope S2) that the outer rim of the upright projection of a side surface of flat board 730 surrounds.Can find out in Fig. 7 a that flat board 730 is positioned at the upside of the outer surface of device body 710, and a side surface relative with device body 710 outer surface of dull and stereotyped 730 is the lower surface of dull and stereotyped 730, flat board 730 is connected to the outer surface of device body 710 by its lower surface relative with device body 710 outer surface.As shown in Figure 7b, can find out in Fig. 7 b that the outer rim scope S1 of dull and stereotyped 730 contains the outer rim scope S2 of device body 710 in the upright projection of flat board 730.In the present embodiment, device body 710 shown in Fig. 7 b is really contained in the outer rim scope S1 of dull and stereotyped 730 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 730 place planes surrounds, namely device body 710 in the first area (outer rim scope S2) that the outer rim of the upright projection of dull and stereotyped 730 place planes surrounds in the outer rim scope S1 of dull and stereotyped 730, but completely not overlapping with the outer rim scope S1 of dull and stereotyped 730.In other embodiments, device body can be completely overlapping with the outer rim scope of flat board in the first area that the outer rim of the upright projection of dull and stereotyped place plane surrounds.

In the present embodiment, the flat board 730 made by the insulating material arranged can meet the insulation property between electrode and another energized conductor, and the first area (outer rim scope S2) that the region (outer rim scope S1) that surrounds of the outer rim of dull and stereotyped 730 outer rim that is greater than or equal to device body 710 surrounds, then just can increase minimum creep distance between electrode to another energized conductor without the need to increasing electric clearance, decrease the thickness of the device of these components and parts of application, save more space.In addition, these components and parts, by the insulation property of dull and stereotyped 730 and the larger performance of minimum creep distance, reduce the probability that creepage surface all pollutes, make these components and parts be more applicable for the high environment of pollution level.

In the present embodiment, the shape of electrode is the square-shaped electrode of band chamfering, and electrode is iron nickel electrode, and the insulated tube be tightly connected between adjacent electrode is square porcelain tube, and dull and stereotyped 730 is that resin material or plastic cement make the flat board 730 formed.In other embodiments, electrode can be the electrode of square or other regular shapes of square or rectangle or circle or band chamfering, electrode can be iron nickel electrode or copper electrode or be electronickelling on oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, the electrode of any one material in gold, the insulated tube be tightly connected between adjacent electrode can be square or circular or oval glass tube or porcelain tube, and flat board can be the flat board that pottery or resin or plastic material or printed circuit board are made, and the shape of flat board can be rectangle, oval, circular, any one in square or regular shape.

In the present embodiment, one side surface of dull and stereotyped 730 can by the gluing outer surface being connected to device body 710 in succession, in other embodiments, a dull and stereotyped side can arrange pad, then a dull and stereotyped side can by pad solder to the outer surface of device body.In the present embodiment, the thickness of dull and stereotyped 730 is 0.6mm, and dull and stereotyped 730 is flat boards 730 that transparent resin material is made, in other embodiments, dull and stereotyped thickness is less than or equal to 1.5mm, can be 0.8mm or 0.5mm or 0.4mm or 0.65mm or 0.3mm or 0.2mm, and flat board can be transparent or the flat board that is made of semi-transparent resin material or opaque resin material.

In the present embodiment, as shown in Figure 7b, the shape of dull and stereotyped 730 is rectangle, a side surface relative with device body 710 outer surface of dull and stereotyped 730 is the dull and stereotyped length of 730 and the plane at wide place, the axial length of device body 710 is less than the length of flat board 730 and the width that the radical length of device body 710 equals dull and stereotyped 730.As the optional execution mode of one, refer to Fig. 7 c, the upward view of the components and parts that Fig. 7 c provides for another embodiment of the application, as shown in Figure 7 c, in this embodiment, the axial length of device body 710 is less than the length of flat board 730, and the radical length of device body 710 is less than dull and stereotyped width.In addition, as the optional execution mode of another kind, in other embodiments, the axial length of device body can equal dull and stereotyped length, and the radical length of device body can be less than or equal to dull and stereotyped width.

In the present embodiment, the central area of the outer surface of electrode 711 and electrode 716 is recessed to form boss towards connected porcelain tube; At electrode 712, electrode 713, electrode 714, electrode 715 with on the two sides be connected with porcelain tube of electrode 716, the central area of each side extends to form a boss towards the porcelain tube be connected with this side, and the structure of concrete electrode 712, electrode 713, electrode 714, electrode 715 and electrode 716 can the structure of the electrode 512 shown in reference diagram 6c.Wherein, the surface of boss is provided with the grid of regular shape, and surface mesh can apply the electronic emission materials such as electronic powder.

As the optional execution mode of one, refer to the structure chart of the components and parts that Fig. 8 a and Fig. 8 b, Fig. 8 a provides for the application the 8th embodiment, the cutaway view of components and parts of Fig. 8 b for providing based on the application the 8th embodiment shown in Fig. 8 a.As shown in Figure 8 a, the components and parts that the present embodiment provides are the components and parts improvement structurally provided based on the application the 7th embodiment shown in Fig. 7 a.In the present embodiment, the outer rim of dull and stereotyped 730 vertically extends to form bead 810 towards device body 710, the axial length of device body 710 is less than the length of flat board 730, and the width that the radical length of device body 710 is less than dull and stereotyped 730, namely dull and stereotyped outer rim scope contains the outer rim scope of device body 710 in the upright projection of flat board 730.Wherein, as shown in Figure 8 b, the distance that bead 810 extends is less than or equal to the radial distance of device body 710, and namely dull and stereotyped 730 form a lid with bead 810, cover buckle is to device body 710.In order to reduce the space that dull and stereotyped length in the axial direction takies with the axis of saving components and parts, the length of the flat board that the present embodiment provides is less than the length of the flat board that the 5th embodiment provides, relative to the components and parts that the application the 7th embodiment provides, present embodiment not only reduces by lid that is dull and stereotyped and bead formation the space that components and parts take, the minimum creep distance between electrode to another energized conductor can also be increased further, to increase the safe distance between components and parts to another energized conductor, improve the safe distance of components and parts reliability, and creepage surface can be reduced by the probability all polluted, these components and parts are made to be more applicable for the high environment of pollution level.

As shown in Figure 8 b, in the present embodiment, the central area of the outer surface of electrode 711 and electrode 716 is recessed to form boss 711a towards connected porcelain tube; At electrode 712, electrode 713, electrode 714, electrode 715 with on the two sides be connected with porcelain tube of electrode 716, the central area of each side extends to form a boss 712a towards the porcelain tube be connected with this side, and the structure of concrete electrode 712, electrode 713, electrode 714, electrode 715 and electrode 716 can the structure of the electrode 512 shown in reference diagram 6c.Wherein, the surface of boss 711a is provided with the grid 711b of regular shape, and the surface of boss 712a is provided with the grid 712b of regular shape, and the surface of grid 711b and grid 712b can apply the electronic emission materials such as electronic powder.

In multiple embodiments that the application provides; should be understood that; more than describe; be only the embodiment of the application; but the protection range of the application is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the application discloses, amendment or the replacement of various equivalence can be expected easily, these amendments or replace all should be encompassed in the application protection range within.

Claims

1. components and parts, comprise the device body that profile is column, described device body comprises at least two electrodes be arranged in order, be tightly connected between two often adjacent electrodes in described at least two electrodes insulated tube, chamber is formed to make the insulated tube between two often adjacent electrodes and described two often adjacent electrodes, it is characterized in that, described components and parts also comprise flat board, described flat board is positioned at the side of the outer surface of described device body, described flat board by its near described device body and be connected to the outer surface of described device body with the parallel relative side surface of described device body outer surface, described device body is contained in the outer rim scope of described flat board in the first area that the outer rim of the upright projection of a described side surface of described flat board surrounds, described flat board is the flat board that insulating material is made.

2. components and parts as claimed in claim 1, is characterized in that, described components and parts also comprise the bead that the outer rim of described flat board is vertical towards described device body or tilt to extend to form.

3. components and parts as claimed in claim 2, it is characterized in that, described first area is contained in the outer rim scope of described flat board, comprising:

4. components and parts as claimed in claim 2, it is characterized in that, described device body is contained in the outer rim scope of described flat board in the first area that the outer rim of the upright projection of described dull and stereotyped place plane surrounds, and comprising:

5. components and parts as claimed in claim 1 or 2 or 3 or 4, is characterized in that, described flat board by its near described device body and be connected to the outer surface of described device body with the parallel relative side surface of described device body outer surface, comprising:

6. components and parts as claimed in claim 5, is characterized in that, the shape of described flat board be rectangle, ellipse, circle, square in any one.

7. components and parts as claimed in claim 6, it is characterized in that, described flat board is the flat board that resin material or plastic material are made, and the thickness of described flat board is less than or equal to 1.5mm.

8. components and parts as claimed in claim 7, is characterized in that, described flat board is the flat board that heat resistant resin material or heat resistant plastics material or high temperature resistant plastic material are made.

9. components and parts as claimed in claim 6, it is characterized in that, described flat board is the flat board of ceramic material or print circuit plates making, and the thickness of described flat board is greater than or equal to 0.4mm, and the thickness of described flat board is less than or equal to 2mm.

10. components and parts as claimed in claim 2, it is characterized in that, the shape of described flat board is rectangle, the close described device body of described flat board and be the length of described flat board and the plane at wide place with the parallel relative described side surface of described device body outer surface, the axial length of described device body is less than or equal to the length of described flat board, and the radical length of described device body is less than or equal to the width of described flat board.

11. components and parts as claimed in claim 10, is characterized in that, described electrode is copper electrode or oxygen-free copper electrode or iron nickel electrode;

12. components and parts as described in claim 1 or 2 or 3 or 4 or 10 or 11, is characterized in that, be sealed with gas in described chamber.

13. components and parts as claimed in claim 12, is characterized in that, the insulated tube between described two often adjacent electrodes and described two often adjacent electrodes forms the chamber of at least one inert gas included in argon gas, helium, neon, hydrogen, nitrogen.

14. components and parts as described in claim 1 or 2 or 3 or 4 or 10 or 11, it is characterized in that, in described chamber, be packaged with the electrical combination module be combined to form with at least one components and parts of described two adjacent electrode electrical interconnects or at least two component circuit.

15. components and parts as described in claim 1 or 2 or 3 or 4 or 10 or 11, it is characterized in that, be sealed with gas in described chamber, described insulated tube is rectangle porcelain tube or square porcelain tube or circular porcelain tube or oval porcelain tube, and the shape of described electrode is square-shaped electrode or circular electrode;