CN204515195U - Optical module heat radiation module and electronic equipment - Google Patents

Optical module heat radiation module and electronic equipment Download PDF

Info

Publication number
CN204515195U
CN204515195U CN201520186400.6U CN201520186400U CN204515195U CN 204515195 U CN204515195 U CN 204515195U CN 201520186400 U CN201520186400 U CN 201520186400U CN 204515195 U CN204515195 U CN 204515195U
Authority
CN
China
Prior art keywords
optical module
heat radiation
heat
accommodation space
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201520186400.6U
Other languages
Chinese (zh)
Inventor
关明慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lenovo Beijing Ltd
Original Assignee
Lenovo Beijing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lenovo Beijing Ltd filed Critical Lenovo Beijing Ltd
Priority to CN201520186400.6U priority Critical patent/CN204515195U/en
Application granted granted Critical
Publication of CN204515195U publication Critical patent/CN204515195U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides a kind of optical module heat radiation module and electronic equipment, relates to electronic device field, and the object reached improves rate of heat dispation, and strengthen radiating effect, practicality is high.The technical scheme of main employing is: optical module radiator comprises housing and heat abstractor.Described housing has the accommodation space for accommodating optical module, and described housing comprises top board, and described top board is provided with opening, described opening and described accommodation space through.Described heat abstractor is arranged on described top board, produces and the heat given out from described opening part for receiving and distributing described optical module.

Description

Optical module heat radiation module and electronic equipment
Technical field
The utility model relates to electronic device field, particularly relates to a kind of optical module heat radiation module and electronic equipment.
Background technology
Along with the development of fiber optic network, the network equipment using optical module gets more and more, and applied environment becomes increasingly complex, and the power consumption of optical module is increasing, and is all be inserted in optical module radome to work, and heat radiation becomes an important problem.
Current optical module radiating mode on optical module radome, is provided with multiple louvre carry out natural heat dissipation, and this mode is applicable to the less optical module of power consumption.Larger the produced heat of power consumption due to optical module is larger, again because louvre rate of heat dispation is comparatively slow, can not be left by heat fast, therefore, optical module radome be provided with the cooling requirements that multiple louvre can not meet large power consumption optical module.
Utility model content
Fundamental purpose of the present utility model is the optical module heat radiation module and the electronic equipment that provide a kind of new structure, and technical matters to be solved is that rate of heat dispation is slow, and radiating effect is poor.
The purpose of this utility model and solve its technical matters and realize by the following technical solutions:
On the one hand, the utility model provides a kind of optical module heat radiation module, and this optical module heat radiation module comprises:
Housing, it has the accommodation space for accommodating optical module, and described housing comprises top board, and described top board is provided with opening, described opening and described accommodation space through;
Heat abstractor, it is arranged on described top board, produces and the heat given out from described opening part for receiving and distributing described optical module.
Foregoing optical module heat radiation module, wherein, described heat abstractor comprises:
Substrate, it covers over said opening, and can stretch into described accommodation space from described opening and contact with described optical module;
Heat radiator, it is arranged on the relative end face of the surface of contact contacted with described optical module of described substrate.
Foregoing optical module heat radiation module, wherein, described housing comprises:
At least one baffle plate, it is arranged in described accommodation space along predetermined direction, and vertical with described top board;
Described baffle plate is provided with the groove for placing described heat abstractor, and the notch of described groove is relative with described opening;
When described optical module inserts described accommodation space, the face relative with described opening of described optical module is end face, and the bottom land of described groove is lower than described end face, or described bottom land and described end face are in same plane.
Foregoing optical module heat radiation module, wherein, described heat radiation module also comprises:
Elastic component, it contacts with described heat abstractor;
When elastic deformation occurs described elastic component under external force, described substrate and described optical module are fitted.
Foregoing optical module heat radiation module, wherein, described elastic component comprises spring; Accordingly,
Described substrate has pillar, and described pillar and described heat radiator are positioned on same end face;
Described housing is provided with web member, and described web member and described pillar are slidably connected, and described spring housing is located on described pillar;
When described pillar slides relative to described web member, and when applying pressure to described spring, described spring applies pressure to described heat abstractor makes described substrate and described optical module fit.
Foregoing optical module heat radiation module, wherein, in the both sides of described housing, and extends upward brace table along the side perpendicular to described top board;
Described brace table is provided with described web member.
On the other hand, the utility model provides a kind of electronic equipment, and this electronic equipment comprises:
Apparatus body, it has accommodation space;
Mainboard, it is arranged in described accommodation space;
Communication adapter, it is arranged on described mainboard, and is electrically connected with described mainboard;
Optical module heat radiation module described above, it is arranged on described communication adapter;
Optical module connector, it is arranged on one end of the housing of described optical module heat radiation module, and is electrically connected with described communication adapter;
Optical module, it inserts in the accommodation space of described optical module heat radiation module, and is electrically connected with described optical module connector.
Foregoing electronic equipment, wherein, described apparatus body comprises: server or communication facilities.
By technique scheme, the utility model structure at least has following advantages:
The technical scheme that the utility model provides by being provided with opening on the top board of housing, and heat abstractor is arranged on top board, the heat that optical module is produced passes on heat abstractor through opening, then is distributed by heat by heat abstractor, thus the heat that the optical module that effectively leaves produces.The optical module heat radiation module rate of heat dispation provided compared with prior art the utility model is fast, and good heat dissipation effect, practicality is higher.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of instructions, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further described.
The structural representation of the optical module heat radiation module that Fig. 1 provides for the utility model embodiment one;
The optical module heat radiation module that Fig. 2 provides for the utility model embodiment one is in the constitutional diagram of the first state;
The optical module heat radiation module that Fig. 3 provides for the utility model embodiment one is in the constitutional diagram of the second state;
The structural representation of the electronic equipment that Fig. 4 provides for the utility model embodiment two.
Embodiment
For further setting forth the utility model for the technological means reaching predetermined utility model object and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of testing table, structure, feature and the effect thereof that the utility model proposes, be described in detail as follows.In the following description, the not necessarily same embodiment that different " embodiment " or " embodiment " refers to.In addition, special characteristic, structure or feature in one or more embodiment can be combined by any suitable form.
As shown in Figure 1, the utility model embodiment one provide optical module heat radiation module structural representation.A kind of optical module heat radiation module described in the present embodiment comprises: housing 10 and heat abstractor 20.Described housing 10 has the accommodation space 12 for accommodating optical module, and described accommodation space 12 provides structure for optical module described in plug.Described housing 10 comprises top board 11, and described top board 11 is provided with opening 111, and described opening 111 is through with described accommodation space 12.Described heat abstractor 20 is arranged on described top board 11, produces and the heat given out from described opening part for receiving and distributing described optical module.Preferably, described heat abstractor 20 is arranged on described opening 111 place, and described heat abstractor directly can accept the heat spread out of from described opening 111.Wherein, described heat abstractor 20 can be but be not limited to heating radiator.During concrete enforcement, described heating radiator is positioned on described opening 111, and when described optical module works in described accommodation space 12, the heat that described optical module produces can pass to described heating radiator by described opening 111, and described heating radiator will distribute the heat of acquisition.Compared with in prior art, by means of only offering multiple louvre on the housing 10 of accommodating described optical module, to carry out the speed of natural heat dissipation higher, and radiating effect is better, is more suitable for using.
In the present embodiment, described heat abstractor is arranged on described top board implicit: described heat abstractor is connected with described top board.And the specific implementation that described heat abstractor is connected with described top board can adopt connected mode of the prior art.Such as, described heat abstractor can be connected by syndeton with described top board.Wherein, described connection for being fixedly connected with, also can, for being flexibly connected, specifically can need to arrange according to the concrete structure of optical module heat radiation module.
Further, as shown in Figure 1, Figure 2 and Figure 3, in order to accelerate rate of heat dispation, the heat abstractor 20 described in above-described embodiment can comprise substrate 21 and heat radiator 22; Described substrate 21 its cover on described opening 111, and described accommodation space 12 can be stretched into from described opening 111 and contact with described optical module.Described heat radiator 22 is arranged on the relative end face of the surface of contact contacted with described optical module of described substrate 20.When described optical module inserts in described accommodation space 12, described substrate 21 can contact with described optical module, increases the contact area of described heat abstractor 20 and described optical module, thus accelerates rate of heat dispation.
Further, as shown in Figure 1, Figure 2 and Figure 3, in order to improve radiating effect, the housing 10 described in above-described embodiment can comprise: at least one baffle plate 13.Baffle plate 13 described at least one is arranged in described housing 10 along predetermined direction, and vertical with described top board 11, for dividing described accommodation space 12 by described housing 10.Baffle plate 13 is provided with the groove 131 for accommodating described heat abstractor 20, and the notch of described groove 131 is relative with described opening 111.When described optical module inserts described accommodation space 12, the face relative with described opening of described optical module is end face, and the bottom land of described groove 131 is lower than described end face, or described bottom land and described end face are in same plane.Wherein, described predetermined direction is parallel with described top board 11 and the direction of lateral vertical with described housing 10.The setting of baffle plate 13 described in the utility model embodiment can support described optical module, reduces the pressure of described heat abstractor to described optical module; Meanwhile, described baffle plate can be fixed described optical module and provide pulling/inserting structure for described optical module.
In the specific implementation, described baffle plate is provided with described groove, the size of described groove and the consistent size of described heat abstractor.As described in groove two groove arms between distance with as described in the width of heat abstractor consistent.When described heat abstractor is placed in described groove, described heat abstractor contacts with described optical module, thus the heat making described optical module produce directly passes to described heat abstractor, decrease the amount retained of heat in described accommodation space, effectively raise radiating effect.
Further, as shown in Figures 2 and 3, the heat radiation module described in above-described embodiment can also comprise: elastic component 30.Described elastic component 30 contacts with described heat abstractor 20; When there is elastic deformation under external force in described elastic component 30, described substrate 21 is fitted with described optical module under the effect of described elastic component 30, even if described substrate 21 and described optical module intimate contact, thus the heat making described optical module produce conducts to described heat abstractor 20 fully, and then add the rate of heat dispation of optical module heat radiation module, ensure that radiating effect.Under equal External Force Acting, if the end face of described optical module is higher than described bottom land, the elastic deformation that described elastic component occurs is comparatively large, then larger to the pressure of described substrate, what described substrate and described optical module were fitted is tightr, effectively adds the rate of heat dispation of optical module heat radiation module.It is better that the end face of more described optical module and described bottom land are in conplane situation radiating effect.
In the present embodiment, described elastic component 30 can be arranged on described heat abstractor 20, by applying pressure to described elastic component 30, makes described elastic component 30 apply pressure to described heat abstractor 20, fits tightly with described optical module to make described heat abstractor 20; Described elastic component 30 also can be connected with described heat abstractor 20 and described housing 10 inwall respectively, applies pulling force by described elastic component 30 to described heat abstractor 20, and described heat abstractor 20 is fitted tightly with described optical module.Concrete enforcement can set according to the actual requirements, and the utility model embodiment is not specifically limited.
In the specific implementation, described elastic component 30 can comprise spring; Accordingly, described substrate 21 has pillar 211, described pillar 211 is positioned on the relative end face of the surface of contact contacted with described optical module of described substrate 21; Described housing 10 is provided with web member 14, and described web member 14 is slidably connected with described pillar 211, and described spring housing is located on described pillar 211.When described pillar 211 slides relative to described web member 14, and when adding pulling force to described pillar 211, in the raw, now, the described substrate 21 of described heat abstractor 20 is placed in described opening 111 place (as shown in Figure 2) to described spring; When described web member 14 slides relative to described pillar 211, and when applying pressure to described spring, described spring applies pressure to described heat abstractor 20, and described substrate 21 is fitted (as shown in Figure 3) with described optical module.Described elastic component also can comprise rubber bar; One end of described rubber bar is connected with described substrate, and the other end is connected with described inner walls.Described heat abstractor is subject to the pulling force of described rubber bar, and when described optical module inserts described accommodation space, described optical module is fitted with described optical module under the pulling force effect of described rubber bar.Certainly, described elastic component can also other have flexible object in prior art, are not limited to described above.For different elastic articles, they also can be different from the connected mode of substrate, can determine particularly according to the structure of actual elastic object and attribute, as long as can apply power to substrate under external force in the application, substrate and optical module fitted.
Further, as shown in Figure 1, Figure 2 and Figure 3, in order to reinforce the steadiness of described web member 14, in the both sides of described housing 10 in above-described embodiment, and brace table 15 is extended upward along the side perpendicular to described top board 11.Described brace table 15 is provided with described web member 14.Wherein, described brace table 15 has certain thickness.Because described brace table 15 has certain thickness, described brace table can bear described web member and carry the weight of described heat abstractor to its applied pressure, thus firm fixing described web member.
As shown in Figure 4, the structural representation of electronic equipment that provides of the utility model embodiment two.A kind of electronic equipment described in the present embodiment comprises: apparatus body 100, mainboard 200, communication adapter 300, optical module connector 400, optical module heat radiation module 500 and optical module 600.As shown in Figure 1, Figure 2 with shown in 3, described optical module heat radiation module 500 comprises: housing 10 and heat abstractor 20.Described housing 10 has the accommodation space 12 for accommodating optical module, and described housing 10 comprises top board 11, and described top board 11 is provided with opening 111, and described opening 111 is through with described accommodation space 12.Described heat abstractor 20 is arranged on described top board 11, produces and the heat given out from described opening 111 for receiving and distributing described optical module.As shown in Figure 4, described apparatus body 100 has accommodation space.Described mainboard 200 is arranged in described accommodation space.Described communication adapter 300 is arranged on described mainboard 200, and is electrically connected with described mainboard 200.Described optical module heat radiation module 500 is arranged on described communication adapter 300.Described optical module connector 400 is arranged on one end of the housing of described optical module heat radiation module 500, and is electrically connected with described communication adapter 300.Described optical module 600 inserts in the accommodation space of described optical module heat radiation module 500, and is electrically connected with described optical module connector 400.
Particularly, the described optical module heat radiation module that the optical module heat radiation module described in the present embodiment two can directly adopt above-described embodiment one to provide, the concrete structure that realizes see the related content described in above-described embodiment one, can repeat no more herein.
Further, the apparatus body 100 described in above-described embodiment can comprise: server or communication facilities.
The utility model provides embodiment to pass through to be provided with opening on the top board of housing, and heat abstractor is arranged on top board, the heat that optical module is produced passes on heat abstractor through opening, then is distributed by heat by heat abstractor, thus the heat that the optical module that effectively leaves produces.The optical module heat radiation module rate of heat dispation provided compared with prior art the utility model is fast, and good heat dissipation effect, practicality is higher.
Above embodiment only in order to the technical solution of the utility model to be described, is not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.

Claims (8)

1. an optical module heat radiation module, is characterized in that, comprising:
Housing, it has the accommodation space for accommodating optical module, and described housing comprises top board, and described top board is provided with opening, described opening and described accommodation space through;
Heat abstractor, it is arranged on described top board, produces and the heat given out from described opening part for receiving and distributing described optical module.
2. optical module heat radiation module according to claim 1, it is characterized in that, described heat abstractor comprises:
Substrate, it covers over said opening, and can stretch into described accommodation space from described opening and contact with described optical module;
Heat radiator, it is arranged on the relative end face of the surface of contact contacted with described optical module of described substrate.
3. optical module heat radiation module according to claim 2, it is characterized in that, described housing comprises:
At least one baffle plate, it is arranged in described accommodation space along predetermined direction, and vertical with described top board;
Described baffle plate is provided with the groove for placing described heat abstractor, and the notch of described groove is relative with described opening;
When described optical module inserts described accommodation space, the face relative with described opening of described optical module is end face, and the bottom land of described groove is lower than described end face, or described bottom land and described end face are in same plane.
4. optical module heat radiation module according to claim 3, it is characterized in that, described heat radiation module also comprises:
Elastic component, it contacts with described heat abstractor;
When elastic deformation occurs described elastic component under external force, described substrate and described optical module are fitted.
5. optical module heat radiation module according to claim 4, it is characterized in that, described elastic component comprises spring; Accordingly,
Described substrate has pillar, and described pillar and described heat radiator are positioned on same end face;
Described housing is provided with web member, and described web member and described pillar are slidably connected, and described spring housing is located on described pillar;
When described pillar slides relative to described web member, and when applying pressure to described spring, described spring applies pressure to described heat abstractor makes described substrate and described optical module fit.
6. optical module heat radiation module according to claim 5, is characterized in that, in the both sides of described housing, and extend upward brace table along the side perpendicular to described top board;
Described brace table is provided with described web member.
7. an electronic equipment, is characterized in that, comprising:
Apparatus body, it has accommodation space;
Mainboard, it is arranged in described accommodation space;
Communication adapter, it is arranged on described mainboard, and is electrically connected with described mainboard;
Optical module heat radiation module according to any one of the claims 1 ~ 6, it is arranged on described communication adapter;
Optical module connector, it is arranged on one end of the housing of described optical module heat radiation module, and is electrically connected with described communication adapter;
Optical module, it inserts in the accommodation space of described optical module heat radiation module, and is electrically connected with described optical module connector.
8. electronic equipment according to claim 7, is characterized in that, described apparatus body comprises: server or communication facilities.
CN201520186400.6U 2015-03-30 2015-03-30 Optical module heat radiation module and electronic equipment Active CN204515195U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520186400.6U CN204515195U (en) 2015-03-30 2015-03-30 Optical module heat radiation module and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520186400.6U CN204515195U (en) 2015-03-30 2015-03-30 Optical module heat radiation module and electronic equipment

Publications (1)

Publication Number Publication Date
CN204515195U true CN204515195U (en) 2015-07-29

Family

ID=53713153

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520186400.6U Active CN204515195U (en) 2015-03-30 2015-03-30 Optical module heat radiation module and electronic equipment

Country Status (1)

Country Link
CN (1) CN204515195U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106027154A (en) * 2016-07-13 2016-10-12 无锡路通视信网络股份有限公司 Field optical network platform
CN107688214A (en) * 2017-08-08 2018-02-13 深圳三星通信技术研究有限公司 A kind of optical module mounting construction
CN109613666A (en) * 2018-12-29 2019-04-12 苏州松翔电通科技有限公司 A kind of heat dissipation structure and optical module of optical module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106027154A (en) * 2016-07-13 2016-10-12 无锡路通视信网络股份有限公司 Field optical network platform
CN107688214A (en) * 2017-08-08 2018-02-13 深圳三星通信技术研究有限公司 A kind of optical module mounting construction
CN109613666A (en) * 2018-12-29 2019-04-12 苏州松翔电通科技有限公司 A kind of heat dissipation structure and optical module of optical module

Similar Documents

Publication Publication Date Title
CN102695393B (en) Perpendicular orthogonal interconnection system and communication device
CN204515195U (en) Optical module heat radiation module and electronic equipment
CN203826873U (en) Cable bridge
CN204859871U (en) Heat radiating system
CN201364516Y (en) Arbitrary waveform generator
CN104254199B (en) Electronics board system and electronic equipment
CN207780063U (en) Power battery electric performance test frock clamp and test system
CN206282904U (en) Lithium battery and scooter
CN203826874U (en) Novel cable bridge
CN206181052U (en) Novel network card module
CN206292371U (en) A kind of plug-in and pull-off device of electrokinetic cell box for needle or pin
CN206209481U (en) A kind of server
CN206326571U (en) A kind of wiring board and chip board maintenance platform
CN203930801U (en) Hot measurement jig
CN204514577U (en) A kind of tunable laser wavelength search test erecting device
CN204168691U (en) A kind of high density high speed connector of elasticity self-locking
CN207505229U (en) A kind of circuit board module
CN206892734U (en) A kind of Shockproof computer mainboard
CN206024282U (en) The trading halt retainer of super long PCB actual load machine
CN205890795U (en) Automobile -mounted terminal based on system is shared to car digit key
CN204668508U (en) A kind of electric connector of edge clipping formula nut lock plate structure
CN205210207U (en) Many parameter synthesis test controlling means and system thereof
CN202931735U (en) Simulated processor radiator device
CN208459940U (en) A kind of GPU-Switch structure cabinet
CN211426974U (en) Power utilization box suitable for aging test of liquid crystal display module

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant