CN204503678U - A kind of wafer cleaning system - Google Patents
A kind of wafer cleaning system Download PDFInfo
- Publication number
- CN204503678U CN204503678U CN201420837429.1U CN201420837429U CN204503678U CN 204503678 U CN204503678 U CN 204503678U CN 201420837429 U CN201420837429 U CN 201420837429U CN 204503678 U CN204503678 U CN 204503678U
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- Prior art keywords
- wafer
- cleaning system
- whirligig
- air
- utility
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Abstract
The utility model discloses a kind of wafer cleaning system, belong to technical field of semiconductors.The utility model adopts following technical scheme: a kind of wafer cleaning system, it is characterized in that, comprise wafer liquid-jet device, wafer whirligig, wafer air-blast device, described wafer liquid-jet device arranges the top with described wafer whirligig, and described wafer air-blast device is arranged at the side of described wafer whirligig.The utility model rotates along level and vertical both direction by driving wafer, and the cleaning fluid that blower blows is sprayed onto on wafer washes metal fillings, achieves the effect thoroughly cleaned up by wafer.
Description
Technical field
The utility model relates to a kind of wafer cleaning system, belongs to technical field of semiconductors.
Background technology
In semiconductor fabrication process, the cleannes of crystal column surface are the key factors affecting semiconductor device reliability.Therefore, cleaning is wherein most important and one of technique the most frequently.In conventional semiconductor technology, such as: deposition, plasma etching, spin coating photoresist, photoetching, plating etc., all likely can introduce at crystal column surface and pollute and/or particle, cause the cleannes of crystal column surface to decline, make the semiconductor devices yield of manufacture low.In general, in the whole manufacturing process of semiconductor devices, the processing step up to 20% is cleaning.
Crystal column surface has the pollution of four large common types: subparticle; Organic remains; Inorganic residues; Need the oxide layer removed.The object of wafer cleaning is in order to the oxide layer removing the organic compound be attached on crystal column surface, metal impurities or subparticle, needs are removed, avoid micro ion and metal impurities to the pollution of semiconductor devices, thus improve performance and the qualification rate of semiconductor devices.
To sum up, need badly and a kind of new wafer cleaning device is provided, do not clean up to solve wafer, and then affect subsequent handling, produce cross pollution, the problem that product yield is low.
Utility model content
For solving the problems of the technologies described above, overcome the deficiency that prior art exists, the utility model provides a kind of wafer cleaning system.The utility model adopts following technical scheme: a kind of wafer cleaning system, it is characterized in that, comprise wafer liquid-jet device, wafer whirligig, wafer air-blast device, described wafer liquid-jet device arranges the top with described wafer whirligig, and described wafer air-blast device is arranged at the side of described wafer whirligig.
Preferably, described wafer liquid-jet device comprises sparge pipe, is provided with cleaning fluid in described sparge pipe.
Preferably, described wafer whirligig comprises horizontal rotating table, pedestal, interior rotary pawl, wafer, described pedestal is fixedly installed on described horizontal rotating table, and described interior rotary pawl is arranged at the inner side of described pedestal, and described interior rotary pawl and described wafer fit tightly.
Preferably, described interior rotary pawl is provided with draw-in groove, and described draw-in groove matches with the size of described wafer.
Preferably, described base interior is provided with driver, and described driver is connected with described interior rotary pawl; In driver drives, rotary pawl rotates in the horizontal direction, thus drives wafer to rotate thereupon.
Preferably, described horizontal rotating table lower end is provided with CD-ROM drive motor, is used for driving horizontal rotating table vertically to rotate, and band moving base and wafer rotate thereupon.
Preferably, described wafer air-blast device comprises air blast, is used for the metal fillings blown off on wafer.
The beneficial effect that the utility model reaches: by driving wafer to rotate along level and vertical both direction, the cleaning fluid that blower blows is sprayed onto on wafer washes metal fillings, thus is thoroughly cleaned up by wafer.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
The implication marked in figure: 1-sparge pipe, 2-cleaning fluid, 3-pedestal, rotary pawl in 4-, 5-wafer, 6-air blast, 7-horizontal rotating table, 8-CD-ROM drive motor.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
As shown in Figure 1 be structural representation of the present utility model, the utility model provides a kind of wafer cleaning system, comprise wafer liquid-jet device, wafer whirligig, wafer air-blast device, described wafer liquid-jet device arranges the top with described wafer whirligig, and described wafer air-blast device is arranged at the side of described wafer whirligig.
Preferably, wafer liquid-jet device comprises sparge pipe 1, is provided with cleaning fluid 2 in sparge pipe 1.
Preferably, wafer whirligig comprises horizontal rotating table 7, pedestal 3, interior rotary pawl 4, wafer 5, and pedestal 3 is fixedly installed on horizontal rotating table 7, and interior rotary pawl 4 is arranged at the inner side of pedestal 3, and interior rotary pawl 4 fits tightly with wafer 5.
Preferably, interior rotary pawl 4 is provided with draw-in groove, and draw-in groove matches with the size of wafer 5.
Preferably, pedestal 3 inside is provided with driver, and driver is connected with interior rotary pawl 4; In driver drives, rotary pawl 4 rotates in the horizontal direction, thus drives wafer 5 to rotate thereupon.
Preferably, horizontal rotating table 7 lower end is provided with CD-ROM drive motor 8; CD-ROM drive motor 8 is used for driving horizontal rotating table 7 vertically to rotate, and band moving base 3 and wafer 5 rotate thereupon.
Preferably, wafer air-blast device comprises air blast 6, is used for blowing the metal fillings on wafer 5 off.
The utility model rotates along level and vertical both direction by driving wafer, and the cleaning fluid that blower blows is sprayed onto on wafer washes metal fillings, thus is thoroughly cleaned up by wafer.
The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvement and distortion, these improve and distortion also should be considered as protection domain of the present utility model.
Claims (7)
1. a wafer cleaning system, it is characterized in that, comprise wafer liquid-jet device, wafer whirligig, wafer air-blast device, described wafer liquid-jet device arranges the top with described wafer whirligig, and described wafer air-blast device is arranged at the side of described wafer whirligig.
2. a kind of wafer cleaning system according to claim 1, is characterized in that, described wafer liquid-jet device comprises sparge pipe, is provided with cleaning fluid in described sparge pipe.
3. a kind of wafer cleaning system according to claim 1, it is characterized in that, described wafer whirligig comprises horizontal rotating table, pedestal, interior rotary pawl, wafer, described pedestal is fixedly installed on described horizontal rotating table, described interior rotary pawl is arranged at the inner side of described pedestal, and described interior rotary pawl and described wafer fit tightly.
4. a kind of wafer cleaning system according to claim 3, is characterized in that, described interior rotary pawl is provided with draw-in groove, and described draw-in groove matches with the size of described wafer.
5. a kind of wafer cleaning system according to claim 4, it is characterized in that, described base interior is provided with driver, and described driver is connected with described interior rotary pawl.
6. a kind of wafer cleaning system according to claim 5, is characterized in that, described horizontal rotating table lower end is provided with CD-ROM drive motor.
7. a kind of wafer cleaning system according to claim 1, is characterized in that, described wafer air-blast device comprises air blast.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420837429.1U CN204503678U (en) | 2014-12-26 | 2014-12-26 | A kind of wafer cleaning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420837429.1U CN204503678U (en) | 2014-12-26 | 2014-12-26 | A kind of wafer cleaning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204503678U true CN204503678U (en) | 2015-07-29 |
Family
ID=53701682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420837429.1U Expired - Fee Related CN204503678U (en) | 2014-12-26 | 2014-12-26 | A kind of wafer cleaning system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204503678U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104492764A (en) * | 2014-12-26 | 2015-04-08 | 苏州凯锝微电子有限公司 | Wafer cleaning system |
-
2014
- 2014-12-26 CN CN201420837429.1U patent/CN204503678U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104492764A (en) * | 2014-12-26 | 2015-04-08 | 苏州凯锝微电子有限公司 | Wafer cleaning system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20151226 |
|
| EXPY | Termination of patent right or utility model |